MC270A330M024FP VICOR | Alldatasheet
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(=VOUT x10) Output Power Designator (=POUT /10) Part Numbering MIL-COTS Bus Converter Module Input Voltage Designator Package Size Pin Style P = Through hole Size: 1.91 x 1.09 x 0.37 in 48,6 x 27,7 x 9,5 mm
Bus Converter Module MC270A330M024FP vicorpower.com Rev. 1.0 Page 2 of 17 CONTROL PIN SPECIFICATIONS See page 13 for further application details and guidelines. PC – VI BRICK BCM Primary Control The PC pin can enable and disable the BCM. When held below VPC_DIS the BCM shall be disabled. When allowed to float with an impedance to –IN of greater than 50 kΩthe module will start. When connected to another BCM PC pin, the BCMs will start simultaneously when enabled. The PC pin is capable of being driven high by either an external logic signal or internal pull up to 5 V (operating). TM – VI BRICK BCM Temperature Monitor The TM pin monitors the internal temperature of the BCM within an accuracy of +5/-5°C. It has a room temperature setpoint of ~3.0 V and an approximate gain of 10 mV/°C. It can source up to 100 µA and may also be used as a “Power Good” flag to verify that the BCM is operating. Note : If TM is not used to validate the thermal management system, a 100°C case (baseplate) maximum applies. SPECIFICATIONS Absolute Maximum Ratings Min Max Unit +In to –In -1.0 +400 Vdc PC to –In -0.3 +20 Vdc TM to –In -0.3 +7 Vdc +In /-In to +Out /-Out (hipot) 4242 V +In /-In to +Out /-Out (working) 500 V +Out to –Out -1.0 +60 Vdc
Attribute Symbol Conditions / Notes Min Typ Max Unit Voltage Range V IN 240 270 330 Vdc dV/dt dV IN /dt 1 V/µs Quiescent Power P Q PC connected to -IN 395 410 mW No Load Power Dissipation P NL VIN = 240 to 330 V 10 W Inrush Current Peak I INR_P VIN = 330 V COUT = 100 µF, 2.5 4 APOUT = 235 W DC Input Current I IN_DC POUT = 235 W 0.95 A K Factor ( VOUT ) K 1/8VIN Output Power (Average) P OUT VIN = 270 VDC; See Figure 14 235 WVIN = 240 – 330 VDC; See Figure 14 215 Output Power (Peak) P OUT_P VIN = 270 VDC 352.5 WAverage POUT < = 235 W, Tpeak < 5 ms Output Voltage V OUT See Page 11; No load 30 41.25 V Output Current (Average) I OUT Pout < = 235 W 7.3 A Efficiency (Ambient) η VIN = 270 V, POUT = 235 W 94.1 95.4 %VIN = 240 V to 330 V, POUT = 235 W 94 95.2 Efficiency (Hot) η VIN = 270 V, TJ = 100° C,POUT = 235 W 93.7 94.7 % Minimum Efficiency η 60 W < POUT < 235 W Max 90 %(Over Load Range) Output Resistance (Ambient) R OUT TJ = 25° C 100 130 170 m Ω Output Resistance (Hot) R OUT TJ = 125° C 130 180 210 m Ω Output Resistance (Cold) R OUT TJ = -55° C 40 105 160 m Ω Load Capacitance C OUT 100 uF Switching Frequency F SW 1.56 1.64 1.72 MHz Ripple Frequency F SW_RP 3.12 3.28 3.44 MHz Output Voltage Ripple V OUT_PP COUT = 0 µF, POUT = 235 W, VIN = 270 V, 160 400 mV See Page 15 VIN to VOUT (Application of VIN)T ON1 VIN = 270 V, CPC = 0; See Figure 17 460 540 620 ms PC PC Voltage (Operating) V PC 4.7 5 5.3 V PC Voltage (Enable) V PC_EN 2 2.5 3 V PC Voltage (Disable) V PC_DIS 1.95 V PC Source Current (Startup) I PC_EN 50 100 300 uA PC Source Current (Operating) I PC_OP 2 3.5 5 mA PC Internal Resistance R PC_SNK Internal pull down resistor 50 150 400 kΩ PC Capacitance (Internal) C PC_INT See Page 13 1000 pF PC Capacitance (External) C PC_EXT External capacitance delays PC enable time 1000 pF External PC Resistance R PC Connected to –VIN 50 kΩ PC External Toggle Rate F PC_TOG 1 Hz PC to VOUT with PC Released T on2 VIN = 270 V, Pre-applied 50 100 150 µsCPC = 0, COUT = 0; See Figure 17 PC to VOUT, Disable PC T PC_DIS VIN = 270 V, Pre-applied 41 0µ sCPC = 0, COUT = 0; See Figure 17 PRELIMINARY DATASHEET Bus Converter Module MC270A330M024FP vicorpower.com Rev. 1.0 Page 3 of 17 Specifications apply over all line and load conditions unless otherwise noted; Boldface specifications apply over the temperature range of -55°C < TC < 100°C (T-Grade); All other specifications are at TC = 25ºC unless otherwise noted SPECIFICATIONS (CONT.)
