MS5536C INTERSEMA | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 17

Technical content

DA5536C_002.doc August 25th, 2008 1 0005536C1245 ECN1126 MS5536C (RoHS*) SMD Gage Pressure MODULE

  • Pressure range -400 to 1000 mbar (Optional -1000 to 400 mbar)
  • 0.1 mbar Resolution
  • Factory Calibrated (coefficients for software compensation stored on- chip)
  • 3-wire serial interface
  • Low voltage / low power

DESCRIPTION

MS5536C is a family of high-resolution factory cali brated pressure sensors. The devices include a piez oresistive pressure sensor and an ADC-Interface IC. The 3-wire serial interface ensures simple communication with any microcontroller. The devices provide digital pressu re and temperature information as 16-Bit data word each. In addition 64-Bit of individually calibrated compensa tion coefficients are stored allowing for a highly accurate software compensation of process spread and temperature effects. The devices have a very low standby current and aut omatically enter power down mode after each convers ion. The optimum compromise of refresh rate and average current consumption can be defined by the applicati on software. FEATURES APPLICATIONS

  • • •• 16-Bit ADC resolution •• •• Medical application
  • • •• Supply voltage 2.2 V to 3.6 V •• •• Blood pressure meter
  • • •• Low supply current •• •• Air flow measurement
  • • •• -40° C to +85° C •• •• HVAC application
  • • •• Small size
  • • •• No external components required BLOCK DIAGRAM VDD GND MCLK SCLK DOUT DIN Input MUX ADC Digital Interface Memory (PROM) 64 bits SENSOR SGND +IN -IN dig. Filter Sensor Interface IC Fig.: 1 Block Diagram MS5536C * The European RoHS directive 2002/95/EC (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment) bans the use of lead, mercury, cadmium, hexavalent chromium and polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE).

DA5536C_002.doc August 25th, 2008 2 0005536C1245 ECN1126 PIN CONFIGURATION Top view Bottom view Fig. 2: Pin configuration of MS5536-CPJU, MS5536-CNJU PIN DESCRIPTION Pin Name Pin Type Function N/C 1 Not Connected VDD 2 P Positive Supply Voltage MCLK 3 I Master Clock (32.768kHz) DIN 4 I Data Input DOUT 5 O Data Output SCLK 6 I Serial Data Clock GND 7 G Ground N/C 8 Not Connected N/C 9 Not Connected N/C 10 Not Connected N/C 11 Not Connected N/C 12 Not Connected PV 13 N Negative Programming Voltage PEN 14 I Programming Enable NOTE Pins 13 (PEN) and 14 (PV) are only used by the manufacturer for calibration purposes and should not be connected. PRESSURE UNIT CONVERSION mbar kPa bar mm Hg PSI atm mm H 2O Inches H 2O

