MS5561-C INTERSEMA | Alldatasheet

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DA5561_03 January 5, 2009 1 000055611126 – ECN1158 MS5561-C MICRO ALTIMETER

  • 10 - 1100 mbar / 1 – 110 kPa absolute pressure rang e
  • High accuracy temperature measurement
  • Integrated miniature pressure sensor module 4.75 mm x 4.25 mm
  • Thin design of 1.6 mm
  • Piezo-resistive silicon micro-machined sensor
  • 6 coefficients for software compensation stored on- chip
  • 16 bit ADC, sigma delta converter
  • 3-wire serial interface
  • 1 system clock line (32.768 kHz)
  • Low voltage and low power consumption
  • RoHS-compatible & Pb-free *

DESCRIPTION

The MS5561 is a SMD-hybrid device including a precision piezo-resistive pressure sensor and an ADC-Interface IC. It uses a three-wire serial interface for communication. The module dimensions of 4.75 mm x 4.25 mm and a height of only 1.6 mm allows for up-to-date SMD design. It provides a 16 bit data word from a pressure and temperature dependent voltage. The MS5561 is a low power, low voltage device with automatic power down (ON/OFF) switching. A 3-wire interface is used for all communications with a micro-controller. FEATURES APPLICATIONS

  • Pressure resolution 0.1 mbar
  • Operating temperature -40° C to +85° C
  • Supply voltage 2.2 V to 3.6 V
  • Low supply current, typ. 4 µA Standby current < 0.1 µA
  • Calibrated temperature and pressure sensor for 2nd order compensation
  • ESD protected, HBM 4 kV
  • Mobile phones
  • GPS receivers
  • Altimeter applications
  • Personal Navigation Devices (PND)
  • Digital cameras with altimeter function BLOCK DIAGRAM VDD GND MCLK SCLK DOUT DIN Input MUX ADC Digital Interface Memory (PROM) 64 bits SENSOR SGND +IN -IN dig. Filter Sensor Interface IC Fig. 1: Block diagram MS5561 * The European RoHS directive 2002/95/EC (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment) b ans the use of lead, mercury, cadmium, hexavalent chrom ium and polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE).

DA5561_03 January 5, 2009 2 000055611126 – ECN1158 PIN CONFIGURATION Fig. 2: Pin configuration of MS5561 Pin Name Pin Type Function SCLK 1 I Serial data clock GND 2 G Ground PV (1) 3 N Negative programming voltage PEN (1) 4 I Programming enable VDD 5 P Positive supply voltage MCLK 6 I Master clock (32.768 kHz) DIN 7 I Serial data input DOUT 8 O Serial data output NOTE 1) Pin 3 (PV) and PIN 4 (PEN) are only used by the manufacturer for calibration purposes and should not be connected. ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Min Max Unit Notes Supply voltage VDD Ta = 25 ° C -0.3 4 V Storage temperature T S -40 +85 ° C 1 Overpressure P Ta = 25 ° C 10 bar NOTE 1) Storage and operation in an environment of dry a nd non-corrosive gases.

DA5561_03 January 5, 2009 3 000055611126 – ECN1158 RECOMMENDED OPERATING CONDITIONS (Ta = 25° C, VDD = 3.0 V unless noted otherwise) Parameter Symbol Conditions Min. Typ Max Unit Operating pressure range p 10 1100 mbar abs. Supply voltage VDD 2.2 3.0 3.6 V Supply current, average (1) during conversion (2) standby (no conversion) I avg Isc Iss VDD = 3.0 V 0.1 µ A mA µ A Current consumption into MCLK (3) MCLK = 32.768 kHz 0.5 µ A Operating temperature range T -40 +25 +85 ° C Conversion time t conv MCLK = 32.768 kHz 35 ms External clock signal (4) MCLK 30.000 32.768 35.00 0 kHz Duty cycle of MCLK 40/60 50/50 60/40 % Serial data clock SCLK 500 kHz NOTES 1) Under the assumption of one conversion every sec ond. Conversion means either a pressure or a temperature measurement started by a command to the serial interface of MS5561. 2) During conversion the sensor will be switched on and off in order to reduce power consumption; the total on time within a conversion is about 2 ms. 3) This value can be reduced by switching off MCLK while MS5561 is in standby mode. 4) It is strongly recommended that a crystal oscill ator be used because the device is sensitive to clock jitter. A square-wave form of the clock signal is a must.

