NL0333 NISSHINBO | Alldatasheet

Document overview

  • Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
  • PDF pages: 47

Technical content

Low power, Zero-Drift, High EMC Performance Rail-to-Rail I/O, Operational Amplifier - 1 - Ver.1.2

FEATURES

Low Input Offset Voltage 10μV max. Zero-Drift 0.01μV/°C typ. Low Supply Current NL0333/NL1333 17μA NL2333 15μA/ch Rail-to-Rail Input and Output Supply Voltage 2.1V to 5.5V Input Bias Current 30pA Gain Bandwidth Product 260kHz Slew Rate 0.11V/μs Equivalent Input Noise Voltage 60nV/√Hz Integrated EMI Filter No phase-reversal CMOS Architecture Package: SOT-23-5-DC, SC-88A-DB VSP-8-AF, EMP-8-AN

APPLICATIONS

Battery-Ppowered Equipment Sensor Interface Temperature Sensors Current Sensing Amplifier GENERAL DESCRIPTION The NL0333/NL1333/NL2333 are single and dual rail-to-rail input and output single supply OpAmp featuring very low offset voltage (10μV max.) and zero-drift over temperature (0.01μV/°C typ.). Also features, low supply current, high-impedance rail-to- rail input, and rail-to-rail output that swings within 50 mV of the rails. NLx333 series includes integrated EMI filter to reduce malfunctions caused by RF noises from mobile phones and other wireless devices. NLx333 series operates from supply range of 2.1V to 5.5V and can operate from -40°C to 125°C temperature range. The NL0333 is available in 5- pin SOT-23 package. The NL1333 is available in 5- pin SC-88A package. The NL2333 is available in 8- pin VSP, and EMP package. Precision Characteristics -10 -8 -6 -4 -2 0 2 4 6 8 10 Percent of Amplifiers [%] Input Offset Voltage [μV] Offset Voltage Distribution V+ = 3.3V, V− = 0V, VCOM = V+/2, Ta = 25°C -0.05 -0.04 -0.03 -0.02 -0.01 0.01 0.02 0.03 0.04 0.05 Percent of Amplifiers [%] Offset Voltage drift [μV/°C] Offset Voltage drift Distribution V+ = 3.3V, V− = 0V, VCOM = V+/2, Ta=-40°C to 125°C

  • 2 - Ver.1.2 ■ PRODUCT NAME INFORMATION Description of configuration Composition Item Description x Number of circuits Indicates number of circuits. 0: Single 1: Single 2: Dual aa Package code Indicates the package. DC: SOT-23-5-DC DB: SC-88A-DB AF: VSP-8-AF AN: EMP-8-AN A Version Product version. A: Default bb Packing Insert Direction. Refer to the packing specifications. S Grade Indicates the quality grade. S: Standard Grade Applications Operating Temperature Range Test Temperature S General−purpose and Consumer application -40°C to 125°C 25°C ■ ORDER INFORMATION Product Name Package RoHS Halogen- Free Plating Composition Weight (mg) Quantity (pcs/reel) NL0333DCAE1S SOT-23-5-DC ✓ ✓ Sn2Bi 15 3000 NL1333DBAE1S SC-88A-DB ✓ ✓ Sn2Bi 7 3000 NL2333AFAE2S VSP-8-AF ✓ ✓ Sn2Bi 21 2000 NL2333ANAE2S EMP-8-AN ✓ ✓ Sn2Bi 76 2000 NLx333 aa A bb S
  • 3 - Ver.1.2 ■ PIN DESCRIPTIONS (NL0333DC) Pin No. Pin Name I/O Description

1 OUTPUT O Output channel

2 V− - Negative supply or GND (single supply)

3 +INPUT I Non-inverting input channel 4 −INPUT I Inverting input channel

5 V+ - Positive supply

-INPUT+INPUT (Top View) SOT-23-DC

  • 4 - Ver.1.2 ■ PIN DESCRIPTIONS (NL1333DB) Pin No. Pin Name I/O Description 1 +INPUT I Non-inverting input channel

3 −INPUT I Inverting input channel

4 OUTPUT O Output channel

+INPUT (Top View) SC-88A-DB

  • 5 - Ver.1.2 ■ PIN DESCRIPTIONS (NL2333AF) Pin No. Pin Name I/O Description

1 A OUTPUT O Output channel A

2 A −INPUT I Inverting input channel A

3 A +INPUT I Non-inverting input channel A

4 V− - Negative supply or GND (single supply)

5 B +INPUT I Non-inverting input channel B

6 B −INPUT I Inverting input channel B

7 B OUTPUT O Output channel B

8 V+ - Positive supply

(Top View) VSP-8-AF

  • 6 - Ver.1.2 ■ PIN DESCRIPTIONS (NL2333AN) Pin No. −INPUT I/O Inverting input channel

