NHSB064T-NA

NHSB064T-NA NICHIA | Alldatasheet

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NICHIA STS-DA1-2150B <Cat.No.180802> NICHIA CORPORATION SPECIFICATIONS FOR LED NHSB064T-NA

• Pb-free Reflow Soldering Application
• Built-in ESD Protection Device
• RoHS Compliant
• ISO/TS16949 Compliant

NICHIA STS-DA1-2150B <Cat.No.180802> SPECIFICATIONS (1) Absolute Maximum Ratings Item Symbol Absolute Maximum Rating Unit Forward Current IF 15 mA Pulse Forward Current IFP 30 mA Allowable Reverse Current IR 85 mA Power Dissipation PD 53 mW Operating Temperature Topr -40~110 °C Storage Temperature Tstg -40~110 °C Junction Temperature TJ 125 °C * Absolute Maximum Ratings at TA=25°C. * IFP conditions with pulse width ≤10ms and duty cycle ≤10%. (2) Initial Electrical/Optical Characteristics Item Symbol Condition Typ Unit Forward Voltage VF IF=10mA 3.1 V Luminous Intensity Iv IF=10mA 450 mcd Chromaticity Coordinate x IF=10mA 0.19 y IF=10mA 0.19 Thermal Resistance RθJS - 340 °C/W RθJA - 520 * Characteristics at TA=25°C. * Luminous Intensity value as per CIE 127:2007 standard. * Chromaticity Coordinates as per CIE 1931 Chromaticity Chart. * RθJS is the thermal resistance from the junction to the TS measurement point. * RθJA is Thermal Resistance from junction to ambient䠄Test board: FR4 board thickness=1.6mm, copper layer thickness=35μm䠅.

NICHIA STS-DA1-2150B <Cat.No.180802> RANKS Item Rank Min Max Unit Forward Voltage - 2.7 3.5 V Luminous Intensity S 500 720 mcd R 360 500 Q 250 360 Color Rank Rank NA10 * Ranking at TA=25°C. * Forward Voltage Tolerance: ±0.05V * Luminous Intensity Tolerance: ±7% * Chromaticity Coordinate Tolerance: ±0.005 * LEDs from the above ranks will be shipped. The rank combination ratio per shipment will be decided by Nichia.

NICHIA STS-DA1-2150B <Cat.No.180802> CHROMATICITY DIAGRAM 460 470 480 490 NA10 0.0 0.1 0.2 0.3 0.4 y x

NICHIA STS-DA1-2150B <Cat.No.180802> OUTLINE DIMENSIONS STS-DA7-2000A NxSB064x-Nx 管理番号 No. (単位 Unit: mm) This product complies with RoHS Directive. 本製品䛿RoHS指௧䛻適合し䛶䛚䜚ます䚹* (単位 Unit: mm, 公差 Tolerance: ±0.2) K A 保護素子 Protection Device (0.45) 0.8±0.3 (0.4) AnodeCathode (2.4) 2.8 (2.4) 3.2 Cathode Mark 2±0.3 2.2 (1.05) (0.8) 3.5±0.3 (1.9)0.8±0.3 The dimension(s) in parentheses are for reference purposes. 括弧䛷囲ま䜜た寸法䛿参考値䛷す䚹* 㡯目 Item 䝟ッ䜿ー䝆材質 Package Materials 封止樹脂材質 Encapsulating Resin Materials 電極材質 Electrodes Materials 質量 Weight 内容 Description 耐熱性䝫䝸䝬ー Heat-Resistant Polymer 䝅䝸䝁ーン樹脂(蛍ග体入䜚䠅 Silicone Resin(with phosphor) 銅合金+銀メッキ Ag-plated Copper Alloy 0.036g(TYP)