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ELECTRICAL CHARACTERISTICS

Parameter Symbol Conditions Min Typ Max Unit Input High Voltage V IH 80% VDD 100% VDD V Input Low Voltage V IL 0% VDD 20% VDD V Signal Rise Time t r 200 ns Signal Fall Time t f 200 ns DIGITAL OUTPUTS Parameter Symbol Conditions Min Typ Max Unit Output High Voltage V OH I source = 0.6 mA 80% VDD 100% VDD V Output Low Voltage V OL I sink = 0.6 mA 0% VDD 20% VDD V Signal Rise Time t r 200 ns Signal Fall Time t f 200 ns AD-CONVERTER Parameter Symbol Conditions Min Typ Max Unit Resolution 16 bit Linear Range 4’000 40’000 LSB Conversion Time MCLK = 32.768 kHz 35 ms INL Within linear range -5 +5 LSB

DA5561_03 January 5, 2009 5 000055611126 – ECN1158 PRESSURE OUTPUT CHARACTERISTICS With the calibration data stored in the interface IC of the MS5561, the following characteristics can be achieved: (VDD = 3.0 V unless noted otherwise) Parameter Conditions Min Typ Max Unit Notes Resolution p = 300 .. 1000 mbar Ta = 25° C 0.1 mbar 1 Absolute Pressure Accuracy p = 750 .. 1100 mbar Ta = 25° C -1.5 +1.5 mbar 2 Relative Pressure Accuracy p = 750 .. 1100 mbar Ta = 25° C -0.5 +0.5 mbar 3 T = 0 .. +50° C p = 300 .. 1000 mbar -1 +1 mbar 4 Relative Pressure Error over Temperature T = -40 .. +85° C p = 300 .. 1000 mbar -2 +3 mbar 4 Long-term Stability 12 months -1 mbar 5 Maximum Error over Supply Voltage VDD = 2.2 .. 3.6 V p = const. -1.6 +1.6 mbar NOTES 1) A stable pressure reading of the given resolutio n requires taking the average of 2 to 4 subsequent pressure values due to noise of the ADC. 2) Maximum error of pressure reading over the press ure range. 3) Maximum error of pressure reading over the press ure range after offset adjustment at one pressure point. 4) With the second-order temperature compensation a s described in Section “FUNCTION". See next section for typical operating curves. 5) The long-term stability is measured with non-sol dered devices. TEMPERATURE OUTPUT CHARACTERISTICS This temperature information is not required for most applications, but it is necessary to allow for temperature compensation of the pressure output. (VDD = 3.0 V unless noted otherwise) Parameter Conditions Min Typ Max Unit Notes Resolution 0.005 0.01 0.015 ° C T = 20° C -0.8 0.8 ° C Accuracy Maximum Error over Supply NOTES 1) With the second-order temperature compensation a s described in Section “FUNCTION". See next section for typical operating curves. 2) At Ta = 25 ° C

DA5561_03 January 5, 2009 6 000055611126 – ECN1158 TYPICAL PERFORMANCE CURVES Absolute Pressure Accuracy after Calibration, 2nd order compensation 0 100 200 300 400 500 600 700 800 900 1000 1100 Pressure (mbar) Pressure error (mbar) 85° C 60° C 25° C 0° C -40° C ADC-value D2 vs Temperature (typical) 15000 20000 25000 30000 35000 40000 -40 -20 0 20 40 60 80 Temperature (° C) ADC-value D2 (LSB) ADC-value D1 vs Pressure (typical) 6000 8000 10000 12000 14000 16000 18000 20000 22000 0 100 200 300 400 500 600 700 800 900 1000 1100 Pressure (mbar) ADC-value D1 (LSB) -40° C 25° C 85° C

DA5561_03 January 5, 2009 7 000055611126 – ECN1158 Temperature Error Accuracy vs temperature (typical) -40 -20 0 20 40 60 80 Temperature (° C) Temperature error (° C) Temperature error (standard calculation) Temperature error (with 2nd order calculation) Pressure Error Accuracy vs temperature (typical) -40 -20 0 20 40 60 80 Temperature (° C) Pressure error (mbar) Perror(1000,1st order) Perror(1000,2nd order) Perror(800,1st order) Perror(800,2nd order) Perror(300,1st order) Perror(300,2nd order)

