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1 Current Sense 5 Inverting Input

2 No Connection 6 Negative Power Supply

3 Positive Power Supply 7 No Connection

4 Non-Inverting Input 8 Output Drive

The above pin out table is for the MSK541 (TO-3). Refer to the me- chanical specifications page for the pin out information of additional package styles. FEATURES: Available to SMD #5962-88701 High Output Current - 10 Amps Peak Wide Power Supply Range - ±10V to ±40V Programmable Current Limit FET Input Isolated Case Replacement for OMA 541SKB - MSK541 OMA 541SDB - MSK146 OMA 541SZB - MSK147 DESCRIPTION: The MSK541 is a high power monolithic amplifier ideally suited for high power amplification and magnetic deflection applications. This amplifier is capable of operation at a supply voltage rating of 80 volts and can deliver guaranteed continuous output currents up to 5A, making the MSK541 series an excellent low cost choice for motor drive circuits. The amplifier and load can be protected from fault conditions through the use of internal current limit circuitry that can be user programmed with a single external resistor. The MSK541 is pin compatible with popular op-amps such as the Burr- Brown OPA501, OPA511, OPA512, OPA541 and 3573. The MSK541 is available in a hermetically sealed 8 pin TO-3 package. The MSK145 is available in a 6 pin SIP Package. The MSK146 is an 8 pin Power DIP Package and the MSK147 is available in an 8 pin Power Z-TAB Package for applications requiring bolt down heat sinking. Other package styles are also available for a wide range of applications. EQUIVALENT SCHEMATIC MSK147 MSK145 MSK541 MSK146 HIGH POWER OP-AMP (TO-3 PIN-OUT SHOWN) M.S KENNEDY CORP. 541 SERIES HIGH POWER OP-AMP 8548-29 Rev. L 6/14 CASE=ISOLATED MIL-PRF-38534 AND 38535 CERTIFIED FACILITY

1, 2, 3 2, 3 2, 3 2, 3 5, 6 5, 6 5, 6 STATIC Supply Voltage Range Quiescent Current INPUT Input Offset Voltage Input Offset Voltage Drift Input Capacitance Input Impedance Common Mode Rejection Ratio Power Supply Rejection Ratio Input Noise Voltage OUTPUT Settling Time Power Bandwidth TRANSFER CHARACTERISTICS Slew Rate Max. ±40 ±10 ±100 2.2 1.5 Typ. ±35 ±20 ±1.0 ±15 ±0.2 2.0 113 ±29 100 1.9 1.0 Min. ±10 ±28 Max. ±40 ±30 ±1.5 ±50 ±50 ±150 1.9 1.2 Typ. ±35 ±20 ±0.1 ±15 ±0.2 2.0 113 ±29 ±31 100 1.2 1.0 Min. ±10 ±28 ±30 ±3.0 V IN = 0V VIN = 0V VIN = 0V VCM = 0V Either Input F = DC F = DC VCM = ±22V VCC = ±10V to ±40V F = 10 Hz to 1 KHz RL = 5.6Ω F = 10 KHz RL =10Ω F = 10 KHz RL = 5.6Ω F =10 KHz RL = 10Ω F = 10 KHz 0.1% 2V step R L = 10Ω VO = 20 VRMS VOUT = ±10V RL = 10Ω ±VCC Supply Voltage ±40V IOUT Peak Output Current See S.O.A. VIN Differential Input Voltage ±V CC VIN Common Mode Input Voltage ±V CC ABSOLUTE MAXIMUM RATINGS ELECTRICAL SPECIFICATIONS TST Storage Temperature Range -65° to +150°C TLD Lead Temperature Range (10 Seconds) 300° T J Junction Temperature 150°C TC Case Operating Temperature Range Military Versions -55°C to +125°C Industrial Versions -40°C to +85°C Units V mA mV μV/°C pA nA pA nA pF Ω dB dB μV RMS V V A A μS KHz V/μS dB dB °C/W °C/W Unless otherwise specified RCL = 0Ω, ±VCC = ±34 VDC Electrical specifications are derated for power supply voltages other than ±34 VDC. AV = -1, measured in false summing junction circuit. Devices shall be capable of meeting the parameter, but need not be tested. Typical parameters are for reference only. Industrial devices shall be tested to subgroups 1 and 4 unless otherwise specified. Military grade devices ('B' suffix) shall be 100% tested to subgroups 1, 2, 3 and 4. Subgroup 5 and 6 testing available upon request. Subgroup 1, 4 T A = T C = +25°C Subgroup 2, 5 T A = T C = +125°C Subgroup 3, 6 T A = T C = -55°C Reference DSCC SMD 5962-88701 for electrical specifications for devices purchased as such. Continuous operation at or above maximum ratings may adversely effect the device performance and/or life cycle. Internal solder reflow temperature is 180°C, do not exceed. Military Industrial VCM=0VInput Offset Current Input Bias Current Output Voltage Swing Output Current Open Loop Voltage Gain F = 10 HZ RL = 10 KΩ Parameter Test Conditions 5 Thermal Resistance (541) All Others NOTES: 2 8548-29 Rev. L 6/14