Electrical Characteristics
Bus Converter Module MC270A330M024FP vicorpower.com Rev. 1.0 Page 4 of 17 Specifications apply over all line and load conditions unless otherwise noted; Boldface specifications apply over the temperature range of -55°C < TC < 100°C (T-Grade); All other specifications are at TC = 25ºC unless otherwise noted Attribute Symbol Conditions / Notes Min Typ Max Unit TM TM accuracy A CTM -5 +5 ºC TM Gain A TM 10 mV/°C TM Source Current I TM 100 uA TM Internal Resistance R TM_SNK 25 40 50 kΩ External TM Capacitance C TM 50 pF TM Voltage Ripple V TM_PP CTM = 0 µF, VIN = 330 V, POUT = 235 W 200 400 500 mV PROTECTION Negative going OVLO V IN_OVLO- 350 365 380 V Positive going OVLO V IN_OVLO+ 355 372 385 V Negative going UVLO V IN_UVLO- 90 115 125 V Positive going UVLO V IN_UVLO+ 100 125 135 V Output Overcurrent Trip I OCP VIN = 270 V, 25°C 9 12 14 A Short Circuit Protection ISCP 14 ATrip Current Short Circuit Protection TSCP 0.8 1 1.2 usResponse Time Thermal Shutdown TJ_OTP 125 130 135 °CJunction setpoint GENERAL SPECIFICATION Isolation Voltage (hipot) V HIPOT 4242 V Working Voltage (In – Out) V WORKING 500 V Isolation Capacitance C IN_OUT Unpowered unit 500 660 800 pF Isolation Resistance R IN_OUT 10 MΩ MTBF MIL HDBK 217F, 25° C, GB 4.2 Mhrs Agency Approvals/Standards cTUVus CE Mark Electrical Characteristics (Continued) SPECIFICATIONS (CONT.)
Attribute Symbol Conditions / Notes Typ Unit No Load Power P NL VIN = 270 V, PC enabled; See Figure 1 5.5 W Inrush Current Peak I NR_P COUT = 100 µF, POUT = 235 W 2.5 A Efficiency (Ambient) η VIN = 270 V, POUT = 235 W 95.4 % Efficiency (Hot – 100°C) η VIN = 270 V, POUT = 235 W 94.7 % Output Resistance (-40°C) R OUT VIN = 270 V 105 m Ω Output Resistance (25°C) R OUT VIN = 270 V 130 m Ω Output Resistance (120°C) R OUT VIN = 270 V 180 m Ω Output Voltage Ripple V OUT_PP COUT = 0 uF, POUT = 235 W @ VIN = 270, 160 mVVIN = 270 V VOUT Transient (Positive) V OUT_TRAN+ IOUT_STEP = 0 TO 7.3 A, 1.4 VISLEW >10 A/us; See Figure 11 VOUT Transient (Negative) V OUT_TRAN- IOUT_STEP = 7.3 A to 0 A, 1.3 VISLEW > 10 A/us; See Figure 12 Undervoltage Lockout TUVLO 150 usResponse Time Output Overcurrent TOCP 9< IOCP < 14 A 5 msResponse Time Overvoltage Lockout TOVLO 120 µsResponse Time TM Voltage (Ambient) V TM_AMB TJ ≅27°C 3 V PRELIMINARY DATASHEET Bus Converter Module MC270A330M024FP vicorpower.com Rev. 1.0 Page 5 of 17 All specifications are at TC = 25ºC unless otherwise noted. See associated figures for general trend data. SPECIFICATIONS (CONT.) Application Characteristics
Bus Converter Module MC270A330M024FP vicorpower.com Rev. 1.0 Page 6 of 17 230 250 270 290 310 330 No Load Power Dissipation vs Line Input Voltage (V) No Load Power Dissipation (W) -55°C 25°C 100°CT :CASE 94.2 94.4 94.6 94.8 95.0 95.2 95.4 95.6 95.8 96.0 -100 -50 0 50 100 150 Case Temperature (C) Efficiency (%) Full Load Efficiency vs. Case Temperature
240 V 270 V 330 VV :IN
Efficiency & Power Dissipation -55°C Case Output Current (A) Efficiency (%) Power Dissipation (W)
240 V 270 V 330 VV :IN 240 V 270 V 330 V
η PD 012345678 Efficiency & Power Dissipation vs. 25°C Case Output Current (A) Efficiency (%) Power Dissipation (W) η PD 012345678 2.5 4.5 6.5 8.5 10.5 12.5 14.5 16.5 Efficiency & Power Disspiation 100°C Case Output Current (A) Efficiency (%) Power Dissipation (W) η PD 100 11 0 120 130 140 150 160 170 180 190 -80 -60 -40 -20 0 20 40 60 80 100 120 ROUT vs. Case Temperature Case Temperature (°C) /nobreakspaceRout (mΩ) I :OUT 0.73 A 7.3 A Figure 1 — No load power dissipation vs. V IN; TCASE Figure 2 — Full load efficiency vs. temperature; V IN Figure 3 — Efficiency and power dissipation at -55°C (case); V IN Figure 4 — Efficiency and power dissipation at 25°C (case); V IN Figure 5 — Efficiency and power dissipation at 100°C (case); V IN Figure 6 —R OUT vs. temperature vs. IOUT SPECIFICATIONS (CONT.) WAVEFORMS
Bus Converter Module MC270A330M024FP vicorpower.com Rev. 1.0 Page 7 of 17 100 120 140 160 180 012345678 Ripple vs. Load Load Current (A) Ripple (mV pk-pk) Vpk-pk (mV) Figure 7 — Vripple vs. I OUT ; 270 Vin, no external capacitance Figure 8 — PC to V OUT startup waveform Figure 9 —V IN to VOUT startup waveform Figure 10 — Output voltage and input current ripple, 270 Vin,