DA5536C_002.doc August 25th, 2008 3 0005536C1245 ECN1126 ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Min. Max Unit Supply Voltage V DD -0.3 4 V Differential Overpressure (1), (2) P diff -5 5 bar CM Overpressure (1), (3) P CM 10 bar Storage Temperature (1) T Stg -40 +125 oC NOTES 1) Storage and operation in an environment of dry a nd non-corrosive gases. 2) For a differential sensor, Differential Pressure is the difference of pressure at port 1 minus pres sure at port 2. For a gage sensor Differential Pressure is the d ifference of pressure at the port minus pressure of the ambient air. 3) For a differential sensor Common Mode Pressure i s the average of the pressure at port 1 and port 2. For a gage sensor Common Mode Pressure is the avera ge of the pressure at the port and the pressure of the ambient air. RECOMMENDED OPERATING CONDITIONS (T=25° C, VDD=3.0V unless noted otherwise) Parameter Symbol Conditions Min. Typ. Max Unit Supply Voltage V DD 2.2 3.0 3.6 V Supply Current, average (1) during conversion (2) standby (no conversion) I avg ISC Iss VDD = 3.0 V 0.1 µA mA µA Current consumption into MCLK (3) MCLK=32768Hz 0.5 µA Operating pressure range(4) p Pressure Range P devi ces -400 1000 mbar Operating pressure range(4) p Pressure Range N devi ces -1000 400 mbar Operating temperature range T a -40 +25 +85 ° C Conversion time T conv MCLK=32768Hz 35 ms External clock signal (5) MCLK 30000 32768 35000 H z Duty cycle of MCLK 40/60 50/50 60/40 % Serial Data Clock SCLK 500 kHz NOTES 1) Under the assumption of one conversion every sec ond. Conversion means either a pressure or a temperature measurement started by a command to the serial interface of MS5536C. 2) During conversion time the sensor will be switch ed on and off in order to reduce power consumption; the total on time within a conversion is about 2 ms. The current specified is active only during this on time. 3) This value can be reduced by switching off MCLK while MS5536C is in standby mode. 4) Positive pressure corresponds to higher pressure at port 1 (nozzle port on plastic cap). 5) It is strongly recommended that a crystal oscill ator be used because the device is sensitive to clo ck jitter. A square-wave form of the clock signal is a must.

DA5536C_002.doc August 25th, 2008 4 0005536C1245 ECN1126

ELECTRICAL CHARACTERISTICS

Parameter Symbol Conditions Min Typ Max Unit Input High Voltage V IH V DD = 2.2…3.6V 80% V DD 100% V DD V Input Low Voltage V IL V DD = 2.2…3.6 V 0% V DD 20% V DD V Signal Rise Time t R 200 ns Signal Fall Time t f 200 ns DIGITAL OUTPUTS Parameter Symbol Conditions Min Typ Max Unit Output High Voltage V OH I Source = 0.6 mA 80% V DD 100% V DD V Output Low Voltage V OL I Sink = 0.6 mA 0% V DD 20% V DD V Signal Rise Time t r 200 ns Signal Fall Time t f 200 ns AD-CONVERTER (T=25° C, V DD =3.0V) Parameter Symbol Conditions Min Typ Max Unit Resolution (1) 16 Bit Linear Range 4000 40000 LSB Conversion Time MCLK=32768Hz 35 ms INL Within linear range -5 +5 LSB

DA5536C_002.doc August 25th, 2008 5 0005536C1245 ECN1126 PRESSURE OUTPUT CHARACTERISTICS With the calibration data provided by the MS5536C system (stored in the interface IC) the following characteristics can be achieved: (VDD=3.0V unless noted otherwise) Parameter Conditions Min Typ Max Unit Notes Resolution 0.1 mbar 1 Ta = 10 …+40° C MS5536-CPJU: p = -100…700 mbar MS5536-CNJU: p = -700…100 mbar -2.5 2.5 mbar 2 Pressure Accuracy Ta = 10 ... +40° C MS5536-CPJU: p = -400…1000 mbar MS5536-CNJU: p = -1000…400 mbar -9 9 mbar 2 Maximum Error over Temperature T a = -40…+85° C p = const. -7 +7 mbar 3 Maximum Error over Supply Voltage VDD = 2.2…3.6V -1.5 0 1.5 mbar 2 NOTES 1) A stable pressure reading of the given resolutio n requires to take the average of 2 to 8 subsequent pressure values due to noise of the ADC 2) Specified values assume an offset adjustment at any given pressure e.g. p = 0 prior to the measurement 3) Specified values assume quadratic temperature co mpensation (Refer to the paragraph ‘second-order temperature compensation‘ in the section ‘FUNCTION’. TEMPERATURE OUTPUT CHARACTERISTICS The temperature information is not required for most applications, but it is necessary to allow for temperature compensation of the pressure output. The reference temperature is 20° C. (VDD=3.0V unless noted otherwise) Parameter Conditions Min Typ Max Unit Notes Resolution 0.01 ° C at reference temperature -0.8 0.8 ° C 1, 2 Accuracy Maximum Change over Supply Voltage VDD = 2.2…3.6V -0.2 0.2 ° C NOTES 1) Refer to the paragraph second-order temperature compensation in the section ‘FUNCTION’ 2) ∆ p=0