(Top View) EMP-8-AN

  • 7 - Ver.1.2 ■ ABSOLUTE MAXIMUM RATINGS Symbol Ratings Unit Supply Voltage VS = V+ - V− V+ - V− 7 V Input Voltage*1 VIN V− - 0.3 to V+ + 0.3 V Input Current*1 IIN ±10 mA Output Terminal Input Voltage*2 VO V− - 0.3 to V+ + 0.3 V Differential Input Voltage*3 VID ±7 V Output Short-Circuit Duration*4 Continuous Storage Temperature Range Tstg -55 to 150 °C Junction Temperature *5 Tj 150 °C *1 Input voltages outside the supply voltage will be clamped by ESD protection diodes. If the input voltage exceeds the supply voltage, the current must be limited 10 mA or less by μsing a restriction resistance. Input current inflow is positive and Input current outflow is negative. *2 The output terminal input voltage is limited at 7V. *3 Differential voltage is the voltage difference between +INPUT and -INPUT. *4 Power loss increases when output is short-circuited; do not exceed Tj. *5 Calculate the power consumption of the IC from the operating conditions, and calculate the junction temperature with the thermal resistance. Please refer to "Thermal characteristics" for the thermal resistance under our measurement board conditions. ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause permanent damage and may degrade the lifetime and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings is not assured. ■ THERMAL CHARACTERISTICS Package Measurement Result *1 Unit θja ψjt SOT-23-5-DC SC-88A-DB VSP-8-AF EMP-8-AN 192 255 170 125 °C/W θja: Junction-to-Ambient Thermal Resistance ψjt: Junction-to-Top Thermal Characterization Parameter
  • 8 - Ver.1.2 ■ ELECTROSTATIC DISCHARGE (ESD) PROTECTION VOLTAGE Conditions Protection Voltage HBM C = 100 pF, R = 1.5 kΩ ±2000V CDM ±1000V ELECTROSTATIC DISCHARGE RATINGS The electrostatic discharge test is done based on JEDEC JS001 and JS002. In the HBM method, ESD is applied using the power supply pin and GND pin as reference pins. ■ RECOMMENDED OPERATING CONDITIONS Symbol Ratings Unit Supply Voltage V+ - V− 2.1 to 5.5 V Operating Temperature Range Ta -40 to 125 °C RECOMMENDED OPERATING CONDITIONS All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if they are used over such conditions by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions. ■ BLOCK DIAGRAM OUTPUT +INPUT -INPUT
  • 9 - Ver.1.2 ■ ELECTRICAL CHARACTERISTICS (NL0333/NL1333) V+ = 2.1V to 5.5V, V− = 0V, VCOM = V+/2, RL = 10kΩ to VCOM, Ta = 25°C, unless otherwise specified. Parameter Symbol Conditions MIN TYP MAX Unit INPUT CHARACTERISTICS *1 Input Offset Voltage VIO V+ = 3.3V - 2 10*2 μV Input Offset Voltage Drift ΔVIO/ΔT Ta = -40°C to 125°C - 0.01 - µV/°C Input Bias Current IB - 30 - pA Ta = -40°C to 125°C - 70 - pA Input Offset Current IIO - 60 - pA Open-Loop Voltage Gain AV VO = V− + 0.1V to V+ - 0.1V, RL = 10kΩ to V+/2 106 130 - dB Common-Mode Rejection Ratio CMR VCOM = V− to V+ 106 130 - dB Common-Mode Input Voltage Range VICM CMR ≥ 106dB V− - V+ V OUTPUT CHARACTERISTICS High-level Output Voltage (V+ - VO) VOH V+ = 2.1V, 5.5V, RL = 10kΩ to V+/2 - 30 50 mV Low-level Output Voltage VOL V+ = 2.1V, 5.5V, RL = 10kΩ to V+/2 - 30 50 mV Capacitive Load Drive CL ΦM = 45deg - 500 - pF Output Impedance ZO V+ = 5V, f = 260kHz - 3 - kΩ Output Short-Circuit Current ISC V+ = 5V, Source / Sink - 17 - mA POWER SUPPLY Supply Current ISUPPLY V+ = 5V, VCOM = V− - 17 25 μA Supply Voltage Rejection Ratio SVR V+ = 2.1 to 5.5V 106 120 - dB AC CHARACTERISTICS Slew Rate SR CL = 10pF, VIN = 4VPP, GV = 1 - 0.11 - V/μs Gain Bandwidth Product GBW RL = 100kΩ, CL = 10pF, f = 10kHz - 260 - kHz Phase Margin ΦM CL = 10pF - 60 - Deg CL = 500pF - 45 - Deg Equivalent Input Noise Voltage VNI f = 0.1 to 10Hz - 1.2 - μVPP Equivalent Input Noise Voltage en f = 10Hz - 60 - nV/√Hz Equivalent Input Noise Current In f = 10Hz - 100 - fA/√Hz *1 Input offset voltage and drift, Input bias and offset current are positive or negative, its absolute values are listed in electrical characteristics. *2 Guaranteed by design.
