MS5534-CM

MS5534C INTERSEMA | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 21

Technical content

DA5534C_003.doc June 16th, 2008 1 0005534C1175 ECN1118 MS5534C (RoHS *) BAROMETER MODULE

• 10 - 1100 mbar absolute pressure range
• 6 coefficients for software compensation stored on-chip
• Piezoresistive silicon micromachined sensor
• Integrated miniature pressure sensor 9 x 9 mm
• 16 Bit ADC
• 3-wire serial interface
• 1 system clock line (32.768 kHz)
• Low voltage and low power consumption
• RoHS-compatible & Pb-free

DESCRIPTION

The MS5534C is a SMD-hybrid device including a piez oresistive pressure sensor and an ADC-Interface IC. It provides a 16 Bit data word from a pressure and tem perature dependent voltage. Additionally the module contains 6 readable coefficients for a highly accur ate software calibration of the sensor. MS5534C is a low power, low voltage device with automatic power down (ON/OFF) switching. A 3-wire interface is used for all communications with a microcontroller. The MS5534C is fully software compatible to the pre vious versions (MS5534A and MS5534B). Compared to t he previous versions the ESD sensitivity level has been improved to 4kV on all pins. FEATURES APPLICATIONS

• Supply voltage 2.2 V to 3.6 V • Mobile altimeter / barometer systems
• Low supply current • Weather control systems
• -40° C to +125° C operation temperature • Adventure or multi-mode watches
• No external components required • GPS receivers BLOCK DIAGRAM VDD GND MCLK SCLK DOUT DIN Input MUX ADC Digital Interface Memory (PROM) 64 bits SENSOR SGND +IN -IN dig. Filter Sensor Interface IC Fig. 1: Block diagram MS5534C. * The European RoHS directive 2002/95/EC (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment) bans the use of lead, mercury, cadmium, hexavalent chromium and polybrominated biphenyls (PBB) or poly brominated diphenyl ethers (PBDE).

DA5534C_003.doc June 16th, 2008 2 0005534C1175 ECN1118 PIN CONFIGURATION Fig. 2: Pin configuration of MS5534CM. Pin Name Pin Type Function GND 1 G Ground SCLK 2 I Serial data clock DOUT 3 O Data output DIN 4 I Data input MCLK 5 I Master clock (32.768 kHz) VDD 6 P Positive supply voltage PEN (1) 7 I Programming enable PV (1) 8 N Negative programming voltage NOTES 1) Pin 7 (PEN) and PIN 8 (PV) are only used by the manufacturer for calibration purposes and should no t be connected. ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Min Max Unit Notes Supply voltage VDD Ta = 25 o C -0.3 4 V Storage temperature T S -40 +125 oC 1 MS5534-CP, Ta = 25 o C 5 bar Overpressure P MS5534-CM, Ta = 25 o C 10 bar 2 NOTES 1) Storage and operation in an environment of dry a nd non-corrosive gases. 2) The MS5534CM is qualified referring to the ISO S tandard 2281 and can withstand an absolute pressure of 11 bar in salt water or 100 m water respectively.

DA5534C_003.doc June 16th, 2008 3 0005534C1175 ECN1118 RECOMMENDED OPERATING CONDITIONS (Ta = 25° C, VDD = 3.0 V unless noted otherwise) Parameter Symbol Conditions Min. Typ. Max Unit Operating pressure range p 10 1100 mbar abs. Supply voltage VDD 2.2 3.0 3.6 V Supply current, average (1) during conversion (2) standby (no conversion) I avg Isc Iss VDD = 3.0 V 0.1 µ A mA µ A Current consumption into MCLK (3) MCLK = 32.768 kHz 0.5 µ A Operating temperature range T -40 +125 ° C Conversion time t conv MCLK = 32.768 kHz 35 ms External clock signal (4) MCLK 30.000 32.768 35.00 0 kHz Duty cycle of MCLK 40/60 50/50 60/40 % Serial data clock SCLK 500 kHz NOTES 1) Under the assumption of one conversion every sec ond. Conversion means either a pressure or a temperature measurement started by a command to the serial interface of MS5534C. 2) During conversion the sensor will be switched on and off in order to reduce power consumption; the total on time within a conversion is about 2 ms. 3) This value can be reduced by switching off MCLK while MS5534C is in standby mode. 4) It is strongly recommended that a crystal oscill ator be used because the device is sensitive to clo ck jitter. A square-wave form of the clock signal is a must.

