MMDL6050T1 LRC | Alldatasheet
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LESHAN RADIO COMPANY, LTD. S3–1/3 CASE 477–02, STYLE 1 SOD-323 MMDL6050T1 Switching Diode ANODE CATHODE MAXIMUM RATINGS Rating Symbol V alue Unit Reverse Voltage V R 70 Vdc Forward Current I F 200 mAdc Peak Forward Surge Current I FM(surge) 500 mAdc THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Total Device Dissipation FR-5 Board,* P D 200 mW T A = 25°C Derate above 25°C 1.57 mW/°C Thermal Resistance Junction to Ambient R θJA 635 °C/W Junction and Storage Temperature T J , T stg 150 °C **FR-4 Minimum Pad DEVICE MARKING MMDL6050T1 = 5A ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted) Characteristic Symbol Min Max Unit OFF CHARACTERISTICS Reverse Breakdown Voltage (I (BR) = 100 µAdc) V (BR) 70 — Vdc Reverse Voltage Leakage Current I R — 0.1 µAdc(V R = 50 Vdc) Forward Voltage V F Vdc (I F = 1.0 mAdc) 0.55 0.7 (I F = 100 mAdc) 0.85 1.1 Reverse Recovery Time t rr — 4.0 ns(I F = I R = 10 mAdc, I R(REC) = 1.0 mAdc) (Figure 1) Capacitance (V R = 0 V) C — 2.5 pF
LESHAN RADIO COMPANY, LTD. S3–3/3 MMDL6050T1 PACKAGE DIMENSIONS SOD–323 PLASTIC PACKAGE CASE 477–02 ISSUE A K A D B1 2 J NOTE 3 H E C 0.63 mm 0.025’’ 1.60 mm 0.063’’ 2.85 mm 0.112’’ 0.83 mm 0.033’’ mm inches SOD–323 Soldering Footprint NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH SOLDER PLATING. DIM MILLIMETERS INCHES MIN MAX MIN MAX A 1.60 1.80 0.063 0.071 B 1.15 1.35 0.045 0.053 C 0.80 1.00 0.031 0.039 D 0.25 0.40 0.010 0.016 E 0.15 REF 0.006 REF H 0.00 0.10 0.000 0.004 J 0.089 0.177 0.0035 0.0070 K 2.30 2.70 0.091 0.106 STYLE 1: PIN 1. CATHODE 2. ANODE