  • 10 - Ver.1.2 ■ ELECTRICAL CHARACTERISTICS (NL2333) V+ = 2.1V to 5.5V, V− = 0V, VCOM = V+/2, RL = 10kΩ to VCOM, Ta = 25°C, unless otherwise specified. Parameter Symbol Conditions MIN TYP MAX Unit INPUT CHARACTERISTICS *1 Input Offset Voltage VIO V+ = 3.3V - 2 10*2 μV Input Offset Voltage Drift ΔVIO/ΔT Ta = -40°C to 125°C - 0.01 - µV/°C Input Bias Current IB - 30 - pA Ta = -40°C to 125°C - 70 - pA Input Offset Current IIO - 60 - pA Open-Loop Voltage Gain AV VO = V− + 0.1V to V+ - 0.1V, RL = 10kΩ to V+/2 106 130 - dB Common-Mode Rejection Ratio CMR VCOM = V− to V+ 106 130 - dB Common-Mode Input Voltage Range VICM CMR ≥ 106dB V− - V+ V OUTPUT CHARACTERISTICS High-level Output Voltage (V+ - VO) VOH V+ = 2.1V, 5.5V, RL = 10kΩ to V+/2 - 30 50 mV Low-level Output Voltage VOL V+ = 2.1V, 5.5V, RL = 10kΩ to V+/2 - 30 50 mV Capacitive Load Drive CL ΦM = 45deg - 500 - pF Output Impedance ZO V+ = 5V, f = 260kHz - 3 - kΩ Output Short-Circuit Current ISC V+ = 5V, Source / Sink - 17 - mA POWER SUPPLY Supply Current per Amplifier ISUPPLY V+ = 5V, VCOM = V− - 15 23 μA Supply Voltage Rejection Ratio SVR V+ = 2.1 to 5.5V 106 120 - dB AC CHARACTERISTICS Slew Rate SR CL = 10pF, VIN = 4VPP, GV = 1 - 0.11 - V/μs Gain Bandwidth Product GBW RL = 100kΩ, CL = 10pF, f = 10kHz - 260 - kHz Phase Margin ΦM CL = 10pF - 60 - Deg CL = 500pF - 45 - Deg Equivalent Input Noise Voltage VNI f = 0.1 to 10Hz - 1.2 - μVPP Equivalent Input Noise Voltage en f = 10Hz - 60 - nV/√Hz Equivalent Input Noise Current In f = 10Hz - 100 - fA/√Hz Channel Separation CS f = 10Hz - 140 - dB *1 Input offset voltage and drift, Input bias and offset current are positive or negative, its absolute values are listed in electrical characteristics. *2 Guaranteed by design.
  • 11 - Ver.1.2 ■ TYPICAL CHARACTERISTICS Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed. -10 -75 -50 -25 0 25 50 75 100 125 150 Input Offset Voltage [μV] Ambient Temperature [°C] Input Offset Voltage vs. Temperature V+ = 3.3V, V− = 0V, VCOM = V+/2 -200 -150 -100 -50 100 150 200 -75 -50 -25 0 25 50 75 100 125 150 Input Bias Curent [pA] Ambient Temperature [°C] Input Bias Current vs. Temperature VCOM = V+/2 V+ = 2.1V V+ = 5.5V IB+ IB- 200 160 120 -40 -80 -120 -160 -200 Percent of Amplifiers [%] Input Bias Current [pA] Input Bias Current Distribution V+ = 5.5V, V− = 0V, VCOM = V+/2, Ta = 25°C IB-IB+ -10 -8 -6 -4 -2 0 2 4 6 8 10 Percent of Amplifiers [%] Input Offset Voltage [μV] Offset Voltage Distribution V+ = 3.3V, V− = 0V, VCOM = V+/2, Ta = 25°C -0.05 -0.04 -0.03 -0.02 -0.01 0.01 0.02 0.03 0.04 0.05 Percent of Amplifiers [%] Offset Voltage drift [μV/°C] Offset Voltage drift Distribution V+ = 3.3V, V− = 0V, VCOM = V+/2, Ta=-40°C to 125°C -400 -360 -320 -280 -240 -200 -160 -120 -80 -40 120 160 200 240 280 320 360 400 Percent of Amplifiers [%] Input Offset Current [pA] Input Offset Current Distribution V+ = 5.5V, V− = 0V, VCOM = V+/2, Ta = 25°C
  • 12 - Ver.1.2 ■ TYPICAL CHARACTERISTICS Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed. -10 Input Offset Voltage [μV] Common-Mode Input Voltage [V] Input Offset Voltage vs. Common-Mode Input Voltage V+ = 2.1V, V− = 0V Ta = 125°C Ta = 25°C Ta = -40°C -10 Input Offset Voltage [μV] Common-Mode Input Voltage [V] Input Offset Voltage vs. Common-Mode Input Voltage V+ = 5.5V, V− = 0V Ta = -40°C Ta = 125°C Ta = 25°C 100 120 140 160 -75 -50 -25 0 25 50 75 100 125 150 Open-Loop Voltage Gain [dB] Ambient Temperature [°C] Open-Loop Voltage Gain vs. Temperature V− = 0V, RL = 10kΩ, VO = V− +0.1V to V+ − 0.1V V+ = 5.5V V+ = 2.1V -200 -150 -100 -50 100 150 200 Input Bias Current [pA] Common-Mode Input Voltage [V] Input Bias Current vs. Common-Mode Input Voltage IB- IB+ 0 1 2 3 4 5 6 7 Supply Current per Amplifier [μA] Supply Voltage [V] Supply Current per Amplifier vs. Supply Voltage NL6012, VCOM = V− Ta = 25°C Ta = -40°C Ta = 125°C -75 -50 -25 0 25 50 75 100 125 150 Supply Current per Amplifier [μA] Ambient Temperature [°C] Supply Current per Amplifier vs. Temperature NL6012, VCOM = V− V+ = 5V V+ = 2.1V