DA5534C_003.doc June 16th, 2008 4 0005534C1175 ECN1118

ELECTRICAL CHARACTERISTICS

Parameter Symbol Conditions Min Typ Max Unit Input High Voltage V IH 80% VDD 100% VDD V Input Low Voltage V IL 0% VDD 20% VDD V Signal Rise Time t r 200 ns Signal Fall Time t f 200 ns DIGITAL OUTPUTS Parameter Symbol Conditions Min Typ Max Unit Output High Voltage V OH I source = 0.6 mA 80% VDD 100% VDD V Output Low Voltage V OL I sink = 0.6 mA 0% VDD 20% VDD V Signal Rise Time t r 200 ns Signal Fall Time t f 200 ns AD-CONVERTER Parameter Symbol Conditions Min Typ Max Unit Resolution 16 Bit Linear Range 4000 40000 LSB Conversion Time MCLK = 32.768 kHz 35 ms INL Within linear range -5 +5 LSB

DA5534C_003.doc June 16th, 2008 5 0005534C1175 ECN1118 PRESSURE OUTPUT CHARACTERISTICS With the calibration data stored in the interface IC of the MS5534C the following characteristics can be achieved: (VDD = 3.0 V unless noted otherwise) Parameter Conditions Min Typ Max Unit Notes Resolution 0.1 mbar 1 Absolute Pressure Accuracy p = 750 .. 1100 mbar Ta = 25° C -1.5 +1.5 mbar 2 Relative Pressure Accuracy p = 750 .. 1100 mbar Ta = 25° C -0.5 +0.5 mbar 3 T = 0 .. +85° C p = 300 .. 1000 mbar -2 +2 mbar 4 Relative Pressure Error over Temperature T = -40 .. +125° C p = 300 .. 1000 mbar -8 +5 mbar 4 Long-term Stability 12 months -1 mbar 5 Maximum Error over Supply Voltage VDD = 2.2 .. 3.6 V p = const. -1.6 +1.6 mbar NOTES 1) A stable pressure reading of the given resolutio n requires taking the average of 2 to 4 subsequent pressure values due to noise of the ADC. 2) Maximum error of pressure reading over the press ure range. 3) Maximum error of pressure reading over the press ure range after offset adjustment at one pressure point. 4) With the second-order temperature compensation a s described in Section “FUNCTION". See next section for typical operating curves. 5) The long-term stability is measured with non-sol dered devices. TEMPERATURE OUTPUT CHARACTERISTICS This temperature information is not required for most applications, but it is necessary to allow for temperature compensation of the pressure output. (VDD = 3.0 V unless noted otherwise) Parameter Conditions Min Typ Max Unit Notes Resolution 0.005 0.01 0.015 ° C T = -20 .. +85° C -2 +2 ° C 1 Accuracy Maximum Error over Supply NOTES 1) With the second-order temperature compensation a s described in Section “FUNCTION". See next section for typical operating curves. 2) At Ta = 25 ° C

DA5534C_003.doc June 16th, 2008 6 0005534C1175 ECN1118 TYPICAL PERFORMANCE CURVES ADC-value D1 vs Pressure (typical) 6000 8000 10000 12000 14000 16000 18000 20000 22000 0 100 200 300 400 500 600 700 800 900 1000 1100 Pressure (mbar) ADC-value D1 (LSB) -40° C 25° C 125° C ADC-value D2 vs Temperature (typical) 15000 20000 25000 30000 35000 40000 45000 -40 -20 0 20 40 60 80 100 120 Temperature (° C) ADC-value D2 (LSB) Absolute Pressure Accuracy after Calibration, 2nd order compensation 0 100 200 300 400 500 600 700 800 900 1000 1100 Pressure (mbar) Pressure error (mbar) 125° C 85° C 60° C 25° C 0° C -40° C

