PAN4620

PAN4620 PANASONIC | Alldatasheet

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IEEE® 802.15.4 and Bluetooth® Low Energy Module Product Specification Rev. 1.1 Wireless Modules 

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 2 Overview The PAN4620 is Panasonic’s Internet of Things dual mode module comprising the NXP® Kinetis® MKW41Z512CAT4 SoC – a 2.4 GHz 802.15.4 and Bluetooth Low Energy wireless radio microcontroller based on an ARM® Cortex® M0+.

Features

• UART, SPI, I²C, TSI, ADC, and DAC
• Same form factor and compatible pinout for VCC, GND, Reset, UART, I²C, and SWD as PAN1026, PAN1760, PAN1760A, and PAN1761
• Single and concurrent operation of IEEE 802.15.4 and Bluetooth Low Energy
• Open to various known application layers or proprietary solutions
• Surface Mount Type dimensions: 15.6 mm x 8.7 mm x 1.9 mm
• On module 32 MHz and 32 kHz crystal
• SoC: NXP Kinetis KW41Z – 2.4 GHz 802.15.4 and Bluetooth Low Energy 4.2 Wireless Radio Microcontroller
• Core: Up to 48 MHz 32 bit ARM Cortex-M0+
• Memory: 512 kB of flash and 128 kB of SRAM
• Voltage range: 1.8 V to 4.2 V
• Temperature range: -40 °C to 85 °C Characteristics
• Transceiver frequency range 2 360 MHz to 2 483.5 MHz
• Programmable transmitter output power: -30 dBm to 3.5 dBm (Power and sensitivity measured at chip output)
• Typical receiver sensitivity Bluetooth Low Energy @1Mbps: -95 dBm
• Typical receiver sensitivity typical for IEEE Standard 802.15.4 @250 kbps: -100 dBm
• Typical transmitter current consumption 7.6 mA (6.1 mA for Tx, 0dBm, 3.6 V)
• Typical receiver current consumption 8.4 mA (6.8 mA for RX, 3.6 V) Bluetooth
• Bluetooth Low Energy 4.2 compliant implementation certified by Bluetooth SIG
• Supporting software consisting of Bluetooth Low Energy host stack and profiles and IPv6 over Bluetooth Low Energy
• Bluetooth Developer Studio Plug-In IEEE 802.15.4
• IEEE standard 802.15.4 compliant
• Supporting software consisting of 802.15.4 MAC/PHY implementation, Simple Media Access Controller (SMAC), and the NXP certified Thread stack Block Diagram

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 3 By purchase of any of the products described in this document the customer accepts the document's validity and declares their agreement and understanding of its contents and recommendations. Panasonic Industrial Devices Europe GmbH (Panasonic) reserves the right to make changes as required at any time without notification. Please consult the most recently issued Product Specification before initiating or completing a design. © Panasonic Industrial Devices Europe GmbH 2019. This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do not disclose it to a third party. All rights reserved. This Product Specification does not lodge the claim to be complete and free of mistakes. Engineering Samples (ES) If Engineering Samples are delivered to the customer, these samples have the status “Engineering Samples”. This means that the design of this product is not yet concluded. Engineering Samples may be partially or fully functional, and they may differ from the published Product Specification. Engineering Samples are not qualified and they are not to be used for reliability testing or series production. Disclaimer The customer acknowledges that samples may deviate from the Product Specification and may bear defects due to their status of development and the lack of qualification mentioned above. Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic disclaims liability for damages caused by:  The use of the Engineering Sample other than for evaluation purposes, particularly the installation or integration in another product to be sold by the customer,  Deviation or lapse in function of the Engineering Sample,  Improper use of the Engineering Sample. Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental damages. In case of any queries regarding the Engineering Samples, please contact your local sales partner or the related product manager.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 4 Table of Contents

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 5

 802.15.4 and Bluetooth LE Module

1 About This Document

Product Specification Rev. 1.1 Page 6

1.1 Purpose and Audience

This Product Specification provides details on the functional, operational, and electrical characteristics of the Panasonic PAN4620 module. It is intended for hardware design, application, and Original Equipment Manufacturers (OEM) engineers. The product is referred to as “the PAN4620” or “the module” within this document.

1.2 Revision History

Revision Date Modifications/Remarks 1.0 2018-12-07 First version 1.1 2019-07-17 Added certification information. Formatting changes.

1.3 Use of Symbols

Indicates important information for the proper use of the product. Non-observance can lead to errors. Attention Indicates important notes that, if not observed, can put the product’s functionality at risk.  [chapter number] [chapter title] Cross reference Indicates cross references within the document. Example: Description of the symbols used in this document  1.3 Use of Symbol.

1.4 Related Documents

Please refer to the Panasonic website for related documents  7.3.2 Product Information. For further information please also refer to the datasheet and reference manual “MKW41Z512CAT4” from the NXP website.

 802.15.4 and Bluetooth LE Module

2 Overview

Product Specification Rev. 1.1 Page 7 The PAN4620 is Panasonic’s Internet of Things dual mode module comprising th e NXP Kinetis MKW41Z512CAT4 SoC – a 2.4 GHz 802.15.4 and Bluetooth Low Energy wireless radio microcontroller based on an ARM Cortex-M0+. To provide maximum flexibility, the module can be operated in stand-alone and hosted mode. With 512 kB flash memory and 128 kB SRAM the PAN4620 can easily be used as a stand-alone controller eliminating the need for an external processor, saving complexity, space and cost. It is thus well suited for very small and low power applications. Also the integration of 802.15.4 and/or Bluetooth Low Energy connectivity into existing applications can easily be achieved when using the PAN4620 in hosted mode. Using the PAN4620 with low power consumption in combination with the NXP certified Thread stack, Bluetooth Low Energy stack or a combination of both for concurrent operation allows to meet IoT application requirements without the need for a gateway. Since Thread does not define an application layer, various application layers can be used, such as Dotdot, IoTivity, OpenDOF, and others. FCC, IC, and CE approval are available. Please refer to the Panasonic website for related documents  7.3.2 Product Information. Further information on the variants and versions  7.1 Ordering Information. For further information please also refer to the datasheet MKW41Z512CAT4 and reference manual from www.nxp.com.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 8