235 W no COUT
Figure 11 — Positive load transient (0 – 7.3 A) Figure 12 — Negative load transient (7.3 A – 0 A) SPECIFICATIONS (CONT.) WAVEFORMS (CONT.)
Bus Converter Module MC270A330M024FP vicorpower.com Rev. 1.0 Page 9 of 17 Attribute Symbol Conditions / Notes Min Typ Max Unit Length L 48.6 / 1.91 mm/in Width W 27.7 / 1.09 mm/in Height H 9.5 / 0.37 mm/in Weight W 1.10/31.3 oz/g Operating Temperature T C Baseplate temperature -40 100 °C Storage Temperature T ST -65 125 °C Thermal Capacity 23.8 Ws /°C Thermal Impedance ØBA Baseplate - Ambient 7.7 °C/ W Baseplate - Ambient 1000 LFM 2.9 °C/ W ØBS Baseplate - Sink Greased 0.4 °C/ W Baseplate - Thermal Pad 0.36 °C/ W All specifications are at TC = 25ºC unless otherwise noted. See associated figures for general trend data. SPECIFICATIONS (CONT.) Package / Mechanical Specifications
Bus Converter Module MC270A330M024FP vicorpower.com Rev. 1.0 Page 11 of 17 Power, Voltage, Efficiency Relationships Because of the high frequency, fully resonant SAC topology, power dissipation and overall conversion efficiency of BCM converters can be estimated as shown below. Key relationships to be considered are the following: 1. Transfer Function a. No load condition V OUT = VIN K Eq. 1 Where K (transformer turns ratio) is constant for each part number b. Loaded condition VOUT = Vin K – IOUT ROUT Eq. 2 2. Dissipated Power The two main terms of power losses in the BCM module are: - No load power dissipation (PNL) defined as the power used to power up the module with an enabled power train at no load. - Resistive loss (ROUT) refers to the power loss across the BCM modeled as pure resistive impedance. PDISSIPATED ~ PNL + PROUT Eq. 3~ Therefore, with reference to the diagram shown in Figure 16 POUT = PIN –P DISSIPATED = PIN –P NL –P ROUT Eq. 4 Notice that ROUT is temperature and input voltage dependent and PNL is temperature dependent (See Figure 16). INPUT POWER OUTPUT POWER PNL PROUT Figure 19 — Power transfer diagram The above relations can be combined to calculate the overall module efficiency: η = POUT = PIN –P NL –P ROUT = PIN PIN VIN IIN –P NL –( IOUT)2 ROUT =1 – ( PNL + (I OUT)2 ROUT )VIN IIN VIN IIN Eq. 5 EFFICIENCY / DISSIPATION
Bus Converter Module MC270A330M024FP vicorpower.com Rev. 1.0 Page 12 of 17 12 3 4 5 6 VUVLO+ PC 5 V 3 V LL • K A: TON1 B: TOVLO* C: Max recovery time D:T UVLO E: TON2 F: TOCP G: TPC–DIS H: TSSP** 1: Controller start 2: Controller turn off 3: PC release 4: PC pulled low 5: PC released on output SC 6: SC removed Vout TM
3 V @ 27°C
0.4 V VIN
3 V 5 V
2.5 V 500mS before retrial VUVLO– A B E H ISSP IOUT IOCP G F D C VOVLO+ VOVLO– VOVLO+ NL Notes: – Timing and voltage is not to scale – Error pulse width is load dependent *Min value switching off **From detection of error to power train shutdown C Figure 20 – Timing diagram TIMING DIAGRAM
Bus Converter Module MC270A330M024FP vicorpower.com Rev. 1.0 Page 13 of 17 Using the Control Signals TM and PC The PC control pin can be used to accomplish the following functions: Delayed start: At start-up, PC pin will source a constant 100 uA current to the internal RC network. Adding an external capacitor will allow further delay in reaching the 2.5 V threshold for module start. Synchronized start up: In a parallel module array, PC pins shall be connected in order to ensure synchronous start of all the units. While every controller has a calibrated 2.5 V reference on PC comparator, many factors might cause different timing in turning on the 100 uA current source on each module, i.e.: – Different V IN slew rate – Statistical component value distribution By connecting all PC pins, the charging transient will be shared and all the modules will be enabled synchronously. Auxiliary voltage source: Once enabled in regular operational conditions (no fault), each BCM PC provides a regulated 5 V, 2 mA voltage source. Output Disable: PC pin can be actively pulled down in order to disable module operations. Pull down impedance shall be