DA5534C_003.doc June 16th, 2008 7 0005534C1175 ECN1118 Temperature Error Accuracy vs temperature (typical) -40 -20 0 20 40 60 80 100 120 Temperature (° C) Temperature error (° C) Temperature error (standard calculation) Temperature error (with 2nd order calculation) Pressure Error Accuracy vs temperature (typical) -40 -20 0 20 40 60 80 100 120 Temperature (° C) Pressure error (mbar) Perror(1000,1st order) Perror(1000,2nd order) Perror(800,1st order) Perror(800,2nd order) Perror(300,1st order) Perror(300,2nd order)

DA5534C_003.doc June 16th, 2008 8 0005534C1175 ECN1118 Pressure error vs supply voltage (typical) -0.8 -0.6 -0.4 -0.2 0.2 0.4 0.6 0.8 Voltage (V) Pressure error (mbar) 1000mbar 800mbar 300mbar Temperature error vs supply voltage (typical) -0.15 -0.1 -0.05 0.05 0.1 0.15 Voltage (V) Temperature error (° C)

DA5534C_003.doc June 16th, 2008 9 0005534C1175 ECN1118 FUNCTION GENERAL The MS5534C consists of a piezoresistive sensor and a sensor interface IC. The main function of the MS 5534C is to convert the uncompensated analogue output vol tage from the piezoresistive pressure sensor to a 1 6-Bit digital value, as well as providing a 16-Bit digital value for the temperature of the sensor.

• measured pressure (16-Bit) “D1”
• measured temperature (16-Bit) “D2” As the output voltage of a pressure sensor is stron gly dependent on temperature and process tolerances , it is necessary to compensate for these effects. This com pensation procedure must be performed by software u sing an external microcontroller. For both pressure and temperature measurement the same ADC is used (sigma delta converter):
• for the pressure measurement, the differential out put voltage from the pressure sensor is converted
• for the temperature measurement, the sensor bridge resistor is sensed and converted During both measurements the sensor will only be sw itched on for a very short time in order to reduce power consumption. As both, the bridge bias and the refer ence voltage for the ADC are derived from VDD, the digital output data is independent of the supply voltage. FACTORY CALIBRATION Every module is individually factory calibrated at two temperatures and two pressures. As a result, 6 coefficients necessary to compensate for process variations and temperature variations are calculated and stored in the 64- Bit PROM of each module. These 64-Bit (partitioned into four words of 16-Bit) must be read by the microcontroller software and used in the program co nverting D1 and D2 into compensated pressure and temperature values. PRESSURE AND TEMPERATURE MEASUREMENT The sequence of reading pressure and temperature as well as of performing the software compensation is depicted in Fig. 3 and Fig. 5. First the Word1 to Word4 have to be read through th e serial interface. This can be done once after res et of the microcontroller that interfaces to the MS5534C. Next the compensation coefficients C1 to C6 are extracted using Bit-wise logical- and shift-operations (refer to Fig. 4 for the Bit-pattern of Word1 to Word4). For the pressure measurement the microcontroller ha s to read the 16 Bit values for pressure (D1) and temperature (D2) via the serial interface in a loop (for instance every second). Then, the compensated pressure is calculated out of D1, D2 and C1 to C6 according to the algorithm in Fig. 3 (possibly using quadrati c temperature compensation according to Fig. 5). All calculations can be performed with signed 16-Bit va riables. Results of multiplications may be up to 32-Bit long (+sign). In the flow according to Fig. 3 each mult iplication is followed by a division. This division can be perfor med by Bit-wise shifting (divisors are to the power of 2). It is ensured that the results of these divisions are less than 65536 (16-Bit). For the timing of signals to read out Word1 to Word 4, D1, and D2 please refer to the paragraph “Serial Interface”. Sensor Word1..4 Calculation in external micro- controller Pressure Temperature