2.1 Block Diagram

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 9

2.2 Pin Configuration

Top view (dimensions are in mm) Pin Functions No. Pin Name Alternative Pin Function Pin Type Description A1 GND Ground Connect to ground A2 NC Do not connect A3 RESET PTA2, TPM0_CH3 Digital I/O Can be configured to use the mentioned alternative pin functions A4 NC Do not connect A5 VCC Power Supply voltage 1.8 V to 4.2 V A6 VCC Power Supply voltage 1.8 V to 4.2 V A7 GND Ground Connect to ground A8 PTC18 TSI0_CH6, LLWU_P2, SPI0_SIN, I2C1_SDA, LPUART0_TX, BSM_DATA, DTM_TX Digital I/O Can be configured to use the mentioned alternative pin functions.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 10 No. Pin Name Alternative Pin Function Pin Type Description A9 GND Ground Connect to ground A11 GND Ground Connect to ground A12 GND Ground Connect to ground B1 NC Do not connect B2 PTA17 TSI0_CH11, LLWU_P5, RF_RESET, SPI1_SIN, TPM_CLKIN1 Digital I/O Can be configured to use the mentioned alternative pin functions B3 PTC19 TSI0_CH7, LLWU_P3, SPI0_PCS0, I2C0_SCL, LPUART0_CTS_b, BSM_CLK, BLE_RF_ACTIVE Digital I/O Can be configured to use the mentioned alternative pin functions B4 PTC17 TSI0_CH5, LLWU_P1 SPI0_SOUT, I2C1_SCL LPUART0_RX, BSM_FRAME, DTM_RX Digital I/O Can be configured to use the mentioned alternative pin functions B5 PTC16 TSI0_CH4, LLWU_P0, SPI0_SCK, I2C0_SDA, LPUART0_RTS_b, TPM0_CH3 Digital I/O Can be configured to use the mentioned alternative pin functions B6 PTA16 TSI0_CH10, LLWU_P4, SPI1_SOUT, TPM0_CH0 Digital I/O Can be configured to use the mentioned alternative pin functions. B7 NC Do not connect B8 NC Do not connect B9 NC Do not connect C1 NC Do not connect C2 PTA19 TSI0_CH13, ADC0_SE5, LLWU_P7, SPI1_PCS0, TPM2_CH1 Digital I/O Can be configured to use the mentioned alternative pin functions C3 PTA18 TSI0_CH12, LLWU_P6, SPI1_SCK, TPM2_CH0 Digital I/O Can be configured to use the mentioned alternative pin functions C4 SWDIO PTA0, TSI0_CH8, SPI0_PCS1, TPM1_CH0, SWD_DIO Digital I/O Can be configured to use the mentioned alternative pin functions. C5 SWDCLK PTA1, TSI0_CH9, SPI1_PCS0, TPM1_CH1, SWD_CLK Digital I/O Can be configured to use the mentioned alternative pin functions.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 11 No. Pin Name Alternative Pin Function Pin Type Description C6 PTC1 I2C0_SDA, LPUART0_RTS_b, TPM0_CH2, BLE_RF_ACTIVE Digital I/O Can be configured to use the mentioned alternative pin functions. C7 NC Do not connect C8 GND Ground Connect to ground C9 GND Ground Connect to ground D1 PTB0 LLWU_P8, XTAL_OUT_EN, I2C0_SCL, CMP0_OUT, TPM0_CH1, CLKOUT Digital I/O Can be configured to use the mentioned alternative pin functions. D2 PTB1 ADC0_SE1, CMP0_IN5, DTM_RX, I2C0_SDA, LPTMR0_ALT1, TPM0_CH2, CMT_IRO Digital I/O Can be configured to use the mentioned alternative pin functions. D3 PTB2 ADC0_SE3, CMP0_IN3, RF_NOT_ALLOWED, DTM_TX, TPM1_CH0 Digital I/O Can be configured to use the mentioned alternative pin functions. D4 PTB3 ADC0_SE2, CMP0_IN4, CLKOUT, TPM1_CH1, RTC_CLKOUT Digital I/O Can be configured to use the mentioned alternative pin functions. D5 NC Do not connect D6 NC Do not connect D7 GND Ground Connect to ground D8 GND Ground Connect to ground D9 NC (ANT) This pad is not connected, but by moving a jumper (0201 size) on the module, it can be used as RF bottom pad for testing purposes. E1 PTC3 TSI0_CH15, LLWU_P11, RX_SWITCH, I2C1_SDA, LPUART0_TX, TPM0_CH1, DTM_TX Digital I/O Can be configured to use the mentioned alternative pin functions. E2 PTC2 TSI0_CH14, LLWU_P10, TX_SWITCH, I2C1_SCL, LPUART0_RX, CMT_IRO, DTM_RX Digital I/O Can be configured to use the mentioned alternative pin functions. E3 NC Do not connect

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 12 No. Pin Name Alternative Pin Function Pin Type Description E4 NC Do not connect E5 PTC0 LLWU_P9, I2C0_SCL, LPUART0_CTS_b, TPM0_CH1 Digital I/O Can be configured to use the mentioned alternative pin functions. E6 PTC6 TSI0_CH2, LLWU_P14, XTAL_OUT_EN, I2C1_SCL, LPUART0_RX, TPM2_CH0, BSM_FRAME Digital I/O Can be configured to use the mentioned alternative pin functions. E7 VREFH/_OUT O Internally generated voltage reference output E8 GND Ground Connect to ground E9 GND Ground Connect to ground F1 GND Ground Connect to ground F2 NC Do not connect F3 ADC0_DP0, CMP0_IN0 Analog F4 ADC0_DM0, CMP0_IN1 Analog F5 PTC4 TSI0_CH0, LLWU_P12, LPUART0_CTS_b, TPM1_CH0, BSM_DATA Digital I/O Can be configured to use the mentioned alternative pin functions. F6 PTB18 DAC0_OUT, ADC0_SE4, CMP0_IN2, I2C1_SCL, TPM_CLKIN0, TPM0_CH0 Digital I/O Can be configured to use the mentioned alternative pin functions. F7 PTC7 TSI0_CH3, LLWU_P15, SPI0_PCS2, I2C1_SDA, LPUART0_TX, TPM2_CH1, BSM_DATA Digital I/O Can be configured to use the mentioned alternative pin functions. F8 PTC5 TSI0_CH1, LLWU_P13, RF_NOT_ALLOWED LPTMR0_ALT2, LPUART0_RTS_b, TPM1_CH1, BSM_CLK Digital I/O Can be configured to use the mentioned alternative pin functions. F9 GND Ground Connect to ground F11 GND Ground Connect to ground F12 GND Ground Connect to ground

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 13

2.3 Transceiver Features

The PAN4620 features an integrated chip antenna and corresponding matching networks . Both, a high accuracy 32 MHz crystal and a low frequency clock are integrated in the module. Therefore, no external crystal is required to make full use of the reduced power modes. The operating frequency is in the ISM band and the MBAN band from 2 360 MHz to 2 483.5 MHz with a programmable output power from -30 dBm to 3.5 dBm Bluetooth Features 2.3.1  Bluetooth Low Energy 4.2 (1 Mbps)  Two simultaneous connections (2 independent hardware connection engines)  Receive sensitivity of -95 dBm For further information see  4.9 Transceiver Feature Summary. IEEE 802.15.4 Features 2.3.2  IEEE Standard 802.15.4-2011 compliant OQPSK modulation  Receive sensitivity of -100 dBm (Receive sensitivity in generic FSK modes depends on mode selection and data rate.)  Hardware acceleration for packet processing/link layer  NXP certified Thread stack For further information see  4.9 Transceiver Feature Summary. MCU Features 2.3.3 The KW41Z features an ARM Cortex-M0+MCU with up to 48 MHz. As compared to Cortex-M0, the Cortex-M0+ uses optimized 2-stage pipeline microarchitecture for reduced power consumption and improved architectural performance (cycles per instruction). Interrupt Controller  Supports up to 32 interrupt request sources  32 vectored interrupts, 4 programmable priority levels  Includes a single non-maskable interrupt  Supports interrupt handling when system clocking is disabled in low power modes . On Chip Memory  512 kB flash memory implemented as two equal 256 kB blocks.  One block can be read or erased, while code is being executed or read from another.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 14  Flash can be marked execute only in 8 kB blocks to prevent code from being read by third parties.  128 kB SRAM  The chip features security circuitry to prevent unauthorized access to RAM and flash contents through the debugger. Debug Controller  Serial wire debug (SWD) interface  Hardware breakpoint unit for two code addresses  Hardware watchpoint unit for two data items  Micro trace buffer for program tracing Security Features 2.3.4  Advanced encryption standard accelerator (AES-128 Accelerator)  True random number generator (TRNG)  Flash memory protection Power Management Control Unit 2.3.5  Supports external voltage sources of 1.8 V to 4.2 V (2.1 V required for startup) and is therefore ideally suited for single coin-cell battery operation.  Programmable power saving modes  Integrated low frequency clock to make full use of the reduced power modes  Available wake-up from power saving modes via internal and external sources  Integrated power-on reset (POR)  Integrated low voltage detect (LVD) with reset (brownout) capability  Selectable LVD trip points  Programmable low voltage warning (LVW) interrupt capability  Individual peripheral clocks can be gated off to reduce current consumption  Internal buffered bandgap reference voltage  Factory programmed trim for bandgap and LVD  1 kHz low power oscillator (LPO) Peripheral Features 2.3.6  16-Bit analog-to-digital converter  12-Bit digital-to-analog converter  High-speed analog comparator (CMP)  Timer: low power timer (LPTMR), timer/PWM, programmable interrupt timer (PIT),

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 15  Real-time clock (RTC)  Inter-integrated circuit (I²C), two channels, up to 400 kHz, multi-master operation  Low power universal asynchronous receiver transmitter (LPUART), one channel full-duplex operation  Serial peripheral interface (SPI), master and slave mode, full-duplex, three-wire synchronous transfers  Carrier modulator timer (CMT) with four modes of operation  Touch sensor input (TSI) with up to 16 external electrodes  24 General purpose Input/Outputs  GPIOs can be configured to function as a interrupt driven keyboard scanning matrix For further information see  4.6 Interface Specification.