To select the correct heat sink for your application, refer to the thermal model and governing equation below. Thermal Model: Governing Equation: TJ = PD X (RθJC + RθCS + RθSA) + TA Where TJ = Junction Temperature PD = Total Power Dissipation RθJC = Junction to Case Thermal Resistance RθCS = Case to Heat Sink Thermal Resistance RθSA = Heat Sink to Ambient Thermal Resistance TC = Case Temperature TA = Ambient Temperature TS = Sink Temperature Example: (TO-3 PACKAGE) In our example the amplifier application requires the output to drive a 20 volt peak sine wave across a 5 ohm load for 4 amps of output current. For a worst case analysis we will treat the 4 amps peak output current as a D.C. output current. The power supplies are ±35 VDC. 1.) Find Power Dissipation P D = [(quiescent current) X (+VCC - (VCC))] + [(VS - VO) X IOUT] = 2.1W + 60W = 62.1W 2.) For conservative design, set T J = +150°C 3.) For this example, worst case T A = +25°C 4.) R θJC = 1.2°C/W typically for the TO-3 package 5.) R θCS = 0.15°C/W for most thermal greases 6.) Rearrange governing equation to solve for R θSA RθSA =( T J - TA) / PD - (RθJC) - (RθCS) = 0.66°C/W The heat sink in this example must have a thermal resistance of no more than 0.66°C/W to maintain a junction temperature of no more than +150°C. Since this value of thermal resistance may be difficult to find, other measures may have to be taken to decrease the overall power dissipation. APPLICATION NOTES CURRENT LIMIT The MSK541 has an on-board current limit scheme designed to limit the output drivers anytime output current exceeds a predetermined limit. The following formula may be used to de- termine the value of the current limit resistance necessary to establish the desired current limit. R CL (OHMs) = (0.809 volts / current limit in amps) - 0.057 OHM The 0.057 OHM term takes into account any wire bond and lead resistance. Since the 0.809 volt term is obtained from the base emitter voltage drop of a bipolar transistor, the equation only holds true for operation at +25°C case temperature. The effect that temperature has on current limit may be seen on the Current Limit vs. Case Temperature Curve in the Typical Perfor- mance Curves. Current Limit Connection See "Application Circuits" in this data sheet for additional information on current limit connections. POWER SUPPLY BYPASSING Both the negative and the positive power supplies must be effectively decoupled with a high and low frequency bypass circuit to avoid power supply induced oscillation. An effective decoupling scheme consists of a 0.1 microfarad ceramic ca- pacitor in parallel with a 4.7 microfarad tantalum capacitor from each power supply pin to ground. It is also a good practice with very high power op-amps, such as the MSK541, to place a 30-50 microfarad nonelectrolytic capacitor with a low effec- tive series resistance in parallel with the other two power sup- ply decoupling capacitors. This capacitor will eliminate any peak output voltage clipping which may occur due to poor power supply load regulation. All power supply decoupling capaci- tors should be placed as close to the package power supply pins as possible (pins 3 and 6 for the MSK541). SAFE OPERATING AREA The safe operating area curve is a graphical representation of the power handling capability of the amplifier under various conditions. The wire bond current carrying capability, transis- tor junction temperature and secondary breakdown limitations are all incorporated into the safe operating area curves. All ap- plications should be checked against the S.O.A. curves to ensure high M.T.B.F. 8548-29 Rev. L 6/14

Isolating Capacitive Loads Motor Current a Function of VIN Programmable Torque Circuit Clamping Output for EMF-Generating Loads The linear relationship of torque output to current input of the modern torque motor makes this simple control cir- cuit ideal for many material processing and testing appli- cations. The sense resistor develops a feedback voltage proportional to motor current and the small signal proper- ties of the Power Op Amp insure accuracy. With this closed loop operation, temperature induced impedance variations of the motor winding are automatically compensated. Replacing OPA501 with MSK541 When replacing the OPA501, OPA511, OPA512 or 3573 with the MSK541, it is not necessary to make any changes in the current limit scheme. Since pin 2 is not connected in the MSK541, the current limit resistor connected from pin 1 to pin 2 can be left in the circuit or removed. 8548-29 Rev. L 6/14

TYPICAL PERFORMANCE CURVES 5 8548-29 Rev. L 6/14

MSK146 POWER Z-TAB PACKAGEPOWER DIP PACKAGE MSK147 ALL DIMENSIONS ARE SPECIFIED IN INCHES ESD TRIANGLE INDICATES PIN 1 WEIGHT=14.2 GRAMS TYPICAL WEIGHT=5.9 GRAMS TYPICAL WEIGHT=6.5 GRAMS TYPICAL CASE=ISOLATED CASE=ISOLATED CASE=ISOLATED 8548-29 Rev. L 6/14

ORDERING INFORMATION

MECHANICAL SPECIFICATIONS CONTINUED Industrial MIL-PRF-38534, Class H DSCC-SMD DSCC-SMD WEIGHT=15.2 GRAMS TYPICAL ALL DIMENSIONS ARE SPECIFIED IN INCHES 8548-29 Rev. L 6/14

M.S. Kennedy Corp. Phone (315) 701-6751 Fax (315) 701-6752 www.mskennedy.com The information contained herein is believed to be accurate at the time of printing. MSK reserves the right to make changes to its products or specifications without notice, however and assumes no liability for the use of its products. Please visit our website for the most recent revision of this datasheet

REVISION HISTORY

8548-29 Rev. L 6/14