NICHIA STS-DA1-2150B <Cat.No.180802> SOLDERING

• Recommended Reflow Soldering Condition(Lead-free Solder) 120sec Max Pre-heat 180 to 200°C 260°CMax 10sec Max 60sec Max Above 220°C 1 to 5°C per sec
• Recommended Hand Soldering Condition Temperature 350°C Max Soldering Time 3sec Max
• Recommended Soldering Pad Pattern (単位 Unit: mm) 4 4 9.5 2.6 1.5 1.5 Blank boxes: Solder resist opening , Shaded areas: Footprint * This LED is designed to be reflow soldered to a PCB. If dip soldered, Nichia will not guarantee its reliability. * Reflow soldering must not be performed more than twice. Hand soldering must not be performed more than once. * When cooling the LEDs from the peak temperature a gradual cooling slope is recommended; do not cool the LEDs rapidly. * During reflow soldering, the heat and atmosphere in the reflow oven may cause the optical characteristics to degrade. In particular, reflow soldering performed with an air atmosphere may have a greater negative effect on the optical charact eristics than if a nitrogen atmosphere is used; Nichia recommends using a nitrogen reflow atmosphere. * This LED uses a silicone resin for the encapsulating resin; the silicone resin is soft. If pressure is applied to the silicone resin, it may cause the resin to be damaged, chipped, delaminated and/or deformed. If the resin i s damaged, chipped, delaminated and/or deformed, it may cause the wire to break causing a catastrophic failure (i.e. the LED not to illuminate) and/or reliability issues (e.g. the LED to corrode and/or to become dimmer, the color/directivity to change, et c.). Ensure that pressure is not applied to the encapsulating resin. * Once the LEDs have been soldered to a PCB, it should not be repaired/reworked. If it must be done, using a double-head soldering iron is strongly recommended. Ensure that sufficient verification is performed prior to use to ensure that the repair/rework has not caused the LED characteristics to deteriorate. * When soldering, do not apply stress to the LED while the LED is hot. * When using an automatic pick-and-place machine, choose an appropriate nozzle for this LED. Using a pick-and-place nozzle with a smaller diameter than the size of the LED's emitting surface will cause damage to the emitting surface causing a catastrophic failure (i.e. the LED not to illuminate). * The soldering pad pattern above is a general recommendation for LEDs to be mounted without issues; if a high degree of precision is required for the chosen application (i.e. high-density mounting), ensure that the soldering pad pattern is optimized. * Consider factors such as the reflow soldering temperature, hand soldering temperature, etc. when choosing the solder. * When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner where the flux will come in contact with the LEDs. * Ensure that there are no issues with the type and amount of solder that is being used.

NICHIA STS-DA1-2150B <Cat.No.180802> TAPE AND REEL DIMENSIONS Cathode Mark -0Φ1+0.25 2.85±0.1 STS-DA7-0165A Reel Size: 2000pcs 数量䛿1䝸ー䝹䛻䛴䛝 2000個入䜚䛷す䚹* Nxxx064x 0.25±0.05 2.15±0.1 3.65±0.1 䝖䝺ー䝷部/䝸ーダ部 Trailer and Leader Top Cover Tape 引䛝出し方向 LED装着部 䝸ーダ部最小400mm 䝖䝺ー䝷部最小160mm䠄空部䠅 Trailer 160mm MIN(Empty Pockets) Loaded Pockets エン䝪䝇キャ䝸䜰䝔ープ Embossed Carrier Tape 䝖ップカ䝞ー䝔ープ Feed Direction Leader without Top Cover Tape 400mm MIN 引䛝出し部最小100mm䠄空部䠅 Leader with Top Cover Tape 100mm MIN(Empty Pocket) The tape packing method complies with JIS C 0806 (Packaging of Electronic Components on Continuous Tapes). * JIS C 0806電子部品䝔ーピン䜾䛻準拠し䛶います䚹 管理番号 No. (単位 Unit: mm) Φ60+1 䝸ー䝹部 Reel f 13 ±0.2 f 21±0.8 䝷䝧䝹 Label Φ21 ±0.8 Φ ±0.2 11.4±1 9±0.3180+0-3 -0Φ1.5+0.1 䝔ーピン䜾部 Tape 4±0.1 1.75±0.1 4±0.1 2±0.05 3.5±0.05 8+0.3 -0.1 When the tape is rewound due to work interruptions, no more than 10N should be applied to the embossed carrier tape. The LEDs may stick to the top cover tape. * 実装作業䛾中断䛺䛹䛷エン䝪䝇キャ䝸䜰䝔ープ䜢䝸ー䝹䛻巻䛝取䜛場合䚸 エン䝪䝇キャ䝸䜰䝔ープ䜢強く(10N௨ୖ)締䜑䛺い䛷ୗさい䚹 LED䛜カ䝞ー䝔ープ䛻貼䜚付く可能性䛜あ䜚ます䚹