 802.15.4 and Bluetooth LE Module

3 Detailed Description

Product Specification Rev. 1.1 Page 16

3.1 Dimensions

All dimensions are in millimeters. No. Item Dimension Tolerance Remark 1 Width 8.70 ± 0.35 2 Length 15.60 ± 0.35 3 Height 1.80 ± 0.35 With case

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 17

3.2 Footprint

The outer dimensions have a tolerance of 0.35 mm. Top view (dimensions are in mm)

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 18

3.3 Packaging

The product is an engineering sample status product and will be delivered in the package described below. Tape Dimensions 3.3.1 Packing in Tape 3.3.2 Empty spaces in the component packed area shall be less than two per reel and those spaces shall not be consecutive. The top cover tape shall not be found on reel holes and it shall not stick out from the reel. 100730-PAN1720.vsd trailer (empty) 1 x circumference / hub (min 160mm) component packed area standard 1500pcs leader (empty) minimum 10 pitch Top cover tape more than 1 x circumference plus 100mm to avoid fixing of tape end on sealed modules. Direction of unreeling (for customer)

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 19 Component Direction 3.3.3 Reel Dimension 3.3.4

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 20 Package Label 3.3.5 (1T) (1P) (2P) (9D) (Q) (HW/SW) Lot code Customer order number, if applicable Order number Date code Quantity Hardware/software version Total Package 3.3.6

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 21

3.4 Case Marking

ENW-No./Model Name FCC ID IC ID Lot code MAC address (EUI-48) Engineering Sample marking, if applicable Marking for Pin 1 10 2D barcode for internal usage only

11 Bluetooth logo

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 22

3.5 Production Data Storage

The production data consists of the Extended Unique Identifier EUI-48 the EUI-64, and the crystal trim value. The information is stored in the last sector of the flash, which starts at 0x7F800. The short EUI-48 is stored at 0x7f832 and is also, as described in  3.4 Case Marking, lasered on the module cover. If the last flash sector is erased by accident, the EUI-48 can be recovered from the cover. The extended address EUI-64 is stored at 0x7f82a and it is constructed from the EUI-48. A block FFFE is inserted between the Organizationally Unique Identifier (OUI) (fixed Panasonic identifier) and the rest of the address. Example 001343AABBCC – EUI-48 (Written on the cover) 001343FFFEAABBCC – EUI-64 (Constructed from the short address) The 1 byte crystal trim value is optimized during the production test for each module and saved at 0x7F838. If this value is deleted by accident, a default of 0x30 should be used.

 802.15.4 and Bluetooth LE Module

4 Specification

Product Specification Rev. 1.1 Page 23 All specifications are over temperature and process, unless indicated otherwise.

4.1 Default Test Conditions

Temperature: 25 ± 10 °C Humidity: 40 to 85 % RH Supply Voltage: 3.6 V

4.2 Absolute Maximum Ratings

The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. Symbol Parameter Condition Min. Typ. Max. Unit TSTOR Storage Temperature -40 +85 °C VESD ESD robustness Electrostatic discharge voltage, human body model -2 000 +2 000 V Electrostatic discharge voltage, charged-device model -500 +500 RF input power Pmax 10 dBm VDD Supply voltage -0.3 4.2 V VIO Voltage on any IO pin -0.3 VDD+0.3 V

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 24

4.3 Recommended Operating Conditions

The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. Symbol Parameter Condition Min. Typ. Max. Unit VDD Supply voltage DCDC converter needs this minimum voltage to start. 2.1 4.2 V The supply can drop to this minimum voltage after DCDC converter settles. 1.81 fIN Input frequency 2.36 2.48 GHz TA Ambient temperature range -40 25 75 °C VIO Voltage on any IO pin -0.3 VDD+0.3 V ID Instantaneous max. current Single pin limit (applies to all port pins) -25 25 mA VIL Logic low input voltage 0 0.3∙ VDD INT V VIH Logic high input voltage 0.7∙VDD INT VDD INT V

4.4 Current Consumption

The current consumption depends on the user scenario and on the setup and timing in the power modes. Assume VDD=3.6 V, Tamb=25 °C, if nothing else is stated. 1 DC-DC converter requires slightly higher input voltage during startup. Bit DCDC_STS_DC_OK will be set when the DC-DC converter finished the startup sequence. Typical startup time is 50 ms and it varies with the loading of the converter. 2 VDD INT is the internal LDO regulated voltage supplying various circuit blocks, VDD INT=1.2 V.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 25 Parameter Condition Min. Typ. Max. Unit Typical average RX current Measured under continuous RX with MCU stop/Flash doze 8.4 mA Typical average TX (0 dBm) current Measured under continuous TX with MCU stop/Flash doze 7.6 mA Typical average RX current Measured under continuous RX with MCU run/Flash enabled 10.2 mA Typical average TX (0 dBm) current Measured under continuous TX with MCU run/Flash enabled 9.6 mA Low Power Mode current Current consumption in very low leakage stop mode VLLS1 0.67 1.07 µA

4.5 Internal Operating Frequencies

Symbol Parameter Condition Max. Unit fSYS System and core clock Normal run mode 48 MHz fBUS Bus clock Normal run mode 24 fFLASH Flash clock fLPTMR LPTMR clock fSYS System and core clock VLPR and VLPS mode 4 fBUS Bus clock VLPR and VLPS mode3 1 fFLASH Flash clock fLPTMR LPTMR clock4 VLPR and VLPS mode3 24 fERCLK External reference clock VLPR and VLPS mode3 16 fLPTMR-ERCLK LPTMR external reference clock fTPM TPM asynchronous clock VLPR and VLPS mode3 8 fLPUART0 LPUART0 asynchronous clock VLPR and VLPS mode3 12

4.6 Interface Specification

LPUART 4.6.1 See also  4.8 General Switching Specification. Signal Name Description I/O Pad LPUART0_RX Receive data I B4, E2, E6 LPUART0_TX Transmit data I/O A8, E1, F7 3 The frequency limitations in VLPR and VLPS modes here override any frequency specification listed in the timing specification for any other module. These same frequency limits apply to VLPS, whether VLPS was entered from RUN or from VLPR. 4 The LPTMR can be clocked at this speed in VLPR or VLPS only when the source is an external pin.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 26 Signal Name Description I/O Pad LPUART0_CTS_b Clear to send I B3, E5, F5 LPUART0_RTS_b Request to send O B5, C6, F8 Description Range Default Baud rate Programmable baud rates (13-bit modulo divider) 115 200 Data bits Programmable 8-bit or 9-bit data format 8 data bits Parity bits Hardware parity generation and checking No parity Stop bit 1-2 One stop bit Inter-Integrated Circuit (I2C) 4.6.2 Two I2C channels See also  4.8 General Switching Specification. Signal Name Module Description I/O Pad I2C0_SCL I2C0 I2C serial clock line I/O B3, D1, E5 I2C0_SDA I2C0 I2C serial data line I/O B5, C6, D2 I2C1_SCL I2C1 I2C serial clock line I/O B4, E2, E6 I2C1_SDA I2C1 I2C serial data line I/O A8, E1, F7 I2C timing Compare  Figure 1. Symbol Description Standard Mode Fast Mode Unit Min. Max. Min. Max. fSCL SCL clock frequency 0 100 0 400 kHz tHD; STA Hold time (repeated) START condition. After this period, the first clock pulse is generated. 4 - 0.6 - µs tLOW LOW period of the SCL clock 4.7 - 1.3 - µs tHIGH HIGH period of the SCL clock 4 - 0.6 - µs tSU; STA Set-up time for a repeated START condition 4.7 - 0.6 - µs tHD; DAT Data hold time for I2C bus devices 05 3.456 07 0.96 µs 5 The master mode I2C deassert ACK of an address byte simultaneously with the falling edge of SCL. If no slaves acknowledge this address byte, then a negative hold time can result, depending on the edge rates of the SDA and SCL lines.

6 The maximum tHD; DAT must be met only if the device does not stretch the LOW period (tLOW) of the SCL

signal. 7 Input signal Slew=10 ns and Output Load=50 pF.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 27 Symbol Description Standard Mode Fast Mode Unit Min. Max. Min. Max. tSU; DAT Data set-up time 2508 - 1006,9 - ns tr Rise time of SDA and SCL signals - 1 000 20+0.1Cb 10 300 ns tf Fall time of SDA and SCL signals - 300 20+0.1Cb 9 300 ns tSU; STO Set-up time for STOP condition 4 - 0.6 - µs tBUF Bus free time between STOP and START condition 4.7 - 1.3 - µs tSP Width of spikes that must be suppressed by the input filter N/A N/A 0 50 µs Figure 1: Timing definition for fast and standard mode devices on the I2C bus. 8 Set-up time in slave-transmitter mode is 1 IPbus clock period, if the TX FIFO is empty.