lower than 850 Ωand toggle rate lower than 1 Hz. Fault detection flag: The PC 5 V voltage source is internally turned off as soon as a fault is detected. After a minimum disable time, the module tries to re-start, and PC voltage is re-enabled. For system monitoring purposes (microcontroller interface) faults are detected on falling edges of PC signal. It is important to notice that PC doesn’t have current sink capability (only 150 kΩtypical pull down is present), therefore, in an array, PC line will not be capable of disabling all the modules if a fault occurs on one of them. The temperature monitor (TM) pin provides a voltage proportional to the absolute temperature of the converter control IC. It can be used to accomplish the following functions: Monitor the control IC temperature: The temperature in Kelvin is equal to the voltage on the TM pin scaled remember that VI BRICKs are multi-chip modules, whose temperature distribution greatly vary for each part number as well with input/output conditions, thermal management and environmental conditions. Therefore, TM cannot be used to thermally protect the system. Fault detection flag: The TM voltage source is internally turned off as soon as a fault is detected. After a minimum disable time, the module tries to re-start, and TM voltage is re-enabled. Fuse Selection VI BRICKs are not internally fused in order to provide flexibility in configur- ing power systems. Input line fusing of VI BRICKs is recommended at sys- tem level, in order to provide thermal protection in case of catastrophic failure. The fuse shall be selected by closely matching system requirements with the following characteristics: Current rating (usually greater than maximum BCM current) Maximum voltage rating (usually greater than the maximum possible input voltage) Ambient temperature Nominal melting I Recommended fuse: ≤2.5 A Bussmann PC-Tron or SOC type 36CFA. CONTROL FUNCTIONS / FUSING
Bus Converter Module MC270A330M024FP vicorpower.com Rev. 1.0 Page 14 of 17 Current Sharing The SAC topology bases its performance on efficient transfer of energy through a transformer, without the need of closed loop control. For this reason, the transfer characteristic can be approximated by an ideal trans- former with some resistive drop and positive temperature coefficient. This type of characteristic is close to the impedance characteristic of a DC power distribution system, both in behavior (AC dynamic) and absolute value (DC dynamic). When connected in an array (with same K factor), the BCM module will in- herently share the load current with parallel units, according to the equiva- lent impedance divider that the system implements from the power source to the point of load. It is important to notice that, when successfully started, BCMs are capable of bidirectional operations (reverse power transfer is enabled if the BCM input falls within its operating range and the BCM is otherwise enabled). In parallel arrays, because of the resistive behavior, circulating currents are never experienced (energy conservation law). General recommendations to achieve matched array impedances are (see also AN016 for further details): to dedicate common copper planes within the PCB to deliver and return the current to the modules to make the PCB layout as symmetric as possible to apply same input/output filters (if present) to each unit Figure 21 – BCM Array APPLICATION NOTES
Bus Converter Module MC270A330M024FP vicorpower.com Rev. 1.0 Page 15 of 17 Input and Output Filter Design A major advantage of SAC systems versus conventional PWM converters is that the transformers do not require large functional filters. The resonant LC tank, operated at extreme high frequency, is amplitude modulated as a function of input voltage and output current, and efficiently transfers charge through the isolation transformer. A small amount of capacitance, embedded in the input and output stages of the module, is sufficient for full functionality and is key to achieve power density. This paradigm shift requires system design to carefully evaluate external fil- ters in order to: 