MBR05100AJ3 CYSTEKEC | Alldatasheet

Document overview

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  • PDF pages: 8

Technical content

Features

  • 175℃ operating junction temperature
  • Low VF and low IR type
  • Metal silicon junction, major carrier conduction
  • Guardring for over voltage protection
  • Low power loss, high efficiency
  • High surge capability
  • For use in low voltage, high frequency inverters, free wheeling, and polarity protection application
  • Pb-free lead plating and halogen-free package Mechanical Data
  • Case: TO-252 molded plastic
  • Mounting Position: Any
  • Weight: 0.34 grams approximately
  • Terminals: Pure tin plated, lead-free, solderable per MIL-STD-750 method 2026
  • Epoxy: UL 94V-0 rate flame retardant
  • Polarity : Indicated by diode symbol E q u i v a l e n t C i r c u i t O u t l i n e TO-252AB TO-252AA MBR05100AJ3 IF(A V) 5A VRRM 100V Tj 175°C VF(typ.) 0.65V A K A A K A

CYStech Electronics Corp. Spec. No. : C463J3 Issued Date : 2010.06.30 Revised Date : 2012.07.30 Page No. : 2/8 MBR05100AJ3 CYStek Product Specification Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.) Parameter Symbol Min. Typ. Max. Units Maximum Recurrent peak reverse voltage V RRM 100 V Maximum RMS voltage V RMS 70 V Maximum DC blocking voltage V DC 100 V IF=5A, TC=25℃ 0.85 IF=5A, TC=125℃ 0.65 0.70 IF=10 A, TC=25℃ 0.92 Maximum instantaneous forward voltage at (Note 1) IF=10A, TC=125℃ VF 0.80 V Maximum Average forward rectified current @ TC=133℃ IF(AV) 5 A Peak repetitive forward current (square wave, 20kHz, TC=133℃) IFRM 10 A Non-repetitive peak forward surge current @ 8.3ms single half sine wave superimposed on rated load (JEDEC method) I FSM 110 A Peak repetitive reverse surge current (Note 1 ), TJ<175℃ IRRM 2.5 A VR=100 V, TC=25℃ 5 μA Maximum instantaneous reverse current at VR=100 V, TC=125℃ IR 5 mA Voltage rate of change, (rated VR) dV/dt 10,000 V/ μs Typical junction capacitance @ f=1MHz and applied 5V reverse voltage CJ 105 pF ESD susceptibility (Note 2) 8000 V Storage temperature range T stg -65 +175 ℃ Operating junction temperature range T J -65 +175 ℃ Notes : 1. 2.0μs pulse width, f=1.0kHz 2. Human body model, 1.5k Ω in series with 100pF Thermal Data Parameter Symbol Value Unit Maximum Thermal Resistance, Junction-to-case R th,j-c 2.5 °C/W Maximum Thermal Resistance, Junction-to-ambient R th,j-a 125 °C/W

Ordering Information

(Pb-free lead plating and Halogen-free package) 2500 pcs / Tape & Reel

CYStech Electronics Corp. Spec. No. : C463J3 Issued Date : 2010.06.30 Revised Date : 2012.07.30 Page No. : 3/8 MBR05100AJ3 CYStek Product Specification Typical Characteristics Forward Current Derating Curve 0 25 50 75 100 125 150 175 200 Case Temperature---T C(℃) Average Forward Current---I F(AV)(A) resistive or inductive load per leg Forward Current vs Forward Voltage 100 1000 10000 100000 Forward Voltage---V F(V) Instantaneous Forward Current---IF(mA) Pulse width=300μs, 1% Duty cycle Tj=25℃ Tj=150℃ Per leg Reverse Leakage Current vs Reverse Voltage 0.001 0.01 0.1 100 0 2 04 06 08 0 1 0 0 1 2 0 Reverse Voltage---V R(V) Reverse Leakage Current---I R(μA) Tj=75℃ Tj=25℃ Tj=125℃ Per leg Junction Capacitance vs Reverse Voltage 100 1000 0.1 1 10 100 Reverse Voltage---V R(V) Junction Capacitance---C J(pF) Tj=25℃, f=1.0MHz Per Leg

CYStech Electronics Corp. Spec. No. : C463J3 Issued Date : 2010.06.30 Revised Date : 2012.07.30 Page No. : 4/8 MBR05100AJ3 CYStek Product Specification Recommended soldering footprint

CYStech Electronics Corp. Spec. No. : C463J3 Issued Date : 2010.06.30 Revised Date : 2012.07.30 Page No. : 5/8 MBR05100AJ3 CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C463J3 Issued Date : 2010.06.30 Revised Date : 2012.07.30 Page No. : 6/8 MBR05100AJ3 CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3 °C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6 °C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max.

CYStech Electronics Corp. Spec. No. : C463J3 Issued Date : 2010.06.30 Revised Date : 2012.07.30 Page No. : 7/8 MBR05100AJ3 CYStek Product Specification TO-252AB Dimension *: Typical D1 0.205 0.213 5.200 5.400 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Lead : Pure tin plated
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Marking: Style: Pin 1.Anode 2.Cathode 3.Anode3-Lead TO-252AB Plastic Surface Mount Package CYStek Package Code: J3 CYS 05100A

CYStech Electronics Corp. Spec. No. : C463J3 Issued Date : 2010.06.30 Revised Date : 2012.07.30 Page No. : 8/8 MBR05100AJ3 CYStek Product Specification TO-252AA Dimension *: Typical Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Lead : Pure tin plated.
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Marking: Style: Pin 1.Anode 2.Cathode 3.Anode3-Lead TO-252AA Plastic Surface Mount Package CYStek Package Code: J3 CYS 05100A