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Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 6

Technical content

Features

  • Low power consumption
  • RoHS Compliant
  • Gray Face, White Segments or Black Face, White Segments
  • Easy mounting on PCB or socket Mechanical Dimensions Notes: 1. Dimensions in millimeters [inch], and tolerance is ±0.25 [.010] and angle is ±1° unless otherwise noted. 2. Bending ≤ Length*1% 4. Specifications subject to change without notice

www.p-tec.net 030915 Rev0 JAS Page 2 of 6 Device Selection Guide Model Number Chip Note Common Anode Common Cathode Material Emitting Color Add “-BW” to end of part number for Black Face, White Segment version PA47-CADG13 PA47-CCDG13 GaP Yellow Green Absolute Maximum Ratings at Ta=25°C Electrical and Optical Characteristics at Ta=25°C Parameter Symbol Condition Min. Typ. Max. Unit Luminous Intensity Per Segment IV If=10mA/seg. 1.15 2.4 mcd Forward Voltage Vf If=20mA/seg. 2.1 2.6 V Peak Wavelength λP If=20mA/seg. 567 nm Dominant Wavelength λD If=20mA/seg. 572 nm Reverse Current Per Chip (Leakage Current Per Chip) Ir VR=5V 100 µA Spectrum Line Halfwidth ∆λ If=20mA/seg. 30 nm Response Time T --- 250 ns Parameter Symbol Rating Unit Power Dissipation Per Segment PAD 78 mW Pulse Current (1/10Duty Cycle, 0.1ms Pulse Width.) Per Chip IFP 100 mA Continuous Forward Current Per Chip IAF 30 mA Reverse Voltage Per Chip VR 5 V Reverse (Leakage) Current Per Chip Ir 100 uA Operating Temperature Topr -25~+85 °C Storage Temperature Tstg -40~+100 °C Solder Conditions: 1/16 inch below seating plane for 3 -5 seconds at 260°C.

www.p-tec.net 030915 Rev0 JAS Page 3 of 6 Typical Electrical/Optical Characteristic Curves

www.p-tec.net 030915 Rev0 JAS Page 4 of 6 Internal Circuit Diagram Common Anode Common Cathode

www.p-tec.net 030915 Rev0 JAS Page 5 of 6 Precautions for Use PLEASE PAY SPECIAL ATTNTION TO THE NEXT POINT TO INCORPORATE OPTO DEVICE TO HIGH RELIABILITY 1. Do not bend the lead. Bending leads could cause breakage of leads or the degradation of the chip. When bending is unavoidable, strictly follow the cautionary instruction below. (1)Bend the leads before soldering. (2)Bending a lead must be done by fixing a lead tightly and applying no stress on the resin part. (3) The lead bending point must be more than 1.6mm away from the edge or the resin part. (4)When a pin is tested for its endurance, bending degree should be 45° and repeated no more than two times. 2. Setting a product by using tool such as a holder should be avoided. When necessary, no stress should be applied to the resin part and lead to consider dimension tolerance, thermal expansion, thermal contraction of holder, product and circuit board etc. 3. The hole pitch of a circuit board must fit into the lead pitch of products. 4. When soldering, extra care for the following: (1)Do not heat a product under any stress (i.e.: twist) to leads. (2)Do not heat (for example, by soldering) a product while outside force is applied the resin part. (3) The lead bending point must be more than 1.6mm away from the edge or the resin part. (4)Soldering with PC Board should be conducted with following conditions. (a) For dip soldering Pre-heating: 90°C Max. For within 60 Sec. Soldering Max. : 260±5°C (Solder Temp.) for within 5 Sec. (b) Soldering iron: 350°C (Soldering iron tip) for within 3 Sec. 5. Flux could corrode the leads. Use flux that contains as little chlorine as possible (RA, RMA, less than 0.2 wt%) and need not be washed way. When, however, washing is necessary, partially wash around the leads, instead of the entire LED, by the following conditions. Cleaning agent: Methyl Alcohol Cleaning temp: 45°C Max. Cleaning time: 30Sec. Max. 6. Minimum amount of soldering flux should be used. Soldering flux should be applied only to the pin portion. 7. The following may damage products or LED chips: Attachment or contact of residual flux solvent onto the product surface or to LED chips, or invasion of the same into the product.

www.p-tec.net 030915 Rev0 JAS Page 6 of 6 Record Of Revisions Rev. Comments Page Date

0 Released Spec -- 6/6/13

Approved By Checked By Notes/Remarks