MSL-518SB UOT | Alldatasheet

Document overview

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Technical content

Features

l Package : white micro-sideview PLCC-2 package with clear silicon. l Feature of the device : extremely wide viewing angle ideal for backlighting and coupling in light guides l Wavelength : Typical : 470nm l Viewing angle : Lambertian Emitter (X : 120 o / Y : 120o) l Technology : InGaN on SiC with clear silicon l Grouping parameter : luminous intensity , Chromaticity l Assembly methods : suitable for all SMT assembly methods l Soldering methods : IR reflow soldering l Preconditioning : acc. to JEDEC Level 3 l Taping : 8-mm tape with 3500/reel, φ 180mm

Applications

l Backlighting : LCD Display, Key pads Technical Data mSideLEDs PRELIMINARY Unity Opto Technology Co., Ltd.

Package Dimensions Unit : mm (inch) Recommended Solder Patterns Method of Taping / Polarity and Orientation Packing unit 3500/reel Notes : 1. All dimensions are in millimeters (inches) 2. Tolerance is ±0.1 unless other specified Notes : 1. All dimensions are in millimeters (inches) 2. Tolerance is ±0.1 unless other specified 1.6 2.1 1.1 1.6 1.54±0.1 1.02±0.1 4.24±0.1

Min. Max Min. Typ. Max - 4.0 - - 50 Maximum Ratings Symbol Operating Temp. range T OP Storage Temp. range T stg Forward current I F Peak forward current I FM Reverse Voltage V R Power dissipation P tot IFP Conditions : Pulse Width <10msec and Duty < 1/10 MSL-518SB Forward Voltage VF (Volts) @IF = 20mA Typ. 3.1 mcd Luminous Intensity nm Device Type Thermal Current Typ. 470 475 100 Part Number Max Resistance RqqJ-S (oC/W)IR (uA) @ VR = 5V Reverse oC mA V oC mA Soldering Temperature Tsid 120 Hand Soldering : 350oC, for 3 sec mW Reflow Soldering : 260oC, for 10 sec Unit Selection Guide Viewing Angle 2qq 1/2 (Degrees) Wavelength 120 120MSL-518SB 460 -30 ~ +85 -40 ~ +100 Parameter Value

Relative Spectrum Emission Irel = f (l), TA = 25oC, IF = 20mA V(l) = Standard eye response curve Forward Current IF = f (VF) Relative Luminous Intensity IV/IV (20mA) = f (IF) TA = 25oC TA = 25oC Ambient Temperature VS. Allowable Forward Radiation Characteristic Irel = f (q) X Y 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 10 20 30 40 50 0 20 40 60 80 100 TA temp. ambient Relative Luminous Intensity Wavelength (nm) FIG.1 RELATIVE LUMINOUS INTERSITY VS. WAVELENGTH Forward Voltage (V) FIG.2 FORWARD CURRENT VS. FORWARD VOLTAGE Forward Current IF (mA) FIG.3 RELATIVE LUMINOUS INTENSITY VS. FORWARD CURRENT Ambient Temperature TA (oC) FIG.4 FORWARD CURRENT VS. AMBIENT TEMPERATURE FIG.5 RADIATION DIAGRAM IF (mA) T (oC) (mA) IF IV X Y 30o 40o 50o 60o 70o 80o 90o 0o 10o 20o 0.8 0.9 1.0 VF (V) (mA) IF 0 1 2 3 4 0.5 380 450 520 590 660

IR Reflow Soldering Profile Lead Solder Time 240oC Max. 10sec. Max. Temp 60sec. Max. Above 200oC 2-5oC / sec. 2-5oC / sec. Pre heating 120-150oC 120sec. Max.

Luminous intensity is tested at a current pulse duration minimum maximum minimum maximum minimum maximum 460 465 465 470 470 475 Wavelength groups are tested at a current pulse duration of 25 ms and an accuracy of ± 1nm A Luminous Intensity Group of 25 ms and an accuracy of +/- 11% CB Dominant Wavelength (in nanometers) @ IF=20mA MSL-510SB 213-300 Unity mSideLEDs Bin Codes T B Category Code SB R S T U 75-104 104-150 150-213 P/N BIN

The end of the tape shall be inserted into a slit of the hubThere shall be more than 40 emptiesTrailer Items RemarksSpecifications Leader Cover Tape Cover tape shall be longer than 400mm without carrier tape There shall be more than 40 empties The end of the carrier tape shall be adhered on the cover tape The orientation of tape shall be as shown

Surface Mount Moisture Sensitivity Specifications 1. Controlling Moisture Unity Opto Technology, in its design of packing materials and packing methods, takes into consideration the susceptibility of some Unity packages to moisture induced damage. The risk of this damage is caused when the LED lens plastic encapsulation material is exposed to increases or decreases in the Relative Humidity of the surrounding environment. Such damage may include delamination between the die and the LED lens plastic encapsulation material, which may result in open connections due to broken wire bonds. Moisture in the package having reached a critical level will fracture the package in order to escape when exposed to peak temperature conditions, typical in soldering practices. Therefore, the control of moisture levels in the LED package is critical to reduce the risk of moisture-induced failures. Please follow JEDEC-STD-033A standards for handling moisture sensitive devices. 2. Packaging SMD devices: Unity packages all SMD devices into dry pack bags (moisture barrier bags). Unity includes a desiccant pouch in each bag. Testing confirms that the desiccant pouch greatly reduces the presence of moisture by maintaining the environment in the bag, thus protecting the devices during shipment and storage. 3. Handling Dry Packed Parts Upon receipt, the bags should be inspected for damage to ensure that the bag’s integrity has been maintained. Inspection should verify that there are no holes, gouges, tears, or punctures of any kind that may expose the contents of the bag. To open the bag, simply cut across the top of the bag as close to the original seal as possible being careful not to damage the contents. Once open the desired quantity of units should be removed and the bag resealed. If the bag is left open longer than 2 hours, the desiccant pouch should be replaced with a dry desiccant and the bag should be sealed immediately to avoid moisture damage.