MTF44P03N3 CYSTEKEC | Alldatasheet

Document overview

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Technical content

Features

  • Lower gate charge
  • Pb-free lead plating and Halogen-free package Equivalent Circuit Outline Absolute Maximum Ratings (Tc=25°C, unless otherwise noted) Parameter Symbol Limits Unit Drain-Source V oltage VDS -30 V Gate-Source V oltage VGS ±12 V TA=25°C -4 Continuous Drain Current TA=70°C ID -3 A Pulsed Drain Current IDM -16 (Note 1 & 2) A TA=25°C 1.5 (Note 3) Power Dissipation TA=70°C PD 1 (Note 3) W Thermal Resistance, Junction to Ambient Rth, j-a 100 (Note 3) °C/W Operating Junction and Storage Temperature Tj, Tstg -55 ~ +175 °C Note : 1. Pulse width limited by maximum junction temperature 2. Duty cycle ≤ 1% 3. Surface mounted on 1 in² copper pad of FR4 board; 270°C/W when mounted on min. copper pad MTF44P03N3 SOT-23 S G：Gate S：Source D：Drain D G

CYStech Electronics Corp. Spec. No. : C782N3 Issued Date : 2011.05.04 Revised Date : Page No. : 2/7 MTF44P03N3 CYStek Product Specification Electrical Characteristics (TA=25°C, unless otherwise specified) Symbol Min. Typ. Max. Unit Test Conditions Static BVDSS -30 - - V VGS=0, ID=-250μA VGS(th) -0.3 -0.75 -1.2 V VDS=VGS, ID=-250μA IGSS - - ±100 nA VGS=±12V , VDS=0 - - -1 μA VDS=-24V , VGS=0 IDSS - - -10 μA VDS=-20V , VGS=0, Tj=125°C IDON -4 - - A VDS=-5V , VGS=-4.5V - 32 38 ID=-4.5A, VGS=-10V - 39 44 ID=-4A, VGS=-4.5V *RDS(ON) - 60 75 mΩ ID=-3A, VGS=-2.5V *GFS - 13 - S VDS=-5V , ID=-4A Dynamic Ciss - 1079 - Coss - 116 - Crss - 93 - pF VDS=-15V , VGS=0, f=1MHz *td(ON) - 6 - *tr - 7 - *td(OFF) - 45 - *tf - 15 - ns VDS=-15V , ID=-1A,VGS=-4.5V , RG=6Ω *Qg - 10 - *Qgs - 1.5 - *Qgd - 3.5 - nC VDS=-15V , ID=-4A, VGS=-4.5V Source-Drain Diode IS - - -2 ISM - - -8 A VSD - - -1.2 V IF=IS, VGS=0V Pulse test : Pulse width≤300μs, Duty cycle≤2% Independent of operating temperature Pulse width limited by maximum junction temperature

Ordering Information

Device Package Shipping Marking MTF44P03N3 SOT-23 (Pb-free) 3000 pcs / Tape & Reel 26

CYStech Electronics Corp. Spec. No. : C782N3 Issued Date : 2011.05.04 Revised Date : Page No. : 3/7 MTF44P03N3 CYStek Product Specification Characteristic Curves

CYStech Electronics Corp. Spec. No. : C782N3 Issued Date : 2011.05.04 Revised Date : Page No. : 4/7 MTF44P03N3 CYStek Product Specification Characteristic Curves(Cont.)

CYStech Electronics Corp. Spec. No. : C782N3 Issued Date : 2011.05.04 Revised Date : Page No. : 5/7 MTF44P03N3 CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C782N3 Issued Date : 2011.05.04 Revised Date : Page No. : 6/7 MTF44P03N3 CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C782N3 Issued Date : 2011.05.04 Revised Date : Page No. : 7/7 MTF44P03N3 CYStek Product Specification SOT-23 Dimension Marking: Style: Pin 1.Gate 2.Source 3.Drain 3-Lead SOT-23 Plastic Surface Mounted Package CYStek Package Code: N3 Device Code Date Code *: Typical DIM Inches Millimeters Inches Millimeters A2 0.0315* 0.80* e1 0.0748* 1.90* E 0.0906 0.1063 2.30 2.70 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Lead: Pure tin plated.
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.