  • 13 - Ver.1.2 ■ TYPICAL CHARACTERISTICS Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed. 0.5 1.5 2.5 3.5 4.5 5.5 0.1 1 10 100 Maximum Output Voltage [V] Output Current [mA] Maximum Output Volgage vs. Output Current V+ = 5.5V, V− = 0V Source Sink Ta = -40°C Ta = 25°C Ta = 125°C 0.3 0.6 0.9 1.2 1.5 1.8 2.1 0.1 1 10 Maximum Output Voltage [V] Output Current [mA] Maximum Output Volgage vs. Output Current V+ = 2.1V, V− = 0V Source Sink Ta = 25°C Ta = -40°C Ta = 125°C -180 -135 -90 -45 -60 -40 -20 100 1k 10k 100k 1M Phase [°C] Voltage Gain [dB] Frequency [Hz] 40dB Voltage Gain / Phase vs. Freqency V+ = 5V, V− = 0V, RF = 100kΩ, Ta = 25°C Gain Phase CL = 10pF CL = 100pF CL = 330pF -180 -135 -90 -45 -60 -40 -20 100 1k 10k 100k 1M Phase [°C] Voltage Gain [dB] Frequency [Hz] 40dB Voltage Gain / Phase vs. Frequency V+ = 5V, V− = 0V, RF = 100kΩ, CL = 100pF Gain Phase Ta = -40°C Ta = 25°C Ta = 125°C 100 120 140 -75 -50 -25 0 25 50 75 100 125 150 CMR [dB] Ambient Temperature [°C] CMR vs. Temperature V− = 0V, VCOM = V− to V+ 100 120 140 -75 -50 -25 0 25 50 75 100 125 150 SVR [dB] Temperature [°C] SVR vs. Temperature V+ = 2.1V to 5.5V, V− = 0V, VCOM = V+/2
  • 14 - Ver.1.2 ■ TYPICAL CHARACTERISTICS Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed. Voltage Noise [500nV/DIV] Time [1s/DIV] 0.1Hz to 10Hz Voltage Noise V+ = 5V, V− = 0V, VCOM = V+/2, Ta = 25°C -160 -140 -120 -100 -80 -60 -40 -20 10 100 1k 10k 100k Channel Separation [dB] Frequency [Hz] Channel Separation vs. Frequency V+ = 5V, V− = 0V, VCOM = V+/2, Gain = 40dB, Ta = 25°C 100 120 140 10 100 1k 10k 100k CMR [dB] Frequency [Hz] CMR vs. Frequency V+ = 5V, V− = 0V, VIN = 1VPP, Ta = 25°C 100 1000 1 10 100 1k 10k Equivalent Input Noise Voltage [nV/√Hz] Frequency [Hz] Voltage Noise Density vs. Frequency V+ = 5V, V− = 0V, VCOM = V+/2, Ta = 25°C 100 1000 1 10 100 1k 10k Equivalent Input Noise Current [fA/√Hz] Frequency [Hz] Current Noise Density vs. Frequency V+ = 5V, V− = 0V, VCOM = V+/2, Ta = 25°C 100 120 140 10 100 1k 10k 100k SVR [dB] Frequency [Hz] SVR vs. Frequency SVR+ (V+ = 5±0.5V, V− = 0V), SVR- (V+ = 5V, V− = 0±0.5V), Ta = 25°C SVR- SVR+
  • 15 - Ver.1.2 ■ TYPICAL CHARACTERISTICS Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed. Voltage [1V/DIV] Time [50μs/DIV] Large Signal Step Response V+ = 5V, V− = 0V, Gain = +1, RL = 10kΩ, CL = 10pF, Ta = 25°C Input Output Voltage [50mV/DIV] Time [5μs/DIV] Small Signal Step Response V+ = 5V, V− = 0V, Gain = +1, RL = 10kΩ, CL = 10pF, Ta = 25°C Input Output VOLTAGE (1V/DIV) TIME [2ms/DIV] No Phase Reversal V+ = 5V, V− = 0V, GV = +1, RL = No Load, CL = No Load, Ta = 25°C Input Output Output Voltage [1V/DIV] Input Voltage [1V/DIV] Time [100μs/DIV] Negative Overvoltage Recovery V+ /V− = ±2.5V, Gain = −10, RL = 10kΩ, Ta = 25°C Input Output Output Voltage [1V/DIV] Input Voltage [1V/DIV] Time [100μs/DIV] Positive Overvoltage Recovery V+ /V− = ±2.5V, Gain = −10, RL = 10kΩ, Ta = 25°C Input Output
  • 16 - Ver.1.2 ■ TEST CIRCUITS RL VO VCOM VID VCOM
  • ISUPPLY, VIO, CMR, SVR
  • VOH, VOL
  • GBW
  • SR VOH; VID = -0.1V, VCOM = V / 2 VOL; VID = 0.1V, VCOM = V / 2 RG = 1kΩ, RF = 100kΩ RL = 10kΩ CL VO RL V-50Ω Vo Δt ΔV 90% 10% Δt ΔV 90% 10% CL VO RG RF V-50Ω RG = 50Ω, RF = 500kΩ VO RF RG RG RF VCOM VREF VS=V+ - V- VREF=VS / 2