DA5536C_002.doc August 25th, 2008 6 0005536C1245 ECN1126 TYPICAL PERFORMANCE CURVES ADC-value D1 vs Pressure (typical) for MS5536-CPJU 8000 10000 12000 14000 16000 18000 20000 22000 24000 26000 28000 -400 -300 -200 -100 0 100 200 300 400 500 600 700 800 900 1000 Pressure (mbar) ADC-value D1 (LSB) -40° C 25° C 85° C ADC-value D2 vs Temperature (typical) 15000 20000 25000 30000 35000 40000 45000 50000 -40 -20 0 20 40 60 80 Temperature (° C) ADC-value D2 (LSB) -400 -300 -200 -100 0 100 200 300 400 500 600 700 800 900 1000 Pressure (mbar) Pressure error (mbar) 85° C 60° C 40° C 20° C 0° C

DA5536C_002.doc August 25th, 2008 7 0005536C1245 ECN1126 Temperature Error Accuracy vs temperature (typical) -40 -20 0 20 40 60 80 Temperature (° C) Temperature error (° C) Temperature error (standard calculation) Temperature error (with 2nd order calculation) Pressure Error Accuracy vs temperature (typical) for MS5536-CPJU -40 -20 0 20 40 60 80 Temperature (° C) Pressure error (mbar) Perror(600,1st order) Perror(600,2nd order) Perror(0,1st order) Perror(0,2nd order)

DA5536C_002.doc August 25th, 2008 8 0005536C1245 ECN1126 Pressure error vs supply voltage (typical) -0.8 -0.6 -0.4 -0.2 0.2 0.4 0.6 0.8 Voltage (V) Pressure error (mbar) 600mbar 0mbar Temperature error vs supply voltage (typical) -0.15 -0.1 -0.05 0.05 0.1 0.15 Voltage (V) Temperature error (° C)

DA5536C_002.doc August 25th, 2008 9 0005536C1245 ECN1126 FUNCTION GENERAL The MS5536C consists of a piezoresistive sensor and a sensor interface IC. The main function of the MS 5536C is to convert the uncompensated analogue output vol tage from the piezoresistive pressure sensor to a 1 6-Bit digital value, as well as providing a 16-Bit digital value for the temperature of the sensor.

  • measured pressure (16-Bit) “D1”
  • measured temperature (16-Bit) “D2” As the output voltage of a pressure sensor is stron gly dependent on temperature and process tolerances , it is necessary to compensate for these effects. This com pensation procedure must be performed by software u sing an external microcontroller. For both pressure and temperature measurement the same ADC is used (sigma delta converter):
  • for the pressure measurement, the differential out put voltage from the pressure sensor is converted
  • for the temperature measurement, the sensor bridge resistance is sensed and converted During both measurements the sensor will only be sw itched on for a very short time in order to reduce power consumption. As both, the bridge bias and the refer ence voltage for the ADC are derived from VDD, the digital output data is independent of the supply voltage. FACTORY CALIBRATION Each module is individually factory calibrated at t wo temperatures and two pressures. As a result, 6 c oefficients necessary to compensate for process variations and temperature variations are calculated and stored in the 64- Bit PROM of each module. These 64-Bit (partitioned into four words of 16-Bit) must be read by the microcontroller software and used in the program co nverting D1 and D2 into compensated pressure and temperature values. PRESSURE AND TEMPERATURE MEASUREMENT The sequence of reading pressure and temperature as well as of performing the software compensation is depicted in flow chart, Fig. 3 and Fig. 5. First WORD1 to WORD4 are read through the serial in terface. This can be done once after reset of the microcontroller that interfaces to the MS5536C. Next the compensation coefficients C1 to C6 are extracted using Bit-wise logical- and shift-operations (refer to Fig. 4 for the Bit-pattern of word 1 to word 4). For the pressure measurement, the microcontroller h as to read the 16-Bit values for pressure (D1) and temperature (D2) via the serial interface in a loop (for instance once every second). Then, the compen sated pressure is calculated out of D1, D2 and C1 to C6 a ccording to the algorithm in Fig. 3 (possibly using quadratic temperature compensation according to Fig. 5). All calculations can be performed with signed 16-Bit va riables. Results of multiplications may be up to 32-Bit long (+sign). In the flow according to Fig. 3 each mult iplication is followed by a division. This division can be perfor med by Bit-wise shifting (divisors are to the power of 2). It is ensured that the results of these divisions are less than 65536 (16-Bit). For the timing of signals to read out WORD1 to WORD 4, D1, and D2 please refer to the paragraph ‘Serial Interface’. Sensor Word1...4 Calculation in external micro- controller Pressure Temperature

