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Bluetooth Basic Data Rate and Low Energy Module Product Specification Rev. 1.2 Wireless Modules
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 2 Overview Panasonic’s new PAN1326C is a Host Controlled Interface (HCI) Bluetooth RF module that brings Texas Instrument’s seventh generation Bluetooth core integrated circuit, the CC2564C, to an easy-to-use module format. The PAN1326C is Bluetooth 4.2 compliant and it offers best-in-class RF performance with about twice the range of other Bluetooth Low Energy solutions. Panasonic’s tiny footprint technology has produced a module of only 85.5 mm². The module is designed to accommodate PCBs pad pitch of 1.3 mm and as few as two layers for easy implementation and manufacturing. The module has been designed to be 100 percent pin-compatible with previous generations of Texas Instrument’s based Bluetooth HCI modules.
Features
- Bluetooth-4.2-compliant up to the HCI layer
- Best-in-class Bluetooth RF performance (Tx, Rx sensitivity, blocking)
- Dimensions: 9.0 mm x 9.5 mm x 1.8 mm
- Based upon TI’s CC2564C
- Interfaces: UART, GPIO, PCM Characteristics
- Bluetooth 4.2
- Receiver sensitivity -93 dBm
- Output power 11.5 dBm
- Power supply 1.7 V to 4.8 V
- Power consumption Tx 40 mA
- Power consumption Rx 20 mA
- Sleep mode 135 µA
- Operating temperature range -45 ºC to +85 ºC Block Diagram Chip Antenna Texas Instruments CC2564C BT-HCI Chip UART GPIOs Audio PCM/I2C Reset 32 kHz input Vcc 3.3 V LPF PAN1326C Bluetooth 4.2 Module BR/EDR/LE Crystal
26 MHz
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 3 By purchase of any of the products described in this document the customer accepts the document's validity and declares their agreement and understanding of it is contents and recommendations. Panasonic reserves the right to make changes as required at any time without notification. Please consult the most recently issued Product Specification before initiating or completing a design. © Panasonic Industrial Devices Europe GmbH 2017. This Product Specification is copyrighted. Reproduction of this document is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do not disclose it to a third party. All rights reserved. This Product Specification does not lodge the claim to be complete and free of mistakes. Engineering Samples (ES) If Engineering Samples are delivered to the customer, these samples have the status “Engineering Samples”. This means that the design of this product is not yet concluded. Engineering Samples may be partially or fully functional, and they may differ from the published Product Specification. Engineering Samples are not qualified and they are not to be used for reliability testing or series production. Disclaimer The customer acknowledges that samples may deviate from the Product Specification and may bear defects due to their status of development and the lack of qualification mentioned above. Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic disclaims liability for damages caused by: The use of the Engineering Sample other than for evaluation purposes, particularly the installation or integration in another product to be sold by the customer, Deviation or lapse in function of the Engineering Sample, Improper use of the Engineering Sample. Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental damages. In case of any queries regarding the Engineering Samples, please contact your local sales partner or the related product manager.
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 4 Table of Contents
PAN1326C Bluetooth Module
1 About This Document
Product Specification Rev. 1.2 Page 5
1.1 Purpose and Audience
This Product Specification provides details on the functional, operational, and electrical characteristics of the Panasonic PAN1326C module. It is intended for hardware design, application, and Original Equipment Manufacturer (OEM) engineers. The product is referred to as “the PAN1326C” or “the module” within this document.
1.2 Revision History
Revision Date Modifications/Remarks 1.0 01.11.2017 1st version 1.1 01.02.2018 Added Bluetooth QDIDs. 1.2 10.08.2018 Update layout and editorial changes.
1.3 Use of Symbols
Indicates important information for the proper use of the product. Non-observance can lead to errors. Attention Indicates important notes that, if not observed, can put the product’s functionality at risk. [chapter number] [chapter title] Cross reference Indicates cross references within the document. Example: Description of the symbols used in this document 1.3 Use of Symbols.
1.4 Related Documents
Please refer to the Panasonic website for related documents 6.2.2 Product Information.
PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.2 Page 6 Panasonic’s new PAN1326C is a Host Controlled Interface (HCI) Bluetooth RF module that brings Texas Instrument’s seventh generation Bluetooth core integrated circuit, the CC2564, to an easy-to-use module format. The PAN1326C is Bluetooth-4.2-compliant and it offers best in class RF performance with about twice the range of other Bluetooth Low Energy solutions. Panasonic’s tiny footprint technology has produced a module of only 85.5 mm². The module is designed to accommodate PCBs pad pitch of 1.3 mm and as few as two layers for easy implementation and manufacturing. The module has been designed to be 100 percent pin-compatible with previous generations of Texas Instruments-based Bluetooth HCI modules. Please refer to the Panasonic website for related documents 6.2.2 Product Information. Further information on the variants and versions 6.1 Ordering Information.
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 7
2.1 Block Diagram
Vcc 3.3 V LPF PAN1316C Bluetooth 4.2 Module BR/EDR/LE Crystal Vcc 3.3 V LPF PAN1326C Bluetooth 4.2 Module BR/EDR/LE Crystal
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 8 The Slow Clock 32.768 kHz is mandatory, otherwise the module does not start up 2.4 Clock Inputs. The IO are 1.8 V driven and might need external level shifter and LDO. The MLDO_OUT PIN can not be used as reference due to RF internal connection. The total capacity will not exceed 2.8 µF and the total inductance will not exceed 0 nH. There are no voltage multiplying or voltage boosting circuits.
