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FEATURES: M.S.KENNEDY CORP. 111 HIGH SPEED POWER AMPLIFIER The MSK111 is a high speed operational amplifier which utilizes low impedance push-pull circuitry to achieve high speed amplification. Laser trimmed offset voltage provides a high DC accuracy typically less than ±2mV. The MSK111 also offers an external offset null capability for applications in which zero offset is critical. The speed and output current offered by the MSK111 makes it an excellent choice for video processing circuits and high speed test circuits. The MSK111 is packaged in a hermetically sealed 8 pin TO-3 package. DESCRIPTION: Replaces Apex WA-01 Internal 1.5KΩ Feedback Resistor High Output Current: 400mA Very Fast Slew Rate: 3000V/μS Fast Settling Time Low Offset Voltage: ±5mV Offset Null Capability TYPICAL APPLICATIONS Sample and Hold Circuits Video Processing Line Drivers Function Generators PIN-OUT INFORMATION BALANCE -VCC +INPUT -INPUT OUTPUT +VCC NC BALANCE EQUIVALENT SCHEMATIC MIL-PRF-38534 AND 38535 CERTIFIED FACILITY 8548-136 Rev. C 10/14
Typ. ±15 ±28 ±0.5 ±11 3000 2.9 1.5 Max. ±16 ±30 ±50 ±30 1.503 Typ. ±15 ±28 ±0.5 ±11 3000 2.9 1.5 Group A Subgroup 2,3 2,3 V CM=±5V VCC=24V to 30V f=1KHz RL=1KΩ f=1KHz RL=50Ω VO=20VPP 10V Step VOUT=±10V R L=1KΩ TC=25°C Junction to Case @ 125°C Rf Storage Temperature Range Lead Temperature Range (10 Seconds) Case Operating Temperature MSK111 MSK111H Junction Temperature ABSOLUTE MAXIMUM RATINGS VCC IOUT VIN VIN Total Supply Voltage Output Current Differential Input Voltage Common Mode Input Voltage -65°C to +150°C 300°C -40°C to +85°C -55°C to +125°C 175°C T ST TLD TC TJ MSK111H MSK111 Parameter Test Conditions ELECTRICAL SPECIFICATIONS
1 Units
Min. ±12 ±10 400 2500 1.495 Max. ±16 ±35 ±10 1.505 Min. ±12 ±10 400 2500 1.497 NOTES: 3030303030 0.4A ±6V ±VCC V mA mA mV mV μA dB dB V mA MHz nS V/μS nS °C/W KΩ Unless otherwise specified, ±VCC=±15V AV=10V/V and RL=∞ and Tc=25°C. Guaranteed by design but not tested. Typical parameters are representative of actual device performance but are for reference only. Industrial grade devices shall be tested to subgroups 1 and 4 unless otherwise specified. Military grade devices ("H" suffix) shall be 100% tested to subgroups 1,2,3 and 4. Subgroup 5 and 6 testing available upon request. Subgroup 1,4 T A=TC=+25°C Subgroup 2,5 TA=TC=+125°C Subgroup 3,6 TA=TC=-55°C Continuous operation at or above absolute maximum ratings may adversely effect the device performance and/or life cycle. Internal solder reflow temperature is 180°C, do not exceed. STATIC Supply Voltge Range INPUT Input Bias Current Common Mode Rejection Power Supply Rejection OUTPUT Output Voltage Swing Output Current Power Bandwidth Settling Time Slew Rate Propagation Delay Thermal Resistance Internal Feedback Resistor ○○○ ○ ○○ ○ Quiescent Current Input Offset Voltage VIN=0V VIN=0V 8548-136 Rev. C 10/14
Both the negative and the positive supplies must be ef- fectively decoupled with a high and low frequency bypass circuit to avoid power supply induced oscillation. An ef- fective decoupling scheme consists of a 0.01 microfarad ceramic capacitor in parallel with a 4.7 microfarad tanta- lum capacitor from each power supply pin to ground. All power supply decoupling capacitors should be placed as close to the package power supply pins as possible. Output, power supply, and bypass leads should be kept as short as possible. Long connections can add signifi- cant inductance, raising impedance and limiting output current slew rate. This is especially true in the video fre- quency