DA5536C_002.doc August 25th, 2008 10 0005536C1245 ECN1126 System initialisation Pressure and temperature measurement Example: Word1, Word2, Word3 and Word4 (4x16 Bit) D1 = 15832 D2 = 28877 Start Convert calibration data into coefficients: (see bit pattern of Word1-Word4) Read calibration data (factory calibrated) from PROM of MS5536 Display pressure and temperature value Basic equations: Calculate temperature compensated pressure Difference between actual temperature and reference temperature: dT = D2 - UT1 Actual temperature: TEMP = 2000 + dT*(C6+262)/2 (weight: 0.01° C) Calculate actual temperature SENST1 OFFT1 TCS TCO T ref TEMPSENS C1: Pressure sensitivity (13 Bit) C2: Pressure offset (13 Bit) C3: Temperature coefficient of pressure sensitivity (9 Bit) C4: Temperature coefficient of pressure offset (9 B it) C5: Reference Temperature (12 Bit) C6: Temperature coefficient of the temperature (8 B it) Word1 = 45834 Word2 = 61787 Word3 = 49110 Word4 = 4060 C1 = 4054 C2 = 4060 C3 = 179 C4 = 241 C5 = 2826 C6 = 91 dT(D2) = D2 - T ref TEMP(D2)=20° +dT(D2)*TEMPSENS Offset at actual temperature: Sensitivity at actual temperature: X = (SENS * (D1-OFF))/2 Temperature compensated pressure: P = 2X (weight: 0.01mmHg) P = X*1365/2 9 (weight: 0.01mbar) OFF(D2)=OFFT1+TCO*dT(D2) SENS(D2)=SENST1+TCS*dT(D2) P(D1,D2)= SENS(D2)*(D1- OFF(D2)) dT = 2437 TEMP = 3680 = 36.80 ° C OFF = 14440 SENS = 14710 X = 4999 P = 9998 = 99.98 mmHg UT1= 26440 28877 Read digital pressure value from MS5536 D1 (16 Bit) Calculate calibration temperature UT1=4*C5+15136 Read digital temperature value from MS5536 D2 (16 Bit) Fig. 3: Flow chart for pressure/temperature reading and software compensation. NOTES 1) Readings of D2 can be done less frequently, but the display will be less stable in this case 2) For a stable display of 0.1 mm Hg resolution or below, it is recommended to display the average of at least 8 subsequent pressure values.

