MTN10N65FP CYSTEKEC | Alldatasheet

Document overview

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  • PDF pages: 9

Technical content

Features

  • BVDSS=700V typically @ Tj=150℃
  • Low On Resistance
  • Simple Drive Requirement
  • Low Gate Charge
  • Fast Switching Characteristic
  • RoHS compliant package

Applications

  • Power Factor Correction
  • LCD TV Power
  • Full and Half Bridge Power Symbol Outline MTN10N65FP TO-220FP G：Gate D：Drain S：Source G D S

CYStech Electronics Corp. Spec. No. : C725FP Issued Date : 2009.06.15 Revised Date : Page No. : 2/9 MTN10N65FP CYStek Product Specification Absolute Maximum Ratings (TC=25°C) Parameter Symbol Limits Unit Drain-Source V oltage (Note 1) VDS 650 V Gate-Source V oltage VGS ±30 V Continuous Drain Current ID 10* A Continuous Drain Current @TC=100°C ID 6 A Pulsed Drain Current @ VGS=10V (Note 2) IDM 40* A Single Pulse Avalanche Energy @ L=4.3mH, ID=10 Amps, VDD=50V EAS 237 Repetitive Avalanche Energy EAR 5 mJ Peak Diode Recovery dv/dt (Note 3) dv/dt 3.0 V/ns Maximum Temperature for Soldering @ Lead at 0.063 in(1.6mm) from case for 10 seconds TL 300 °C Maximum Temperature for Soldering @ Package Body for 10 seconds TPKG 260 °C W Total Power Dissipation (TC=25℃) Linear Derating Factor Pd 50

0.4 W/°C

Operating Junction and Storage Temperature Tj, Tstg -55~+150 °C *Drain current limited by maximum junction temperature Note : 1. TJ=+25℃ to +150℃. 2. Repetitive rating; pulse width limited by maximum junction temperature. 3. ISD≤10A, dI/dt≤100A/μs, VDD≤BVDSS, TJ=+150℃. Thermal Data Parameter Symbol Value Unit Thermal Resistance, Junction-to-case, max Rth,j-c 2.5 °C/W Thermal Resistance, Junction-to-ambient, max Rth,j-a 100 °C/W

CYStech Electronics Corp. Spec. No. : C725FP Issued Date : 2009.06.15 Revised Date : Page No. : 3/9 MTN10N65FP CYStek Product Specification Characteristics (Tj=25°C, unless otherwise specified) Symbol Min. Typ. Max. Unit Test Conditions Static BVDSS 650 - - V VGS=0, ID=250μA BVDSS - 700 - V VGS=0, ID=250μA, Tj=150℃ ∆BVDSS/∆Tj - 0.631 - V/°C Reference to 25°C, ID=250μA BVDS - 700 - V VGS=0, ID=10A VGS(th) 2.0 - 4.0 V VDS = VGS, ID=250μA *GFS - 6.8 - S VDS =15V , ID=5A IGSS - - ±100 nA VGS=±30 IDSS - - 25 μA VDS =650V , VGS =0 IDSS - - 250 μA VDS =520V , VGS =0, Tj=125°C *RDS(ON) - 0.65 0.75 Ω VGS =10V , ID=6A Dynamic *Qg - 39 - *Qgs - 9.5 - *Qgd - 17.6 - nC ID=10A, VDD=300V , VGS=10V *td(ON) - 19 - *tr - 16 - *td(OFF) - 49 - *tf - 16 - ns VDD=300V , ID=10A, VGS=10V , RG=9.1Ω Ciss - 1882 - Coss - 170 - Crss - 20 - pF VGS=0V , VDS=25V , f=1MHz Source-Drain Diode *VSD - - 1.5 V IS=10A, VGS=0V *IS - - 10 *ISM - - 40 A VD=VG=0, VS=1.3V *trr - 352 528 ns *Qrr - 2.9 4.35 μC VGS=0, IF=10A, dI/dt=100A/μs *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2%

Ordering Information

Device Package Shipping Marking MTN10N65FP TO-220FP (RoHS compliant) 50 pcs/tube, 20 tubes/box, 4 boxes / carton 10N65

CYStech Electronics Corp. Spec. No. : C725FP Issued Date : 2009.06.15 Revised Date : Page No. : 4/9 MTN10N65FP CYStek Product Specification Characteristic Curves

CYStech Electronics Corp. Spec. No. : C725FP Issued Date : 2009.06.15 Revised Date : Page No. : 5/9 MTN10N65FP CYStek Product Specification Characteristic Curves(Cont.)

CYStech Electronics Corp. Spec. No. : C725FP Issued Date : 2009.06.15 Revised Date : Page No. : 6/9 MTN10N65FP CYStek Product Specification Characteristic Curves(Cont.)

CYStech Electronics Corp. Spec. No. : C725FP Issued Date : 2009.06.15 Revised Date : Page No. : 7/9 MTN10N65FP CYStek Product Specification Test Circuit and Waveforms

CYStech Electronics Corp. Spec. No. : C725FP Issued Date : 2009.06.15 Revised Date : Page No. : 8/9 MTN10N65FP CYStek Product Specification Test Circuit and Waveforms(Cont.)

CYStech Electronics Corp. Spec. No. : C725FP Issued Date : 2009.06.15 Revised Date : Page No. : 9/9 MTN10N65FP CYStek Product Specification TO-220FP Dimension Date Code Marking: Device Name 10N65 □□□□ 3-Lead TO-220FP Plastic Package CYStek Package Code: FP Style: Pin 1.Gate 2.Drain 3.Source 4.Drain Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Lead: KFC ; pure tin plated
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.