MSK MERITEK | Alldatasheet
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Rev. 7 Safety Certified Multilayer Ceramic Chip Capacitor RoHS MERITEK MSK/MSH Series (X1/Y2, X2/Y3)
FEATURES
X1Y2/X2Y3 class, size 1808~2220, COG(NPO)/X7R, 250VAC High reliability and stability. Small size and high capacitance. Safety standard approval by UL60384-14. HALOGEN compliant APPLICATION Modem, Facsimile, Telephone Other electronic equipment for lighting or surge protection and isolation. PART NUMBER SYSTEM S PECIFICATIONS Dielectric C0G(NPO) X7R Size 1808 1808, 1812, 2211 Rated voltage (WVDC) 250VAC 250VAC Capacitance range* X1/Y2 Class 3pF ~ 270pF X1/Y2 Class 130pF ~ 2200pF X2/Y3 Class 3pF ~ 1000pF X2/Y3 Class 150pF ~ 5600pF Capacitance tolerance Cap≤5pF: B (±0.1pF), C (±0.25pF) 5pF<Cap<10pF: C (±0.25pF), D (±0.5pF) K (±10%), M (±20%) Tan δ*(Tangent of loss angle) Cap<30pF: D.F≤1/(400+20C) Cap≥30pF: D.F≤0.10% ≤2.5% Insulation resistance at 500VDC for 60 seconds ≥100GΩ or R·C≥1000 whichever is smaller ≥10GΩ or R·C≥500Ω-F whichever is smaller Operating temperature -55 to +125°C Capacitance characteristic ±30ppm / ºC ±15% Termination (Cu or Ag) / Ni / Sn (lead-free termination) * C0G(NPO): Apply 1.0±0.2Vrms, 1.0MHz±10%, at 25°C ambient temperature X7R: Apply 1.0±0.2Vrms, 1.0kHz±10%, at 25°C ambient temperature MSK 08 X 101 K 302 Series number Code MSK MSH Type X1/Y2 X2/Y3 Dimension Code 08 12 21 Size (inch) 1808 1812 2211 Dielectric Code N X NPO X7R Capacitance Capacitance express in microfarads (pF) First two digits are significant figures Third digit denoted number of zero i.e. 101=100pF Capacitance Tolerance Code F G J K M Safety Class Code 302 502 X2/Y3 (impulse 2.5kV) X1/Y2 (impluse 5.0kV) MERITEK capacitors are designed for surge or lightning immunity in moderm facsimile and other equipments.The capacitors of series MSK are class X1/Y2 compliant respectively. The green type capacitors in MSK and MSH series are manufactured by using environmentally friendly materials without lead or cadmium. The terminations are composed of plated nickel and pure tin to feature the superior leaching resistance during soldering C US File Number - E197475
Rev. 7 Safety Certified Multilayer Ceramic Chip Capacitor RoHS MERITEK MSK/MSH Series (X1/Y2, X2/Y3) DIMENSIONS CAPACITANCE RANGE Class X1/Y2(MSK series) X2/Y3(MSH series) Rated Voltage 250VAC Dielectric C0G(NPO) X7R C0G(NPO) X7R Certificated UL UL UL UL UL UL Size 1808 1812 2211 1808 1808 1812 Impulse 5kV 5kV 2.5kV Capacitance 3.0pF (3R0) D D 3.3pF (3R3) D D 4.0pF (4R0) D D 4.7pF (4R7) D D 5.0pF (5R0) D D 5.6pF (5R6) D D 6.8pF (6R8) D D 8.2pF (8R2) D D 10pF (100) D D 12pF (120) D D 15pF (150) D D 18pF (180) D D 22pF (220) D D 27pF (270) D D 33pF (330) D D 39pF (390) E E 47pF (470) E E 56pF (560) E E 68pF (680) E E 82pF (820) E E 100pF (101) F F 120pF (121) F F 130pF (131) F E F 150pF (151) F E E F E 160pF (161) F E E F E 180pF (181) F E E F E 220pF (221) F E E F E 270pF (271) F E E F E E 330pF (331) E E F E E 390pF (391) E E F E E 470pF (471) E F F E E 560pF (561) E F F E E 680pF (681) F F F E E 720pF (721) F F F E E 820pF (821) F F F E E 1,000pF (102) G G F F E 1,200pF (122) G F E 1,500pF (152) G F F 1,800pF (182) G F F 2,200pF (222) G F G 2,700pF (272) G Size inch(mm) BL BW BH LW 1.25±0.1 C 0.26 1.40±0.15 D 1.60±0.20 E 2.00±0.20 F 1.25±0.10 C 0.26 1.60±0.20 E 2.00±0.20 F 2.50±0.30 G 1.60±0.20 E 0.30 2.00±0.20 F 2.50±0.30 G 2.80±0.30 H All dimension is mm BL BW LW BH