Figure10 shows a one OpAmp differential amplifier that consists of the single OpAmp and four external resistors. isolation amplifier to remove common-mode noise. Figure 10. Differential Amplifier If using resistors with 1% tolerance and gain = 1, the CMR will only be 34dB.

  • 23 - Ver.1.2 Current Sensing Current sensing applications are one such application in a wide range of electronic applications and mostly used for feedback control systems, including power metering battery life indicators and chargers, over- current protection and supervising circuit, automotive, and medical equipment. In such applications, it is desirable to use a shunt with very low resistance to minimize the series voltage drop and minimizes wasted power, and allows the measurement of high current. The NLx333 series is ideal for these current sensing applications. Figure13 shows a high-side current sensing circuit, and Figure14 shows a low-side current sensing circuit. The NLx333 series has rail-to-rail input and output characteristics, thus allows the both of high-side and low-side current sensing circuit. The current detection circuit uses a differential amplifier consisting of an OpAmp and resistors R1/R2/R3/R4. The differential amplifier’s common-mode rejection ratio (CMR) is primarily determined by resistor mismatches. For details, refer to “differential amplifiers” in the application note. Figure13. High-Side Current Sensing Figure14. Low-Side Current Sensing Transimpedance Amplifier The features high input impedance with CMOS input and low power can be used for transimpedance amplifier applications shown in Figure15. The output voltage of amplifier is given by the equation VOUT = IIN∙RF. Since the output voltage swing of amplifier is limited, RF should be selected such that all possible values of IIN can be detected. Load Power Supply Rs Vout I Rs Vout ILoad Power Supply
  • 25 - Ver.1.2 EMIRR (EMI Rejection Ratio) Definition EMIRR is a parameter indicating the EMI robustness of an OpAmp. The definition of EMIRR is given by the following equation1. The tolerance of the RF signal can be grasped by measuring an RF signal and offset voltage shift quantity. Offset voltage shift is small so that a value of EMIRR is big. And it understands that the tolerance for the RF signal is high. In addition, about the input offset voltage shift with the RF signal, there is the thinking that influence applied to the input terminal is dominant. Therefore, generally the EMIRR becomes value that applied an RF signal to +INPUT terminal. *For details, refer to “Application Note for EMI Immunity" in our HP. 100 120 140 1M 10M 100M 1G EMIRR [dB] Frequency [Hz] EMIRR vs. Frequency V+ = 5V, V− = 0V, Ta = 25°C
  • 26 - Ver.1.2 ■ MARKING SPECIFICATION (SOT-23-5-DC) ①②③ Part Marking List Product Name ① ② ③ NL0333DCAE1S A 1 2 NOTICE There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the case of recognizing the marking characteristic with AOI, please contact our sales or distributor before attempting to use AOI. Product Code Refer to Part Marking List Lot Number Alphanumeric Serial Number ① ② ③ ④ ⑤ 1Pin
  • 27 - Ver.1.2 ■ MARKING SPECIFICATION (SC-88A-DB) ①④⑤ Part Marking List Product Name ② ③ NL1333DBAE1S S 2 NOTICE There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the case of recognizing the marking characteristic with AOI, please contact our sales or distributor before attempting to use AOI. Product Code Refer to Part Marking List Lot Number Alphanumeric Serial Number 1Pin
  • 28 - Ver.1.2 ■ MARKING SPECIFICATION (VSP-8-AF) ① to ⑦ ⑧ to ⑫ Part Marking List Product Name ① ② ③ ④ ⑤ ⑥ ⑦ NL2333AFAE2S L 2 3 3 3 A S Product Code Refer to Part Marking List Lot Number Alphanumeric Serial Number NOTICE There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the case of recognizing the marking characteristic with AOI, please contact our sales or distributor before attempting to use AOI. ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ ⑫ 1Pin
  • 29 - Ver.1.2 ■ MARKING SPECIFICATION (EMP-8-AN) ① to ⑦ ⑧ to ⑫ Part Marking List Product Name ① ② ③ ④ ⑤ ⑥ ⑦ NL2333ANAE2S L 2 3 3 3 A S Lot Number Alphanumeric Serial Number NOTICE There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the case of recognizing the marking characteristic with AOI, please contact our sales or distributor before attempting to use AOI. Product Code Refer to Part Marking List ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ ⑫ 1Pin