DA5534C_003.doc June 16th, 2008 10 0005534C1175 ECN1118 System initialisation Pressure and temperature measurement Example: Word1, Word2, Word3 and Word4 (4x16 Bit) D1 = 17000 D2 = 22500 Start Convert calibration data into coefficients: (see bit pattern of Word1-Word4) Read calibration data (factory calibrated) from PROM of MS5534C Read digital pressure value from MS5534C D1 (16 Bit) Read digital temperature value from MS5534C Display pressure and temperature value Basic equations: Calculate calibration temperature UT1 = 8*C5+20224 Calculate temperature compensated pressure Difference between actual temperature and reference temperature: dT = D2 - UT1 Actual temperature: TEMP = 200 + dT*(C6+50)/2 10 (0.1° C resolution) Calculate actual temperature D2 (16 Bit) SENST1 OFFT1 TCS TCO T ref TEMPSENS C1: Pressure sensitivity (15 Bit) C2: Pressure offset (12 Bit) C3: Temperature coefficient of pressure sensitivity (10 Bit) C4: Temperature coefficient of pressure offset (10 Bit) C5: Reference temperature (11 Bit) C6: Temperature coefficient of the temperature (6 B it) (Refer to application note AN509 for limits of coefficients and calculated results ) Word1 = 50426 Word2 = 9504 Word3 = 48029 Word4 = 55028 C1 = 25213 C2 = 1908 C3 = 859 C4 = 750 C5 = 148 C6 = 32 dT(D2) = D2 - T ref TEMP(D2) = 20° +dT(D2)*TEMPSENS Offset at actual temperature: Sensitivity at actual temperature: SENS = C1 + (C3*dT)/2 10 + 24576 X = (SENS * (D1-7168))/2 14 - OFF Temperature compensated pressure: P = X*10/2 5 + 250*10 (0.1mbar resolution) OFF(D2) = OFFT1+TCO*dT(D2) SENS(D2) = SENST1+TCS*dT(D2) P(D1,D2) = D1*SENS(D2)-OFF(D2) dT = 1092 TEMP = 287 = 28.7 ° C OFF = 7695 SENS = 50705 X = 22732 P = 9603 = 960.3 mbar Fig. 3: Flow chart for pressure and temperature reading and software compensation. NOTES 1) Readings of D2 can be done less frequently, but the display will be less stable in this case. 2) For a stable display of 0.1 mbar resolution, it is recommended to display the average of 8 subseque nt pressure values.

DA5534C_003.doc June 16th, 2008 11 0005534C1175 ECN1118 C1 (15 Bit) C5/I

1 Bit

Word1 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB 3 DB2 DB1 DB0 DB10 C5/II (10 Bit) C6 (6 Bit) Word2 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB5 DB4 DB3 DB2 DB1 DB0 C4 (10 Bit) C2/I (6 Bit) Word3 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB11 DB10 D B9 DB8 DB7 DB6 C3 (10 Bit) C2/II (6-Bit) Word4 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB5 DB4 DB3 DB2 DB1 DB0 Fig. 4: Arrangement (Bit-pattern) of calibration data in Word1 to Word4. SECOND-ORDER TEMPERATURE COMPENSATION In order to obtain best accuracy over the whole tem perature range, it is recommended to compensate for the non-linearity of the output of the temperature sens or. This can be achieved by correcting the calculat ed temperature and pressure by a second order correcti on factor. The second-order factors are calculated as follows: No correction T2 = 0 P2 = 0 High Temperatures P2 = T2 * (P - 10000)/2 13 TEMP < 200 yes Calculate pressure and temperature TEMP = TEMP – T2 P = P – P2 Low Temperatures P2 = 3 *T2 * (P - 3500)/2 14 TEMP > 450 yes 200 ≤ TEMP ≤ 450 yes Fig. 5: Flow chart for calculating the temperature and pressure to the optimum accuracy.

DA5534C_003.doc June 16th, 2008 12 0005534C1175 ECN1118 SERIAL INTERFACE The MS5534C communicates with microprocessors and o ther digital systems via a 3-wire synchronous seria l interface as shown in Fig. 1. The SCLK (Serial cloc k) signal initiates the communication and synchroni ses the data transfer with each Bit being sampled by the MS 5534C on the rising edge of SCLK and each Bit being sent by the MS5534C on the rising edge of SCLK. The data should thus be sampled by the microcontroller on t he falling edge of SCLK and sent to the MS5534C with t he falling edge of SCLK. The SCLK-signal is genera ted by the microprocessor’s system. The digital data provi ded by the MS5534C on the DOUT pin is either the conversion result or the software calibration data. In addition the signal DOUT (Data output) is also used to indicate the conversion status (conversion-ready si gnal, see below). The selection of the output data is done by sending the corresponding instruction on the pin DIN (Data input). Following is a list of possible output data instructions:

