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Publication Date : Apr., 2011 < High-power GaAs FET (small signal gain stage) > MGF0921A L & S BAND / 2W SMD non - matched

DESCRIPTION

The MGF0921A GaAs FET with an N-channel schottky Gate, is designed for use UHF band amplifiers.

FEATURES

 High output power Po=33dBm(TYP.) @f=1.9GHz,Pin=17dBm  High power gain Gp=17dB(TYP.) @f=1.9GHz  High power added efficiency add=40%(TYP.) @f=1.9GHz,Pin=17dBm  Hermetic Package APPLICATION  For UHF Band power amplifiers QUALITY  GG RECOMMENDED BIAS CONDITIONS  Vds=10V  Ids=500mA  Rg=200 Delivery -01: Tape & Reel(1K), -03:Trai(50pcs) Absolute maximum ratings (Ta=25C) Symbol Parameter Ratings Unit V GSO Gate to source breakdown voltage -15 V V GDO Gate to drain breakdown voltage -15 V I D Drain current 1800 mA I GR Reverse gate current -5.0 mA I GF Forward gate current 15 mA P T Total power dissipation 10 W T c h Cannel temperature 175 C T s t g Storage temperature -65 to +175 C Electrical characteristics (Ta=25C) Symbol Parameter Test conditions Limits Unit Min. Typ. Max. I DSS Saturated drain current VDS=3V,VGS=0V - 1100 1800 mA V GS(off) Gate to source cut-off voltage VDS=3V,ID=4.0mA -1.0 - -5.0 V gm Transconductance VDS=3V,ID=500mA - 370 - mS Po Output power VDS=10V,ID=500mA,f=1.9GHz 31 33 - dBm add Power added Efficiency Pin=17dBm - 38 - % G LP Linear Power Gain VDS=10V,ID=500mA,f=1.9GHz 15 17 - dB Rth(ch-c) Thermal Resistance *1 Vf Method - 11 15 C/W *1:Channel to case / Above parameters, ratings, limits are subject to change. Fig.1

< High-power GaAs FET (small signal gain stage) > MGF0921A L & S BAND / 2W SMD non - matched Publication Date : Apr., 2011 MGF09121A TYPICAL CHARACTERISTICS

< High-power GaAs FET (small signal gain stage) > MGF0921A L & S BAND / 2W SMD non - matched Publication Date : Apr., 2011 MGF0921A S PARAMETERS (Ta=25C,VD=10V,ID=500mA, Reference Plane see Fig.1)

< High-power GaAs FET (small signal gain stage) > MGF0921A L & S BAND / 2W SMD non - matched Publication Date : Apr., 2011 © 2011 MITSUBISHI ELECTRIC CORPORATION. ALL RIGHTS RESERVED. Keep safety first in your circuit designs! Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is alwa ys the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appr opriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials

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