MTN55N03J3 CYSTEKEC | Alldatasheet

Document overview

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Technical content

Features

  • Dynamic dv/dt Rating
  • Simple Drive Requirement
  • Repetitive Avalanche Rated
  • Fast Switching Characteristic
  • RoHS compliant package Symbol Outline MTN55N03J3 TO-252 Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limits Unit Drain-Source V oltage VDS 25 V Gate-Source V oltage VGS ±20 V Continuous Drain Current @VGS=10V , TC=25°C ID 55 A Continuous Drain Current @VGS=10V , TC=100°C ID 35 A Pulsed Drain Current IDM 215 *1 A W Total Power Dissipation (TC=25℃) Linear Derating Factor Pd 62.5

0.5 W/°C

Single Pulse Avalanche Energy EAS 240 *2 mJ Single Pulse Avalanche Current IAS 31 A Operating Junction and Storage Temperature Tj, Tstg -55~+150 °C Note : *1. Pulse width limited by safe operating area *2 . Tj=25°C, VDD=20V , L=0.1mH, RG=25Ω, IAS=10A G：Gate G D S D：Drain S：Source

CYStech Electronics Corp. Spec. No. : C411J3 Issued Date : 2007.07.05 Revised Date : 2009.02.04 Page No. : 2/7 MTN55N03J3 CYStek Product Specification Thermal Data Parameter Symbol Value Unit Thermal Resistance, Junction-to-case, max Rth,j-c 2.0 °C/W Thermal Resistance, Junction-to-ambient, max Rth,j-a 110 °C/W Characteristics (Tj=25°C, unless otherwise specified) Symbol Min. Typ. Max. Unit Test Conditions Static BVDSS 25 - - V VGS=0, ID=250μA ∆BVDSS/∆Tj - 0.037 - V/°C Reference to 25°C, ID=1mA VGS(th) 1.0 - 3.0 V VDS = VGS, ID=250μA GFS - 30 - S VDS =10V , ID=28A IGSS - - ±100 nA VGS=±20 IDSS - - 1 μA VDS =25V , VGS =0 IDSS - - 25 μA VDS =20V , VGS =0, Tj=150°C *RDS(ON) - 4.5 6 mΩ VGS =10V , ID=30A *RDS(ON) - 7 9 mΩ VGS =4.5V , ID=30A Dynamic *Qg - 16.8 - *Qgs - 6.0 - *Qgd - 4.9 - nC ID=28A, VDS=20V , VGS=5V *td(ON) - 15.1 - *tr - 4 - *td(OFF) - 45.2 - *tf - 7.6 - ns VDS=15V , ID=28A, VGS=10V , RG=3.3Ω, RD=0.53Ω Ciss - 2326 - Coss - 331 - Crss - 174 - pF VGS=0V , VDS=25V , f=1MHz Source-Drain Diode *VSD - - 1.5 V IS=20A, VGS=0V *IS - - 55 A VD=VG=0, VS=1.5V *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2%

Ordering Information

Device Package Shipping Marking MTN55N03J3 TO-252 (RoHS compliant) 2500 pcs / Tape & Reel 55N03

CYStech Electronics Corp. Spec. No. : C411J3 Issued Date : 2007.07.05 Revised Date : 2009.02.04 Page No. : 3/7 MTN55N03J3 CYStek Product Specification Characteristic Curves

CYStech Electronics Corp. Spec. No. : C411J3 Issued Date : 2007.07.05 Revised Date : 2009.02.04 Page No. : 4/7 MTN55N03J3 CYStek Product Specification Characteristic Curves(Cont.)

CYStech Electronics Corp. Spec. No. : C411J3 Issued Date : 2007.07.05 Revised Date : 2009.02.04 Page No. : 5/7 MTN55N03J3 CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C411J3 Issued Date : 2007.07.05 Revised Date : 2009.02.04 Page No. : 6/7 MTN55N03J3 CYStek Product Specification Recommended wave soldering condition Soldering Time Product Peak Temperature Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds Time maintained above: −Temperature (TL) 217°C − Time (tL) 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak 10-30 seconds 20-40 seconds temperature(tp) Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C411J3 Issued Date : 2007.07.05 Revised Date : 2009.02.04 Page No. : 7/7 MTN55N03J3 CYStek Product Specification TO-252 Dimension *: Typical Inches Millimeters Marking: B A C E H I J K D F GL Style: Pin 1.Gate 2.Drain 3.Source 3-Lead TO-252 Plastic Surface Mount Package CYStek Package Code: J3 55N03 □□□□ Device Name Date code Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Lead: KFC; pure tin plated
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.