DA5536C_002.doc August 25th, 2008 11 0005536C1245 ECN1126 C3/II (8-Bit) C5/II(8-Bit) Word 1 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 C4/II (8-Bit) C6(8-Bit) Word 2 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 C5/I (4-Bit) C1/II (12-Bit) Word 3 DB11 DB10 DB9 DB8 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 C1/I C4/I C3/I C2 (13-Bit) Word 4 DB12 DB8 DB8 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Fig. 4: Arrangement (Bit-pattern) of calibration data in Word1 to Word4. SECOND-ORDER TEMPERATURE COMPENSATION In order to obtain full accuracy over the whole tem perature range, it is recommended to compensate for the non-linearity of the output of the temperature sens or. This can be achieved by the second-order temper ature calculation, i.e. by replacing the block ‘Calculate actual temperature’ in flow chart Fig. 3 by the fo llowing sequence: Calculate actual temperature Difference between the actual temperature and reference temperature: dT = (D2 - UT1) - ((D2-UT1)*(D2-UT1))/2 Actual temperature in ° C TEMP = 2000 + dT*(C6+262)/2 (weight: 0.01° C) Calculate actual temperature Difference between the actual temperature and reference temperature: dT = (D2 - UT1) - (9*(D2-UT1)*(D2-UT1))/2 Actual temperature in ° C TEMP = 2000 + dT*(C6+262)/2 (weight: 0.01° C) D2 ≥ UT1? no yes Fig. 5: Flow chart for calculating the temperature to the optimum accuracy. The value for dT thus obtained is then used for the calculation of the temperature compensated pressure as shown in Fig. 3.

DA5536C_002.doc August 25th, 2008 12 0005536C1245 ECN1126 SERIAL INTERFACE The MS5536C communicates with microprocessors and o ther digital systems via a 3-wire synchronous seria l interface as shown in Fig. 1. The SCLK (Serial Cloc k) signal initiates the communication and synchroni zes the data transfer with each Bit being sampled by the MS 5536C on the rising edge of SCLK and each Bit being sent by the MS5536C on the rising edge of SCLK. The data should thus be sampled by the microcontroller on t he falling edge of SCLK and sent to the MS5536C with t he falling edge of SCLK. The SCLK-signal is genera ted by the microprocessor’s system. The digital data provi ded by the MS5536C on the DOUT pin is either the conversion result or the software calibration data. In addition the signal DOUT (Data Out) is also use d to indicate the conversion status (conversion-ready signal, see below). The selection of the output data is done b y sending the corresponding instruction on the pin DIN (Data Input). Following is a list of possible output data instructions:

  • Conversion start for pressure measurement and ADC- data-out “D1” (Figure 6a)
  • Conversion start for temperature measurement and A DC-data-out “D2” (Figure 6b)
  • Calibration data read-out sequence for word 1 and word 3 (Figure 6c)
  • Calibration data read-out sequence for word 2 and word 4 (Figure 6d)
  • RESET sequence (Figure 6e) Every communication starts with an instruction sequ ence at Pin DIN. Fig. 6 shows the timing diagrams f or the MS5536C. The device does not need a ‘Chip select’ s ignal. Instead there is a Start Sequence (3-Bit hig h) before each Setup Sequence and Stop Sequence (3-Bit low) a fter each Setup Sequence. The Setup Sequence consists in 4-Bit that select a reading of pressure, tempera ture or calibration data. In case of pressure- (D1) or temperature- (D2) reading the module acknowledges t he start of a conversion by a low to high transitio n at Pin DOUT during the last Bit of the Stop Sequence. Two additional clocks at SCLK are required after th e acknowledge signal. Then SCLK is to be held low b y the microcontroller until a high to low transition on DOUT indicates the end of the conversion. This signal can be used to create an interrupt in t he microcontroller. The microcontroller may now rea d out the 16-Bit word by giving another 17 clocks on the SLCK pin. It is possible to interrupt the data read-out sequence with a hold of the SCLK signal. It is important to always read out the last conversion result before starting a new conversion. The RESET-sequence is special as its unique pattern is recognized by the module in any state. By conse quence it can be used to restart if synchronization betwee n the microcontroller and the MS5536C has been lost . This sequence is 21-Bit long. The DOUT signal might chan ge during that sequence (see Fig. 6e). It is recommended to send the RESET sequence before first conversion sequence to avoid hanging up the protocol permanent ly in case of electrical interference. sequence: START+P-measurement SCLK DOUT DIN Bit7 Conversion start for pressure measurement and ADC-data-out "D1": end of conversion Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 conversion (33ms) DB7 ADC-data out MSB ADC-data out LSB Bit8 Bit9 Start-bit Stop-bit DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 start of conversion Setup-bits Fig. 6a: D1 acquisition sequence