Rev. 7 Safety Certified Multilayer Ceramic Chip Capacitor RoHS MERITEK MSK/MSH Series (X1/Y2, X2/Y3) 3,300pF (332) G 3,900pF (392) G 2,700pF (272) G 4,700pF (472) G 5,600pF (562) G RELIABILITY No. Item Standard Method Test Condition Requirements 1. Visual examination and Dimensions IEC 60384-1 4.1 * No remarkable defect. * Dimensions to confirm to individual specification sheet. 2. Capacitance IEC 60384-1 4.2.2 Class I (C0G/NPO): 1.0±0.2Vrms, 1MHz±10% For CR ≤100pF 1KHz±10% For CR > 100pF Class II (X7R): 1.0±0.2Vrms, 1KHz±10% * Capacitance is within specified tolerance * CR means rated capacitance for conform to the E6 series of preferred values given in IEC 60063. 3. D.F. (Dissipation Factor) Tangent of loos angle IEC 60384-1 4.2.3 Class I (C0G/NPO): Cap≥30pF, D.F≤0.1%; Cap<30pF, D.F≤1/(400+20C) Class II (X7R): ≤2.5% 4. Temperature Coefficient IEC 60384-21/22 4.6 With no electrical load. T.C. Operating Temp C0G(NPO) -55~125°C at 25°C X7R -55~125°C at 25°C T.C. Capacitance C ange C0G(NPO) Within ±30ppm/℃ X7R Within ±15% 5. Insulation Resistance IEC 60384-21/22 4.5.3 * To apply voltage at 500VDC for 60 sec. * The charge current shall not exceed 0.05A. Class I (NP0) : ≥ 100GΩ or RxC ≥ 1000 Ω-F whichever is smaller. Class II (X7R) : ≥ 10GΩ or RxC ≥ 500 Ω-F whichever is smaller. 6. Voltage proof (Dielectric Strength) IEC 60384-14 4.2.1 * To apply voltage: X Capacitor: 1075VDC (4.3UR) Y Capacitor: 1500VAC * Duration: 60 sec. * The charge current shall not exceed 0.05A. * No evidence of damage or flashover during test. * The voltage shall be raised from the near zero to the test voltage a rate not exceeding 150V(r.m.s.)/sec. Solderability IEC 60384-21/22 4.10 * Solder temperature: 245±5°C * Dipping time: 2±0.2 sec. 75% min. coverage of all metalized area. 8. Resistance to Soldering Heat IEC 60384-14 4.4 IEC 60384-21/22 4.9 * Solder temperature: 260±5°C * Dipping time: 10±1 sec * Preheating: 120 to 150°C for 1 minute before immerse the capacitor in a eutectic solder. * Before initial measurement (Class II only): Perform 150+0/-10°C for 1 hr and then set for 48±4 hrs at room temp. * Measurement to be made after keeping at room temp. for 24±2 hrs (Class I) and 48± 4 hrs (Class II) * No visible damage. * Cap change: NP0: within ±2.5% or ±0.25pF whichever is larger. I.R: More than 1GΩ X7R: within ±10% I.R: More than 1GΩ 9. Humidity (Damp Heat) Steady State IEC 60384-14 4.12 * Test temp.: 40±2°C * Humidity: 90~95% RH * Test time: 500+24/-0hrs. * Applied Voltage:250VAC * Measurement to be made after keeping at room temp. for 24±2 hrs (Class I) and 48± 4 hrs (Class II) * No remarkable damage. * Cap change: NP0 within ±5% or ±0.5pF whichever is larger X7R within ±15% * D.F Value: NP0 ≤ 0.25% X7R: ≤5.0% * I.R. ≥1GΩ * Dielectric strength satisfies the specified initial value
