NA2100 NISSHINBO | Alldatasheet
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Technical content
Voltage to Frequency Converter - 1 - Ver.1.1 FEATURES GENERAL DESCRIPTION
- Synchronous Operation
- Full-Scale Frequency Set by External System Clock
- 3 V / 5 V Operation
- Low Consumption 3 mW (typ)
- Nominal Input Range 0 to VREF
- VREF Range 2.5 V to VDD
- Internal Reference Voltage 2.5 V
- Maximum Input Frequency 1 MHz
- Operating Temperature Range: -40C to +125C
- Package VSP-8-AF The NA2100 is a voltage to frequency converter (VFC) manufactured using a CMOS process. Operating from a single supply up to 5.25 V, the NA2100 has an internal 2.5 V bandgap reference voltage, but an external reference voltage can also be used. This external reference supply range is up to VDD. The full-scale output frequency is synchronized to the clock signal on the CLKIN pin. The maximum input frequency of the NA2100 is 1 MHz; for analog input signals varying from 0 V to VREF, the output frequency varies from 10% to 90% of fCLKIN.
- Simple Analog to Digital converter(ADC), simple isolated transmission, etc.
APPLICATIONS
2.8 mm x 2.9 mm x 1.1 mm
- 2 - Ver.1.1 ◼ PRODUCT NAME INFORMATION NA2100 aa c dd e Description of Configuration Composition Item Description aa Package Code Indicates the package. AF: VSP-8-AF c Version Product version A: Specified value dd Packing Taping direction. Refer to the packing specifications. e Grade Indicates the quality grade. Package code aa AF VSP-8-AF Version c A Specified value Packaging dd E2 Refer to the packing specifications. Grade e Applications Operating Temperature Range Test Temperature D Industrial equipment and Social infrastructures − 40°C to 125°C 25°C, 125°C ◼ ORDER INFORMATION PRODUCT NAME PACKAGE RoHS HALOGEN- FREE PLATING COMPOSITION WEIGHT (mg) QUANTITY (pcs/reel) NA2100AFAE2D VSP-8-AF ✓ ✓ Sn2Bi 21 2000
- 3 - Ver.1.1 ◼ PIN DESCRIPTIONS NA2100 Pin Configuration Pin No. Pin Name I/O Description 1 CLKOUT O Connection Pin when resonator/oscillator is used. In case of clock input, inverted clock signal is output.
2 CLKIN I Clock Input Pin
Automatically powers down when CLKIN remains low for 1 ms (typ).
3 GND Ground
4 REFIN/
Reference Voltage Input and Internal Reference Voltage Output Pin If there is no external reference input, 2.5V is output and it is used only as a reference power supply for the NA2100. There is no capacitor to GND is required.
5 VIN I Analog Input Pin
6 VDD Power Power Supply Input Pin
7 FOUT O Frequency Output Pin
8 BUF I Buffer Mode Select Pin
- 4 - Ver.1.1 ◼ ABSOLUTE MAXIMUM RATINGS Symbol Ratings Unit Power Supply Input Voltage VDDabs +7 V Analog Input Pin Voltage VAI -0.3 to VDD+0.3 V Reference Voltage Input Pin Voltage VVREF -0.3 to VDD+0.3 V Logic Input Pin Voltage VLI -0.3 to VDD+0.3 V FOUT Pin Voltage VFOUT -0.3 to VDD+0.3 V Junction Temperature Range Tj -40 to +150 C Storage Temperature Range Tstg -40 to +150 C ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause permanent damage and may degrade the lifetime and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings is not assured. ◼ THERMAL CHARACTERISTICS Package Parameter Measurement Result Unit VSP-8-AF Thermal Resistance (ja) 252 (2Layer) 189 (4Layer) °C / W Thermal Characterization Parameter (ψjt) 62 (2Layer) 53 (4Layer) ja：Junction-to-Ambient Thermal Resistance ψjt：Junction-to-Top Thermal Characterization Parameter 2Layer Mounted on glass epoxy board (76.2 mm × 114.3 mm × 1.6 mm: based on EIA/JEDEC standard, 2-layer FR-4). 4Layer Mounted on glass epoxy board (76.2 mm × 114.3 mm × 1.6 mm: based on EIA/JEDEC standard, 4-layer FR-4), internal Cu area: 74.2 mm × 74.2 mm.