Package Information

SOT-23-5-DC PI-SOT-23-5-DC-02-E-A ■ PACKAGE DIMENSIONS UNIT: mm ■ EXAMPLE OF SOLDER PADS DIMENSIONS 1.0 0.7max 0.95 0.95 1.9 2.4

SOT-23-5-DC PI-SOT-23-5-DC-02-E-A ■ PACKING SPEC UNIT: mm (1) Taping dimensions / Insert direction 3.3±0.1 3.2±0.1 4.0±0.1 2.0±0.05 4.0±0.1 1.1±0.1 1.5 +0.1 1.75±0.13.5±0.05 8.0±0.3 0.3±0.1 2.0max Insert direction (E1) (2) Taping state Feed direction more than 160mm 3000pcs/reel Sealing with covering tape DevicesTrailer part Leader part more than 550mm

SOT-23-5-DC PI-SOT-23-5-DC-02-E-A (3) Reel dimensions 2±0.5 13±0.221±0.8 11.4±1.0 9 +1.0 -0.3 60 +1 180 -3.0 (4) Peeling strength Peeling strength of cover tape ・Peeling angle 165 to 180°degrees to the taped surface. ・Peeling speed 300mm/min ・Peeling strength 0.1 to 1.0N 165 to 180° Direction to pull Feed direction Carrier tape Cover tape

SOT-23-5-DC PI-SOT-23-5-DC-02-E-A (5) Packing state Box size:185×185×20 <Label> Product name, Quantity, Lot No, Mark ■ HEAT-RESISTANCE PROFILES Reflow profile 3℃/s MAX. 217℃ 200℃ 150℃ 255℃ 260℃ MAX. 30s MAX. 6℃/s MAX. 60-120s 60-150s Time(s) Package Surface Temperature(℃)

SC-88A-DB PI-SC-88A-DB-02-E-A ■ PACKAGE DIMENSIONS UNIT: mm 0.23±0.1 0.1 M S AB 1.3±0.2 2.0±0.2 A 2.1±0.3 B 0.65 1.25 +0.2 -0.1 0.1 S 1.1max S 0~0.1 0.9 +0.1 -0.2 0.15±0.08 0.36 +0.1 -0.12 0~14° 1 2 3 ■ EXAMPLE OF SOLDER PADS DIMENSIONS 0.8 0.65 1.9 0.35