NICHIA STS-DA1-2150B <Cat.No.180802> PACKAGING - TAPE & REEL Nichia LED STS-DA7-0006C Nxxxxxxx 䝷䝧䝹 Label 䝷䝧䝹 Label 管理番号 No. Reel 䝸ー䝹 熱䝅ー䝹 Seal Moisture-proof Bag 䜰䝹䝭防湿袋 RoHS Nxxxxxxx XXXX LED NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN TYPE LOT QTY. YMxxxx-RRR PCS RoHS Nxxxxxxx XXXX LED RRR PCS TYPE RANK QTY. NICHIA CORPORATION

491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN

Reels are shipped with desiccants in heat-sealed moisture-proof bags. 䝅䝸カ䝀䝹䛸䛸䜒䛻䝸ー䝹䜢䜰䝹䝭防湿袋䛻入䜜䚸熱䝅ー䝹䛻䜘䜚封䜢します䚹 Desiccants 䝅䝸カ䝀䝹 Moisture-proof bags are packed in cardboard boxes with corrugated partitions. 䜰䝹䝭防湿袋䜢並べ䛶入䜜䚸ダン䝪ー䝹䛷仕ษ䜚ます䚹 ダン䝪ー䝹䛻䛿防水加工䛜さ䜜䛶䛚䜚ませ䜣䛾䛷䚸梱包箱䛜水䛻濡䜜䛺い䜘う注意し䛶ୗさい䚹* 輸送䚸運搬䛻際し䛶弊社䜘䜚䛾梱包状態あ䜛い䛿ྠ等䛾梱包䜢行䛳䛶ୗさい䚹* 取䜚扱い䛻際し䛶䚸落ୗさせた䜚䚸強い衝撃䜢与えた䜚します䛸䚸製品䜢損傷させ䜛原因䛻䛺䜚ます䛾䛷注意し䛶ୗさい䚹* Using the original package material or equivalent in transit is recommended. Do not expose to water. The box is not water-resistant. Do not drop or expose the box to external forces as it may damage the products. Products shipped on tape and reel are packed in a moisture-proof bag. They are shipped in cardboard boxes to protect them from external forces during transportation. * 本製品䛿䝔ーピン䜾した䛾ち䚸輸送䛾衝撃䛛䜙保護す䜛た䜑ダン䝪ー䝹䛷梱包します䚹 If not provided, it will not be indicated on the label. ******* is the customer part number. 客ඛ型ྡ䛜設定さ䜜䛶い䛺い場合䛿空白䛷す䚹 参照し䛶ୗさい䚹 For details, see "LOT NUMBERING CODE" in this document. * 䝻ッ䝖表記方法䛻䛴い䛶䛿䝻ッ䝖番号䛾㡯䜢 The label does not have the RANK field for un-ranked products. * 䝷ン䜽ศけ䛜䛺い場合䛿䝷ン䜽表記䛿あ䜚ませ䜣䚹

NICHIA STS-DA1-2150B <Cat.No.180802> LOT NUMBERING CODE Lot Number is presented by using the following alphanumeric code. YMxxxx - RRR Y - Year Year Y 2017 H 2018 I 2019 J 2020 K 2021 L 2022 M M - Month Month M Month M 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 A 5 5 11 B 6 6 12 C xxxx-Nichia's Product Number RRR-Ranking by Color Coordinates, Ranking by Luminous Intensity

