MTA300B02KS6R CYSTEKEC | Alldatasheet

Document overview

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  • PDF pages: 9

Technical content

Features

  • Low on-resistance
  • ESD protected gate
  • High speed switching
  • Low-voltage drive
  • Easily designed drive circuits
  • Easy to use in parallel
  • Pb-free lead plating and halogen-free package Equivalent Circuit Outline

Ordering Information

MTA300B02KS6R-0-T1-G SOT-363 (Pb-free lead plating and halogen-free package) 3000 pcs / Tape & Reel SOT-363 MTA300B02KS6R Tr1 Tr2 Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs / tape & reel, 7” reel Product rank, zero for no rank products Product name

CYStech Electronics Corp. Spec. No. : C982S6R Issued Date : 2017.02.07 Revised Date : Page No. : 2/ 9 MTA300B02KS6R CYStek Product Specification The following characteristics apply to both Tr1 and Tr2 Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limits Unit Drain-Source V oltage VDSS -20 Gate-Source V oltage VGSS ±12 V TA=25°C -1060 Continuous Drain Current @VGS=-4.5V (Note 1) TA=85°C ID -765 TA=25°C -900 Continuous Drain Current @VGS=-2.5V (Note 1) TA=85°C ID -645 TA=25°C -1150 Continuous Drain Current @VGS=-4.5V (Note 2) TA=85°C ID -830 TA=25°C -970 Continuous Drain Current @VGS=-2.5V (Note 2) TA=85°C ID -706 Pulsed Drain Current, tp=300μs, duty ≤5% IDP -4800 mA Total Power Dissipation (Note 1) 300 Total Power Dissipation (Note 2) PD 350 mW Operating Junction and Storage Temperature Range Tj ; Tstg -55~+150 °C Thermal Performance Parameter Symbol Limit Unit Thermal Resistance, Junction-to-Ambient, Steady state (Note 1) 417 Thermal Resistance, Junction-to-Ambient, Steady state (Note 2) RθJA 357 Thermal Resistance, Junction-to-Case RθJC 120 °C/W Note : 1. Surface mounted on FR-4 board of minimum copper pad, t≤5s. 2. Surface mounted on FR-4 board of 1 in² copper pad, 2 oz copper, t≤5s. Electrical Characteristics (Ta=25°C) Symbol Min. Typ. Max. Unit Test Conditions Static BVDSS* -20 - - VGS=0V , ID=-250μA (Note 1) VGS(th) -0.5 - -1.2 V VDS=VGS, ID=-250μA IGSS - - ±10 VGS=±10V , VDS=0V - - 1 VDS=-16V , VGS=0V IDSS - - 5 μA VDS=-16V , VGS=0V , Tj=85°C (Note 2) - 158 260 VGS=-4.5V , ID=-650mA (Note 1) - 219 350 VGS=-2.5V , ID=-650mA (Note 1)RDS(ON)* - 342 800 mΩ VGS=-1.8V , ID=-650mA (Note 1) GFS - 1.7 - S VDS=-10V, ID=-500mA

CYStech Electronics Corp. Spec. No. : C982S6R Issued Date : 2017.02.07 Revised Date : Page No. : 3/ 9 MTA300B02KS6R CYStek Product Specification Dynamic Ciss - 181 - Coss - 38 - Crss - 28 - pF VDS=-10V , VGS=0V , f=1MHz Qg - 2.6 - Qgs - 0.6 - Qgd - 0.7 - nC VDS=-10V , VGS=-4.5V , ID=-1A td(ON) - 6.4 - tr - 18.8 - td(OFF) - 17 - tf - 15.8 - ns VDD=-10V , ID=-500mA, VGS=-4.5V , RG=20Ω Source-Drain Diode VSD - -0.91 -1.2 V VGS=0V , IS=-1A (Note 1) trr - 4.6 - ns Qrr - 1.0 - nC IF=-0.5A, dIF/dt=100A/μs Note :1. Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2%. 2. Guaranteed by design, not subject to production testing. Recommended Soldering Footprint

CYStech Electronics Corp. Spec. No. : C982S6R Issued Date : 2017.02.07 Revised Date : Page No. : 4/ 9 MTA300B02KS6R CYStek Product Specification Typical Characteristics Typical Output Characteristics 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 01234 5 Brekdown Voltage vs Ambient Temperature 0.4 0.6 0.8 1.0 1.2 1.4 -75 -50 -25 0 25 50 75 100 125 150 175 Tj, Junction Temperature(°C) -BVDSS, Normalized Drain-Source Breakdown Voltage -VDS, Drain-Source Voltage(V) -ID, Drain Current(A) VGS=-2V ID=-250μA, VGS=0V Static Drain-Source On-State resistance vs Drain Current 100 1000 0.001 0.01 0.1 1 ID, Drain Current(A) RDS(ON), Static Drain-Source On-State Resistance(Ω) VGS=-4.5V VGS=-10VVGS=-3V Reverse Drain Current vs Source-Drain Voltage 0.2 0.4 0.6 0.8 1.2 0 0.2 0.4 0.6 0.8 1 -IDR, Reverse Drain Current(A) -VSD, Source-Drain Voltage(V) Tj=25°C Tj=125°C Static Drain-Source On-State Resistance vs Gate-Source Voltage 100 200 300 400 500 600 700 800 900 1000 02468 1 -VGS, Gate-Source Voltage(V) RDS(ON), Static Drain-Source On- State Resistance(Ω) ID=-650mA ID=-300mA Drain-Source On-State Resistance vs Junction Tempearture 0.4 0.6 0.8 1.2 1.4 1.6 1.8 -75 -50 -25 0 25 50 75 100 125 150 175 Tj, Junction Temperature(°C) RDS(ON), Normalized Static Drain- Source On-State Resistance VGS=-4.5V, ID=-650mA RDS( ON)@Tj=25°C : 158mΩ typ.