DA5536C_002.doc August 25th, 2008 13 0005536C1245 ECN1126 sequence: START+T-measurement SCLK DOUT DIN Bit7 Conversion start for temperature measurement and ADC-data-out "D2": end of conversion Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 conversion (33ms) Bit8 Bit9 Start-bit Stop-bit Setup-bits start of conversion DB7 ADC-data out MSB ADC-data out LSB DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Fig. 6b: D2 acquisition sequence sequence: coefficient read + address SCLK DOUT DIN Bit7 Calibration data read out sequence for word 1/ wor d 3: Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 DB7 coefficient-data out MSB coefficient-data out LSB Bit8 Bit9 Start-bit Stop-bit DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Bit10 Bit11 address word 1 address word 3 Setup-bits Fig. 6c: W1, W3 reading sequence address word 2 address word 4 sequence: coefficient read + address SCLK DOUT DIN Bit7 Calibration data read out sequence for word 2/ wor d 4: Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 DB7 coefficient-data out MSB coefficient-data out LSB Bit8 Bit9 Start-bit Stop-bit DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Bit10 Bit11 Setup-bits Fig. 6d: W2, W4 reading sequence sequence: RESET SCLK DOUT DIN Bit7 RESET - sequence: Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Bit8 Bit9 Bit10 Bit11Bit12 Bit13 Bit14 Bit15 Fig. 6e: Reset sequence (21-Bit)

DA5536C_002.doc August 25th, 2008 14 0005536C1245 ECN1126

APPLICATION INFORMATION

The MS5536C consists in a sensor die and a mixed signal interface IC on a single ceramic substrate with Pb-free leads attached. It is compatible with standard PCB- assembly technologies (Pick and Place followed by I R-reflow soldering). Single sided PCB layout is possible. Th e device directly interfaces to a standard microcon troller, no costly external components like Instrumentation Amp lifiers or A/D converters are required. A mark on t he ceramic substrate indicates pin 1 (see Fig. 2). The silicon pressure transducer, the IC and the bon ding wires are protected against humidity by a sili cone gel and against mechanical damage by a plastic cap. The cap is also used as the pressure port. The MS5536C does not show pressure hysteresis effects. The simple digital 3 wire synchronous serial interf ace eliminates all sensitive analogue signal lines on the PCB with their often critical routing and guarding issu es. The protocol does not require specific interfac e cells and can be implemented on any microcontroller using standar d I/Os. The required external clock-signal of 32.76 8 kHz is standard in the watch industry and readily available in most hand-held applications. The MS5536C is well suited for battery powered port able devices. This is due to the low supply voltage of 2.2V and the small amount of computing power required to calculate the compensated values for pressure and temperature (use of 4-Bit microcontrollers is possi ble). No costly end-of-line calibrations are requir ed as the MS5536C contains factory stored calibration coefficients. In order to further enhance accuracy it is recommen ded to periodically recalibrate the device offset i n the application software. This can be achieved by readi ng the compensated pressure in a known state, prefe rably at ∆ p=0 (e.g. Blood Pressure Meters with vent open). Th e detected difference between displayed and actual pressure can be memorized and subtracted from following readings. The pressure range and port configurations make the MS5536C well suited for applications like blood-pr essure metering, air flow and pressure measurements in HVAC-systems and liquid level detection. 4/8bit-Microcontroller LCD-Display EEPROM Keypad MS5536 SCLK DIN DOUT MCLK XTAL1 XTAL2 32.768 kHz optional VDD GND VDD GND 3V-Battery 47µF Tantal Fig. 7: Application example of the MS5536C for a battery powered device