DA5561_03 January 5, 2009 8 000055611126 – ECN1158 Pressure error vs supply voltage (typical) -0.8 -0.6 -0.4 -0.2 0.2 0.4 0.6 0.8 Voltage (V) Pressure error (mbar) 1000mbar 800mbar 300mbar Temperature error vs supply voltage (typical) -0.15 -0.1 -0.05 0.05 0.1 0.15 Voltage (V) Temperature error (° C)

DA5561_03 January 5, 2009 9 000055611126 – ECN1158 FUNCTION GENERAL The MS5561 consists of a piezo-resistive sensor and a sensor interface IC. The main function of the MS5561 is to convert the uncompensated analogue output voltage from the piezo-resistive pressure sensor to a 16-bit digital value, as well as providing a 16-bit digital value for the temperature of the sensor. Measured pressure (16-bit) “D1” Measured temperature (16-bit) “D2” As the output voltage of a pressure sensor is strongly dependent on temperature and process tolerances, it is necessary to compensate for these effects. This compensation procedure must be performed by software using an external microcontroller. For both pressure and temperature measurement the same ADC is used (sigma delta converter):

  • for the pressure measurement, the differential out put voltage from the pressure sensor is converted
  • for the temperature measurement, the sensor bridge resistor is sensed and converted During both measurements the sensor will only be switched on for a very short time in order to reduce power consumption. As both, the bridge bias and the reference voltage for the ADC are derived from VDD, the digital output data is independent of the supply voltage. FACTORY CALIBRATION Every module is individually factory calibrated at two temperatures and two pressures. As a result, 6 coefficients necessary to compensate for process variations and temperature variations are calculated and stored in the 64- bit PROM of each module. These 64-bit (partitioned into four words of 16-bit) must be read by the microcontroller software and used in the program converting D1 and D2 into compensated pressure and temperature values. PRESSURE AND TEMPERATURE MEASUREMENT The sequence of reading pressure and temperature as well as of performing the software compensation is depicted in Fig. 3 and Fig. 5. First Word1 to Word4 have to be read through the serial interface. This can be done once after reset of the microcontroller that interfaces to the MS5561. Next, the compensation coefficients C1 to C6 are extracted using bit-wise logical- and shift-operations (refer to Fig. 4 for the bit-pattern of Word1 to Word4). For the pressure measurement, the microcontroller has to read the 16-bit values for pressure (D1) and temperature (D2) via the serial interface in a loop (for instance every second). Then, the compensated pressure is calculated out of D1, D2 and C1 to C6 according to the algorithm in Fig. 3 (possibly using quadratic temperature compensation according to Fig. 5). All calculations can be performed with signed 16-bit variables. Results of multiplications may be up to 32-bit long (+sign). In the flow according to Fig. 3 a division follows each multiplication. This division can be performed by bit-wise shifting (divisors are to the power of 2). It is ensured that the results of these divisions are less than 65536 (16 bit). For the timing of signals to read out Word1 to Word 4, D1, and D2 please refer to the paragraph “Serial Interface”. Sensor Word1..4 Calculation in external micro- controller Pressure Temperature