9 A Fast mode I2C bus device can be used in a Standard mode I2C bus system, but the requirement tSU;

DAT≥250 ns must then be met. This is automatically the case, if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal then it must output the next data bit to the SDA line trmax + tSU; DAT=1 000+250=1 250 ns (according to the Standard mode I2C bus specification), before the SCL line is released. 10 Cb=total capacitance of the one bus line in pF.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 28 DMA Serial Peripheral Interface (DSPI) 4.6.3 Two independent SPI channels Master/Slave Signal Name Module Description I/O Pad SPI0_PCS0 SPI0 Chip Select/Slave Select I/O B3 SPI0_PCS1 SPI0 Chip Select O C4 SPI0_PCS2 SPI0 Chip Select O F7 SPI0_SCK SPI0 Serial Clock I/O B5 SPI0_SIN SPI0 Data In I A8 SPI0_SOUT SPI0 Data Out O B4 SPI1_PCS0 SPI1 Chip Select/Slave Select I/O B3 SPI1_SCK SPI1 Serial Clock I/O C3 SPI1_SIN SPI1 Data In I B2 SPI1_SOUT SPI1 Data Out O B6

4.6.3.1 DSPI Switching Specifications (Limited Voltage Range)

Compare  Figure 2. Symbol Description Min. Max. Unit Operating voltage 2.7 3.6 V Frequency of operation - 12 MHz DS1 DSPI_SCK output cycle time 2 x tBUS - ns DS2 DSPI_SCK output high/low time (tSCK/2)-2 (tSCK/2)+2 ns DS3 DSPI_PCSn valid to DSPI_SCK delay11 (tBUS x 2)-2 - ns DS4 DSPI_SCK to DSPI_PCSn invalid delay12 (tBUS x 2)-2 - ns DS5 DSPI_SCK to DSPI_SOUT valid - 8.5 ns DS6 DSPI_SCK to DSPI_SOUT invalid -2 - ns DS7 DSPI_SIN to DSPI_SCK input setup 16.2 - ns DS8 DSPI_SCK to DSPI_SIN input hold 0 - ns 11 The delay is programmable in SPIx_CTARn[PSSCK] and SPIx_CTARn[CSSCK]. 12 The delay is programmable in SPIx_CTARn[PASC] and SPIx_CTARn[ASC].

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 29 Figure 2: Master mode DSPI timing. Slave mode DSPI timing Compare  Figure 3. Symbol Description Min. Max. Unit Operating voltage 2.7 3.6 V Frequency of operation - 6 MHz DS9 DSPI_SCK output cycle time 4 x tBUS - ns DS10 DSPI_SCK output high/low time (tSCK/2)-2 (tSCK/2)+2 ns DS11 DSPI_SCK to DSPI_SOUT valid - 21.4 ns DS12 DSPI_SCK to DSPI_SOUT invalid 0 - ns DS13 DSPI_SIN to DSPI_SCK input setup 2.6 - ns DS14 DSPI_SCK to DSPI_SIN input hold 7 - ns DS15 DSPI_SS active to DSPI_SOUT driven - 14 ns DS16 DSPI_SS inactive to DSPI_SOUT not driven - 14 ns Figure 3: Slave mode DSPI timing.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 30

4.6.3.2 DSPI Switching Specifications (Full Voltage Range)

Compare  Figure 4. Symbol Description Min. Max. Unit Operating voltage13 1.71 3.6 V Frequency of operation - 12 MHz DS1 DSPI_SCK output cycle time 2 x tBUS - ns DS2 DSPI_SCK output high/low time (tSCK/2)-4 (tSCK/2)+4 ns DS3 DSPI_PCSn valid to DSPI_SCK delay14 (tBUS x 2)-4 - ns DS4 DSPI_SCK to DSPI_PCSn invalid delay15 (tBUS x 2)-4 - ns DS5 DSPI_SCK to DSPI_SOUT valid - 10 ns DS6 DSPI_SCK to DSPI_SOUT invalid -1.2 - ns DS7 DSPI_SIN to DSPI_SCK input setup 23.3 - ns DS8 DSPI_SCK to DSPI_SIN input hold 0 - ns Figure 4: Master mode DSPI timing. Slave mode DSPI timing Compare  Figure 5. Symbol Description Min. Max. Unit Operating voltage 1.71 3.6 V Frequency of operation - 6 MHz DS9 DSPI_SCK output cycle time 4 x tBUS - ns DS10 DSPI_SCK output high/low time (tSCK/2)-4 (tSCK/2)+4 ns DS11 DSPI_SCK to DSPI_SOUT valid - 29.1 ns 13The DSPI module can operate across the entire operating voltage for the processor, but to run across the full voltage range the maximum frequency of operation is reduced. 14The delay is programmable in SPIx_CTARn[PSSCK] and SPIx_CTARn[CSSCK]. 15The delay is programmable in SPIx_CTARn[PASC] and SPIx_CTARn[ASC].

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 31 Symbol Description Min. Max. Unit DS12 DSPI_SCK to DSPI_SOUT invalid 0 - ns DS13 DSPI_SIN to DSPI_SCK input setup 3.2 - ns DS14 DSPI_SCK to DSPI_SIN input hold 7 - ns DS15 DSPI_SS active to DSPI_SOUT driven - 25 ns DS16 DSPI_SS inactive to DSPI_SOUT not driven - 25 ns Figure 5: Slave mode DSPI timing. Carrier Modulator Timer (CMT) 4.6.4 See also  4.8 General Switching Specification. Signal Name Description I/O Pad CMT_IRO Carrier Modulator Transmitter Infrared Output O D2, E2 Touch Sensing Input (TSI) 4.6.5 Signal Name Description I/O Signal Pad TSI0_CH[15:0] Touch sensing input capacitive pins I/O TSI0_CH0 F5 TSI0_CH1 F8 TSI0_CH2 E6 TSI0_CH3 F7 TSI0_CH4 B5 TSI0_CH5 B4 TSI0_CH6 A8 TSI0_CH7 B3 TSI0_CH8 C4 TSI0_CH9 C5

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 32 Signal Name Description I/O Signal Pad TSI0_CH10 B6 TSI0_CH11 B2 TSI0_CH12 C3 TSI0_CH13 C2 TSI0_CH14 E2 TSI0_CH15 E1 TSI electrical specifications Symbol Description Min. Typ Max. Unit Ta Ambient temperature -30 - 75 °C TSI_RUNF Fixed power consumption in run mode - 100 - µA TSI_RUNV Variable power consumption in run mode (depends on oscillator's current selection) 1 - 128 µA TSI_EN Power consumption in enable mode - 100 - µA TSI_DIS Power consumption in disable mode - 1.2 - µA TSI_TEN TSI analog enable time - 66 - µs TSI_CREF TSI reference capacitor - 1 - pF TSI_DVOLT Voltage variation of VP and VM around nominal values 0.19 - 1.03 V General Purpose Input/Output (GPIO) 4.6.6 Signal Name Description I/O GPIO Pad PTA[19:16][2:0] General Purpose Input/Output I/O PTA0 C4 PTA1 C5 PTA2 A3 PTA16 B6 PTA17 B2 PTA18 C3 PTA19 C2 PTB[18][3:0] General Purpose Input/Output I/O PTB0 D1 PTB1 D2 PTB2 D3 PTB3 D4 PTB18 F3 PTC[19:16][7:0] General Purpose Input/Output I/O PTC0 E5 PTC1 A8 PTC2 E2

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 33 Signal Name Description I/O GPIO Pad PTC3 E1 PTC4 F5 PTC5 F8 PTC6 E6 PTC7 F7 PTC16 B5 PTC17 B4 PTC18 A8 PTC19 B3 The maximum input voltage on PTC0/1/2/3 is VDD+0.3 V. See also  4.8 General Switching Specification. Low-Leakage Wakeup (LLWU) 4.6.7 Signal Name Description I/O Signal Pad LLWU_P[15:0] Wakeup inputs I LLWU_P0 B5 LLWU_P1 B4 LLWU_P2 A8 LLWU_P3 B3 LLWU_P4 B6 LLWU_P5 B2 LLWU_P6 C3 LLWU_P7 C2 LLWU_P8 D1 LLWU_P9 E5 LLWU_P10 E2 LLWU_P11 E1 LLWU_P12 F5 LLWU_P13 F8 LLWU_P14 E6 LLWU_P15 F7