CYStech Electronics Corp. Spec. No. : C982S6R Issued Date : 2017.02.07 Revised Date : Page No. : 5/ 9 MTA300B02KS6R CYStek Product Specification Typical Characteristics (Cont.) Capacitance vs Drain-to-Source Voltage 100 1000 0369 1 2 1 5 Threshold Voltage vs Junction Tempearture 0.2 0.4 0.6 0.8 1.0 1.2 1.4 -75 -50 -25 0 25 50 75 100 125 150 175 Tj, Junction Temperature(°C) -VGS(th), Normalized Threshold Voltage ID=-250μA ID=-1mA -VDS, Drain-Source Voltage(V) Capacitance---(pF) Ciss Coss Crss Maximum Safe Operating Area 0.001 0.01 0.1 0.01 0.1 1 10 100 -VDS, Drain-Source Voltage(V) -ID, Drain Current (A) DC 10ms 100ms 1ms 100μs TA=25°C, Tj=150°C, VGS=-4.5V, RθJA=357°C/W Single Pulse Maximum Drain Current vs JunctionTemperature 0.2 0.4 0.6 0.8 1.2 25 50 75 100 125 150 175 Tj, Junction Temperature(°C) -ID, Maximum Drain Current(A) TA=25°C, VGS=-4.5V, RθJA=357°C/W Forward Transfer Admittance vs Drain Current 0.01 0.1 0.001 0.01 0.1 1 10 -ID, Drain Current(A) GFS, Forward Transfer Admittance(S) Pulsed Ta=25°C VDS=-15V VDS=-10V Gate Charge Characteristics 0123456 Qg, Total Gate Charge(nC) -VGS, Gate-Source Voltage(V) VDS=-10V ID=-1A

CYStech Electronics Corp. Spec. No. : C982S6R Issued Date : 2017.02.07 Revised Date : Page No. : 6/ 9 MTA300B02KS6R CYStek Product Specification Typical Characteristics (Cont.) Typical Transfer Characteristics 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 012345 GS, Gate-Source Voltage(V) -ID, Drain Current(A) VDS=-5V Single Pulse Power Rating, Junction to Case Ambient 0.0001 0.001 0.01 0.1 1 10 Pulse Width(s) Power (W) TJ(MAX)=150°C TA=25°C RθJA=357°C/W Transient Thermal Response Curves 0.001 0.01 0.1 t1, Square Wave Pulse Duration(s) r(t), Normalized Transient Thermal Resistance Single Pulse 0.01 0.02 0.05 0.1 0.2 D=0.5 1.RθJA(t)=r(t)*RθJA 2.Duty Factor, D=t1/t2 3.TJM-TA=PDM*RθJA(t) 4.RθJA=357°C/W

CYStech Electronics Corp. Spec. No. : C982S6R Issued Date : 2017.02.07 Revised Date : Page No. : 7/ 9 MTA300B02KS6R CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C982S6R Issued Date : 2017.02.07 Revised Date : Page No. : 8/ 9 MTA300B02KS6R CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note :1. All temperatures refer to topside of the package, measured on the package body surface. 2.For devices mounted on FR-4 PCB of 1.6mm or equivalent grade PCB. If other grade PCB is used, care should be taken to match the coefficients of thermal expansion between components and PCB. If they are not matched well, the solder joints may crack or the bodies of the parts may crack or shatter as the assembly cools.

CYStech Electronics Corp. Spec. No. : C982S6R Issued Date : 2017.02.07 Revised Date : Page No. : 9/ 9 MTA300B02KS6R CYStek Product Specification SOT-363 Dimension Marking: D 2.000 2.200 0.079 0.087 θ 0° 8° 0° 8° E 1.150 1.350 0.045 0.053 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material :

  • Lead : Pure tin plated.
  • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Style: Pin 1. Source1 (S1) Pin 2. Gate1 (G1) Pin 3. Drain2 (D2) Pin 4. Source2 (S2) Pin 5. Gate2 (G2) 6-Lead SOT-363R Plastic Surface Mounted Package CYStek Package Code: S6RPin 6. Drain1 (D1) Device Code HB2 XX Date Code