NICHIA STS-DA1-2150B <Cat.No.180802> DERATING CHARACTERISTICS NHSB064x-Nx 管理番号 No. STS-DA7-1820B 0 20 40 60 80 100 120 Derating1 (85, 15.0) (110, 6.00) 100 1 10 100 Duty 許容㡰電流 Allowable Forward Current(mA) 周囲温度-許容㡰電流特性 Ambient Temperature vs Allowable Forward Current 許容㡰電流 Allowable Forward Current(mA) 周囲温度 Ambient Temperature(°C) 䝕ュー䝔䜱ー比 Duty Ratio(%) 䝕ュー䝔䜱ー比-許容㡰電流特性 Duty Ratio vs Allowable Forward Current TA =25°C

NICHIA STS-DA1-2150B <Cat.No.180802> OPTICAL CHARACTERISTICS NHSB064-NA 管理番号 No. STS-DA7-2021A 0.0 0.2 0.4 0.6 0.8 1.0 350 400 450 500 550 600 650 700 750 800 Spectrum 相対ග度 Relative Luminosity(a.u.) 90° 80° 70° 60° 50° 40° 30° 20° 10°0°-10° -20° -30° -40° -50° -60° -70° -80° -90° Directivity1 発ග䝇䝨䜽䝖䝹 Spectrum 相対発ග強度 Relative Emission Intensity(a.u.) 波長 Wavelength(nm) 指向特性 Directivity 放射角度 Radiation Angle 1 0.5 0 0.5 1 10mAIFP= TA=25°C 10mAIFP= TA=25°C * 本特性䛿参考䛷す䚹 All characteristics shown are for reference only and are not guaranteed.

NICHIA STS-DA1-2150B <Cat.No.180802> FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS NHSB064x-NA STS-DA7-1822A管理番号 No. 100 VfIf 2.0 2.5 3.0 3.5 4.0 -60 -40 -20 0 20 40 60 80 100 120 TaVf 0.6 0.8 1.0 1.2 1.4 -60 -40 -20 0 20 40 60 80 100 120 TaIv 相対ග度 Relative Luminosity(a.u.) 周囲温度-相対ග度特性 Ambient Temperature vs Relative Luminosity 㡰電流 Forward Current(mA) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 10 20 30 40 IfIv 相対ග度 Relative Luminosity(a.u.) 㡰電流-相対ග度特性 Forward Current vs Relative Luminosity 㡰電流 Forward Current(mA) 㡰電圧-㡰電流特性 Forward Voltage vs Forward Current 周囲温度-㡰電圧特性 Ambient Temperature vs Forward Voltage 㡰電圧 Forward Voltage(V) 㡰電圧 Forward Voltage(V) 周囲温度 Ambient Temperature(°C) 周囲温度 Ambient Temperature(°C) TA=25°C * 本特性䛿参考䛷す䚹 All characteristics shown are for reference only and are not guaranteed. TA=25°C IFP=10mA IFP=10mA

NICHIA STS-DA1-2150B <Cat.No.180802> FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS NHSB064-NA STS-DA7-2022管理番号 No. 0.17 0.18 0.19 0.20 0.21 Taxy -40°C 0°C 25°C 50°C 110°C x 0.17 0.18 0.19 0.20 0.21 Ifxy 1mA 5mA 10mA 15mA 30mA x yy 10mAIFP= 周囲温度-色度特性 Ambient Temperature vs Chromaticity Coordinate 㡰電流-色度特性 Forward Current vs Chromaticity Coordinate TA =25°C * 本特性䛿参考䛷す䚹 All characteristics shown are for reference only and are not guaranteed.