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 9
2.2 Pin Configuration
9,00 mm 6,50 mm 18 12 Pad = 24 x 0.60mm x 0.60mm Module Height 1.8 mm 17 15 13 22 10 Pad = 28 x 0.60mm x 0.60mm Top View 9.00 0,55 1.80 9.50 0,60 18 12 A C B D
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 10 Pin Functions No Pin Name Pull at Reset Def. Dir. 1 I/O Type 2 Description
1 GND Connect to Ground
2 TX_DBG PU O 2 mA Logger output
3 HCI_CTS PU I 8 mA HCI UART clear-to-send
4 HCI_RTS PU O 8 mA HCI UART request-to-send
5 HCI_RX PU I 8 mA HCI UART data receive
6 HCI_TX PU O 8 mA HCI UART data transmit
7 AUD_FSYNC PD IO 4 mA PCM frame synchronisation (NC if not used) FailSafe3
8 SLOW_CLK_IN I 32.768-kHz clock in Fail Safe
9 NC IO Not connected
10 MLDO_OUT O Main LDO output (1.8 V nom.) 11 CL1.5_LDO_IN I PA LDO input
12 GND Connect to Ground
13 RF IO Bluetooth RF IO
14 GND Connect to Ground
15 MLDO_IN I Main LDO input
16 nSHUTD PD I Shutdown input (active low) 17 AUD_OUT PD O 4 mA PCM data output. (NC if not used) Fail Safe 18 AUD_IN PD I 4 mA PCM data input. (NC if not used) Fail Safe 19 AUD_CLK PD IO HY, 4 mA PCM clock. (NC if not used) Fail Safe
20 GND Connect to Ground
21 NC EEPROM I²C SDA (Internal)
22 VDD_IO PI I/O power supply 1.8 V Nom
23 NC EEPROM I²C SCL (Internal)
24 NC IO Not connected
1 I=input; O=output; IO=bidirectional; P=power; PU=pulled up; PD=pulled down
2 I/O Type: Digital I/O cells. HY=input hysteresis, current=typ. output current 3 No signals are allowed on the IO pins if no VDD_IO (Pin 22) power supplied, except pin 7, 8, 17-19.
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 11 For RF conducted measurements either use the PAN1323ETU or de-solder the antenna and solder an antenna connector to the hot pin. Pin Description No Pin Name Pull at Reset Def. Dir. 4 I/O Type 5 Description
7 AUD_FYSNC PD IO 4 mA PCM frame synchronisation (NC if not used) Fail safe
19 AUD_CLK PD IO HY, 4 mS PCM clock (NC if not used) Fail safe
18 AUD_IN PD I 4 mA PCM data input (NC if not used) Fail safe
17 AUD_OUT PD O 4 mA PCM data output (NC if not used) Fail safe
TX_DBG PU O 2 mA Logger output OPTION: nTX_DBG - logger out (low=1) 8 SLOW_CLK_IN I 32.768 kHz clock in Fail safe
13 RF IO Bluetooth RF IO (not connected with antenna)
16 nSHUTD PD I Shutdown input (active low) 22 VDD_IO PI I/O power supply 1.8 V Nom
15 MLDO_IN I
Connect directly to battery or to a pre-regulated 1.8 V supply 10 MLDO_OUT O Main LDO output (1.8 V nom.) Can not be used as 1.8 V supply due to internal connection to the RF part 11 CL1.5_LDO_IN I PA LDO input Connect directly to battery or to a pre-regulated 1.8 V supply
1 GND P Connect to Ground
12 GND P Connect to Ground
14 GND P Connect to Ground
20 GND P Connect to Ground
23 NC PU/PD I HY, 4 mA EEPROM I²C SCL (Internal)
21 NC PU/PD IO HY, 4 mA EEPROM I²C IRQ (Internal)
4 I=input; O=output; IO=bidirectional; P=power; PU=pulled up; PD=pulled down
5 I/O Type: Digital I/O cells. HY=input hysteresis, current=typ. output current
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 12 HCI_CTS is an input signal to the CC2564C device:
- When HCI_CTS is low, then CC2564C is allowed to send data to Host device.
- When HCI_CTS is high, then CC2564C is not allowed to send data to Host device.
2.3 Device Power Supply
The PAN1326C Bluetooth radio solution is intended to work in devices with a limited power budget such as cellular phones, headsets, hand-held PC’s and other battery-operated devices. One of the main differentiators of the PAN1326C is its power management – it is ability to draw as little current as possible. The PAN1326C device requires two kinds of power sources: 1. Main power supply for the Bluetooth - VDD_IN=VBAT 2. Power source for the 1.8 V I/O ring - VDD_IO The PAN1326C includes several on-chip voltage regulators for increased noise immunity. The PAN1326C can be connected either directly to the battery or to an external 1.8 V DC to DC converter. Three ways to supply power 1. Full-VBAT system (Maximum RF output power, but not optimum system power):
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 13 2. Full-DC2DC system (Lower RF output power, but optimum system power): 3. Mixed DC2DC-VBAT system (Maximum RF output power and optimum system power, but requires routing of VBAT):
2.4 Clock Inputs
The Slow Clock is always supplied from an external source. It is connected to the SLOW_CLK_IN pin number 8 and can be a digital signal with peak to peak of 0 V - 1.8 V. The Slow Clock's frequency accuracy must be 32.768 kHz 250 ppm for Bluetooth usage (according to the Bluetooth specification). The Slow Clock 32.768 kHz is mandatory to start the internal controller; otherwise the module does not start up.
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 14
2.5 Bluetooth Features
- Bluetooth 4.2 compliant up to the HCI layer
- Up to seven active devices
- Scatternet: up to three piconets simultaneously, one as master and two as slaves
- Up to two Synchronous Connection Oriented (SCO) links on the same piconet
- Support for All Voice Air-Coding - Continuously Variable Slope Delta (CVSD), A-law, µ-law, modified Subband Coding (mSBC), and transparent (uncoded)
- Assisted mode for HFP 1.6 Wideband Speech (WBS) profile or A2DP profile to reduce host processing and power
- Support of multiple Bluetooth profiles with enhanced QoS
- Multiple sniff instances tightly coupled to achieve minimum power consumption
- Independent buffering for Low Energy allows large numbers of multiple connections without affecting BR or EDR performance
- Built-in coexistence and prioritization handling for BR, EDR, and Low Energy
- Capabilities of link layer topology Scatternet - can act concurrently as peripheral and central
- Network support for up to 10 devices
- Time line optimization algorithms to achieve maximum channel utilization
2.6 Interfaces
2.6.1 Host Controller Interface (HCI)
The CC2564C incorporates one UART module dedicated to the host controller interface (HCI) transport layer. The HCI interface transports commands, events, ACL, and synchronous data between the Bluetooth device and it is host using HCI data packets. The UART module supports H4 (4-wires) protocol with maximum baud rate of 4 Mbps for all fast clock frequencies. After power up the baud rate is set for 115.2 kbps, irrespective of fast clock frequency. The baud rate can thereafter be changed with a vendor specific command. The CC2564C responds with a Command Complete Event (still at 115.2 kbps), after which the baud rate change takes place. HCI hardware includes the following features:
- Receiver detection of break, idle, framing, FIFO overflow, and parity error conditions
- Transmitter underflow detection
- CTS/RTS hardware flow control The interface includes four signals: TXD, RXD, CTS, and RTS. Flow control between t he host and the CC2564C is byte-wise by hardware. Flow control is obtained by the following:
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 15 When the UART RX buffer of the CC2564C passes the “flow control” threshold, it will set the UART_RTS signal high to stop transmission from the host. When the UART_CTS signal is set high, the CC2564C will stop it is transmission on the interface. In case HCI_CTS is set high in the middle of transmitting a byte, the CC2564C will finish transmitting the byte and stop the transmission.