DA5561_03 January 5, 2009 10 000055611126 – ECN1158 System initialisation Pressure and temperature measurement Example: Word1, Word2, Word3 and Word4 (4x16 Bit) D1 = 16460 D2 = 27856 Start Convert calibration data into coefficients: (see bit pattern of Word1-Word4) Read calibration data (factory calibrated) from PROM of MS5561 Read digital pressure value from MS5561 D1 (16 Bit) Read digital temperature value from MS5561 Display pressure and temperature value Basic equations: Calculate calibration temperature UT1 = 8*C5+20224 Calculate temperature compensated pressure Difference between actual temperature and reference temperature: dT = D2 - UT1 Actual temperature: TEMP = 200 + dT*(C6+50)/2 (0.1° C resolution) Calculate actual temperature D2 (16 Bit) SENST1 OFFT1 TCS TCO T ref TEMPSENS C1: Pressure sensitivity (15 Bit) C2: Pressure offset (12 Bit) C3: Temperature coefficient of pressure sensitivity (10 Bit) C4: Temperature coefficient of pressure offset (10 Bit) C5: Reference Temperature (11 Bit) C6: Temperature coefficient of the temperature (6 B it) Word1 = 46940 Word2 = 40217 Word3 = 25172 Word4 = 47212 C1 = 23470 C2 = 1324 C3 = 737 C4 = 393 C5 = 628 C6 = 25 dT(D2) = D2 - T ref TEMP(D2) = 20° +dT(D2)*TEMPSENS Offset at actual temperature: Sensitivity at actual temperature: SENS = C1 + (C3*dT)/2 10 + 24576 X = (SENS * (D1-7168))/2 - OFF Temperature compensated pressure: P = X*10/2 5 + 250*10 (0.1 mbar resolution) OFF(D2) = OFFT1+TCO*dT(D2) SENS(D2) = SENST1+TCS*dT(D2) P(D1,D2) = D1*SENS(D2)-OFF(D2) dT = 2608 TEMP = 391 = 39.1 ° C OFF = 5220 SENS = 49923 X = 23093 P = 9716 = 971.6 mbar UT1 = 25248 Fig. 3: Flow chart for pressure and temperature reading and software compensation. NOTES 1) Readings of D2 can be done less frequently, but the display will be less stable in this case. 2) For a stable display of 0.1 mbar resolution, it is recommended to display the average of 8 subsequent pressure values.

DA5561_03 January 5, 2009 11 000055611126 – ECN1158 C1 (15 bit) C5/I 1 bit Word1 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB10 C5/II (10 bit) C6 (6 bit) Word2 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB5 D B4 DB3 DB2 DB1 DB0 C4 (10 bit) C2/I (6 bit) Word3 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB11 DB10 DB9 DB8 DB7 DB6 C3 (10 bit) C2/II (6 bit) Word4 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB5 D B4 DB3 DB2 DB1 DB0 Fig. 4: Arrangement (bit pattern) of calibration data in Word1 to Word4. SECOND-ORDER TEMPERATURE COMPENSATION In order to obtain best accuracy over the whole temperature range, it is recommended to compensate for the non-linearity of the output of the temperature sensor. This can be achieved by correcting the calculated temperature and pressure by a second order correction factor. The second-order factors are calculated as follows: No correction T2 = 0 P2 = 0 High temperatures P2 = T2 * (P - 10000)/2 13 TEMP < 200 yes Calculate pressure and temperature TEMP = TEMP – T2 P = P – P2 Low temperatures P2 = 3 *T2 * (P - 3500)/2 14 TEMP > 450 yes 200 ≤ TEMP ≤ 450 yes Fig. 5: Flow chart for calculating the temperature and pressure to the optimum accuracy.