range. The case of the MSK111 is electrically isolated and should be connected to a common ground plane. In addition to the case, the input signal and input resistors should be connected to this common ground plane using a single point grounding scheme. This will help to prevent undes- ired current feedback that can cause instability in the cir- cuit. GAIN The MSK111, unlike most operational amplifiers, has an internal feedback resistor. The value of this resistor is 1.5KΩ. Fewer external components are required to con- figure the MSK111 in either inverting or non-inverting modes. Using an internal feedback resistor shortens the feedback path, lowering summing node capacitance to ground and stabilizing high frequency characteristics. OUTPUT OFFSET NULL Typically,the MSK111 has an input offset voltage of less than ±2mV. The input offset voltage is laser trimmed to less than ±5mV, but in applications where offset is criti- cal, the balance pins may be used to null the offset to zero. A 20KΩ potentiometer may be placed between pins 4 and 8 with the wiper arm connected to +VCC. If the balance function is not used pins 4 and 8 should not be connected (floating). However, if settling time is extremely important, pin 8 should be tied to the AC ground with a 100-150pF capacitor. SAFE OPERATING AREA-POWER DISSIPATION The safe operating area curve is a graphical representa- tion of the power handling capability of the amplifier under various conditions. The wire bond current carrying capa- bility, transistor junction temperature and secondary break- down limitations are all incorporated into the safe operat- ing area curves. All applications should be checked against IN To select the correct heat sink for your application, refer to the thermal model and governing equation below. Thermal Model: HEAT SINKING 8548-136 Rev. C 10/14 Governing Equation: TJ = PD x (RθJC + RθCS + RθSA) + TA Where TJ = Junction Temperature PD = Total Power Dissipation RθJC = Junction to Case Thermal Resistance RθCS = Case to Heat Sink Thermal Resistance RθSA = Heat Sink to Ambient Thermal Resistance TC = Case Temperature TA = Ambient Temperature TS = Sink Temperature Example: In our example the amplifier application requires the output to drive a 10 volt peak sine wave across a 50 ohm load for 0.2 amp of output current. For a worst case analysis we will treat the 0.2 amp peak output current as a D.C. output current. The power supplies are ±15 VDC. 1.) Find Power Dissipation P D=[(quiescent current) x (+VCC- (VCC))] + [(VS - VO) x IOUT] =0.84W + 1W =1.84W 2.) For conservative design, set T J = +150°C. 3.) For this example, worst case TA = +25°C. 4.) RθJC = 31°C/W 5.) Rearrange governing equation to solve for RθSA: RθSA =( TJ - TA) / PD - (RθJC) - (RθCS) = 36°C/W The heat sink in this example must have a thermal resistance of no more than 36°C/W to maintain a junction temperature of less than +150°C. This calculation assumes a case to sink thermal resistance of 0.15°C/W.
TYPICAL PERFORMANCE CURVES 4 8548-136 Rev. C 10/14
ORDERING INFORMATION
CONTAINS INTERNAL BeO (BERYLLIUM OXIDE) WEIGHT = 15 GRAMS TYPICAL ALL DIMENSIONS ARE SPECIFIED IN INCHES 8548-136 Rev. C 10/14
The information contained herein is believed to be accurate at the time of printing. MSK reserves the right to make changes to its products or specifications without notice, however, and assumes no liability for the use of its products. Please visit our website for the most recent revision of this datasheet. M.S. Kennedy Corp. Phone (315) 701-6751 FAX (315) 701-6752 www.mskennedy.com 6 8548-136 Rev. C 10/14