• Conversion start for pressure measurement and ADC- data-out “D1” (Figure 6a)
• Conversion start for temperature measurement and A DC-data-out “D2” (Figure 6b)
• Calibration data read-out sequence for Word1 (Fi gure 6c)
• Calibration data read-out sequence for Word2 (Fi gure 6d)
• Calibration data read-out sequence for Word3 (Fig ure 6c)
• Calibration data read-out sequence for Word4 (Fig ure 6d)
• RESET sequence (Figure 6e) Every communication starts with an instruction sequ ence at pin DIN. Fig. 6 shows the timing diagrams f or the MS5534C. The device does not need a ‘Chip select’ s ignal. Instead there is a START sequence (3-Bit hig h) before each SETUP sequence and STOP sequence (3-Bit low) after each SETUP sequence. The SETUP sequence consists in 4-Bit that select a reading of pressure, temperature or calibration data. In case of pressure- (D1) or temperature- (D2) reading the module acknow ledges the start of a conversion by a low to high t ransition at pin DOUT. Two additional clocks at SCLK are required after th e acknowledge signal. Then SCLK is to be held low b y the microcontroller until a high to low transition on DOUT indicates the end of the conversion. This signal can be used to create an interrupt in t he microcontroller. The microcontroller may now rea d out the 16-Bit word by giving another 17 clocks on the SLCK pin. It is possible to interrupt the data READOUT sequence with a hold of the SCLK signal. It is important to always read out the last conversion result before starting a new conversion. The RESET sequence is special as its unique pattern is recognised by the module in any state. By conse quence it can be used to restart if synchronisation betwee n the microcontroller and the MS5534C has been lost . This sequence is 21-Bit long. The DOUT signal might chan ge during that sequence (see Fig. 6e). It is recomm ended to send the RESET sequence before first CONVERSION sequence to avoid hanging up the protocol permanently in case of electrical interference. sequence: START+P-measurement SCLK DOUT DIN Bit7 Conversion start for pressure measurement and ADC-data-out "D1": end of conversion Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 conversion (33ms) DB7 ADC-data out MSB ADC-data out LSB Bit8 Bit9 Start-bit Stop-bit DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 start of conversion Setup-bits Fig. 6a: D1 ACQUISITION sequence.

DA5534C_003.doc June 16th, 2008 13 0005534C1175 ECN1118 sequence: START+T-measurement SCLK DOUT DIN Bit7 Conversion start for temperature measurement and ADC-data-out "D2": end of conversion Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 conversion (33ms) Bit8 Bit9 Start-bit Stop-bit Setup-bits start of conversion DB7 ADC-data out MSB ADC-data out LSB DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Fig. 6b: D2 ACQUISITION sequence. sequence: coefficient read + address SCLK DOUT DIN Bit7 Calibration data read out sequence for word 1/ wor d 3: Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 DB7 coefficient-data out MSB coefficient-data out LSB Bit8 Bit9 Start-bit Stop-bit DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Bit10 Bit11 address word 1 address word 3 Setup-bits Fig. 6c: Word1, Word3 READING sequence. address word 2 address word 4 sequence: coefficient read + address SCLK DOUT DIN Bit7 Calibration data read out sequence for word 2/ wor d 4: Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 DB7 coefficient-data out MSB coefficient-data out LSB Bit8 Bit9 Start-bit Stop-bit DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Bit10 Bit11 Setup-bits Fig. 6d: W2, W4 READING sequence. sequence: RESET SCLK DOUT DIN Bit7 RESET - sequence: Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Bit8 Bit9 Bit10 Bit11Bit12 Bit13 Bit14 Bit15 Fig. 6e: RESET sequence (21-Bit).