DA5561_03 January 5, 2009 12 000055611126 – ECN1158 SERIAL INTERFACE The MS5561 communicates with microprocessors and other digital systems via a 3-wire synchronous serial interface as shown in Fig. 1. The SCLK (Serial clock) signal initiates the communication and synchronizes the data transfer with each bit being sampled by the MS5561 on the rising edge of SCLK and each bit being sent by the MS5561 on the rising edge of SCLK. The data should thus be sampled by the microcontroller on the falling edge of SCLK and sent to the MS5561 with the falling edge of SCLK. The SCLK-signal is generated by the microprocessor’s system. The digital data provided by the MS5561 on the DOUT pin is either the conversion result or the software calibration data. In addition, the signal DOUT (Data out) is also used to indicate the conversion status (conversion-ready signal, see below). The selection of the output data is done by sending the corresponding instruction on the pin DIN (Data input). Following is a list of possible output data instructions: Conversion start for pressure measurement and ADC-data-out “D1” (Figure 6a) Conversion start for temperature measurement and ADC-data-out “D2” (Figure 6b) Calibration data read-out sequence for Word1 ( Figure 6c) Calibration data read-out sequence for Word2 ( Figure 6d) Calibration data read-out sequence for Word3 (F igure 6c) Calibration data read-out sequence for Word4 (F igure 6d) RESET sequence (Figure 6e) Every communication starts with an instruction sequence at pin DIN. Fig. 6 shows the timing diagrams for the MS5561. The device does not need a ‘Chip select’ signal. Instead, there is a START sequence (3-bit high) before each SETUP sequence and STOP sequence (3-bit low) after each SETUP sequence. The SETUP sequence consists in 4-bit that select a reading of pressure, temperature or calibration data. In case of pressure- (D1) or temperature- (D2) reading the module acknowledges the start of a conversion by a low to high transition at pin DOUT during the last bit of the STOP sequence. Two additional clocks at SCLK are required after the acknowledge signal. Then SCLK is to be held low by the microcontroller until a high to low transition on DOUT indicates the end of the conversion. This signal can be used to create an interrupt in the microcontroller. The microcontroller may now read out the 16 bit word by giving another 17 clocks on the SLCK pin. It is possible to interrupt the data READOUT sequence with a hold of the SCLK signal. It is important to always read out the last conversion result before starting a new conversion. The RESET sequence is special as the module in any state recognizes its unique pattern. By consequence, it can be used to restart if synchronization between the microcontroller and the MS5561 has been lost. This sequence is 21-bit long. The DOUT signal might change during that sequence (see Fig. 6e). It is recommended to send the RESET sequence before each CONVERSION sequence to avoid hanging up the protocol permanently in case of electrical interference. sequence: START+P-measurement SCLK DOUT DIN Bit7 Conversion start for pressure measurement and ADC-data-out "D1": end of conversion Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 conversion (33ms) DB7 ADC-data out MSB ADC-data out LSB Bit8 Bit9 Start-bit Stop-bit DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 start of conversion Setup-bits Fig. 6a: D1 ACQUISITION sequence.

DA5561_03 January 5, 2009 13 000055611126 – ECN1158 sequence: START+T-measurement SCLK DOUT DIN Bit7 Conversion start for temperature measurement and ADC-data-out "D2": end of conversion Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 conversion (33ms) Bit8 Bit9 Start-bit Stop-bit Setup-bits start of conversion DB7 ADC-data out MSB ADC-data out LSB DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Fig. 6b: D2 ACQUISITION sequence. sequence: coefficient read + address SCLK DOUT DIN Bit7 Calibration data read out sequence for word 1/ wor d 3: Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 DB7 coefficient-data out MSB coefficient-data out LSB Bit8 Bit9 Start-bit Stop-bit DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Bit10 Bit11 address word 1 address word 3 Setup-bits Fig. 6c: Word1, Word3 READING sequence. address word 2 address word 4 sequence: coefficient read + address SCLK DOUT DIN Bit7 Calibration data read out sequence for word 2/ wor d 4: Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 DB7 coefficient-data out MSB coefficient-data out LSB Bit8 Bit9 Start-bit Stop-bit DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Bit10 Bit11 Setup-bits Fig. 6d: W2, W4 READING sequence. sequence: RESET SCLK DOUT DIN Bit7 RESET - sequence: Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Bit8 Bit9 Bit10 Bit11Bit12 Bit13 Bit14 Bit15 Bit16 Bit17 Bit18 Bit19 Bit20 Fig. 6e: RESET sequence (21 bit).

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APPLICATION INFORMATION

The advantage of combining a pressure sensor with a directly adapted integrated circuit is to save other external components and to achieve very low power consumption. The main application field for this system includes portable devices with battery supply, but its high accuracy and resolution make it also suited for industrial and automotive applications. The possibility to compensate the sensor by software allows the user to adapt it to his particular application. Communication between the MS5561 and the widely available microcontrollers is realized over an easy-to-use 3-wire serial interface. Customers may select which microcontroller system to be used, and there are no specific standard interface cells required, which may be of interest for specially designed 4 bit- microcontroller applications. For communication via SPI interface please refer to application note AN510 that may be downloaded from the Intersema website. CALIBRATION The MS5561 is factory calibrated. The calibration data is stored inside the 64 bit PROM memory. SOLDERING Please refer to the application note AN808 for all soldering issues. HUMIDITY, WATER PROTECTION This module is designed for the integration into portable devices and sufficiently protected against humidity. A silicone gel for enhanced protection against humidity covers the membrane of the pressure transducer. The module must not be used for under water applications. LIGHT SENSITIVITY The MS5561 is protected against sunlight by its metal cap. It is, however, important to note that the sensor may still be slightly sensitive to sunlight, especially to infrared light sources. This is due to the strong photo effect of silicon. As the effect is reversible there will be no damage, but the user has to take care that in the final product the sensor cannot be exposed to direct light during operation. DECOUPLING CAPACITOR Particular care must be taken when connecting the device to power supply. A 47 µ F tantalum capacitor must be placed as close as possible of the MS5561's VDD pin. This capacitor will stabilize the power supply during data conversion and thus, provide the highest possible accuracy.