DA5536C_002.doc August 25th, 2008 15 0005536C1245 ECN1126 DEVICE PACKAGE OUTLINES Fig. 8: Device package outlines of MS5536-CPJU / MS5536-CNJU PAD LAYOUT FOR MS5536-C All dimension in mm [inch] Fig. 9: recommended pad-layout for MS5536-CPJU / MS5536-CNJU All dimension in mm 10.8 [0.425] 1.3 [0.051] 0.7 [0.028] 1.27 [0.050]

DA5536C_002.doc August 25th, 2008 16 0005536C1245 ECN1126 ASSEMBLY DECOUPLING CAPACITOR Particular care must be taken when connecting the device to power supply. A 47 µ F tantalum capacitor must be placed as close as possible of the MS5536C's VDD pin. This capacitor will stabilise the power supply during data conversion and thus, provide the highest possible accuracy. SOLDERING Please refer to the application note AN808 for all soldering issues. MOUNTING The MS5536C can be placed with automatic Pick&Place equipment using a special vacuum nozzle. It will not be damaged by the vacuum. For a good mechanical stability, it is important to solder all contact pads. The Pins PEN and PV must be left open or connected to Vdd. Do not connect to GND! LIGHT SENSITIVITY The MS5536C is protected against sunlight by the cap on frontside. It is, however, important to note that the sensor may still be slightly sensitive to sunlight, especially to infrared light sources (Lig ht may also enter the negative pressure port on backside). This is due to the strong photo effect o f silicon. As the effect is reversible there will be no damage, but the user has to take care that in the final product the sensor cannot be exposed to direc t light during operation. This can be achieved for instance by placing mechanical parts with holes in such that light cannot pass. CONNECTING THE PRESSURE PORT The best connection to the pressure port is achieved with a flexible tube fitted to the full le ngth of the nozzle. Care should be taken to keep the nozzle clean. The tube should be flexible enough to minimize the mechanical stress on the module (see Fig. 10) Fig. 10: connection to pressure port CLEANING The MS5536C has been manufactured under cleanroom conditions. It is therefore recommended to assemble the sensor under class 10’000 or better conditions. Should this not be possible, it is recommended to protect the sensor opening during assembly from entering particles and dust. To avoid cleaning of the PCB, solder paste of type ‘No-Clean’ shall be used. CLEANING MIGHT DAMAGE THE SENSOR! ESD PRECAUTIONS The electrical contact pads are protected against E SD according to 4 kV HBM (human body model). It is therefore essential to ground machines and personal properly during assembly and handling of the devic e. The MS5536C is shipped in antistatic transport boxes. A ny test adapters or production transport boxes used during the assembly of the sensor shall be of an equivalent antistatic material.

DA5536C_002.doc August 25th, 2008 17 0005536C1245 ECN1126

ORDERING INFORMATION

Product Code Product Art.-Nr. Package Comments MS5536-CPJU SMD Gage Pressure Module RoHS 325536008 Gage with plastic cap, upright nozzle, vent hole on backside, J-Lead type Pressure Range (port1 – port2): -400 mbar …+1000 mbar MS5536-CNJU SMD Gage Pressure Module RoHS 325536009 Gage with plastic cap, upright nozzle, vent hole on backside, J-Lead type Pressure Range (port1 – port2): -1000 mbar …+400 mbar FACTORY CONTACTS Intersema Sensoric SA Ch. Chapons-des-Prés 11 CH-2022 BEVAIX SWITZERLAND Tel. (032) 847 9550 Tel. Int. +41 32 847 9550 Telefax +41 32 847 9569 e-mail: http://www.intersema.ch NOTICE Intersema reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Intersema assumes no responsibility for the use of any circu its shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustrati on only and Intersema makes no claim or warranty that such applications will be suitable for the use specified without further testing or m odification.