SC-88A-DB PI-SC-88A-DB-02-E-A ■ PACKING SPEC UNIT: mm (1) Taping dimensions / Insert direction 2.5 +0.1 1.75±0.13.5±0.1 8.0±0.3 0.2±0.05 1.6max Insert direction (E1) (2) Taping state more than 160mm 3,000pcs/reel Sealing with covering tape DevicesTrailer part Leader part more than 550mm Feed direction

SC-88A-DB PI-SC-88A-DB-02-E-A (3) Reel dimensions 2±0.5 13±0.221±0.8 60+1 180 -3 11.4±1 +1.0 -0.3 (4) Peeling strength Peeling strength of cover tape ・Peeling angle 165 to 180°degrees to the taped surface. ・Peeling speed 300mm/min ・Peeling strength 0.1 to 1.0N 1 6 5t o1 8 0 ° Direction to pull Feed direction Carrier tape Cover tape

SC-88A-DB PI-SC-88A-DB-02-E-A (5) Packing state Box size:185×185×18 <Label> Product name, Quantity, Lot No, Mark ■ HEAT-RESISTANCE PROFILES Reflow profile 3℃/s MAX. 217℃ 200℃ 150℃ 255℃ 260℃ MAX. 30s MAX. 6℃/s MAX. 60-120s 60-150s Time(s) Package Surface Temperature(℃)

■ PACKAGE DIMENSIONS UNIT: mm 0~10゚ 2.9 +0.3 -0.1 2.8±0.2 4.0±0.3 +0.1 -0.05 +0.1 -0.05 0.2±0.1 0.1 0.1 M 0.1 1.1±0.1 0.6MAX 0.65 0.127 0.55±0.2 ■ EXAMPLE OF SOLDER PADS DIMENSIONS UNIT: mm 1.95 1.0 0.65 3.5 0.23

■ PACKING SPEC UNIT: mm (1) Taping dimensions / Insert direction Insert direction (E2) *Carrier tape material: PS carbon *Cover tape material: Polyester 8.0±0.14.4 3.2 +0.1 1.75±0.15.5±0.05 12.0±0.3 0.3±0.05 2.0(MAX)1.5 +0.1 (2) Taping state Feed direction more than 160mm 2000pcs/reel Sealing with covering tape DevicesTrailer part Leader part more than 850mm

(3) Reel dimensions 2.0±0.5 21±0.8 13±0.2 2.0±0.2 13.5±0.5 100±1 254±2 *Reel material: PS carbon (4) Peeling strength Peeling strength of cover tape ・Peeling angle 165 to 180°degrees to the taped surface. ・Peeling speed 300mm/min ・Peeling strength 0.1 to 1.3N 1 6 5t o1 8 0 ° Direction to pull Feed direction Carrier tape Cover tape

(5) Packing state Box size: 266×263×28 <Label> Device No., Quantity, Lot No., Mark ■ HEAT-RESISTANCE PROFILES Reflow profile 3℃/s MAX. 217℃ 200℃ 150℃ 255℃ 260℃ MAX. 30s MAX. 6℃/s MAX. 60-120s 60-150s Time(s) Package Surface Temperature(℃)

■ PACKAGE DIMENSIONS UNIT: mm 0.4±0.1 0.12 M 0.1 0~10° 0.2 +0.1 -0.05 8 5 1.27

0.74 MAX

5.0±0.3 3.9±0.2 6.0±0.4 1.5±0.150.15±0.1 0.8±0.2 ■ EXAMPLE OF SOLDER PADS DIMENSIONS 0.721.27 1.27 5.72 3.81

■ PACKING SPEC UNIT: mm (1) Taping dimensions / Insert direction 6.6 8.0±0.1 5.4 1.7±0.1 +0.1 1.75±0.15.5±0.05 12.0±0.3 0.3±0.05 2.2*Carrier tape material: PS carbon *Cover tape material: Polyester Insert direction (E1) (2) Taping state Feed direction more than 160mm 2000pcs/reel Sealing with covering tape DevicesTrailer part Leader part more than 880mm

(3) Reel dimensions *Reel material: PS 2±0.5 13±0.221±0.8 80±1 330±2 13.5±0.5 2.0±0.2 (4) Peeling strength Peeling strength of cover tape ・Peeling angle 165 to 180°degrees to the taped surface. ・Peeling speed 300mm/min ・Peeling strength 0.1 to 1.3N 1 6 5t o1 8 0 ° Direction to pull Feed direction Carrier tape Cover tape

(5) Packing state Box size: 342×340×28 <Label> Device No., Quantity, Lot No., Mark ■ HEAT-RESISTANCE PROFILES Reflow profile 3℃/s MAX. 217℃ 200℃ 150℃ 255℃ 260℃ MAX. 30s MAX. 6℃/s MAX. 60-120s 60-150s Time(s) Package Surface Temperature(℃)

■ REVISION HISTORY Date Revision Contents of Changes March 20, 2025 Ver.1.0 Initial Release. May 28, 2025 Ver.1.1 Electrical Characteristics: Corrected Input Offset Voltage condition. December 26, 2025 Ver.1.2 NL2333AN Status Update: Mass Production. Changed datasheet format.