NICHIA STS-DA1-2150B <Cat.No.180802> RELIABILITY (1) Tests and Results Test Reference Standard Test Conditions Test Duration Failure Criteria Units Failed/Tested Resistance to Soldering Heat (Reflow Soldering) JEITA ED-4701 300 301 Tsld=260°C, 10sec, 2reflows, Precondition: 30°C, 70%RH, 168hr #1 0/22 Solderability (Reflow Soldering) JEITA ED-4701 303 303A Tsld=245±5°C, 5sec, Lead-free Solder(Sn-3.0Ag-0.5Cu) #3 0/22 Thermal Shock JEITA ED-4701 300 307 -40°C to 110°C, 1min dwell, 10sec transfer, Precondition: 30°C, 70%RH, 168hr 100cycles #1 0/100 Temperature Cycle JEITA ED-4701 100 105 -40°C(30min)~25°C(5min)~ 110°C(30min)~25°C(5min) 100cycles #1 0/100 Moisture Resistance (Cyclic) JEITA ED-4701 200 203 24hr per cycle 10cycles #1 0/100 High Temperature Storage JEITA ED-4701 200 201 TA=110°C 1000hours #1 0/100 Temperature Humidity Storage JEITA ED-4701 100 103 TA=60°C, RH=90% 1000hours #1 0/100 Low Temperature Storage JEITA ED-4701 200 202 TA=-40°C 1000hours #1 0/100 Room Temperature Operating Life TA=25°C, IF=15mA 1000hours #2 0/100 High Temperature Operating Life TA=85°C, IF=15mA 1000hours #2 0/100 Temperature Humidity Operating Life 60°C, RH=90%, IF=10mA 1000hours #2 0/100 Low Temperature Operating Life TA=-40°C, IF=10mA 1000hours #2 0/100 Permanence of Marking JEITA ED-4701 500 501 Isopropyl Alcohol, 23±5°C, Dipping Time: 5min 1time #1 0/22 Vibration JEITA ED-4701 400 403 200m/s2, 100~2000~100Hz, 4cycles, 4min, each X, Y, Z 48minutes #1 0/10 Free Fall 3drops from a height of 75cm #1 0/10 Electrostatic Discharges JEITA ED-4701 300 304 HBM, 2kV, 1.5kΩ, 100pF, 3pulses, alternately positive or negative #1 0/22 NOTES: Measurements are performed after allowing the LEDs to return to room temperature. (2) Failure Criteria Criteria # Items Conditions Failure Criteria Forward Voltage(VF) IF=10mA >U.S.L.×1.1 Luminous Intensity(IV) IF=10mA <L.S.L.×0.7 Forward Voltage(VF) IF=10mA >U.S.L.×1.1 Luminous Intensity(IV) IF=10mA <L.S.L.×0.5 #3 Solderability - Less than 95% solder coverage

NICHIA STS-DA1-2150B <Cat.No.180802> CAUTIONS (1) Storage Conditions Temperature Humidity Time Storage Before Opening Aluminum Bag ≤30°C ≤90%RH Within 1 Year from Delivery Date After Opening Aluminum Bag ≤30°C ≤70%RH ≤168hours Baking 65±5°C - ≥24hours

