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Reverse Voltage V R 100 Vdc Forward Current I F 200 mAdc Peak Forward Surge Current I FM(surge) 500 mAdc THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Total Device Dissipation FR-5 Board,* P D 200 mW T A = 25°C Derate above 25°C 1.57 mW/°C Thermal Resistance Junction to Ambient R θJA 635 °C/W Junction and Storage Temperature T J , T stg 150 °C **FR-4 Minimum Pad DEVICE MARKING MMDL914 = 5D ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted) Characteristic Symbol Min Max Unit OFF CHARACTERISTICS Reverse Breakdown Voltage R = 100 µAdc) V (BR) 100 — Vdc Reverse Voltage Leakage Current I R (V R = 20Vdc) — 25 nAdc (V R = 75Vdc) — 5.0 µAdc Diode Voltage C T — 4.0 pF(V R =0, f =1.0MHz ) Forward Voltage V F — 1.0 Vdc(I F = 10 mAdc) Reverse Recovery Time t rr — 4.0 ns(I F = I R = 10 mAdc ) (Figure 1) SOD- 323
ORDERING INFORMATION
MMDL914 SOD-323 3000/Tape&Reel FETURE z MMDL914 2012-1 WILLAS ELECTRONIC CORP. 200mA Surface Mount Switching Diode - 100V z
1.60 0.063 0.63 0.025 0.83 0.033 2.85 0.112 SOLDERING FOOTPRINT* 2012-1 WILLAS ELECTRONIC CORP. Dimensions in inches and (millimeters) .075(1.90) .059(1.50) .091(2.30) .106(2.70) .010(0.25)MIN. .057(1.45) .045(1.15) .010(0.25) .016(0.40) .008(0.20) .043(1.10) .031(0.80) .004(0.10)MAX. .010(0.25) .016(0.40) .004(0.10) MMDL914200mA Surface Mount Switching Diode - 100V