2.6.2 Audio/Voice CODEC Interface
The codec interface is a fully-dedicated programmable serial port that provides the logic to interface to several kinds of PCM or I2S codec’s. PAN1326C supports all voice coding schemes required by Bluetooth specification - Log PCM (A-Law or μ-Law) and Linear (CVSD). In addition, module also supports transparent scheme:
- Two voice channels
- Master/slave modes
- µ-Law, A-Law, Linear, Transparent coding schemes
- Long and short frames
- Different data sizes, order, and positions.
- High rate PCM interface for EDR
- Enlarged interface options to support a wider variety of codecs
- PCM bus sharing
2.6.2.1 PCM Hardware Interface
The PCM interface is one implementation of the codec interface. It contains the following four lines:
- Clock: configurable direction (input or output)
- Frame synchronisation: configurable direction (input or output)
- Data In: Input
- Data Out: Output/3-state The Bluetooth device can be either the master of the interface where it ge nerates the clock and the frame synchronisation signals, or slave where it receives these two signals. The PCM interface is fully configured by a vendor specific command. For slave mode, clock input frequencies of up to 16 MHz are supported. At clock rates above 12 MHz, the maximum data burst size is 32 bits. For master mode, the CC2564C can generate any clock frequency between 64 kHz and 6 MHz.
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 16 When the I2S bus is used in an application, it is recommended adding a low pass filter (series resistor and capacitor to GND) to the bus for better noise suppression. Connecting the host μController/DSP directly with the module’s I2S interface is not recommended. The suggested low pass filter component values are: 470 pF 120 Ω
2.6.2.2 Data Format
The data format is fully configurable:
- The data length can be from 8 bits to 320 bits, in 1 bit increments, when working with two channels, or up to 640 bits when using one channel. The Data length can be set independently for each channel.
- The data position within a frame is also configurable in with 1 clock (bit) resolution and can be set independently (relative to the edge of the frame synchronisation signal) for each channel.
- The Data_In and Data_Out bit order can be configured independently. For example; Data_In can start with the MSB while Data_Out starts with LSB. Each channel is separately configurable. The inverse bit order (that is, LSB first) is supported only for sample sizes up to 24 bits.
- It is not necessary for the data in and data out size to be the same length.
- The Data_Out line is configured to “high-Z” output between data words. Data_Out can also be set for permanent high-Z, irrespective of data out. This allows the CC2564C to be a bus slave in a multi-slave PCM environment. At power up, Data Out is configured as “high-Z”.
2.6.2.3 Frame Idle Period
The codec interface has the capability for frame idle periods, where the PCM clock can “take a break” and become “0” at the end of the PCM frame, after all data has been transferred. The CC2564C supports frame idle periods both as master and slave of the PCM bus. When CC2564C is the master of the interface, the frame idle period is configurable. There are two configurable parameters:
- Clk_Idle_Start - Indicates the number of PCM clock cycles from the beginning of the frame until the beginning of the idle period. After Clk_Idle_Start clock cycles, the clock will become “0”.
- Clk_Idle_End - Indicates the time from the beginning of the frame till the end of the idle period. This time is given in multiples of PCM clock periods. The delta between Clk_Idle_Start and Clk_Idle_End is the clock idle period. For example, for PCM clock rate=1 MHz, frame synchronisation period=10 kHz, Clk_Idle_Start=60, Clk_Idle_End=90. Between each two frame synchronisations there are 70 clock cycles (instead of 100). The clock idle period starts 60 clock cycles after the beginning of the frame, and lasts 90 – 60=30 clock cycles. This means that the idle period ends 100 – 90=10 clock cycles before the end of the frame. The data transmission must end prior to the beginning of the idle period.
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 17
2.6.2.4 Clock-Edge Operation
The codec interface of the CC2564C can work on the rising or the falling edge of the clock. It also has the ability to sample the frame synchronisation and the data at inversed polarity. This is the operation of a falling-edge-clock type of codec. The codec is the master of the PCM bus. The frame synchronisation signal is updated (by the codec) on the falling clock edge and therefore shall be sampled (by the CC2564C) on the next rising clock. The data from the codec is sampled (by the CC2564C) on the clock falling edge.
2.6.2.5 Two-Channel PCM Bus Example
In below figure, a 2-channel PCM bus is shown where the two channels have different word sizes and arbitrary positions in the bus frame. (FT stands for Frame Timer)
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 18
2.6.2.6 Audio Encoding
The CC2564C codec interface can use one of four audio-coding patterns:
- A-Law (8 bit)
- µ-Law (8 bit)
- Linear (8 bit or 16 bit)
2.6.2.7 Improved Algorithm For Lost Packets
The CC2564C features an improved algorithm for improving voice quality when received voice data packets are lost. There are two options:
- Repeat the last sample – possible only for sample sizes up to 24 bits. For sample sizes >24 bits, the last byte is repeated.
- Repeat a configurable sample of 8 bits to 24 bits (depends on the real sample size), in order to simulate silence (or anything else) in the PCM bus. The configured sample will be written in a specific register for each channel. The choice between those two options is configurable separately for each channel.
2.6.2.8 Bluetooth/PCM Clock Mismatch Handling
In Bluetooth RX, the CC2564C receives RF voice packets and writes these to the codec I/F. If the CC2564C receives data faster than the codec I/F output allows, an overflow will occur. In this case, the Bluetooth has two possible behaviour modes: “allow overflow” and “don’t allow overflow”.
- If overflow is allowed, the Bluetooth will continue receiving data and will overwrite any data not yet sent to the codec.
- If overflow is not allowed, RF voice packets received when buffer is full will be discarded.