• The storage/packaging requirements for this LED are comparable to JEDEC Moisture Sensitivity Level (MSL) 3 or equivalen t. Nichia used IPC/JEDEC STD-020 as a reference to rate the MSL of this LED.
• This LED uses a package that could absorb moisture; if the package absorbs moisture and is exposed to heat during soldering, it may cause the moisture to vaporize and the package to expand and the resulting pressure may cause internal delamination. This may cause the optical characteristics to degrade. To minimize moisture absorption in storage/transit, moisture-proof aluminum bags are used for the LEDs with a silica gel packet to absorb any air moisture in the bag. The silica gel beads turn blue to red as they absorb moisture.
• Once the moisture-proof aluminum bag is open, ensure that the LED is soldered to a PCB within the range of the conditions above. To store any remaining unused LEDs, use a hermetically sealed container with silica gel desiccants. Nichia recommends placing them back to the original moisture-proof bag and reseal it.
• If the “After Opening” storage time has been exceeded or any pink silica gel beads are found, ensure that the LED are baked before use. Baking should only be done once.
• This LED has silver-plated parts both inside and outside of the package. If the LEDs are exposed to a corrosive environment, it may cause the plated surface to tarnish causing issues (i.e. solderability, optical charac teristics). Ensure that when storing LEDs, a hermetically sealed container is used. Nichia recommends placing them back to the original moisture-proof bag and reseal it.
• Ensure that when designing, there are no issues with the parts/materials used with the LEDs. The following must be taken into consideration: - After soldering LEDs to a PCB and/or installing them in a system, it is possible that the LEDs will be exposed t o corrosive gases released from parts/materials used with the LEDs in the same assembly/system (e.g . rubber materials, cardboard boxes) and/or gases entering from the outside; the plated surface may tarnish depending on the gas compon ent. - Small amounts of corrosive gas may be found in the air. - Resin materials may contain substances (e.g. halogens) that affect the plated s urfaces of the LEDs.
• To prevent substances/gases from affecting the plated surface, ensure that the parts/materials used with the LEDs in the same assembly/system do not contain sulfur (e.g. gasket/seal, adhesive, etc.). If the plating becomes extremely corroded or contaminated, it may cause issues (e.g. electrical connection failures). If a gasket/seal is used, silicone rubber gaskets/seals are recommended; ensure that this use of silicone does not result in issues (e.g. electri cal connection failures) caused by low molecular weight volatile siloxane.
• To avoid condensation, the LEDs must not be stored in areas where temperature and humidity fluctuate greatly.
• Do not store the LEDs in a dusty environment.
• Do not expose the LEDs to direct sunlight and/or an environment over a long period of time where the temperature is higher than normal room temperature.

NICHIA STS-DA1-2150B <Cat.No.180802> (2) Directions for Use

• The circuit must be designed to ensure that the Absolute Maximum Ratings are not exceeded for each LED. The LEDs should be operated at a constant current per LED. In the case of operating at a constant voltage, Circuit B is recommended. If Circuit A is used, it may cause the currents flowing through the LEDs to vary due to the variation in the forward voltage characteristics of the LEDs on the circuit. (A) ... (B) ...
• This LED is designed to be operated at a forward current. Ensure that no voltage is applied to the LED in the forward/reverse direction while the LED is off. If the LEDs are used in an environment where reverse voltages are applied to the LED continuously, it may cause electrochemical migration to occur causing the LED to be damaged. When not in use for a long period of time, the system’s power should be turned off to ensure that there are no issues/damage.
• To stabilize the LED characteristics while in use, Nichia recommends that the LEDs are operated at currents ≥ 10% of the sorting current.
• Ensure that transient excessive voltages (e.g. lighting surge) are not applied to the LEDs.
• If the LEDs are used for outdoor applications, ensure that necessary measures are taken (e.g. protecting the LEDs from water/salt damage and high humidity). (3) Handling Precautions
• Do not handle the LEDs with bare hands as it will contaminate the LED surface and may affect the optical characteristics: it might cause the LED to be deformed and/or the wire to break, which will cause the LED not to illuminate. The lead could also cause an injury.
• Ensure that when handling the LEDs with tweezers, excessive force is not applied to the LED. Otherwise, it may cause damage to the resin (e.g. cut, scratch, chip, crack, delamination and deformation) and the wire to break causing a catastrophic failure (i.e. the LED not to illuminate).
• Dropping may cause damage to the LED (e.g. deformation).
• Do not stack assembled PCBs together. Otherwise, it may cause damage to the resin (e.g. cut, scratch, chip, crack, delamination and deformation) and the wire to break causing a catastrophic failure (i.e. the LED not to illuminate). (4) Design Consideration
• If the LEDs are soldered to a PCB and the PCB assembly is bent (e.g. PCB depaneling process), it may cause the LED package to break. The PCB layout should be designed to minimize the mechanical stress on the LEDs when the PCB assembly is bent/warped.
• The amount of mechanical stress exerted on the LED from depaneling may vary depending on the LED position/orientation on the PCB assembly (e.g. especially in areas near V-groove scores). The PCB layout should be designed to minimize the mechanical stress on the LEDs when the PCB is separated into individual PCB assemblies.
• To separate a PCB populated with the LEDs, use a specially designed tool. Do not break the PCB by hand.
• Volatile organic compounds that have been released from materials present around the LEDs (e.g. housing, gasket/seal, adhesive, secondary lens, lens cover, etc.) may penetrate the LED lens and/or encapsulating resin. If the LEDs are being used in a hermetically sealed environment, these volatile compounds can discolor after being exposed to heat and/or photon energy and it may greatly reduce the LED light output and/or color shift. In this case, ventilating the environment may improve the reduction in light output and/or color shift. Perform a light-up test of the chosen application for optical evaluation to ensure that there are no issues, especially if the LEDs are planned to be used in a hermetically sealed environment.

