MTN50N06E3 CYSTEKEC | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 8
Technical content
Features
- Low On Resistance
- Simple Drive Requirement
- Low Gate Charge
- Fast Switching Characteristic
- RoHS compliant package Symbol Outline MTN50N06E3 G:Gate D:Drain S:Source TO-220 G D S
CYStech Electronics Corp. Spec. No. : C445E3 Issued Date : 2009.05.12 Revised Date : Page No. : 2/8 MTN50N06E3 CYStek Product Specification Absolute Maximum Ratings (TC=25°C) Parameter Symbol Limits Unit Drain-Source V oltage VDS 60 V Gate-Source V oltage VGS ±20 V Continuous Drain Current ID 50 A Continuous Drain Current @TC=100°C ID 35 A Pulsed Drain Current @ VGS=10V (Note 1) IDM 200 A Avalanche Current (Note 1) IAR 50 A Single Pulse Avalanche Energy (Note 2) EAS 500 Repetitive Avalanche Energy (Note 1) EAR 12 mJ Peak Diode Recovery dV/dt (Note 3) dV/dt 4.5 V/ns W Total Power Dissipation (TC=25℃) Linear Derating Factor Pd 120
0.8 W/°C
Operating Junction and Storage Temperature Tj, Tstg -55~+175 °C Maximum lead temperature for soldering purposes, 1/8” from case for 5 seconds TL 300 °C Note : *1. Pulse width limited by maximum junction temperature. *2. L=200μH, IAS=50A,VDD=30V, starting TJ=+25℃ *3. ISD≤50A, dI/dt<100A/μs, VDD≤BVDSS, TJ≤Tj(max). Thermal Data Parameter Symbol Value Unit Thermal Resistance, Junction-to-case, max Rth,j-c 1.24 °C/W Thermal Resistance, Junction-to-ambient, max Rth,j-a 62.5 °C/W
CYStech Electronics Corp. Spec. No. : C445E3 Issued Date : 2009.05.12 Revised Date : Page No. : 3/8 MTN50N06E3 CYStek Product Specification Characteristics (TC=25°C, unless otherwise specified) Symbol Min. Typ. Max. Unit Test Conditions Static BVDSS 60 - - V VGS=0, ID=250μA VGS(th) 2.0 2.8 4.0 V VDS = VGS, ID=250μA IGSS - - ±100 nA VGS=±20 IDSS - - 5 μA VDS =60V , VGS =0 IDSS - - 25 μA VDS =48V , VGS =0, Tj=125°C IDON 50 - - A VDS =10V , VGS=10V (Note 1) RDS(ON) - 19 22 mΩ VGS =10V , ID=30A (Note 1) GFS - 28 - S VDS =10V , ID=25A (Note 1) Dynamic Qg - - Qgs - - Qgd - - nC VDS=80V , ID=30A, VGS=10V (Note 1 & 2) td(ON) - - tr - - td(OFF) - - tf - - ns VDS=50V , ID=1A, VGS=10V , RGS=6Ω (Note 1 & 2) Ciss - - Coss - - Crss - - pF VGS=0V , VDS=25V , f=1MHz Source-Drain Diode IS - - 50 ISM - - 200 A (Note 3) VSD - - 1.5 V IS=25A, VGS=0V (Note 1) trr - 52 - ns Qrr - 75 - nC VGS=0, IF=50A, dIF/dt=100A/μs Note : 1. Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% 2. Independent of operating temperature 3. Pulse width limited by maximum junction temperature.
Ordering Information
Device Package Shipping Marking MTN50N06E3 TO-220 (RoHS compliant) 50 pcs/tube, 20 tubes/box, 4 boxes / carton 50N06
CYStech Electronics Corp. Spec. No. : C445E3 Issued Date : 2009.05.12 Revised Date : Page No. : 4/8 MTN50N06E3 CYStek Product Specification Characteristic Curves
CYStech Electronics Corp. Spec. No. : C445E3 Issued Date : 2009.05.12 Revised Date : Page No. : 5/8 MTN50N06E3 CYStek Product Specification Characteristic Curves(Cont.)
CYStech Electronics Corp. Spec. No. : C445E3 Issued Date : 2009.05.12 Revised Date : Page No. : 6/8 MTN50N06E3 CYStek Product Specification Test Circuit and Waveforms
CYStech Electronics Corp. Spec. No. : C445E3 Issued Date : 2009.05.12 Revised Date : Page No. : 7/8 MTN50N06E3 CYStek Product Specification Test Circuit and Waveforms(Cont.)
CYStech Electronics Corp. Spec. No. : C445E3 Issued Date : 2009.05.12 Revised Date : Page No. : 8/8 MTN50N06E3 CYStek Product Specification TO-220 Dimension *: Typical Inches Millimeters Inches Millimeters DIM Min. Max. Min. Max. A B E G I KM OP C N H D Marking: 50N06 □□□□ Device Name Date Code 3-Lead TO-220 Plastic Package CYStek Package Code: E3 Style: Pin 1.Gate 2.Drain 3.Source 4.Drain DIM Min. Max. Min. Max. Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:
- Lead: KFC ; pure tin plated
- Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice:
- All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
- CYStek reserves the right to make changes to its products without notice.
- CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
- CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.