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 19
2.6.2.9 Bluetooth Inter-IC Sound (I2S)
The CC2564C can be configured as an Inter-IC Sound (I2S) serial interface to an I2S codec device. In this mode, the CC2564C audio codec interface is configured as a bi-directional, full-duplex interface, with two time slots per frame: Time slot 0 is used for the left channel audio data and time slot 1 for the right channel audio data. Each time slot is configurable up to 40 serial clock cycles in length and the frame is configurable up to 80 serial clock cycles in length. Do not connect the microcontroller/DSP directly to the module’s PCM interface. It is recommended to use a simple RC low pass filter to improve noise suppression.
PAN1326C Bluetooth Module
3 Detailed Description
Product Specification Rev. 1.2 Page 20
3.1 Dimensions
All dimensions are in millimeters.
3.1.1 PAN1316C Module Drawing
No. Item Dimension Tolerance Remark 1 Width 6.50 0.30 2 Length 9.00 0.30 3 Height 1.80 0.20 With case
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 21
3.1.2 PAN1326C Module Drawing
No. Item Dimension Tolerance Remark 1 Width 9.50 0.30 2 Length 9.00 0.30 3 Height 1.80 0.20 With case
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 22
3.2 Footprint
The outer dimensions have a tolerance of 0.2 mm. The layout is symmetric to center. The inner pins (2, 4, 6, 9, 11, 14, 16, 18, 21, and 23) are shifted to the center by 1 mm.
3.2.1 Footprint – PAN1316C Without Antenna
0.90 1.70 6,50 0.90 1.80 9,00 17 15 13 14 12 22 10 Pad = 24 x 0.60mm x 0.60mm Top View 1.80 2.70 2.95 3.95
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 23
3.2.2 Footprint – PAN1326C With Antenna
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 24
3.3 Packaging
The product is a mass production status product and will be delivered in the package described below.
3.3.1 Tape Dimensions
3.3.1.1 PAN1316C Without Antenna
to centreline of pocket. Cumulative tolerance of 10 sprocket holes is ± 0.20 . Measured from centreline of sprocket hole to centreline of pocket. (I) (II) (III) (IV) Other material available. ALL DIMENSIONS IN MILLIMETRES UNLESS OTHERWISE STATED.W F +/- 0.10 +/- 0.10 +/- 0.30 7.50 12.00 16.00 K1 2.00 +/- 0.10 Estimated max. length : 72 meter/22B3 reel Forming format : Flatbed - 9 2.80 +/- 0.10 +/- 0.10 9.40Bo Ko 6.90Ao +/- 0.10 Y Y XX SECTION Y-Y SCALE 3.5 : 1 SECTION X-X SCALE 3.5 : 1
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 25
3.3.1.2 PAN1326C With Antenna
3.3.2 Packing in Tape
3.3.2.1 PAN1316C Without Antenna
Empty spaces in the component packed area shall be less than two per reel and those spaces shall not be consecutive. The top cover tape shall not be found on reel holes and it shall not stick out from the reel. Measured from centreline of sprocket holeMeasured from centreline of sprocket hole Cumulative tolerance of 10 sprocket Measured from centreline of sprocket to centreline of pocket. holes is ± 0.20 . hole to centreline of pocket. (I) (II) (III) (IV) Other material available. ALL DIMENSIONS IN MILLIMETRES UNLESS OTHERWISE STATED.W F +/- 0.10 +/- 0.10 +/- 0.30 7.50 12.00 16.00 K1 2.00 +/- 0.10 2.80 +/- 0.10 +/- 0.10 9.40Bo Ko 9.90Ao +/- 0.10 Tooling code: Flatbed - 9 Estimated Max Length: 72m per 22B3 Y Y XX SECTION Y- Y SCALE 3.5 : SECTION X- X SCALE 3.5 : trailer (empty) 1 x circumference / hub (min 160mm) component packed area standard 1500pcs leader (empty) minimum 10 pitch Top cover tape more than 1 x circumference plus 100mm to avoid fixing of tape end on sealed modules. Direction of unreeling (for customer) PAN1315 01/01 ENW89809M5A YYWWDLL FCC ID: T7V1315 Machine readable 2D-Barcode PAN1315 01/01 ENW89809M5A YYWWDLL FCC ID: T7V1315 Machine readable 2D-Barcode
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 26
3.3.2.2 PAN1326C With Antenna
Empty spaces in the component packed area shall be less than two per reel and those spaces shall not be consecutive. The top cover tape shall not be found on reel holes and it shall not stick out from the reel. trailer (empty) 1 x circumference /hub (min 160mm) component packed area standard 1500pcs leader (empty) minimum 10 pitch Top cover tape more than 1 x circumference plus 100mm to avoid fixing of tape end on sealed modules. Direction of unreeling (for customer)
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 27
3.3.3 Component Direction
3.3.4 Reel Dimension
FCC ID: T7V1315 Machine readable 2D-Barcode Direction of unreeling (for customer) Pin 1 Marking (Top Side) Pin 1 Marking (Bottom Side) Circle r = 0.5 mm on solder resist near Pin 1
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 28
3.3.5 Package Label
(1T) (1P) (2P) (9D) (Q) (HW/SW) Lot code Customer order number, if applicable Order number Date code Quantity Hardware/software version
3.3.6 Total Package
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 29
3.4 Case Marking
PAN1326C Bluetooth Module
4 Specification
Product Specification Rev. 1.2 Page 30 All specifications are over temperature and process, unless indicated otherwise.
4.1 Default Test Conditions
Temperature: 25 ± 10 °C Humidity: 40 to 85 % RH Supply Voltage: 3.3 V
4.2 Absolute Maximum Ratings
The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. All parameters are measured as follows unless stated otherwise: VDD_IN 6=3.3 V, VDD_IO=1.8 V. No See7 Min. Max. Unit Ratings Over Operating Free-Air Temperature Range 1 VDD_IN -0.5 5.5 V 2 VDDIO_1.8 V -0.5 2.145 V 3 Input voltage to RF (Pin 13) -0.5 2.1 V
4 Operating ambient temperature range -40 858 °C
5 Storage temperature range -40 125 °C
6 ESD: Human Body Model (HBM). JEDEC 22-A114 500 V 6 VDD_IN is supplied to MLDO_IN (Pin 15) and CL1.5_LDO_IN (Pin 11); other options are described in 2.3 Device Power Supply.