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 34 Radio Module Signals 4.6.8 Signal Name Description I/O Pad DTM_RX Direct test mode receive I B4, D2, DTM_TX Direct test mode transmit O A8, D3, BSM_CLK Bit streaming mode (BSM) clock signal, 802.15.4 packet data stream clock line O B3, F8 BSM_FRAME Bit streaming mode frame signal, 802.15.4 packet data stream frame line O B4, E6 BSM_DATA Bit streaming mode data signal, 802.15.4 packet data stream data line I/O A8, F5, RF_RESET Radio reset signal I B2 BLE_RF_ACTIVE Signal to indicate future Bluetooth Low Energy activity. O B3, C6 RF_NOT_ALLOWED Radio off signal, intended for Wi-Fi coexistence control I D3, F8 RX_SWITCH Front end module receive mode signal O E1 TX_SWITCH Front end module transmit mode signal O E2 Analog-to-Digital Converter (ADC) 4.6.9 Signal Name Description I/O Signal Pad ADC0_DM0 ADC channel 0 differential input negative I ADC0_DM0 F4 ADC0_DP0 ADC channel 0 differential input positive I ADC0_DP0 F3 ADC0_SE[5:1] ADC channel 0 single-ended input I ADC0_SE1 D2 ADC0_SE2 D4 ADC0_SE3 D3 ADC0_SE4 F6 ADC0_SE5 C2 16-bit ADC operating conditions Symbol Description Min. Typ16 Max. Unit VDDA Supply voltage absolute 1.71 - 3.6 V VOUT Internally generated ADC reference voltage output - 1.2 - V VREFL ADC reference voltage low - GND - 16 Typical values assume VDDA=3.0 V, Temp=25 °C, fADCK=1.0 MHz, unless otherwise stated. Typical values are for reference only, and are not tested in production.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 35 Symbol Description Min. Typ16 Max. Unit VADIN Input voltage 16-bit differential mode VREFL - 31/32∙VREF H V All other modes VREFL - VREFH CADIN Input capacitance pF 16-bit mode - 8 10 8-bit/10-bit/12-bit modes - 4 5 RADIN Input series resistance - 2 5 kΩ RAS Analog source resistance (external) 13-bit/12-bit modes fADCK<4 MHz - - 5 kΩ fADCK ADC conversion clock frequency17 MHz ≤13-bit mode 1 - 18 16-bit mode 2 - 12 Crate ADC conversion rate No ADC hardware averaging, continuous conversions enabled, subsequent conversion time ≤13-bit mode 20.000 - 818.330 ksps 16-bit mode 37.037 - 461.467 12-bit Digital-to-Analog Converter (DAC) 4.6.10 Signal Name Description I/O Pad DAC0_OUT DAC output O F6 12-bit DAC operating requirements Symbol Description Min. Max. Unit VDDA Supply voltage 1.71 3.6 V VDACR Reference voltage18 1.2 3.6 V CL Output load capacitance19 - 100 pF IL Output load current - 1 mA 17To use the maximum ADC conversion clock frequency, CFG2[ADHSC] must be set and CFG1[ADLPC] must be clear. 18 The DAC reference can be selected to be VDDA or VREFH=1.2 V. 19 A small load capacitance (47 pF) can improve the bandwidth performance of the DAC.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 36 12-bit DAC operating behaviors Symbol Description Min. Typ Max. Unit IDDA_DACLP Supply current, low-power mode - - 250 µA IDDA_DACHP Supply current, high speed mode - - 900 µA tDACLP Full-scale settling time (0x080 to 0xF7F), low-power mode20 - 100 200 µs tDACHP Full-scale settling time (0x080 to 0xF7F), high-speed mode20 - 15 30 µs tCCDACLP Code-to-code settling time (0xBF8 to 0xC08), low-power mode and high-speed mode20 - 0.7 1 µs Vdacoutl DAC output voltage range low - high-speed mode, no load, DAC set to 0x000 - - 100 mV Vdacouth DAC output voltage range high – high-speed mode, no load, DAC set to 0xFFF VDACR-100 - VDACR mV INL Integral non-linearity error, high-speed mode21 - - ±8 LSB DNL Differential non-linearity error, VDACR > 2 V22 - - ±1 LSB DNL Differential non-linearity error, VDACR =VREF_OUT23 - - ±1 LSB VOFFSET Offset error24 - ±0.4 ±0.8 %FSR EG Gain error24 - ±0.1 ±0.6 %FSR PSRR Power supply rejection ratio, VDDA ≥ 2.4 V 60 - 90 dB TCO Temperature coefficient offset voltage25 - 3.7 - µV/C TGE Temperature coefficient gain error - 0.000421 - %FSR/C ROP Output resistance (load=3 kΩ) - - 250 Ω 20 Settling within ±1 LSB. 21The INL is measured for 0+100 mV to VDACR -100 mV. 22The DNL is measured for 0+100 mV to VDACR -100 mV. 23The DNL is measured for 0+100 mV to VDACR -100 mV with VDDA>2.4 V. 24Calculated by a best fit curve from VSS+100 mV to VDACR – 100 mV. 25VDDA=3 V, reference select set for VDDA (DACx_CO:DACRFS=1), high-power mode (DACx_C0:LPEN=0), DAC set to 0x800, temperature range is across the full range of the device.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 37 Symbol Description Min. Typ Max. Unit SR Slew rate High-power 1.2 1.7 V/µs Low-power 0.05 0.12 BW 3 dB bandwidth High-power 550 - - kHz Low-power 40 - - Analog Comparator (CMP) 4.6.11 Signal Name Description I/O Signal Pad CMP0_IN[5:0] Analog voltage inputs I CMP0_IN0 F3 CMP0_IN1 F4 CMP0_IN2 F6 CMP0_IN3 D3 CMP0_IN4 D4 CMP0_IN5 D2 CMP0_OUT Comparator output O CMP0_OUT D1 CMP and 6-bit DAC electrical specifications Symbol Description Min. Typ Max. Unit VDD Supply voltage 1.71 - 3.6 IDDHS Supply current, high-speed mode (EN=1, PMODE=1) - - 200 µA IDDLS Supply current, low-speed mode (EN=1, PMODE=0) - - 20 µA VAIN Analog input voltage VSS-0.3 - VDD V VAIO Analog input offset voltage - - 20 mV VH Analog comparator hysteresis26 CR0[HYSTCTR]=00 - 5 mV CR0[HYSTCTR]=01 - 10 - CR0[HYSTCTR]=10 - 20 - CR0[HYSTCTR]=11 - 30 - VCMPOh Output high VDD-0.5 - - V VCMPOl Output low - - 0.5 V tDHS Propagation delay, high-speed mode (EN=1, PMODE=1) 20 50 200 ns 26Typical hysteresis is measured with input voltage range limited to 0.6 to VDD-0.6 V.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 38 Symbol Description Min. Typ Max. Unit tDLS Propagation delay, low-speed mode (EN=1, PMODE=0) 80 250 600 ns Analog comparator initialization delay27 - - 40 µs IDAC6b 6-bit DAC current adder (enabled) - 7 - µA INL 6-bit DAC integral non-linearity -0.5 - 0.5 LSB28 DNL 6-bit DAC differential non-linearity -0.3 - 0.3 LSB Timer 4.6.12 Signal Name Module Description I/O Signal Pad TPM_CLKIN[1:0] TPM0 External clock I TPM_CLKIN0 F6 TPM_CLKIN1 B2 TPM0_CH[3:0] TPM0 TPM channel I/O TPM0_CH0 F6,B2 TPM0_CH1 D1, E1 TPM0_CH2 C6, D2 TPM0_CH3 A3, B5 TPM_CLKIN[1:0] TPM1 External clock I TPM_CLKIN0 F6 TPM_CLKIN1 B2 TPM1_CH[1:0] TPM1 TPM channel I/O TPM1_CH0 C4, C5, F5 TPM1_CH1 D3, D4, F8 TPM_CLKIN[1:0] TPM2 External clock I TPM_CLKIN0 F6 TPM_CLKIN1 B2 TPM2_CH[1:0] TPM2 TPM channel I/O TPM2_CH0 C3, E6 TPM2_CH1 C2, F7 LPTMR0_ALT[2:1] LPTMR0 Pulse counter input pin I LPTMR0_ALT1 D2 LPTMR0_ALT2 F8 RTC_CLKOUT RTC Module 1 Hz square-wave output O RTC_CLKOUT D4 Clocks 4.6.13 Signal Name Description I/O Pad CLKOUT Internal clocks monitor O D1, D4 XTAL_OUT_EN 32 MHz clock output enable I D1, E6 27Comparator initialization delay is defined as the time between software writes to change control inputs (Writes to CMP_DACCR[DACEN], CMP_DACCR[VRSEL], CMP_DACCR[VOSEL], CMP_MUXCR[PSEL], and CMP_MUXCR[MSEL]) and the comparator output settling to a stable level.