- 5 - Ver.1.1 ◼ ELECTROSTATIC DISCHARGE RATINGS Conditions Protection Voltage HBM C = 100pF, R = 1.5kΩ ±2000V CDM ±1000V ELECTROSTATIC DISCHARGE RATINGS The electrostatic discharge test is done based on JEDEC JS001 and JS002. In the HBM method, ESD is applied using the power supply pin and GND pin as reference pins. ◼ RECOMMENDED OPERATING CONDITIONS Symbol Ratings Unit Power Supply Input Voltage VDD 3.0 to 5.25 V Nominal Input Range VIN 0 to VREF V Input Frequency fCLKIN 32 to 1,000 kHz Operating Temperature Range Ta -40 to +125 C RECOMMENDED OPERATING CONDITIONS All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if when they are used over such conditions by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions.
- 6 - Ver.1.1 ◼ ELECTRICAL CHARACTERISTICS VDD=3.3V, 5V, REFIN=2.5V, CLKIN=1MHz, Ta=-40C to 125C unless otherwise specified. Parameter Symbol Conditions MIN TYP MAX Unit DC Characteristics Integral Nonlinearity CLKIN=32kHz_1 INL Unbuffer Mode, External Clock Input 0.012 % of Span CLKIN=1MHz_1 Unbuffer Mode, External Clock Input, Ta=25C – – 0.012 CLKIN=32kHz_2 Buffer Mode, External Clock Input – 0.018 – CLKIN=1MHz_2 Buffer Mode, External Clock Input, Ta=25C – – 0.018 Offset Voltage Error Verror Unbuffer Mode, VIN=0V – 0.2 20 mV Buffer Mode, VIN=0.1V – 0.2 20 Gain Error Gainerror – 0.1 0.7 % of Span Offset Voltage Error Drift Verror_drift – 10 – µV/C Gain Error Drift Gainerror_ drift – 4 – ppm of Span/C Ripple Rejection PSRR ∆VDD=±5% (5V) – -55 – dB ∆VDD=±10% (3.3V) – -65 – Analog Input Block Nominal Input Range VIN Unbuffer Mode, – 0-VREF – V Buffer Mode 0.1 – VDD- 0.2 Input Current IIN Unbuffer Mode, VIN=5.4V, REFIN=5.25V – 12 20 µA Buffer Mode, VIN=0.1V, REFIN=2.5V – 10 100 nA Reference Voltage Block Reference Voltage Input Nominal Input Range VREFIN 2.3 – VDD V Reference Voltage Output Output Voltage VREF 2.3 2.5 2.7 V Output Impedance ZREF – 1 – k Reference Voltage Drift VREF_drift – ±25 – ppm/C Ripple Rejection PSRRREF ∆VDD=±5% (5V) – -75 – dB ∆VDD=±10% (3.3V) – -65 – Reference Voltage Noise VNOISE 0.1Hz to 10Hz – 100 – µVp-p Frequency Output Block Nominal Frequency Range FOUT VIN=0V to VREF 0.1 fCLKIN – 0.9 fCLKIN Hz
- 7 - Ver.1.1 ◼ ELECTRICAL CHARACTERISTICS VDD=3.3V, 5V, REFIN=2.5V, CLKIN=1MHz, Ta=-40C to 125C unless otherwise specified. Parameter Symbol Conditions MIN TYP MAX Unit Logic Input Block CLKIN Input Frequency fCLKIN 1000 kHz Input High Voltage1 VIH1_CI VDD=5V5% 3.5 – – V Input High Voltage 2 VIH2_CI VDD=3.3V10% 2.5 – – V Input Low Voltage 1 VIL1_CI VDD=5V5% – – 0.8 V Input Low Voltage 2 VIL2_CI VDD=3.3V10% – – 0.4 V Input Current IIN_CI VIN=0V to VDD – – ±2 µA Pin Capacitance CPIN_CI – 5 – pF BUF Input High Voltage1 VIH1_BUF VDD=5V5% 2.4 V Input High Voltage 2 VIH2_BUF VDD=3.3V10% 2.1 – – V Input Low Voltage 1 VIL1_BUF VDD=5V5% – – 0.8 V Input Low Voltage 2 VIL2_BUF VDD=3.3V10% – – 0.4 V Input Current IIN_BUF – – ±100 nA Pin Capacitance CPIN_BUF – 5 – pF Logic Output Block FOUT Output High Voltage1 VOH1_FO Output Source Current 1.6mA, VDD=5V±5% 4.0 V Output High Voltage2 VOH2_FO Output Source Current 1.6mA, Output Low Voltage VOL_FO Output Sink Current 1.6mA – – 0.4 CLKOUT Output High Voltage1 VOH1_CO