7 Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the
device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
8 Older generation parts, which are not recommended for new designs, will support a temperature
range -20 to 70. See 6.1 Ordering Information for details.
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 31
4.3 Recommended Operating Conditions
The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. Symbol Parameter Condition Min. Max. Unit VDD_IN Power supply voltage 9 1.7 4.8 V VDD_IO IO power supply voltage 1.62 1.92 V VIH High-level input voltage Default 0.65 x VDD_IO VDD_IO V VIL Low-level input voltage Default 0 0.35 x VDD_IO V Tr/Tf IO Input rise/fall times, 10 % to 90 % 10 1 10 ns Maximum ripple on VDD_IN (Sine wave) for 1.8 V (DC2DC) mode 0 MHz to 0.1 MHz 60 mVp- p 0.1 MHz to 0.5 MHz 50 0.5 MHz to 2.5 MHz 30 2.5 MHz to 3.0 MHz 15 > 3.0 MHz 5 Voltage dips on VDD_IN (VBAT) (duration=577 µs to 2.31 ms, period=4.6 m) 400 mV Maximum ambient operating temperature 1112 -40 85 C 9 Excluding 1.98 < VDD_IN < 2.2 V range is not allowed. 10 Asynchronous mode. 11 The device can be reliably operated for seven years at Tambient of 85 °C, assuming 25 percent active mode and 75 percent sleep mode (15 400 cumulative active power-on hours). 12 The device can be reliably operated for seven years at Tambient of 85 °C, assuming 25 percent active mode and 75 percent sleep mode (15 400 cumulative active power-on-hours).
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 32
4.4 Current Consumption
No Characteristics Min. 25 °C Typ. 25 °C Max. 25 °C Min. -40 °C Typ. -40 °C Max. -40 °C Min. +85 °C Typ. +85 °C Max. +85 °C Unit
2 Current
40 105 700 A
3 Total IO current
4 Current
1 Current
1 3 7 A 4.5 nSHUTD Requirements Symbol Parameter Min. Max. Unit VIH Operation mode level 13 1.42 1.98 V VIL Shutdown mode level 0 0.4 V Minimum time for nSHUT_DOWN low to reset the device 5 ms Tr/Tf Rise/fall times 20 µs
4.6 External Digital Slow Clock Requirements
Symbol Parameter Condition Min. Typ. Max. Unit Input Slow Clock frequency 32 768 Hz Input Slow Clock accuracy (Initial + temp + aging) Bluetooth ±250 Ppm Tr/Tf Input transition time Tr/Tf – 10 % to 90 % 100 Ns Frequency input duty cycle 15 50 85 % Phase noise at 1 kHz -125 dBc/Hz Jitter Integrated over 300 Hz to 15 000 Hz 1 Hz VIH Slow Clock input voltage limits Square wave, DC coupled 0.65 x VDD_IO VDD_IO V peak 13 Internal pull down retains shut down mode when no external signal is applied to this pin.
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 33 Symbol Parameter Condition Min. Typ. Max. Unit VIL Slow Clock input voltage limits Square wave, DC coupled 0 0.35 x VDD_IO V peak Input impedance 1 M Input capacitance 5 pF
4.7 Bluetooth
Bluetooth Receiver – In-Band Signals Characteristics Condition Min. Typ. Max. Unit Operation frequency range 2 402 2 480 MHz Channel spacing 1 MHz Input impedance 50 Sensitivity, Dirty Tx on14 GFSK, BER=0.1 % -91.5 -95 dBm π/4-DQPSK, BER=0.01 % -90.5 -94.5 8DPSK, BER=0.01 % -81 -87.5 BER error floor at sensitivity +10 dB, dirty TX off π/4-DQPSK 1E–6 1E–7 8DPSK 1E–6 Maximum usable input power GFSK, BER=0.1 % -5 dBm π/4-DQPSK, BER=0.1 % -10 8DPSK, BER=0.1 % -10 Intermodulation characteristics Level of interferers (for n=3, 4, and 5) -36 -30 dBm C/I performance15 Image=–1 MHz GFSK, cochannel dB EDR, cochannel π/4-DQPSK 9.5 11 8DPSK 16.5 20 GFSK, adjacent ±1 MHz -10 -5 EDR, adjacent ±1 MHz, (image) π/4-DQPSK -10 -5 8DPSK -5 -1 GFSK, adjacent +2 MHz -38 -35 EDR, adjacent, +2 MHz π/4-DQPSK -38 -35 8DPSK -38 -30 GFSK, adjacent –2 MHz -28 -20 EDR, adjacent –2 MHz π/4-DQPSK -28 -20 8DPSK -22 -13 GFSK, adjacent ≥ |±3| MHz -45 -43 14 Sensitivity degradation up to 3 dB may occur for minimum and typical values where the Bluetooth frequency is a harmonic of the fast clock. 15 Numbers show ratio of desired signal to interfering signal. Smaller numbers indicate better C/I performance.
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 34 Characteristics Condition Min. Typ. Max. Unit EDR, adjacent ≥ |±3| MHz π/4-DQPSK -45 -43 8DPSK -44 -36 RF return loss -10 dB RX mode LO leakage Frf=(received RF – 0.6 MHz) -63 -58 dBm Bluetooth Receiver – General Blocking Characteristics Condition Min. Typ. Unit Blocking performance over full range, according to Bluetooth specification16 30 to 2 000 -6 MHz 2 000 to 2 399 -6 MHz 2 484 to 3 000 -6 MHz 3 to 12.75 -6 GHz Bluetooth Transmitter – GFSK Characteristics Min. Typ. Max Unit Maximum RF output power17 VDD_IN=VBAT 12 dBm VDD_IN=external regulator to 1.8 V 10 Power variation over Bluetooth band -1 1 dB Gain control range 30 dB Power control step 5 dB Adjacent channel power |M–N|=2 -45 dBm Adjacent channel power |M–N|>2 -50 dBm 16 Exceptions are taken out of the total 24 allowed in the Bluetooth specification. 17 To modify maximum output power, use an HCI VS command.