1. Guarantee low source impedance: To take full advantage of the BCM dynamic response, the impedance presented to its input terminals must be low from DC to approximately 5 MHz. The connection of the VI BRICK to its power source should be implemented with minimal distribution inductance. If the interconnect inductance exceeds 100 nH, the input should be bypassed with a RC damper to retain low source impedance and stable operation. With an interconnect inductance of 200 nH, the RC damper may be as high as 1 µF in series with 0.3 Ω. A single electrolytic or equivalent low-Q capacitor may be used in place of the series RC bypass. 2. Further reduce input and/or output voltage ripple without sacrificing dynamic response: Given the wide bandwidth of the BCM, the source response is generally the limiting factor in the overall system response. Anomalies in the response of the source will appear at the output of the BCM multiplied by its K factor. This is illustrated in Figures 11 and 12. 3. Protect the module from overvoltage transients imposed by the system that would exceed maximum ratings and cause failures: The VI BRICK input/output voltage ranges shall not be exceeded. An internal overvoltage lockout function prevents operation outside of the normal operating input range. Even during this condition, the powertrain is exposed to the applied voltage and power MOSFETs must withstand it. A criterion for protection is the maximum amount of energy that the input or output switches can tolerate if avalanched. Total load capacitance at the output of the BCM shall not exceed the speci- fied maximum. Owing to the wide bandwidth and low output impedance of the BCM, low frequency bypass capacitance and significant energy storage may be more densely and efficiently provided by adding ca- pacitance at the input of the BCM. At frequencies <500 kHz the BCM ap- pears as an impedance of R OUT between the source and load. Within this frequency range capacitance at the input appears as effective capacitance on the output per the relationship defined in Eq. 5. COUT = CIN Eq. 6 This enables a reduction in the size and number of capacitors used in a typi- cal system. APPLICATION NOTES (CONT.)
Bus Converter Module MC270A330M024FP vicorpower.com Rev. 1.0 Page 16 of 17 +Vout -Vout Modulator +Vin PC Enable -Vin 2.5 V 100 µA 5 V 2 mA
150 K1000 pF
18.5 V Gate Drive Supply 2.5 V Primary Current Sensing Start up & Fault Logic One shot delay 320/540 ms Wake-Up Power and Logic PC Pull-Up & Source Primary Stage & Resonant Tank 1.5 k Adaptive Soft Start Fast current limit Slow current limit Vref Over-Current Protection Vref (125ºC) TM Over Temperature Protection UVLO OVLO VIN Temperature dependent voltage source COUTLs1 Ls2 Synchronous Rectification Lp1 Lp2 Power Transformer CrLr Cr Lr Primary Gate Drive 2.50 V CS2 Secondary Gate Drive 40 K Figure 22 — BCM block diagram APPLICATION NOTES (CONT.)
Bus Converter Module MC270A330M024FP vicorpower.com Rev. 1.0 7/09 Vicor’s comprehensive line of power solutions includes high density AC-DC and DC-DC modules and accessory components, fully configurable AC-DC and DC-DC power supplies, and complete custom power systems. Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for its use. Vicor components are not designed to be used in applications, such as life support systems, wherein a failure or malfunction could result in injury or death. All sales are subject to Vicor’s Terms and Conditions of Sale, which are available upon request. Specifications are subject to change without notice. Intellectual Property Notice Vicor and its subsidiaries own Intellectual Property (including issued U.S. and Foreign Patents and pending patent applications) relating to the products described in this data sheet. Interested parties should contact Vicor's Intel- lectual Property Department. The products described on this data sheet are protected by the following U.S. Patents Numbers: 7,166,898; 7,187,263; 7,361,844; D496,906; D505,114; D506,438; D509,472; and for use under 6,975,098 and 6,984,965 Vicor Corporation
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