Output Source Current 200μA, VDD=5V±5% 4.0 V Output High Voltage2 VOH2_CO Output Source Current 200μA, Output Low Voltage VOL_CO Output Sink Current 200μA – – 0.4 Power Supply Condition Input Voltage Range VDD 3.0 – 5.25 V Quiescent Current 1 IDD_UNBUF VIH=VDD, VIL=GND, Unbuffer Mode – 0.95 1.35 mA Quiescent Current 2 IDD_BUF VIH=VDD, VIL= GND, Buffer Mode – 1.15 1.75 mA Quiescent Current 3 IDD_PD – 30 100 µA Turn On Time tWAKE Exiting Power-Down (Ext. Clock at CLKIN) – 3 – µs
- 8 - Ver.1.1 ◼ TIMING CHARACTERISTICS VDD=3.3V, 5V, REFIN=2.5V, CLKIN=1MHz, Ta=-40C to 125C unless otherwise specified. Parameter Symbol Conditions MIN TYP MAX Unit Clock Frequency fC L K I N VDD=3.3V 32 – 1000 kHz VDD=5V 32 – 1000 Clock Mark/Space Ratio tHIGH:tLOW VDD=3.3V 40:60 – 60:40 VDD=5V 40:60 – 60:40 Clock Input Frequency Output Delay Time t1 VDD=3.3V – 50 – ns VDD=5V – 35 – Frequency Output Rise Time t2 VDD=3.3V – 2.3 – ns VDD=5V – 1.8 – Frequency Output Fall Time t3 VDD=3.3V – 1.6 – ns VDD=5V – 1.4 – Frequency Output Pulse width t4 VDD=3.3V – tHIGH20 – ns VDD=5V – tHIGH8 – CLKIN FOUT t1 t2 t3 tHIGH tLOW
- 9 - Ver.1.1 ◼ GENERAL DISCRIPTION NA2100 is a voltage frequency converter (VFC). The input voltage signal is applied to a front end centered around an analog modulator that converts the input voltage into an output pulse train. The NA2100 operates from 3.3 V or 5 V power supplies. It also has a built-in 2.5 V reference power supply. ■Input Amplifier Buffering and Voltage Range Analog input VIN can be buffered by setting BUF = High. This provides a high impedance of 100 M , allowing it to tolerate large external impedances. The VIN voltage range is 0.1 V to VDD - 0.2 V. When BUF = Low, the NA2100 input circuit accepts analog inputs below GND, so the analog input VIN voltage range is –0.15 V to VDD + 0.15 V. In this case, the input impedance will be 450k(typ.). The transfer function of NA2100 is expressed by the following formula. FOUT = 0.1 fCLKIN + 0.8 (VIN/VREF) fCLKIN Below shows transfer function when the reference voltage is VREF=2.5V and 5V. ■VFC Modulator Digital data representing the analog input voltage is contained within the duty cycle of the pulse train output by the comparator. The output is a pulse train whose frequency depends on the analog input signal. A full -scale input gives an output frequency of 0.9 fCLKIN, and a zero-scale input gives an output frequency of 0.1 fCLKIN. The FOUT pulse width is fixed and determined by the CLKIN high level section. This pulse is synchronous to the rising edge of the clock signal. The delay time between the edge of CLKIN and the edge of FOUT is 35 ns (typ.). Figure 2 shows the waveform of this frequency output (see Power On Time Characteristic Example). When a step change in input voltage occurs, a settling time is required before valid data can be obtained. This is 2 cycles (typ.) of CLKIN. 3tCLKIN 4tCLKIN tCLKIN FOUT=tCLKIN/2 VIN=VREF/2 FOUT=tCLKIN/5 VIN=VREF/8 FOUT=tCLKIN x3/10 VIN=VREF/4