DA5534C_003.doc June 16th, 2008 14 0005534C1175 ECN1118

APPLICATION INFORMATION

The advantage of combining a pressure sensor with a directly adapted integrated circuit is to save other external components and to achieve very low power consumptio n. The main application field for this system inclu des portable devices with battery supply, but its high accuracy and resolution make it also suited for ind ustrial and automotive applications. The possibility to compens ate the sensor with software allows the user to ada pt it to his particular application. Communication between the MS5534C and the widely available microcontrollers is realised over an easy-to-use 3-wire serial interface. Custom ers may select which microcontroller system to be u sed, and there are no specific standard interface cells requ ired, which may be of interest for specially design ed 4 Bit- microcontroller applications. CALIBRATION The MS5534C is factory calibrated. The calibration data is stored inside the 64-Bit PROM memory. SOLDERING Please refer to the application note AN808 for all soldering issues. HUMIDITY, WATER PROTECTION The version MS5534CM carries a metal protection cap filled with silicone gel for enhanced protection a gainst humidity. The properties of this gel ensure functio n of the sensor even when in direct water contact. This feature can be useful for waterproof watches or other appli cations, where direct water contact cannot be avoid ed. Nevertheless the user should avoid drying of hard m aterials like for example salt particles on the sil icone gel surface. In this case it is better to rinse with cl ean water afterwards. Special care has to be taken to not mechanically damage the gel. Damaged gel could lead to air entrapment and consequently to unstable sen sor signal, especially if the damage is close to the sensor surface. The metal protection cap is fabricated of special a nticorrosive stainless steel in order to avoid any corrosive battery effects inside the final product. The MS553 4CM was qualified referring to the ISO Standard 228 1 and can withstand a pressure of 11 bar in salt water. T he concentration of the sea water used for the qual ification is 41 g of see salt for 1 litre of DI water. For underwater operations as specified in ISO Stand ard 2281 it is important to seal the sensor with a rubber O- ring around the metal cap. Any salt water coming to the contact side (ceramic and pads) of the sensor could lead to permanent damage. Especially for "water-resistan t 100 m" watches it is recommended to provide a sta ble mechanical pusher from the backside of the sensor. Otherwise the overpressure might push the sensor backwards and even bend the electronic board on which the sensor is mounted. LIGHT SENSITIVITY The MS5534C is sensitive to sunlight, especially to infrared light sources. This is due to the strong photo effect of silicon. As the effect is reversible there will be no damage, but the user has to take care that in the final product the sensor cannot be exposed to direct ligh t during operation. This can be achieved for instan ce by placing mechanical parts with holes in such that light cannot pass. CONNECTION TO PCB The package outline of the module allows the use of a flexible PCB to connect it. This can be importan t for applications in watches and other special devices, and will also reduce mechanical stress on the device. For applications subjected to mechanical shock, it is recommended to enhance the mechanical reliabilit y of the solder junctions by covering the rim or the corners of MS5534C's ceramic substrate with glue or Globto p-like material.

DA5534C_003.doc June 16th, 2008 15 0005534C1175 ECN1118 DECOUPLING CAPACITOR Particular care must be taken when connecting the d evice to power supply. A 47 µ F tantalum capacitor must be placed as close as possible of the MS5534C's VDD pin. This capacitor will stabilise the power supply during data conversion and thus, provide the highest possible accuracy. APPLICATION EXAMPLE: ALTIMETER SYSTEM USING MS5534C MS5534C is a circuit that can be used in connection with a microcontroller in mobile altimeter applica tions. It is designed for low-voltage systems with a supply volt age of 3 V, particularly in battery applications. T he MS5534C is optimised for low current consumption as the AD-converter clock (MCLK) can use the 32.768 kHz frequency of a standard watch crystal, which is supplied in most portable watch systems. For applications in altimeter systems Intersema can deliver a simple formula to calculate the altitude , based on a linear interpolation, where the number of interpolation points influences the accuracy of the formula. 4/8bit-Microcontroller LCD-Display EEPROM Keypad MS5534 SCLK DIN DOUT MCLK XTAL1 XTAL2 32.768 kHz optional VDD GND VDD GND 3V-Battery 47µF Tantal Figure 7: Demonstration of MS5534C in a mobile altimeter.