DA5561_03 January 5, 2009 15 000055611126 – ECN1158 APPLICATION EXAMPLE: ALTIMETER SYSTEM USING MS5561 MS5561 can be used in connection with a microcontroller in mobile altimeter applications. It is designed for low- voltage systems with a supply voltage of 3 V, particularly in battery applications. The MS5561 is optimized for low current consumption as the AD-converter clock (MCLK) can use the 32.768 kHz frequency of a standard watch crystal, which is supplied in most portable watch systems. For applications in altimeter systems Intersema can deliver a simple formula to calculate the altitude, based on a linear interpolation, where the number of interpolation points influences the accuracy of the formula. Figure 7: Demonstration of MS5561 in a mobile altimeter. RECOMMENDED PAD LAYOUT Pad layout for bottom side of MS5561 soldered onto printed circuit board. Microcontroller LCD-Display EEPROM Keypad MS5561 SCLK DIN DOUT MCLK XTAL1 XTAL2 32.768 kHz optional VDD GND VDD GND 3V-Battery 47uF Tantal

DA5561_03 January 5, 2009 16 000055611126 – ECN1158 DEVICE PACKAGE OUTLINES Fig. 8: Device package outlines of MS5561.

DA5561_03 January 5, 2009 17 000055611126 – ECN1158 ASSEMBLY MOUNTING The MS5561 can be placed with automatic Pick&Place equipment using vacuum nozzles. It will not be damaged by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects. It is important to solder all contact pads to avoid floating of the sensor during soldering. The pins PEN and PV shall be left open or connected to VDD. Do not connect the pins PEN and PV to GND! CLEANING The MS5561 has been manufactured under cleanroom conditions. Each device has been inspected for the homogeneity and the cleanness of the silicone gel. It is therefore recommended to assemble the sensor under class 10’000 or better conditions. Should this not be possible, it is recommended to protect the sensor opening during assembly from entering particles and dust. To avoid cleaning of the PCB, solder paste of type “no-clean” shall be used. Cleaning might damage the sensor! ESD PRECAUTIONS The electrical contacts except programming pads are protected against ESD up to 4 kV HBM (human body model). The MS5561 is shipped in antistatic transport boxes. Any test adapters or production transport boxes used during the assembly of the sensor shall be of an equivalent antistatic material.

DA5561_03 January 5, 2009 18 000055611126 – ECN1158 SHIPPING PACKAGE TAPE Units per reel 4’000 Minimum empty leader (right side of drawing) 250 mm Tape widths 12 mm Tape material Black Conductive Polystyrene Reel diameter 13” / 330 mm Minimum empty trailer (left side of drawing, direction of unreeling) 250 mm Fig. 9: Outline of tape for MS5561. Fig. 10: Outline of reel for MS5561.

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ORDERING INFORMATION

Code Product Art.-Nr. Package Comments MS5561-C Micro Altimeter 325561000 Small Size SMD w ith metal lid Module height 1.6 mm FACTORY CONTACTS Intersema Sensoric SA Ch. Chapons-des-Prés 11 CH-2022 Bevaix Switzerland Tel. 032 847 9550 Tel. Int. +41 32 847 9550 Telefax +41 32 847 9569 e-mail: http://www.intersema.ch NOTICE THIS ADVANCE INFORMATION IS STILL UNDERGOING CONTINOUS CHANGES. Intersema reserves the right to make changes to the products contained in this data sheet. Intersema a ssumes no responsibility for the use of any circuits shown in this data sheet, conveys n o license under any patent or other rights unless o therwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices s hown in this data sheet are for illustration only and Intersema makes no claim or w arranty that such applications will be suitable for the use specified without further testing or modification.