- 10 - Ver.1.1 ■Clock Generation The NA2100 uses an external clock to determine the full-scale output frequency. The NA2100 requires a master clock input, which can be obtained from an external clock signal connected to the CLKIN pin (CLKOUT pin left unconnected). If frequency = 1 MHz, a crystal or resonator can be connected between CLKIN and CLKOUT so that the clock circuit acts as a crystal-controlled oscillator. The NA2100 master clock is inverted and output from the CLKOUT pin. ■Reference Input The NA2100 performs conversions based on the input reference voltage. REFIN/OUT can be left unconnected and derived from the internal 2.5V reference voltage. Alternatively, an external reference voltage can be used. Connect this to the REFIN/OUT pin to override the internal reference voltage. When selecting an external reference voltage, drive capability, voltage error, noise, and drift characteristics must be considered. NJM17431 is suitable as this external reference voltage. ■Power-Down Mode The NA2100 automatically powers down when CLKIN goes low for 1 ms (typ.). During power down, REFOUT is floating and FOUT is low level. ■Typical Application A basic connection diagram of the NA2100 is shown in Figure 3, left. In this connection diagram, the device is set to unbuffered mode: the 5 V supply is used as the reference voltage and the oscillator is the device's master clock source (32 kHz to 1 MHz). The device can also be operated with a crystal oscillator (Fig. 3, right). (1 MHz is recommended) Figure3： Basic Connection Diagram Left , Right ■Isolation Application The NA2100 can be used in isolated transmission applications. This can be achieved using a p hoto-coupler. VOLTAGE-TO- FREQUENCY MODULATOR CLOCK GENERATION 2.5V REFERENCE FOUT CLKINCLKOUTGNDBUF VIN REFIN/OUT VDD 1F VOLTAGE-TO- FREQUENCY MODULATOR CLOCK GENERATION 2.5V REFERENCE FOUT CLKINCLKOUTGNDBUF VIN REFIN/OUT VDD C1C2 1F
- 11 - Ver.1.1 ◼ MARKING SPECIFICATION (1)(2)(3)(4)(5)(6)(7): Product Code … Refer to the following table (8) to (12): Lot Number … Alphanumeric Serial Number NA2100AFAE2D Marking Specification NOTICE There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the case of recognizing the marking characteristic with AOI, please contact our sales or distributor before attempting to use AOI. NA2100 Marking List (VSP-8-AF) Product Name (1) (2) (3) (4) (5) (6) (7) NA2100AFAE2D A 2 1 0 0 A D 1Pin
- 12 - Ver.1.1 ◼ TYPICAL CHARACTERISTICS Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed. INL vs VIN (REFIN=2.5) UNBUF mode BUF mode VDD=5V, REFIN=2.5V, CLKIN=1MHz VDD=5V, REFIN=2.5V, CLKIN=1MHz INL vs VIN (REFIN=5V) UNBUF mode BUF mode VDD=5V, REFIN=5V, Ta=25⁰C VDD=5V, REFIN=5V, Ta=25⁰C Offset Error vs Temperature UNBUF mode BUF mode REFIN=2.5V, CLKIN=1MHz, VIN=0V REFIN=2.5V, CLKIN=1MHz, VIN=0.1V -0.015 -0.01 -0.005 0.005 0.01 0.015 -0.5 0 0.5 1 1.5 2 2.5 3 INL (% of Span) VIN (V) 125℃ 25℃ -40℃ -0.015 -0.01 -0.005 0.005 0.01 0.015 -0.5 0 0.5 1 1.5 2 2.5 3 INL (% of Span) VIN (V) 125℃ 25℃ -40℃ -0.015 -0.01 -0.005 0.005 0.01 0.015 INL (% of Span) VIN (V) CLKIN=1MHz CLKIN=30kHz -0.015 -0.01 -0.005 0.005 0.01 0.015 INL (% of Span) VIN (V) CLKIN=1MHz CLKIN=30kHz -20 -15 -10 -50 -25 0 25 50 75 100 125 OFFSET ERROR (mV) TEMP (⁰C) 3.3V -20 -15 -10 -50 -25 0 25 50 75 100 125 OFFSET ERROR (mV) TEMP (⁰C) 3.3V