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 35 Bluetooth Transmitter – EDR Characteristics Min. Typ. Max Unit EDR output power18 π/4-DQPSK VDD_IN=VBAT 5.5 dBm VDD_IN=external regulator to 1.8 V 8DPSK VDD_IN=VBAT VDD_IN=external regulator to 1.8 V EDR relative power -2 1 dB Power variation over Bluetooth band -1 1 dB Gain control range 30 dB Power control step 5 dB Adjacent channel power |M–N|=1 -36 dBc Adjacent channel power |M–N|=2 -30 dBm Adjacent channel power |M–N|>2 -42 dBm Bluetooth Modulation – GFSK Characteristics Condition Min. Typ. Max. Unit –20 dB bandwidth GFSK 925 kHz F1 avg Modulation characteristics Δf1avg Mod data=4 1 s, 4 0 s: 111100001111... 165 kHz F2 max Δf2max ≥ limit for at least 99.9 % of all Δf2max Mod data=1010101... 130 kHz Δf2avg, Δf1avg 88 % Absolute carrier frequency drift DH1 -25 25 kHz DH3 and DH5 -35 35 Drift rate 15 kHz/5 0 μs Initial carrier frequency tolerance -75 75 kHz Bluetooth low energy Transceiver, Out-Of-Band and Spurious Emissions Characteristics Condition Min. Typ. Max. Unit Second harmonic Measured at maximum output power -14 -2 dBm Third harmonic -10 -6 Fourth harmonics -19 -11 18 To modify maximum output power, use an NCI VS command.
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 36 Bluetooth low energy Receiver – In-Band Signals Characteristics Condition Min. Typ. Max. Unit Operation frequency range 2 402 2 480 MHz Channel spacing 2 MHz Input impedance 50 Ω Sensitivity, Dirty Tx on19 PER=30.8 %; dirty TX on -96 dBm Maximum usable input power GMSK, PER=30.8 % -5 Intermodulation characteristics Level of interferers (for n=3, 4, 5) -30 dBm C/I performance20 Image=–1 MHz GMSK, cochannel 8 dB GMSK, adjacent ±1 MHz -5 GMSK, adjacent ±2 MHz -45 GMSK, adjacent -2 MHz -22 GMSK, adjacent ≥ |±3| MHz -47 RX mode LO leakage Frf=(received RF – 0.6 MHz) -63 dBm Bluetooth low energy Receiver—General Blocking Characteristics Condition Min. Typ. Max. Unit Blocking performance over full range, according to Bluetooth low energy specification21 30 to 2 000 MHz –15 dBm 2 000 to 2 399 MHz –15 2 484 to 3 000 MHz –15 3 to 12.75 GHz –15 Bluetooth low energy Transmitter Characteristics Min. Typ. Max. Unit RF output power VDD_IN=VBAT 12 dBm VDD_IN=External regulator to 1.8 V 10 Power variation over Bluetooth low energy band 1 dB Adjacent channel power |M-N|=2 -45 dBm Adjacent channel power |M-N|>2 -50 dBm 19 Sensitivity degradation up to 3 dB may occur where the Bluetooth low energy frequency is a harmonic of the fast clock. 20 Numbers show wanted signal-to-interfering signal ratio. Smaller numbers indicate better C/I performance. 21 Exceptions are taken out of the total 10 allowed in the Bluetooth low energy specification.
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 37 Bluetooth low energy Modulation Characteristics Condition Min. Typ. Max. Unit Δf1 avg Modulation characteristics Δf1avg Mod data=4 1 s, 4 0 s: 1111000011110000... 240 250 260 kHz Δf2 max Δf2max ≥ limit for at least 99.9 % of all Δf2max Mod data=1010101... 185 210 kHz Δf2avg, Δf1avg 0.85 0.9 Absolute carrier frequency drift -25 25 kHz Drift rate 15 kHz/5 0 ms Initial carrier frequency tolerance -75 75 kHz No Parameter Min. Typ. Max. Unit
1 Average Power Hopping DH5 4 11,3 20 dBm
2 Average Power: Ch0 4 11,4 20 dBm
3 Peak Power: Ch0 11,6 23 dBm
4 Average Power: Ch39 4 11,3 20 dBm
5 Peak Power: Ch39 11,6 23 dBm
6 Average Power: Ch78 4 11,3 20 dBm
7 Peak Power: Ch78 11,5 23 dBm
8 Max. Frequency Tolerance: Ch0 -75 -2.6 75 kHz 9 Max. Frequency Tolerance: Ch39 -75 -2.2 75 kHz 10 Max. Frequency Tolerance: Ch78 -75 -2.1 75 kHz 11 Max. Drift: Ch0_DH1 -25 3.6 25 kHz 12 Max. Drift: Ch0_DH3 -40 3.7 40 kHz 13 Max. Drift: Ch0_DH5 -40 4.0 40 kHz 14 Max. Drift Rate: Ch0_DH1 -20 -2.6 20 kHz 15 Max. Drift Rate: Ch0_DH3 -20 -3.2 20 kHz