NICHIA STS-DA1-2150B <Cat.No.180802> (5) Electrostatic Discharge (ESD)

• This LED is sensitive to transient excessive voltages (e.g. ESD, lightning surge). If this excessive voltage occurs in the circuit, it Ensure that when handling the LEDs, necessary measures are taken to protect them from an ESD discharge. The following examples are recommended measures to eliminate the charge: - Grounded wrist strap, ESD footwear, clothes, and floors - Grounded workstation equipment and tools - ESD table/shelf mat made of conductive materials
• Ensure that all necessary measures are taken to prevent the LEDs from being exposed to transient excessive voltages (e.g. ESD, lightning surge): - tools (e.g. soldering irons), jigs, and machines that are used are properly grounded - appropriate ESD materials/equipment are used in the work area - the system/assembly is designed to provide ESD protection for the LEDs.
• If the tool/equipment used is an insulator (e.g. glass cover, plastic, etc.), ensure that necessary measures have been taken to protect the LED from transient excessive voltages (e.g. ESD). The following examples are recommended measures to eliminate the charge: - Dissipating static charge with conductive materials - Preventing charge generation with moisture - Neutralizing the charge with ionizers
• To detect if an LED was damaged by transient excess voltages (i.e. an ESD event during the system’s assembly process), perform a characteristics inspection (e.g. forward voltage measurement, light-up test) at low current (≤1mA).
• Failure Criteria: VF<2.0V at IF=0.5mA If the LED is damaged by transient excess voltages (e.g. ESD), it will cause: - the Forward Voltage (V F) to decrease - the LED not to illuminate at a low current (6) Thermal Management
• The Absolute Maximum Junction Temperature (TJ) must not be exceeded under any circumstances. The increase in the temperature of an LED while in operation may vary depending on the PCB thermal resistance and the density of LEDs on the PCB assembly. Ensure that when using the LEDs for the chosen application, heat is not concentrated in an area and properly managed in the system/assembly.
• The operating current should be determined by considering the temperature conditions surrounding the LED (i.e. TA). Ensure that when operating the LED, proper measures are taken to dissipate the heat. (7) Cleaning
• Do not clean the LEDs with water, benzine and/or thinner.
• To clean the LEDs, use isopropyl alcohol (IPA). If another solvent is used, it may cause the LED package/resin to be damaged causing issues; ensure that sufficient verification is performed prior to use. Additionally, ensure that the solvent being used does not cause any other issues (e.g. CFC-based solvents are heavily regulated).
• If an LED is contaminated (e.g. dust/dirt), use a cloth soaked with isopropyl alcohol (IPA). Ensure that the cloth is firmly squeezed before wiping the LED.
• Do not clean the LEDs with an ultrasonic cleaner. If cleaning must be done, ensure that sufficient verification is performed by using a finished assembly with LEDs to determine cleaning conditions (e.g. ultrasonic power, LED position on the PCB assembly) that do not cause an issue.