Rev. 7 Safety Certified Multilayer Ceramic Chip Capacitor RoHS MERITEK MSK/MSH Series (X1/Y2, X2/Y3) No. Item Standard Method Test Condition Requirements 10. Endurance IEC 60384-14 4.14 * Impulse Voltage: Each individual capacitor shall be subjected to a Vp = 5.0 kV (X1Y2 Class Impulse 5kV) & Vp = 6.0kV (X1Y2 Class Impulse 6kV) impulse for three times before applied to endurance test. Additional pulse test 10/700µs before endurance test for Y3 class (IEC60950) *Test Temp.: 125±3°C * Test time:: 1000+48/-0 hrs. * Applied Voltage: X capacitor: 1.25UR (312.5VAC) Y capacitor: 1.70UR (425VAC) Once every hour the voltage shall be increased to 1000Vrms for 0.1 sec. * Measurement to be made after keeping at room temp. for 24±2 hrs (Class I) and 48±4 hrs (Class II) * Appearance : No mechanical damage. * Cap change: NP0 within ±5% or ±0.5pF whichever is larger X7R within ±20% * D.F Value: NP0 ≤ 0.25% X7R: ≤5.0% * I.R. ≥1GΩ * Dielectric strength satisfies the specified initial value 11. Resistance to Flexure of Substrate IEC 60384-21/22 4.8 * Capacitors mounted on a substrate. The board shall be bent 1mm with a rate of 1mm/sec. * No remarkable damage. * Cap change is less than 10%. (This capacitance change means the change of capacitance under specified flexure of substrate from the capacitance measured before the test.) 12. Robustness of terminations (Adhesive Strength of Termination) IEC 60384-21/22 4.15 IEC 60384-1 4.13 * Capacitors mounted on a substrate. A force of 5N applied perpendicular to the place of substrate and parallel the line joining the center of terminations for 10±1 sec. * No remarkable damage or removal of the terminations. 13. Passive Flammability IEC 60384-14 4.17 IEC 60384-1 4.38 * Volume sample: 21.56 mm3 * Flame exposure time: 5 sec Max. * Category of flammability : C. * Capacitor didn’t burn at all 14. Active Flammability IEC 60384-21/22 4.18 * The capacitors applied UR (250VAC). Then each sample shall be subjected to 20 discharges from a tank capacitor, charge to a voltage that, when discharged, plase Ui 2500V for X2Y3, Ui 5000V for X1Y2 across the capacitor under test. The interval between successive discharges shall be 5 sec. * The cheese cloth shall not burn with a flame. 15. Impulse Voltage IEC 60384-14 4.13 * Y2 : 5.0kV, Y3 : None. * Number of impulse : 24 max. *There shall be no permanent breakdown or flashover. R = 230 45±1 45±1 1mm Capacitor PC Board
Rev. 7 Safety Certified Multilayer Ceramic Chip Capacitor RoHS MERITEK MSK/MSH Series (X1/Y2, X2/Y3) REFLOW PROFILES Note : For example , Tc is 260ºC and time tp is 15sec. for user : The peak temperature must not exceed 260º C. The time above 255ºC must not exceed 15 seconds. Cooling After soldering, cool the chips and the substrate gradually to room temperature. Natural cooling in air is recommended to minimize stress in the solder joint. A cooling rate not exceeding 4º C per second should be used when forced cooling is necessary. Cleaning All flux residues must be removed by using suitable electronic-grade vapor-cleaning solvents to eliminate contamination that could cause electrolytic surface corrosion. Good results can be obtained by using ultrasonic cleaning of the solvent. The choice of the proper system is depends upon many factors such as component mix, flux, and solder paste and assembly method. The ability of the cle aning system to remove flux residues and contamination from under the chips is very important. Chip Size ΔT 1808, 1812, 2211, 2220 50ºC Soldering Solder Temp.(Tc) Soldering Time (tp) Reflow 235 – 260ºC < 15 sec. ΔT