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 38 No Parameter Min. Typ. Max. Unit 16 Max. Drift Rate: Ch0_DH5 -20 -3.3 20 kHz 17 Max. Drift: Ch39_DH1 -25 4.0 25 kHz 18 Max. Drift: Ch39_DH3 -40 4.3 40 kHz 19 Max. Drift: Ch39_DH5 -40 4.3 40 kHz 20 Max. Drift Rate: Ch39_DH1 -20 -3.1 20 kHz 21 Max. Drift Rate: Ch39_DH3 -20 -3.6 20 kHz 22 Max. Drift Rate: Ch39_DH5 -20 -3.7 20 kHz 23 Max. Drift: Ch78_DH1 -25 4.1 25 kHz 24 Max. Drift: Ch78_DH3 -40 4.5 40 kHz 25 Max. Drift: Ch78_DH5 -40 4.4 40 kHz 26 Max. Drift Rate: Ch78_DH1 -20 -3.4 20 kHz 27 Max. Drift Rate: Ch78_DH3 -20 -3.9 20 kHz 28 Max. Drift Rate: Ch78_DH5 -20 -4.1 20 kHz 29 Delta F1 Avg: Ch0 140 159.5 175 kHz 30 Delta F2 Max.: Ch0 99.9 100.0 % 31 Delta F2 Avg/Delta F1 Avg: Ch0 0.8 0.9 32 Delta F1 Avg: Ch39 140 159.8 175 kHz 33 Delta F2 Max.: Ch39 99.9 100.0 % 34 Delta F2 Avg/Delta F1 Avg: Ch39 0.8 0.9 35 Delta F1 Avg: Ch78 140 159.1 175 kHz 36 Delta F2 Max.: Ch78 99.9 100.0 % 37 Delta F2 Avg/Delta F1 Avg: Ch78 0.8 0.9 45 Sensitivity -81 -93.0 46 f(H)-f(L): Ch0 918.4 1 000 kHz 47 f(H)-f(L): Ch39 918.3 1 000 kHz
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 39 No Parameter Min. Typ. Max. Unit 48 f(H)-f(L): Ch78 918.2 1 000 kHz 49 ACPower -3: Ch3 -51.5 -40 dBm 50 ACPower -2: Ch3 -50.4 -40 dBm 51 ACPower -1: Ch3 -18.5 dBm
52 ACPower Center: Ch3 4 6,8 20 dBm
53 ACPower +1: Ch3 -19.2 dBm 54 ACPower +2: Ch3 -50.7 -40 dBm 55 ACPower +3: Ch3 -53.3 -40 dBm 56 ACPower -3: Ch39 -51.6 -40 dBm 57 ACPower -2: Ch39 -50.7 -40 dBm 58 ACPower -1: Ch39 -19.0 dBm
59 ACPower Center: Ch39 4 6,3 20 dBm
60 ACPower +1: Ch39 -19.7 dBm 61 ACPower +2: Ch39 -50.9 -40 dBm 62 ACPower +3: Ch39 -53.2 -40 dBm 63 ACPower -3: Ch75 -51.7 -40 dBm 64 ACPower -2: Ch75 -50.7 -40 dBm 65 ACPower -1: Ch75 -19.2 dBm
66 ACPower Center: Ch75 4 5,8 20 dBm
67 ACPower +1: Ch75 -20.0 dBm 68 ACPower +2: Ch75 -51.0 -40 dBm 69 ACPower +3: Ch75 -53.4 -40 dBm 70 omega i 2-DH5: Ch0 -75 -4.7 75 kHz 71 omega o + omega i 2-DH5: Ch0 -75 -6.0 75 kHz 72 omega o 2-DH5: Ch0 -10 -1.5 10 kHz
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 40 No Parameter Min. Typ. Max. Unit 73 DEVM RMS 2-DH5: Ch0 0.0 0.2 % 74 DEVM Peak 2-DH5: Ch0 0.1 0.35 % 75 DEVM 99 % 2-DH5: Ch0 99 100.0 % 76 omega i 3-DH5: Ch0 -75 -3.7 75 kHz 77 omega o + omega i 3-DH5: Ch0 -75 -5.8 75 kHz 78 omega o 3-DH5: Ch0 -10 -2.6 10 kHz 79 DEVM RMS 3-DH5: Ch0 0.0 0.13 % 80 DEVM Peak 3-DH5: Ch0 0.1 0.25 % 81 DEVM 99 % 3-DH5: Ch0 99 100.0 % 82 omega i 2-DH5: Ch39 -75 -4.8 75 kHz 83 omega o + omega i 2-DH5: Ch39 -75 -6.1 75 kHz 84 omega o 2-DH5: Ch39 -10 -1.4 10 kHz 85 DEVM RMS 2-DH5: Ch39 0.0 0.2 % 86 DEVM Peak 2-DH5: Ch39 0.1 0.35 % 87 DEVM 99 % 2-DH5: Ch39 99 100.0 % 88 omega i 3-DH5: Ch39 -75 -3.8 75 kHz 89 omega o + omega i 3-DH5: Ch39 -75 -5.9 75 kHz 90 omega o 3-DH5: Ch39 -10 -2.6 10 kHz 91 DEVM RMS 3-DH5: Ch39 0.0 0.13 % 92 DEVM Peak 3-DH5: Ch39 0.1 0.25 % 93 DEVM 99% 3-DH5: Ch39 99 100.0 % 94 omega i 2-DH5: Ch78 -75 -4.9 75 kHz 95 omega o + omega i 2-DH5: Ch78 -75 -6.2 75 kHz 96 omega o 2-DH5: Ch78 -10 -1.4 10 kHz 97 DEVM RMS 2-DH5: Ch78 0.0 0.2 %
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 41 No Parameter Min. Typ. Max. Unit 98 DEVM Peak 2-DH5: Ch78 0.1 0.35 % 99 DEVM 99 % 2-DH5: Ch78 99 100.0 % 100 omega i 3-DH5: Ch78 -75 -3.8 75 kHz 101 omega o + omega i 3-DH5: Ch78 -75 -6.0 75 kHz 102 omega o 3-DH5: Ch78 -10 -2.7 10 kHz 103 DEVM RMS 3-DH5: Ch78 0.0 0.13 % 104 DEVM Peak 3-DH5: Ch78 0.1 0.25 % 105 DEVM 99 % 3-DH5: Ch78 99 100.0 %
4.8 Reliability Tests
The measurement should be done after the test device has been exposed to room temperature and humidity for one hour. No. Item Limit Condition
1 Vibration test Electrical parameter should be in
- Freq.: 10~50 Hz; Amplitude: 1.5 mm; 20 min./cycle, 1 hrs. each of XYZ axis
- Freq.: 30~100 Hz, 6 G; 20min./cycle, 1 hrs. each of XYZ axis
2 Shock test See above Dropped onto hard wood from a height of
3 Heat cycle test See above -40 °C for 30 min. and +85 °C for 30 min.; each temperature 300 cycles
4 Moisture test See above +60 °C, 90 % RH, 300 h
5 Low temperature test See above -40 °C, 300 h
6 High temperature test See above +85 °C, 300 h
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 42
4.9 Recommended Soldering Profile
Reflow permissible cycle: 2 Opposite side reflow is prohibited due to module weight More than 75 percent of the soldering area shall be coated by solder The soldering profiles should be adhered to in order to prevent electrical or mechanical damage Soldering profile assumes lead-free soldering
PAN1326C Bluetooth Module
5 Cautions
Product Specification Rev. 1.2 Page 43 Failure to follow the guidelines set forth in this document may result in degrading of the product’s functions and damage to the product.