NICHIA STS-DA1-2150B <Cat.No.180802> (8) Eye Safety

• There may be two important international specifications that should be noted for safe use of the LEDs: IEC 62471:2006 Photobiological safety of lamps and lamp systems and IEC 60825-1:2001 (i.e. Edition 1.2) Safety of Laser Products - Part 1: Equipment Classification and Requirements. Ensure that when using the LEDs, there are no issues with the following points: - LEDs have been removed from the scope of IEC 60825-1 since IEC 60825 -1:2007 (i.e. Edition 2.0) was published. However, depending on the country/region, there are cases where the requirements of the IEC 60825-1:200 1 specifications or equivalent must be adhered to. - LEDs have been included in the scope of IEC 62471:2006 since the release of the specification in 2 006. - Most Nichia LEDs will be classified as the Exempt Group or Risk Group 1 acc ording to IEC 62471:2006. However, in the case of high-power LEDs containing blue wavelengths in the emission spectrum, there are LEDs that will be cla ssified as Risk Group 2 depending on the characteristics (e.g. radiation flux, emission spectrum, directivit y, etc.) - If the LED is used in a manner that produces an increased output or with an opti c to collimate the light from the LED, it may cause damage to the human eye.
• If an LED is operated in a manner that emits a flashing light, it may cause health issues (e.g. visual stimuli causing eye discomfort). The system should be designed to ensure that there are no harmful effects on the human body. (9) Miscellaneous
• Nichia warrants that the discrete LEDs will meet the requirements/criteria as detailed in the Reliability section within this specification. If the LEDs are used under conditions/environments deviating from or inconsistent with those described in this specification, the resulting damage and/or injuries will not be covered by this warranty.
• Nichia warrants that the discrete LEDs manufactured and/or supplied by Nichia will meet the requirements/criteria as detailed in the Reliability section within this specification; it is the customer’s responsibility to perform sufficient verification prior to use to ensure that the lifetime and other quality characteristics required for the intended use are met.
• The applicable warranty period is one year from the date that the LED is delivered. In the case of any incident that appears to be in breach of this warranty, the local Nichia sales representative should be notified to discuss instructions on how to proceed while ensuring that the LED in question is not disassembled or removed from the PCB if it has been attached to the PCB. If a breach of this warranty is proved, Nichia will provide the replacement for the non-conforming LED or an equivalent item at Nichia’s discretion. FOREGOING ARE THE EXCLUSIVE REMEDIES AVAILABLE TO THE CUSTOMER IN RESPECT OF THE BREACH OF THE WARRANTY CONTAINED HEREIN, AND IN NO EVENT SHALL NICHIA BE RESPONSIBLE FOR ANY INDRECT, INCIDENTAL OR CONSEQUENTIAL LOSSES AND/OR EXPENSES (INCLUDING LOSS OF PROFIT) THAT MAY BE SUFFERED BY THE CUSTOMER ARISING OUT OF A BREACH OF THE WARRANTY.
• NICHIA DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE.
• This LED is intended to be used for general lighting, household appliances, electronic devices (e.g. mobile communication devices) and automobiles; it is not designed or manufactured for use in applications that require safety critical functions (e.g. aircraft, combustion equipment, life support systems, nuclear reactor control system, safety devices, spacecraft, submarine repeaters, traffic control equipment, trains, vessels, etc.). If the LEDs are planned to be used for these applications, unless otherwise detailed in the specification, Nichia will neither guarantee that the LED is fit for that purpose nor be responsible for any resulting property damage, injuries and/or loss of life/health.
• The customer will not reverse engineer, disassemble or otherwise attempt to extract knowledge/design information from the LED.
• All copyrights and other intellectual property rights in this specification in any form are reserved by Nichia or the right holders who have granted Nichia permission to use the content. Without prior written permission from Nichia, no part of this specification may be reproduced in any form or by any means.
• Both the customer and Nichia will agree on the official specifications for the supplied LEDs before any programs are officially launched. Without this agreement in writing (i.e. Customer Specific Specification), changes to the content of this specification may occur without notice (e.g. changes to the foregoing specifications and appearance, discontinuation of the LEDs, etc.).