281 LSB=Vreference/64

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 39 Serial Wire Debug (SWD) 4.6.14 Signal Name Description Comment I/O Pad SWD_DIO Serial wire debug data Input/Output Pulled up internally by default I/O C4 SWD_CLK Serial wire clock Pulled down internally by default I C5 SWD full voltage range electricals See  Figure 6 and  Figure 7. Symbol Description Min. Max. Unit Operating voltage 1.71 3.6 V J1 SWD_CLK frequency of operation - 25 MHz J2 SWD_CLK cycle period 1/J1 - ns J3 SWD_CLK clock pulse width 20 - ns J4 SWD_CLK rise and fall times - 3 ns J9 SWD_DIO input data setup time to SWD_CLK rise 10 - ns J10 SWD_DIO input data hold time after SWD_CLK rise 0 - ns J11 SWD_CLK high to SWD_DIO data valid - 32 ns J12 SWD_CLK high to SWD_DIO high-Z 5 - ns Figure 6: SWD clock input timing.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 40 Figure 7: SWD data timing.

4.7 Flash Electrical Specifications

The following specifications represent the amount of time the internal charge pumps are active and do not include command overhead. Flash timing specifications (program and erase) Symbol Description Min. Typ Max. Unit thvpgm4 Longword program high-voltage time - 7.5 18 µs thversscr Sector erase high-voltage time29 - 13 113 ms thversblk256k Erase block high-voltage time for 256 KB29 - 104 904 ms Flash timing specifications (commands) Symbol Description Min. Typ Max. Unit trd1blk256k Read 1s block execution time30

256 KB program flash

• - 1.7 ms trd1sec2k Read 1s section execution time (flash sector)30 - - 60 µs tpgmchk Program check execution time30 - - 45 µs trdrsrc Read resource execution time30 - - 30 µs tpgm4 Program longword execution time - 65 145 µs 29Maximum time based on expectations at cycling end-of-life. 30Assumes 25 MHz flash clock frequency.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 41 Symbol Description Min. Typ Max. Unit tersblk256k Erase flash block execution time31

• 250 1 500 ms tersscr Erase flash sector execution time31 - 14 114 ms trd1all Read 1s all blocks execution time30 - - 1.8 ms trdonce Read once execution time30 - - 30 µs tpgmonce Program once execution time - 100 - µs tersall Erase all blocks execution time31 - 500 3 000 ms tvfykey Verify backdoor access key execution time30 - - 30 µs tersallu Erase all blocks unsecure execution time31 - 500 3 000 ms Flash high voltage current behaviors Symbol Description Min. Typ Max. Unit IDD_PGM Average current adder during high voltage flash programming operation - 2.5 6 mA IDD_ERS Average current adder during high voltage flash erase operation - 1.5 4 mA

4.8 General Switching Specification

These specifications apply to GPIO, LPUART, CMT, and I2C signals. Description Min. Max. Unit GPIO pin interrupt pulse width (digital glitch filter disabled), Synchronous path32,33 1.5 - Bus clock cycles Reset pin interrupt pulse width (analog filter enabled), Asynchronous path34 200 - ns GPIO pin interrupt pulse width (digital glitch filter disabled, analog filter disabled), Asynchronous path5 20 - ns External RESET_b input pulse width (digital glitch filter disabled) 100 - ns 31Maximum times for erase parameters based on expectations at cycling end-of-life. 32This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry in run modes. 33The greater of synchronous and asynchronous timing must be met. 34This is the minimum pulse width that is guaranteed to be recognized.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 42 Description Min. Max. Unit Port rise and fall time (low drive strength)35,36 Slew enabled 1.71 ≤ VDD ≤ 2.7 V - 25 ns 2.7 ≤ VDD ≤ 3.6 V - 16 Slew disabled 1.71 ≤ VDD ≤ 2.7 V - 8 2.7 ≤ VDD ≤ 3.6 V - 6 Port rise and fall time (low drive strength)37,38 Slew enabled 1.71 ≤ VDD ≤ 2.7 V - 24 ns 2.7 ≤ VDD ≤ 3.6 V - 16 Slew disabled 1.71 ≤ VDD ≤ 2.7 V - 10 2.7 ≤ VDD ≤ 3.6 V - 6 35PTB0, PTB1, PTC0, PTC1, PTC2, PTC3, PTC6, PTC7, PTC17, PTC18. 3675 pF load. 37Ports A, B, and C 3825 pF load

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 43

4.9 Transceiver Feature Summary

The PAN4620 module meets or exceeds all Bluetooth Low Energy 4.2 and IEEE 802.15.4 performance specifications applicable to 2.4 GHz ISM and MBAN (Medical Band Area Network) bands. Channel Plan 4.9.1 Channel Plan for Bluetooth Low Energy Band Carrier frequency [MHz]39 Channel number k Channel Plan for IEEE 802.15.4 Band Carrier frequency [MHz]40 Channel number k Receiver Feature Summary 4.9.2 The current consumption and sensitivity depend on the user scenario. Assume VDD=3.6 V, Tamb=25 °C, if nothing else is stated. Symbol Description40 Min. Typ. Max. Unit IRXon Supply current RX On (VDD=3.6 V)41 - 6.8 - mA fIN Input RF frequency 2.36 - 2.4835 GHz SENSGFSK GFSK RX sensitivity (250 kbps GFSK-BT=0.5, h=0.5) - -100 - dBm SENSBLE Bluetooth Low Energy RX sensitivity42 - -95 - dBm SENS15.4 IEEE 802.15.4 RX sensitivity43 - -100 - dBm RSSIRange Receiver signal strength indicator range44 -100 - 5 dBm 39All the RX parameters are measured at the PAN4620 RF bottom pad. 40All the RX parameters are measured at the PAN4620 RF bottom pad. 41Transceiver power consumption. (As opposed to overall module power consumption.) 42Measured at 0.1 % BER using 37 byte long packets in max. gain mode and nominal conditions. 43In max. gain mode and nominal conditions. 44RSSI performance in narrowband mode.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 44 Symbol Description40 Min. Typ. Max. Unit RSSIRes Receiver signal strength indicator resolution - 1 - dBm Typical RSSI variation over frequency -2 - 2 dB Typical RSSI variation over temperature 2 - 2 dB RSSIACC Narrowband RSSI accuracy45 -3 - 3 dBm BLEco-channel Bluetooth Low Energy Co-channel Interference (Wanted signal at -67 dBm, BER <0.1 %. Measurement resolution 1 MHz) - -7 - dB 15.4co-channel IEEE 802.15.4 Co-channel Interference (Wanted signal 3 dB over reference sensitivity level) - -2 - dB Transmitter Feature Summary 4.9.3 The current consumption and output power depend on the user scenario. Assume VDD=3.6 V, Tamb=25 °C, if nothing else is stated. Symbol Description46 Min. Typ. Max. Unit ITXon

47 Supply current TX On with PRF=0 dBm

(VDD=3.6 V) - 6.1 - mA fc Output Frequency 2.36 - 2.4835 GHz PRFmax Maximum RF Output power - 3.5 - dBm PRFmin Minimum RF Output power - -30 - dBm PRFCR RF Output power control range - 33.5 - dB Fdev15.4 IEEE 802.15.4 Peak frequency deviation - 500 - kHz EVM15.4 IEEE 802.15.4 Error Vector Magnitude (EVM)48 - 4.5 - % Δf1avg,BLE Bluetooth Low Energy average frequency deviation using a 00001111 modulation sequence - 250 - kHz Δf2avg,BLE Bluetooth Low Energy average frequency deviation using a 01010101 modulation sequence - 220 - kHz Fcdev,BLE

49 Bluetooth Low Energy Maximum Deviation of

• 10 - kHz 45With one point calibration over frequency and temperature. 46All the TX parameters are measured at the chip RF output. 47Receiver power consumption. (As opposed to overall module power consumption.) 48Measured as per IEEE Standard 802.15.4 49Maximum drift of carrier frequency of the PLL during a BLE packet with a nominal 32 MHz reference crystal.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 45 Symbol Description46 Min. Typ. Max. Unit Bluetooth Low Energy Frequency Hopping Support Yes TXH2 2nd Harmonic of Transmit Carrier Frequency (for Pout=PRF,max), - -65 - dBm/ MHz TXH3 3rd Harmonic of Transmit Carrier Frequency (for Pout=PRF,max), - -41 - dBm/ MHz Transmitter output power temperature dependence Symbol Description50 -40 °C 25 °C 75 °C Unit PRF,max Typical maximum RF Output power 4.5 3.5 2.1 dBm PRF,min Typical minimum RF Output power -30.1 -31.1 -32.6 dBm

4.10 Reliability Tests

The measurement should be done after the test device has been exposed to room temperature and humidity for one hour. No. Item Limit Condition

1 Variable

(VVT) Electrical parameter should be in specification Freq.: 20~2 000 Hz, Acc.: 17 50 G, Sweep: 8 min, 2 hours each of XYZ axis

2 Shock Drop

Test (DT) Electrical parameter should be in specification Drop parts on concrete from a height of 1 m for 3 times

3 Heat-Shock/

(TC) Electrical parameter should be in specification at -40 °C and +75 °C for 1 h/cycle Total=300 cycles

4 Temperature

Test (THB) Electrical parameter should be in specification

5 Low

Test (LTSL) Electrical parameter should be in specification At -40 °C, 300 h

6 High

Test (HTSL) Electrical parameter should be in specification At +85 °C, 300 h 50All the TX parameters are measured at the chip RF output.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 46

4.11 Recommended Soldering Profile

 Reflow permissible cycles: 2  Opposite side reflow is prohibited due to module weight  More than 75 percent of the soldering area shall be coated by solder  The soldering profiles should be adhered to in order to prevent electrical or mechanical damage  Soldering profile assumes lead-free soldering

 802.15.4 and Bluetooth LE Module

5 Cautions

Product Specification Rev. 1.1 Page 47 Failure to follow the guidelines set forth in this document may result in degrading of the module functions and damage to the module.