- 13 - Ver.1.1 ◼ TYPICAL CHARACTERISTICS Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed. Gain Error vs Temperature UNBUF Mode BUF Mode REFIN=2.5V, CLKIN=1MHz REFIN=2.5V, CLKIN=1MHz IDD vs VDD IDD vs Temperature REFIN=2.5V, CLKIN=1MHz, Ta=25⁰C VDD=5V, REFIN=2.5V, CLKIN=1MHz IDD vs Load Capacitance of FOUT(C_FOUT) IDD vs Load Capacitance of CLKOUT(C_CLKOUT) VDD=5V, Ta=25⁰C, INTREF, VIN=0.1V, CLKIN=1MHz VDD=5V, Ta=25⁰C, INTREF, VIN=0.1V, CLKIN=1MHz -0.7 -0.5 -0.3 -0.1 0.1 0.3 0.5 0.7 -50 -25 0 25 50 75 100 125 GAIN ERROR (% of Span) TEMP (⁰C) 3.3V -0.7 -0.5 -0.3 -0.1 0.1 0.3 0.5 0.7 -50 -25 0 25 50 75 100 125 GAIN ERROR (% of Span) TEMP (⁰C) 3.3V 0.2 0.4 0.6 0.8 1.2 1.4 0 1 2 3 4 5 IDD (mA) VDD (V) UNBUF BUF 0.7 0.8 0.9 1.1 1.2 1.3 1.4 -50 -25 0 25 50 75 100 125 IDD (mA) TEMP (⁰C) UNBUF BUF 0.8 0.9 1.1 1.2 1.3 1.4 1.5 1.6 0 50 100 150 200 250 300 350 IDD (mA) C_FOUT (pF) UNBUF BUF 0.8 1.2 1.4 1.6 1.8 0 20 40 60 80 100 IDD (mA) C_CLKOUT (pF) UNBUF BUF
- 14 - Ver.1.1 ◼ TYPICAL CHARACTERISTICS Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed. IDD vs CLKIN Frequency REFOUT Histogram N=50 VDD=5V, Ta=25⁰C, VIN=0.1V VDD=5V, UNBUF mode, CLKIN=1MHz, VIN=0V, Ta=25⁰C REFOUT vs Temperature REFOUT vs Load Current VDD=5V, UNBUF mode, CLKIN=1MHz, VIN=0V VDD=5V, UNBUF mode, CLKIN=1MHz, VIN=0V Power On Time Power Down Time Power On Time = 3μs Power Down Time = 0.94ms VDD=5V, Ta=25⁰C, CLKIN=1MHz VDD=5V, Ta=25⁰C, CLKIN=1MHz 0.7 0.8 0.9 1.1 1.2 1.3 1.4 0 200 400 600 800 1000 IDD (mA) Freq CLKIN (kHz) UNBUF BUF N (pcs) REFOUT (V) 2.44 2.46 2.48 2.5 2.52 2.54 2.56 -50 -25 0 25 50 75 100 125 REFOUT (V) TEMP (⁰C) 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 -200 -100 0 100 200 REFOUT (V) Load Current (μA) 125℃ 25℃ -40℃ 5CLKIN (V) 5FOUT (V) REFOUT (V) Time (ms) 5CLKIN (V) 5FOUT (V) -3 -2 -1 0 1 2 3 4 5 REFOUT (V) Time (μs)
- 15 - Ver.1.1
Package Information
■ PACKAGE DIMENSIONS UNIT: mm 0～10ﾟ 2.9 +0.3 -0.1 2.8±0.2 4.0±0.3 +0.1 -0.05 +0.1 -0.05 0.2±0.1 0.1 0.1 M 0.1 1.1±0.1 0.6MAX 0.65 0.127 0.55±0.2 ■ EXAMPLE OF SOLDER PADS DIMENSIONS UNIT: mm 1.95 1.0 0.65 3.5 0.23
■ PACKING SPEC UNIT: mm (1) Taping dimensions / Insert direction Insert direction (E2) *Carrier tape material: PS carbon *Cover tape material: Polyester 8.0±0.14.4 3.2 +0.1 1.75±0.15.5±0.05 12.0±0.3 0.3±0.05 2.0(MAX)1.5 +0.1 (2) Taping state Feed direction more than 160mm 2000pcs/reel Sealing with covering tape DevicesTrailer part Leader part more than 850mm
(3) Reel dimensions 2.0±0.5 21±0.8 13±0.2 2.0±0.2 13.5±0.5 100±1 254±2 *Reel material: PS carbon (4) Peeling strength Peeling strength of cover tape ・Peeling angle 165 to 180°degrees to the taped surface. ・Peeling speed 300mm/min ・Peeling strength 0.1 to 1.3N 1 6 5t o1 8 0 ° Direction to pull Feed direction Carrier tape Cover tape
(5) Packing state Box size: 266×263×28 <Label> Device No., Quantity, Lot No., Mark ■ HEAT-RESISTANCE PROFILES Reflow profile 3℃/s MAX. 217℃ 200℃ 150℃ 255℃ 260℃ MAX. 30s MAX. 6℃/s MAX. 60-120s 60-150s Time(s) Package Surface Temperature(℃)
◼ Revision History Date Revision Changes June 18, 2024 1.0 Initial release 2025/06/26 1.1 Analog to Digital converter -> Analog to Digital converter(ADC) Normal Input Range min ; 0.2V -> 0.1V
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