DA5534C_003.doc June 16th, 2008 16 0005534C1175 ECN1118 DEVICE PACKAGE OUTLINES Fig. 8: Device package outlines of MS5534CP .

DA5534C_003.doc June 16th, 2008 17 0005534C1175 ECN1118 DEVICE PACKAGE OUTLINES Fig. 9: Device package outlines of MS5534CM .

DA5534C_003.doc June 16th, 2008 18 0005534C1175 ECN1118 RECOMMENDED PAD LAYOUT Pad layout for bottom side of MS5534C soldered onto printed circuit board Fig. 10: Layout for bottom side Pad layout for top side of MS5534C soldered onto printed circuit board Fig. 11: Layout for top side

DA5534C_003.doc June 16th, 2008 19 0005534C1175 ECN1118 ASSEMBLY MECHANICAL STRESS It is recommended to avoid mechanical stress on the PCB on which the sensor is mounted. The thickness of the PCB should not be below 1.6 mm. A thicker PCB is st iffer creating less stress on the soldering contact s. For applications where mechanical stress cannot be avoi ded (for example ultrasound welding of the case or thin PCB’s in watches) please fix the sensor with drops of low stress epoxy (for example Hysol FP-4401) at the corners of the sensor as shown below. Fixing with Globtop increases mechanical stability MOUNTING The MS5534C can be placed with automatic Pick&Place equipment using vacuum nozzles. It will not be damaged by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects. Special care has to be taken to not touch the protective gel of the sensor during the assembly. The MS5534C can be mounted with the cap down or the cap looking upwards. In both cases it is important to solder all contact pads. The Pins PEN and PV shall be left open or connected to VDD. Do not connect the Pins PEN and PV to GND! Placement cap down (hole in PCB to fit cap) Solder at both sides to increase mechanical stability Placement cap up SEALING WITH O-RING In products like outdoor watches the electronics must be protected a gainst direct water or humidity. For those products the MS5534CM provides the possibility to s eal with an O-ring. The protective cap of the MS553 4CM is made of special anticorrosive stainless steel with a polished surface. In addition to this the MS5534C M is filled with silicone gel covering the sensor and the bondi ng wires. The O-ring (or O-rings) shall be placed a t the outer diameter of the metal cap. This method avoids mecha nical stress because the sensor can move in vertica l direction.

DA5534C_003.doc June 16th, 2008 20 0005534C1175 ECN1118 CLEANING The MS5534C has been manufactured under cleanroom c onditions. Each device has been inspected for the homogeneity and the cleanness of the silicone gel. It is therefore recommended to assemble the sensor under class 10’000 or better conditions. Should this not be possible, it is recommended to protect the senso r opening during assembly from entering particles and dust. T o avoid cleaning of the PCB, solder paste of type “ no-clean” shall be used. Cleaning might damage the sensor! ESD PRECAUTIONS The electrical contact pads are protected against E SD up to 4 kV HBM (human body model). It is therefo re essential to ground machines and personal properly during assembly and handling of the device. The MS5 534C is shipped in antistatic transport boxes. Any test adapters or production transport boxes used during the assembly of the sensor shall be of an equivalent antistatic material.

DA5534C_003.doc June 16th, 2008 21 0005534C1175 ECN1118

ORDERING INFORMATION

Product Art.-Nr. Package Comments MS5534-CP Barometer Module with plastic cap 325534008 SMD hybrid with solder paste, plastic protection cap Standard version MS5534-CM Barometer Module with metal cap 325534009 SMD hybrid with solder paste, metal protection cap, silicon gel sensor protection Recommended for outdoor products FACTORY CONTACTS Intersema Sensoric SA Ch. Chapons-des-Prés 11 CH-2022 BEVAIX SWITZERLAND Tel. 032 847 9550 Tel. Int. +41 32 847 9550 Telefax +41 32 847 9569 e-mail: http://www.intersema.ch NOTICE Intersema reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Intersema assumes no responsibility for the use of any circu its shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes n o claim that the circuits are free from patent infringement. Applications for any devices s hown in this data sheet are for illustration only a nd Intersema makes no claim or warranty that such applications will be suitable fo r the use specified without further testing or modi fication.