MMBD701 FAIRCHILD | Alldatasheet

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Absolute Maximum Ratings* TA = 25 O C unless otherwise noted Sym Parameter Value Units T stg Storage Temperature -55 to +150 O C T J Operating Junction Temperature -55 to +125 O C W iv Working Inverse Voltage 35 V P F Forward Power Dissipation @ T A = 25 O C 200 mW Derate above 25 O C 2.0 Mw/ O C *These ratings are limiting values above which the serviceability of any semiconductor device may be impaired MMBD701 Electrical Characteristics TA = 25 O C unless otherwise noted SYM CHARACTERISTICS MIN MAX UNITS TEST CONDITIONS B V Breakdown Voltage 70 V IR = 10 uA I R Reverse Leakage 200 nA V R = 35 V V F Forward Voltage 500 mV I F = 1.0 mA

1.0 V I F = 10 mA

C T Capacitance 1.0 pF V R = 20 V f = 1.0 MHz 5HF 1 2 Schottky Barrier Diode Sourced from Process GE PACKAGE SOT-23 TO-236AB (Low) © 1997 Fairchild Semiconductor Corporation 1 2 NC PACKAGE SOT-23 TO236AB CONNECTION DIAGRAM ADVANCED INFORMATION ONLY NOT IN PRODUCTION

SOT-23TO-236AB (LOW PROFILE) 22-August-1994 0.098 (2.489) 0.083 (2.108) 0.055 (1.397) 0.047 (1.194) 0.024 (0.810) 0.018 (0.457)

3 CHARACTERS MAX

LOW PROFILE 0.0040 (0.102) 0.120 (3.048) 0.110 (2.794) 0.040 (1.016) 0.035 (0.889) 0.080 (2.032) 0.070 (1.778) 0.019 (0.483) 0.015 (0.381) 0.0059 (0.150) 0.0035 (0.089) LOW PROFILE 0.041 (1.041) (49) 0.035 (0.889)

0.035” TYPICAL (0.889) 0.060” +/- 0.005” (1.524 +/- 0.127) 0.120” MINIMUM (3.048) 0.030” +/- 0.005” (0.762 +/- 0.127) RECOMMENDED SOLDER PADS FOR SOT-23

0.037” +/- 0.005” (0.950 +/- 0.127 ) 0.099” +/- 0.005” (2.524 +/- 0.127 ) 0.039” +/- 0.005” (1.000 +/- 0.127) RECOMMENDED SOLDER PADS FOR U.S. & European SOT-23 Japanese SC-59 0.031” +/- 0.005” (0.800 +/- 0.127) 0.060” +/- 0.005” (1.524 +/- 0.127)

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