5.1 Design Notes

1. Follow the conditions written in this specification, especially the control signals of this module. 2. The supply voltage should abide by the maximum ratings ( 4.2 Absolute Maximum Ratings). 3. The supply voltage must be free of AC ripple voltage (for example from a battery or a low noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in series connection and a bypass capacitor to ground of at least 47 µF directly at the module). 4. This module should not be mechanically stressed when installed. 5. Keep this module away from heat. Heat is the major cause of decreasing the life time of these modules. 6. Avoid assembly and use of the target equipment in conditions where the module temperature may exceed the maximum tolerance. 7. Keep this module away from other high frequency circuits. 8. Refer to the recommended pattern when designing a board.

5.2 Installation Notes

1. Reflow soldering is possible twice based on the conditions set forth in  4.11 Recommended Soldering Profile. Set up the temperature at the soldering portion of this module according to this reflow profile. 2. Carefully position the module so that the heat will not burn into printed circuit boards or affect other components that are susceptible to heat. 3. Carefully locate the module, to avoid an increased temperature caused by heat generated by neighboring components. 4. If a vinyl-covered wire comes into contact with the module, the wire cover will melt and generate toxic gas, damaging the insulation. Never allow contact between a vinyl cover and these modules to occur. 5. This module should not be mechanically stressed or vibrated when reflowed. 6. To repair the board by hand soldering, follow the conditions set forth in this chapter. 7. Do not wash this product. 8. Pressing on parts of the metal cover or fastening objects to the metal will cause damage to the module.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 48

5.3 Usage Condition Notes

1. Take measures to protect the module against static electricity. If pulses or transient loads (a large load, which is suddenly applied) are applied to the modules, check and evaluate their operation before assembly of the final products. 2. Do not use dropped modules. 3. Do not touch, damage, or soil the pins. 4. Follow the recommended condition ratings about the power supply applied to this module. 5. Electrode peeling strength: Do not apply a force of more than 4.9 N in any direction on the soldered module. 6. Pressing on parts of the metal cover or fastening objects to the metal cover will cause damage. 7. These modules are intended for general purpose and standard use in general electronic equipment, such as home appliances, office equipment, information, and communication equipment.

5.4 Storage Notes

1. The module should not be stressed mechanically during storage. 2. Do not store these modules in the following conditions or the performance characteristics of the module, such as RF performance will be adversely affected: – Storage in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX, – Storage in direct sunlight, – Storage in an environment where the temperature may be outside the range of 5 °C to 35 °C, or where the humidity may be outside the 45 % to 85 % range, – Storage of the modules for more than one year after the date of delivery storage period: Please check the adhesive strength of the embossed tape and soldering after 6 months of storage. 3. Keep this module away from water, poisonous gas, and corrosive gas. 4. This module should not be stressed or shocked when transported. 5. Follow the specification when stacking packed crates (max. 10).

5.5 Safety Cautions

These specifications are intended to preserve the quality assurance of products and individual components. Before use, check and evaluate the operation when mounted on your products. Abide by these specifications without deviation when using the products. These products may shor t-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, provide the following failsafe functions as a minimum:

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 49 1. Ensure the safety of the whole system by installing a protection circuit and a protection device. 2. Ensure the safety of the whole system by installing a redundant circuit or another system to prevent a single fault causing an unsafe status.

5.6 Other Cautions

1. Do not use the module for other purposes than those listed in  5.3 Usage Condition Notes. 2. Be sure to provide an appropriate fail-safe function on your product to prevent any additional damage that may be caused by the abnormal function or the failure of the module. 3. This module has been manufactured without any ozone chemical controlled under the Montreal Protocol. 4. These modules are not intended for use under the special conditions shown below. Before using these modules under such special conditions, carefully check their performance and reliability under the said special conditions to determine whether or not they can be used in such a manner: – In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash, – In direct sunlight, outdoors, or in a dusty environment, – In an environment where condensation occurs, – In an environment with a high concentration of harmful gas (e. g. salty air, HCl, Cl2, SO2, H2S, NH3, and NOX). 5. If an abnormal voltage is applied due to a problem occurring in other components or circuits, replace these modules with new modules, because they may not be able to provide normal performance even if their electronic characteristics and appearances appear satisfactory. 6. When you have any question or uncertainty, contact Panasonic.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 50

5.7 Restricted Use

Life Support Policy 5.7.1 This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support appliances, devices, or systems where malfunction can reasonably be expected to result in a significant personal injury to the user, or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Panasonic customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any damages resulting. Restricted End Use 5.7.2 This Panasonic Industrial Devices Europe GmbH product is not designed for any restricted activity that supports the development, production, handling usage, maintenance, storage, inventory or proliferation of any weapons or military use. Transfer, export, re-export, usage or reselling of this product to any destination, end user or any end use prohibited by the European Union, United States or any other applicable law is strictly prohibited.

 802.15.4 and Bluetooth LE Module

6 Regulatory and Certification Information

Product Specification Rev. 1.1 Page 51 The RF synthesizer within the PAN4620 can be configured to use any channel frequency between 2.36 GHz and 2.487 GHz. However, the information given in  6 Regulatory and Certification Information is only valid within the ISM frequency band starting at 2.4 GHz. To not void the precertification and to be sure you are not violating regulatory requirements, use the certified Bluetooth LE, Thread, and Zigbee wireless stacks. To not void the precertification and to ensure compliance with regulatory requirements study the integration guide for this module carefully and follow the given instructions. The Integration guide can be downloaded  1.4 Related Documents.

6.1 Federal Communications Commission (FCC) for US

FCC Notice 6.1.1 The PAN4620 including the antennas, which are listed in  6.1.5 Approved Antenna List, complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407. The transmitter operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. Caution 6.1.2 The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Panasonic Industrial Devices Europe GmbH may void the user's authority to operate the equipment.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 52 This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates us es and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installa tion. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna,
• Increase the separation between the equipment and receiver,
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected,
• Consult the dealer or an experienced radio/TV technician for help. Label Requirements 6.1.3 The OEM must ensure that FCC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Panasonic FCC identifier for this product as well as the FCC Notice above. The FCC identifier is FCC ID: T7V4620. This FCC identifier is valid for the PAN4620. The end product must in any case be labelled on the exterior with: "Contains FCC ID: T7V4620" Antenna Warning 6.1.4 This antenna warning refers to the test device with the model number PAN4620  7.1 Ordering Information The device is tested with a standard SMA connector and with the antenna listed below. When integrated into the OEM’s product, these fixed antennas require installation preventing end users from replacing them with non-approved antennas. Any antenna not in the following table must be tested to comply with FCC Section 15.203 for unique antenna connectors and with Section 15.247 for emissions. The FCC identifier for the device with the antenna listed in  6.1.5 Approved Antenna List is the same (FCC ID: T7V4620).