  1. The products and the product specifications described in this document are subject to change or discontinuation of production without notice for reasons such as improvement. Therefore, before deciding to use the products, please refer to our sales representatives for the latest information thereon. 2. The materials in this document may not be copied or otherwise reproduced in whole or in part without the prior written consent of us. 3. This product and any technical information relating thereto are subject to complementary export controls (so- called KNOW controls) under the Foreign Exchange and Foreign Trade Law, and related politics ministerial ordinance of the law. (Note that the complementary export controls are inapplicable to any application-specific products, except rockets and pilotless aircraft, that are insusceptible to design or program changes.) Accordingly, when exporting or carrying abroad this product, follow the Foreign Exchange and Foreign Trade Control Law and its related regulations with respect to the complementary export controls. 4. The technical information described in this document shows typical characteristics and example application circuits for the products. The release of such information is not to be construed as a warranty of or a grant of license under our or any third party's intellectual property rights or any other rights. 5. The products listed in this document are intended and designed for use as general electronic components in standard applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products, amusement equipment etc.). Those customers intending to use a product in an application requiring extreme quality and reliability, for example, in a highly specific application where the failure or misoperation of the product could result in human injury or death should first contact us.
  • Aerospace Equipment
  • Equipment Used in the Deep Sea
  • Power Generator Control Equipment (nuclear, steam, hydraulic, etc.)
  • Life Maintenance Medical Equipment
  • Fire Alarms / Intruder Detectors
  • Vehicle Control Equipment (automotive, airplane, railroad, ship, etc.)
  • Various Safety Devices
  • Traffic control system
  • Combustion equipment In case your company desires to use this product for any applications other than general electronic equipment mentioned above, make sure to contact our company in advance. Note that the important requirements mentioned in this section are not applicable to cases where operation requirements such as application conditions are conf irmed by our company in writing after consultation with your company. 6. We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products are likely to fail with certain probability. In order to prevent any injury to persons or damages to property resulting from such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy feature, fire containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or damage arising from misuse or inappropriate use of the products. 7. The products have been designed and tested to function within controlled environmental conditions. Do not use products under conditions that deviate from methods or applications specified in this datasheet. Failure to employ the products in the proper applications can lead to deterioration, destruction or failure of the products. We shall not be responsible for any bodily injury, fires or accident, property damage or any consequential damages resulting from misuse or misapplication of the products. 8. Quality Warranty 8-1. Quality Warranty Period In the case of a product purchased through an authorized distributor or directly from us, the warranty period for this product shall be one (1) year after delivery to your company. For defective products that occurred during this period, we will take the quality warranty measures described in section 8-2. However, if there is an agreement on the warranty period in the basic transaction agreement, quality assurance agreement, delivery specifications, etc., it shall be followed. 8-2. Quality Warranty Remedies When it has been proved defective due to manufacturing factors as a result of defect analysis by us, we will either deliver a substitute for the defective product or refund the purchase price of the defective product. Note that such delivery or refund is sole and exclusive remedies to your company for the defective product. 8-3. Remedies after Quality Warranty Period With respect to any defect of this product found after the quality warranty period, the defect will be analyzed by us. On the basis of the defect analysis results, the scope and amounts of damage shall be determined by mutual agreement of both parties. Then we will deal with upper limit in Section 8-2. This provision is not intended to limit any legal rights of your company. 9. Anti-radiation design is not implemented in the products described in this document. 10. The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and characteristics in the evaluation stage. 11. WLCSP products should be used in light shielded environments. The light exposure can influence functions and characteristics of the products under operation or storage. 12. Warning for handling Gallium and Arsenic (GaAs) products (Applying to GaAs MMIC, Photo Reflector). These products use Gallium (Ga) and Arsenic (As) which are specified as poisonous chemicals by law. For the prevention of a hazard, do not burn, destroy, or process chemically to make them as gas or power. When the product is disposed of, please follow the related regulation and do not mix this with general industrial waste or household waste. 13. Please contact our sales representati ves should you have any questions or comments concerning the products or the technical information. Official website https://www.nisshinbo-microdevices.co.jp/en/ Purchase information https://www.nisshinbo-microdevices.co.jp/en/buy/