5.1 Design Notes
- Follow the conditions written in this specification, especially the control signals of this module. 2. The supply voltage must be free of AC ripple voltage (for example from a battery or a low noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in series connection and a bypass capacitor to ground of at least 47 µF directly at the module). 3. This product should not be mechanically stressed when installed. 4. Keep this product away from heat. Heat is the major cause of decreasing the life of these products. 5. Avoid assembly and use of the target equipment in conditions where the product’s temperature may exceed the maximum tolerance. 6. The supply voltage should not be exceedingly high or reversed. It should not carry noise and/or spikes. 7. Keep this product away from other high frequency circuits. 8. Refer to the recommended pattern when designing a board.
5.2 Installation Notes
- Reflow soldering is possible twice based on the conditions set forth in 4.9 Recommended Soldering Profile. Set up the temperature at the soldering portion of this product according to this reflow profile. 2. Carefully position the products so that their heat will not burn into printed circuit boards or affect the other components that are susceptible to heat. 3. Carefully locate these products so that their temperatures will not increase due to the effects of heat generated by neighboring components. 4. If a vinyl-covered wire comes into contact with the products, then the cover will melt and generate toxic gas, damaging the insulation. Never allow contact between the cover and these products to occur. 5. This product should not be mechanically stressed or vibrated when reflowed. 6. To repair the board by hand soldering, follow the conditions set forth in this chapter. 7. Do not wash this product. 8. Pressing on parts of the metal cover or fastening objects to the metal will cause damage to the unit.
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 44
5.3 Usage Condition Notes
- Take measures to protect the unit against static electricity. If pulses or other transient loads (a large load applied in a short time) are applied to the products, check and evaluate their operation befor assembly on the final products. 2. Do not use dropped products. 3. Do not touch, damage or soil the pins. 4. Follow the recommended condition ratings about the power supply applied to this product. 5. Electrode peeling strength: Do not add pressure of more than 4.9 N when soldered on PCB. 6. Pressing on parts of the metal cover or fastening objects to the metal cover will cause damage. 7. These products are intended for general purpose and standard use in general electronic equipment, such as home appliances, office equipment, information, and communication equipment.
5.4 Storage Notes
- The module should not be stressed mechanically during storage. 2. Do not store these products in the following conditions or the performance characteristics of the product, such as RF performance will be adversely affected: – Storage in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX, – Storage in direct sunlight, – Storage in an environment where the temperature may be outside the range of 5 °C to 35 °C, or where the humidity may be outside the 45 to 85 percent range, – Storage of the products for more than one year after the date of delivery storage period: Please check the adhesive strength of the embossed tape and soldering after six months of storage. 3. Keep this product away from water, poisonous gas, and corrosive gas. 4. This product should not be stressed or shocked when transported. 5. Follow the specification when stacking packed crates (maximum 10).
5.5 Safety Cautions
These specifications are intended to preserve the quality assurance of products and individual components. Before use, check and evaluate the operation when mounted on your products. Abide by these specifications without deviation when using the products. These products may short-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, provide the following failsafe functions as a minimum:
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 45 1. Ensure the safety of the whole system by installing a protection circuit and a protection device. 2. Ensure the safety of the whole system by installing a redundant circuit or another system to prevent a single fault causing an unsafe status.
5.6 Other Cautions
- Do not use the products for other purposes than those listed. 2. Be sure to provide an appropriate fail-safe function on your product to prevent any additional damage that may be caused by the abnormal function or the failure of the product. 3. This product has been manufactured without any ozone chemical controlled under the Montreal Protocol. 4. These products are not intended for uses other than under the special conditions shown below. Before using these products under such special conditions, carefully check their performance and reliability under the said special conditions to determine whether or not they can be used in such a manner: – In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash, – In direct sunlight, outdoors, or in a dusty environment, – In an environment where condensation occurs, – In an environment with a high concentration of harmful gas (for example salty air, HCl, Cl2, SO2, H2S, NH3, and NOX). 5. If an abnormal voltage is applied due to a problem occurring in other components or circuits, replace these products with new products because they may not be able to provide normal performance even if their electronic characteristics and appearances appear satisfactory. Please refer to the Panasonic website for for further information 6.2.2 Product Information.
5.7 Bluetooth Declaration
PAN1326C QDID: 39329 https://launchstudio.bluetooth.com/ListingDetails/5045 TI Host-Stack: QDID: 69887 https://launchstudio.bluetooth.com/ListingDetails/23810 TI Profile Stack: QDID: 69886 https://launchstudio.bluetooth.com/ListingDetails/23811
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 46
5.8 Life Support Policy
This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support appliances, devices, or systems where malfunction can reasonably be expected to result in a significant personal injury to the user, or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect it is safety or effectiveness. Panasonic customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any damages resulting.
5.9 Restricted End Use
This Panasonic Industrial Devices Europe GmbH product is not designed for any restricted activity that supports the development, production, handling usage, maintenance, storage, inventory or proliferation of any weapons or military use. Transfer, export, re-export, usage or reselling of this product to any destination, end user or any end use prohibited by the European Union, United States or any other applicable law is strictly prohibited.
PAN1326C Bluetooth Module
6 Appendix
Product Specification Rev. 1.2 Page 47
6.1 Ordering Information
Order Number Brand Name Description MOQ ENW89823C4KF PAN1316C Bluetooth Basic Data Rate and Low Energy Module w/o antenna 1 500 ENW89823A4KF23 PAN1326C Bluetooth Basic Data Rate and Low Energy Module w/ antenna 1 500 22 Abbreviation for Minimum Order Quantity (MOQ). The default MOQ for mass production is 1 500 pieces, fewer only on customer demand. Samples for evaluation can be delivered at any quantity via the distribution channels. 23 Samples are available on customer demand.
PAN1326C Bluetooth Module Product Specification Rev. 1.2 Page 48
6.2 Contact Details
6.2.1 Contact Us
Please contact your local Panasonic Sales office for details on additional product options and services: For Panasonic Sales assistance in the EU, visit https://eu.industrial.panasonic.com/about-us/contact-us Email: wireless@eu.panasonic.com For Panasonic Sales assistance in North America, visit the Panasonic “Sales & Support” website to find assistance near you at https://na.industrial.panasonic.com/distributors Please visit the Panasonic Wireless Technical Forum to submit a question at https://forum.na.industrial.panasonic.com
6.2.2 Product Information
Please refer to the Panasonic Wireless Connectivity website for further information on our products and related documents: For complete Panasonic product details in the EU, visit http://pideu.panasonic.de/products/wireless-modules.html For complete Panasonic product details in North America, visit http://www.panasonic.com/rfmodules