MTP452L3 CYSTEKEC | Alldatasheet

Document overview

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Technical content

Features

  • Simple Drive Requirement
  • Low On-resistance
  • Fast switching Characteristic
  • Pb-free lead plating package Symbol Outline Absolute Maximum Ratings (Ta=25°C) MTP452L3 SOT-223 D S G：Gate D D：Drain S：Source G Parameter Symbol Limits Unit Drain-Source V oltage VDS -30 V Gate-Source V oltage VGS ±20 V ID -6.0 *1 A Continuous Drain Current @ TA=25°C Continuous Drain Current @ TA=70°C ID -4.8 *1 A Pulsed Drain Current IDM -20 *1 A

2.7 W Total Power Dissipation (TA=25℃) Pd

0.02 W/°C Linear Derating Factor

Operating Junction and Storage Temperature Tj, Tstg -55~+150 °C Thermal Resistance, Junction-to-ambient, max Rth,j-a 45 *2 °C/W Note : *1. Pulse width limited by maximum junction temperature *2. Surface mounted on 1 in² copper pad of FR-4 board; 120°C/W when mounted on minimum copper pad

CYStech Electronics Corp. Spec. No. : C400L3 Issued Date : 2009.06.22 Revised Date : Page No. : 2/7 MTP452L3 CYStek Product Specification Characteristics (Tj=25°C, unless otherwise specified) Symbol Min. Typ. Max. Unit Test Conditions Static BVDSS -30 - - V VGS=0, ID=-250μA ΔBVDSS/ΔTj - -0.02 - V/°C Reference to 25°C, ID=-1mA VGS(th) -1.0 - -3.0 V VDS = VGS, ID=-250μA GFS - 10 - S VDS =-10V , ID=-5.3A IGSS - - ±100 nA VGS=±20 IDSS - - -1 μA VDS =-30V , VGS =0 IDSS - - -25 μA VDS =-24V , VGS =0, Tj=70°C *RDS(ON) - 45 55 mΩ VGS =-10V , ID=-5.3A *RDS(ON) - 75 100 mΩ VGS =-4.5V , ID=-4.2A Dynamic *Qg - 9.2 16 *Qgs - 2.8 - *Qgd - 5.2 - nC ID=-5.3A, VDS=-24V , VGS=-4.5V *td(ON) - 11 - *tr - 8 - *td(OFF) - 25 - *tf - 17 - ns VDS=-15V , ID=-1A,VGS=-10V , RG=6Ω, RD=15Ω Ciss - 507 912 Coss - 222 - Crss - 158 - pF VGS=0V , VDS=-15V , f=1MHz Source-Drain Diode *VSD - - -1.2 V IS=-2.3A, VGS=0V *trr - 29 - ns *Qrr - 20 - nC IS=-5.3A, VGS=0, dI/dt=100A/μs *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2%

Ordering Information

Device Package Shipping Marking MTP452L3 SOT-223 (Pb-free lead plating package) 2500 pcs / Tape & Reel 452

CYStech Electronics Corp. Spec. No. : C400L3 Issued Date : 2009.06.22 Revised Date : Page No. : 3/7 MTP452L3 CYStek Product Specification Typical Characteristics

CYStech Electronics Corp. Spec. No. : C400L3 Issued Date : 2009.06.22 Revised Date : Page No. : 4/7 MTP452L3 CYStek Product Specification Typical Characteristics(Cont.)

CYStech Electronics Corp. Spec. No. : C400L3 Issued Date : 2009.06.22 Revised Date : Page No. : 5/7 MTP452L3 CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C400L3 Issued Date : 2009.06.22 Revised Date : Page No. : 6/7 MTP452L3 CYStek Product Specification Recommended wave soldering condition Soldering Time Product Peak Temperature Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C400L3 Issued Date : 2009.06.22 Revised Date : Page No. : 7/7 MTP452L3 CYStek Product Specification SOT-223 Dimension *: Typical Inches Millimeters 3 2 1 F B A C D E G H a1 I Style: Pin 1.Gate 2.Drain 3.Source Marking: 3-Lead SOT-223 Plastic Surface Mounted Package CYStek Package Code: L3 Date Code Device Name □□□□ 452 D 0.0236 0.0315 0.60 0.80 a1 *13o - *13o - E *0.0906 - *2.30 - a2 0 o 10 o 0 o 10 o F 0.2480 0.2638 6.30 6.70 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Lead: Pure tin plated
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.