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 53 Approved Antenna List 6.1.5 Item Part Number Manufacturer Frequency Band Type Max. Gain (dBi) 1 ANT016008LCS2442MA1 TDK 2.4 GHz Chip antenna 1.6 RF Exposure 6.1.6 To comply with FCC RF Exposure requirements, the OEM must ensure that only antennas from the Approved Antenna List are installed  6.1.5 Approved Antenna List. The preceding statement must be included as a CAUTION statement in manuals for products operating with the approved antennas in the previous table to alert users on FCC RF Exposure compliance. Any notification to the end user of installation or removal instructions about the integrated radio module is not allowed. The radiated output power of the PAN4620 with a mounted ceramic antenna (FCC ID: T7V4620) is below the FCC radio frequency exposure limits. Nevertheless, the PAN4620 shall be used in such a manner that the potential for human contact during normal operation is minimized. End users may not be provided with the module installation instructions. OEM integrators and end users must be provided with transmitter operating conditions for satisfying RF exposure compliance. Integration Instructions for Host Product Manufacturers According to KDB 6.1.7

996369 D03 OEM Manual v01

2.2 List of applicable FCC rules

FCC part 15.247 operation within the bands 902 MHz to 928 MHz, 2 400 MHz to 2 483.5 MHZ, and 5 725 MHz to 5 850 MHz.

2.3 Specific operational use conditions

Please refer to  5 Cautions and especially part  5.3 Usage Condition Notes.

2.4 Limited module procedures

This has a single-modular transmitter approval.

2.5 Trace antenna designs

The module has a ceramic chip antenna instead of a trace antenna. For guidance regarding the PCB layout please refer to the PAN4620 Integration Guide  7.3.2 Product Information.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 54 Section Topic and comment

2.6 RF exposure considerations

Please refer to  6.1.6 RF Exposure and also read the “PAN4620 Integration Guide” carefully  7.3.2 Product Information. The FCC test report for the PAN4620 states that the power density levels for FCC at a distance of 20 cm are below the maximum levels allowed by regulations.

2.7 Antennas

For information about the antenna configuration please refer to  6.1.4 Antenna Warning and  6.1.5 Approved Antenna List.

2.8 Label and compliance information

For guidance regarding the required labeling please refer to  6.1.3 Label Requirements.

2.9 Information on test modes and additional testing requirements

Please read the “PAN4620 Integration Guide” carefully  7.3.2 Product Information. It offers guidance for PCB Layout and also relevant software.

2.10 Additional testing, Part 15 Subpart B disclaimer

The PAN4620 is only FCC authorized for the specific rule FCC part 15.247. The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the PAN4620 installed.

6.2 Innovation, Science, and Economic Development (ISED) for

The PAN4620 is licensed to meet the regulatory requirements of ISED. License ID: IC: 216Q-4620 Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits. Users can obtain Canadian information on RF exposure and compliance from www.ic.gc.ca. This device has been designed to operate with the antennas listed in  6.1.5 Approved Antenna List, having a maximum gain of +1.6 dBi. Antennas not included in this list or having a gain greater than +1.6 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. The antenna used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Due to the model size, the IC identifier is displayed in the installation instruction only and it cannot be displayed on the module’s label due to the limited size. French PAN1762 est garanti conforme aux dispositions règlementaires d’Industry Canada (ISED). License: IC: 216Q-4620

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 55 Il est recommandé aux fabricants d’appareils fixes, mobiles ou portables de consulter la réglementation en vigueur et de vérifier la conformité de leurs produits relativement aux limites d’exposition aux rayonnements radiofréquence ainsi qu’au débit d’absorption spécifique maximum autorisé. Des informations pour les utilisateurs sur la réglementation Canadienne concernant l’exposition aux rayonnements RF sont disponibles sur le site www.ic.gc.ca. Ce produit a été développé pour fonctionner spécifiquement avec les antennes listées dans le tableau  6.1.5 Approved Antenna List, présentant un gain maximum de 1.6 dBi. Des antennes autres que celles listées ici, ou présentant un gain supérieur à 1.6 dBi ne doivent en aucune circonstance être utilisées en combinaison avec ce produit. L’impédance des antennes compatibles est 50 Ohm. L’antenne utilisée avec ce produit ne doit ni être située à proximité d’une autre antenne ou d’un autre émetteur, ni être utilisée conjointement avec une autre antenne ou un autre émetteur. En raison de la taille du produit, l’identifiant IC est fourni dans le manuel d’installation. IC Notice 6.2.1 English The device PAN4620 ( 7.1 Ordering Information), including the antennas ( 6.1.5 Approved Antenna List), complies with Canada RSS-GEN Rules. The device meets the requirements for modular transmitter approval as detailed in RSS-Gen. Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. French Le présent appareil PAN4620 ( 7.1 Ordering Information), les antennes y compris ( 6.1.5 Approved Antenna List), est conforme aux CNR-Gen d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: 1. L'appareil ne doit pas produire de brouillage, et 2. L'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 56 Labeling Requirements 6.2.2 English Labeling Requirements The OEM must ensure that IC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Panasonic IC identifier for this product as well as the IC Notice above. The IC identifier is: IC: 216Q-4620 This IC identifier is valid for all PAN4620 modules  7.1 Ordering Information. In any case, the end product must be labelled on the exterior with: "Contains IC: 216Q-4620”. French Obligations d’étiquetage Les fabricants d’équipements d’origine (FEO) – en anglais Original Equipment Manufacturer (OEM) – doivent s’assurer que les obligations d’étiquetage IC du produit final sont remplies. Ces obligations incluent une étiquette clairement visible à l’extérieur de l’emballage externe, comportant l’identifiant IC du module Panasonic inclus, ainsi que la notification ci-dessus. L’ identifiant IC est: IC: 216Q-4620 Cet identifiant est valide pour tous les modules PAN4620  7.1 Ordering Information. Dans tous les cas les produits finaux doivent indiquer sur leur emballage externe la mention suivante: "Contient IC: 216Q-4620”.

6.3 European Conformity According to RED (2014/53/EU)

All modules described in this Product Specification comply with the standards according to the following LVD (2014/35/EU), EMC-D (2014/30/EU) together with RED (2014/53/EU) articles: 3.1a Safety/Health: EN 62368-1:2014 EN 62311:2008

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 57 3.1b EMC: EN 301 489-1 V2.1.1:2017-02 EN 301 489-17 V3.1.1:2017-02 3.2 Radio: EN 300 328 V2.1.1:2016-11 As a result of the conformity assessment procedure described in 2014/53/EU Directive, the end customer equipment should be labelled as follows: The end customer has to assure that the device has a distance of more than 20 cm from the human body under all circumstances. The end customer equipment must meet the actual Safety/Health requirements according to RED. PAN4620 and its model versions in the specified reference design can be used in all countries of the European Economic Area (Member States of the EU, European Free Trade Association States [Iceland, Liechtenstein, Norway]), Monaco, San Marino, Andorra, and Turkey.

6.4 Bluetooth

Bluetooth end products which integrate the PAN4620 need to receive the following IDs at creation: Bluetooth 4.2 Declaration ID QDID Component (Tested) D031669 84040 Component (Tested) D031668 84041 End Product D044186 131815 Bluetooth Marks According to the Bluetooth SIG, the PAN4620 fulfills the criteria to label your product as a Bluetooth device: For further information please refer to the Bluetooth website www.bluetooth.com.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 58

6.5 RoHS and REACH Declaration

The latest declaration of environmental compatibility (Restriction of Hazardous Substances, RoHS and Registration, Evaluation, Authorisation and Restriction of Chemicals, REACH) for supplied products can be found on the Panasonic website in the “Downloads” section of the respective product  7.3.2 Product Information.

 802.15.4 and Bluetooth LE Module

7 Appendix

Product Specification Rev. 1.1 Page 59

7.1 Ordering Information

Order Number Brand Name Description MOQ51 ENWC9B01A1EF PAN4620 IEEE 802.15.4 and Bluetooth Low Energy Module 500 51The default MOQ for mass production is 500 pieces, fewer only on customer demand. Samples for evaluation can be delivered at any quantity via the distribution channels.

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 60

7.2 List of Acronyms

 802.15.4 and Bluetooth LE Module Product Specification Rev. 1.1 Page 61

7.3 Contact Details

Contact Us 7.3.1 Please contact your local Panasonic Sales office for details on additional product options and services: For Panasonic Sales assistance in the EU, visit https://eu.industrial.panasonic.com/about-us/contact-us Email: wireless@eu.panasonic.com For Panasonic Sales assistance in North America, visit the Panasonic website “Sales & Support” to find assistance near you at https://na.industrial.panasonic.com/distributors Please visit the Panasonic Wireless Technical Forum to submit a question at https://forum.na.industrial.panasonic.com Product Information 7.3.2 Please refer to the Panasonic Wireless Connectivity website for further information on our products and related documents: For complete Panasonic product details in the EU, visit http://pideu.panasonic.de/products/wireless-modules.html For complete Panasonic product details in North America, visit http://www.panasonic.com/rfmodules