MCB770

MCB770 SONY | Alldatasheet

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2M-Pixel CMOS Camera Module with Autofocus Function for Mobile Equipment MCB770 I 3-element, 3-group glass lens with AF function I CMOS sensor with 2.01M camera block effective pixels I Supports both uncompressed moving picture and JPEG compressed still im- age data formats I Image expression capabilities based on the AE and AWB technologies used in dedicated digital still cameras Based on Sony’s experience introducing 1.3M-pixel CCD camera mod- ules to the marketplace, Sony has embarked on efforts to respond to customer desires for increased pixel counts, improved functionality, reduced power consumption, and further miniaturization and lower mounting heights in CCD camera modules. The MCB770 introduced here is a new product that responds to these desires with newly-developed technologies such as a 2M-pixel CMOS sensor and an AF function that can handle a wide range of camera to subject distances. This product adopts many ideas from the dedicated digital still cam- era, which has acquired wide support in the image creation areas, to achieve a balanced and rich set of image expression capabilities. VOICE This newly-developed camera module was made possible by the persistence of each of the persons in charge of the various compo- nents; the lens, sensor, DSP, mechanism, mounting, image quality, and plant. Our idea was to provide more freedom and more fun to users, we wanted our users to experience the pleasure of be- ing able to photograph the things around them freely and easily. We are committed to continuing to develop products to the best of our ability. High-Performance Lens with Wide Distance Range AF Function The MCB770 includes an AF system for the first time in a Sony camera module product. This AF system focuses over a wide range of distances from 10 cm, a dis- tance selected specifically for imaging QR codes, to infinity. It also includes a focus point prediction function to improve fo- cusing performance. In addition to an AF control system that takes advantage of Sony’s experience in dedicated digital still cameras, it also adopts a linear method. This made it possible to create a minia- ture low-power AF system optimal for a camera module. The MCB770 also sup- ports manual focus. Sony achieved low TV distortion and high resolution performance by combining a lens design optimized in conjunction with the sensor structure with a 3-element, 3-group glass lens. High Picture Quality CMOS Sensor for Mobile Equipment The MCB770 includes the IMX011CQ* diagonal 5.97 mm (Type 1/3.0) 2.13M total pixels primary color progressive scan CMOS sensor that was designed at the same time as the MCB770. This device was designed for use in mobile equipment and achieves the high-speed progressive scan of all pixels at 15 frames/s and the same high picture quality as CCD sensors. While it goes without saying that this de- vice uses Sony’s know-how developed over many years of CCD development as a foundation, this device also features fur- ther optimization of the pixel layout and on-chip microlenses. * IMX011CQ: See CX-NEWS Vol. 40. Newly-Developed DSP for Natural Image Rendition and High-Generality Interface The MCB770 provides three formats: draft mode, which is intended for preview mov- ing picture, uncompressed capture mode for moving picture recording, and JPEG capture mode for still images. The MCB770 supports flexible end product design by providing a variety of image sizes in each of these modes. The MCB770 provides rich image expres- sion that will not betray our customers’ hopes for image creation. The AE and AWB algorithms implemented in the newly-developed DSP are based on con- cepts from dedicated digital still cameras and take into account the functional balance required in a camera module. The MCB770 thus provides imaging perfor- mance in difficult conditions that is equivalent to that of dedicated digital still cameras. Furthermore, the MCB770 pro- vides a scene selection function that can set optimal condition for the camera mod- ule simply by selecting a scene mode that matches the scene being imaged.

VDD_AF VDD_SA VDD_IO VDD_SD VDD_L GND XRST SCL SDA SERIAL- COMM.TIMING Lens I Figure 2 Application Circuit Example MCB770 AF_GND 1 0.1 µF 10 µF 2.7 V Video I/F VDD_AF 2 NC 3 NC 4 GND 5 GND 6 DCK 7 D [0] 8 D [1] 9 D [2] 10 D [3] 11 D [4] 12 D [5] 13 D [6] 14 D [7] 15 GND 16 VSYNC 17 HSYNC 18 XRST 19 SDA 20 SCL 21 VDD_SD 22 VDD_SA 23 GND 24 VDD_IO 25 VDD_L 26 GND 27 MCK 28 GND 29 0.1 µF 10 µF 0.1 µF R2 R1 10 µF 0.1 µF 10 µF 0.1 µF 10 µF 1.2 V Clock Reset I2C HSYNC VSYNC 1.8 V Far Near Contrast High Focus distance Ideal focus point Focus lens Photographic object Defocused picture example (Low contrast) Sensor Low Far Near Focused picture example (High contrast) I Table 1 Specification Overview I Figure 3 AF System Operation Functions Image sensor 2M-pixel CMOS camera module with AF function for mobile equipment Progressive scan readout diagonal 5.97 mm (Type 1/3.0) color CMOS sensor Number of pixels Total number of pixels Camera block number of effective pixels Recording block number of effective pixels Lens Horizontal angle of view F value Focal length Subject distance 2.13M pixels 2.01M pixels 1632 (H) × 1224 (V) (2M pixels) About 52° 2.8 4.8 mm 100 mm to ∞, AF function provided Exposure control White balance control Scene selection Auto (normal and long time exposure modes), hold Auto tracking, all pull-in, user setting A total of six types Data formats Uncompressed moving picture, JPEG compressed still images Frame rates Draft mode: 30 or 15 fps (up to CIF) Uncompressed capture mode: 15 fps (up to VGA) Capture mode: 15 fps (128 × 96 to 2M) Video signals Uncompressed moving picture JPEG compressed still images YCbCr 8 bits Stream data, no headers Control signals Input clock frequency Supply voltage Power consumption I2C bus

• 2.7 ± 0.1 V (VDD_AF : AF system)
• 2.6 to 2.9 V (VDD_SA : Sensor analog system)
• 2.3 to 3.0 V (VDD_IO : DSP I/O)
• 1.8 ± 0.1 V (VDD_SD : Sensor digital system)
• 1.2 ± 0.1 V (VDD_L : DSP core) 170 mW, AF system not operating Temperature conditions Operating temperature Storage temperature Absolute maximum rating: –10 to +60°C Recommend operating range: – 5 to +45°C –30 to +80°C Package dimensions Mass 17.4 mm × 14.5 mm × 10.5 mm (H × W × D) 5 g