M393T5160FB3

K4T51043QI SAMSUNG | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 14

Technical content

• 1 - Apr. 2010 SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference pur poses only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein re main the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or other- wise. Samsung products are not intended for use in life sup port, critical care, medical, safety equipment, or similar applications where product failure could result in loss of li fe or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. ⓒ 2010 Samsung Electronics Co., Ltd. All rights reserved. Product Guide DDR2 SDRAM Memory

• 2 - Product Guide DDR2 SDRAM Memory Apr. 2010 1. DDR2 SDRAM MEMORY ORDERING INFORMATION 56 : 256Mb 51 : 512Mb 1G : 1Gb 2G : 2Gb 4G : 4Gb : x 4 : x 4 Stack : x 8 Stack : x 8 : x16 : x 4 Stack (JEDEC Standard) : x 8 Stack (JEDEC Standard) 3 : 4 Banks 4 : 8 Banks 3. DRAM Type 4. Density 5. Bit Organization 6. # of Internal Banks M A B C D E F G H I Q R Z J H M T B C L Y 9. Package Type 8. Revision 10. Temp & Power 1. SAMSUNG Memory : K 2. DRAM : 4 Revision # of Internal Banks Bit Organization Density DRAM Type DRAM SAMSUNG Memory Interface (VDD, VDDQ) Package Type Temp & Power 1 2 3 4 5 6 7 8 9 10 11 Speed T : DDR2 SDRAM : Commercial Temp.( 0°C ~ 95°C) & Normal Power : Commercial Temp.( 0°C ~ 95°C) & Low Power : Commercial Temp.( 0°C ~ 95°C) & Low Voltage : FBGA (Lead-free) : FBGA DDP (Lead-free) : FBGA (Lead-free & Halogen-free) : FBGA DDP (Lead-free & Halogen-free) : FBGA DSP (Lead-free & Halogen-free, Thin) : FBGA (Lead-free & Halogen-free, Flip Chip) : 1st Gen. : 2nd Gen. : 3rd Gen. : 4th Gen. : 5th Gen. : 6th Gen. : 7th Gen. : 8th Gen. : 9th Gen. : 10th Gen. : 17th Gen. : 18th Gen. 11. Speed K 4 T X X X X X X X - X X X X : DDR2-400 (200MHz @ CL=3, tRCD=3, tRP=3) : DDR2-533 (266MHz @ CL=4, tRCD=4, tRP=4) : DDR2-667 (333MHz @ CL=5, tRCD=5, tRP=5) : DDR2-800 (400MHz @ CL=6, tRCD=6, tRP=6) : DDR2-800 (400MHz @ CL=5, tRCD=5, tRP=5) CC Q : SSTL_18 (1.8V, 1.8V) 7. Interface ( V DD, VDDQ)

• 3 - Product Guide DDR2 SDRAM Memory Apr. 2010 2. DDR2 SDRAM Component Product Guide

2.1 SDRAM

Density Banks Part Number Package & Power, Temp. (-C/-L) & Speed Org. PKG Avail. 512Mb I-die 4Banks K4T51043QI HCE7/F7/E6 128M x 4 60 ball FBGA NowK4T51083QI HCE7/F7/E6 64M x 8 K4T51163QI HCF8/E7/F7/E6 32M x 16 84 ball FBGA 1Gb Q-die 8Banks K4T1G044QQ HC(L)E7/F7/E6 256M x 4 60 ball FBGA NowK4T1G084QQ HC(L)E7/F7/E6 128M x 8 K4T1G164QQ HC(L)E7/F7/E6 64M x 16 84 ball FBGA 1Gb E-die 8Banks K4T1G044QE HC(L)E7/F7/E6 256M x 4 60 ball FBGA Now K4T1G084QE HC(L)E7/F7/E6 128M x 8 K4T1G164QE HC(L)E7/F7/E6 64M x 16 84 ball FBGA Now 1Gb F-die 8Banks K4T1G044QF BCE7/F7/E6 256M x 4 60 ball FBGA Jun. ’10 K4T1G084QF BCE7/F7/E6 128M x 8 K4T1G164QF BCE7/F7/E6 64M x 16 84 ball FBGA May. ’10 2Gb A-die 8Banks K4T2G044QA HC(L)F7/E6 512M x 4 68 ball FBGA Now K4T2G084QA HC(L)F7/E6 256M x 8

• 4 - Product Guide DDR2 SDRAM Memory Apr. 2010 3. DDR2 SDRAM Module Ordering Information 3 : DIMM 4 : SODIMM 78 : x64 240pin Unbuffered DIMM 91 : x72 240pin ECC unbuffered DIMM 92 : x72 240pin VLP Registered DIMM 93 : x72 240pin Registered DIMM 95 : x72 240pin Fully Buffered DIMM 70 : x64 200pin Unbuffered SODIMM 32 : 32M 33 : 32M (for 128Mb/512Mb) 64 : 64M 65 : 64M (for 128Mb/512Mb) 28 : 128M 29 : 128M (for 128Mb/512Mb) 56 : 256M 57 : 256M (for 512Mb/2Gb) 51 : 512M 52 : 512M (for 512Mb/2Gb) 1G : 1G 1K : 1G (for 2Gb) 0 : Mother PCB 2 : 2nd Rev. 4 : 4th Rev. T : DDR2 SDRAM 1. Memory Module : M 2. DIMM Type 3. Data Bits 4. DRAM Component Type 5. Depth 12. Speed 11. Temp & Power 10. PCB Revision 8. Component Revision 5 : 4Banks & SSTL-1.8V 6 : 8Banks & SSTL-1.8V 6. # of Banks in comp. & Interface 1 : 1st Rev. 3 : 3rd Rev. A : Parity DIMM S : Reduced PCB : DDR2-400 (200MHz @ CL=3, tRCD=3, tRP=3) : DDR2-533 (266MHz @ CL=4, tRCD=4, tRP=4) : DDR2-667 (333MHz @ CL=5, tRCD=5, tRP=5) : DDR2-800 (400MHz @ CL=6, tRCD=6, tRP=6) : DDR2-800 (400MHz @ CL=5, tRCD=5, tRP=5) CC C L Y : Commercial Temp.( 0°C ~ 95°C) & Normal Power : Commercial Temp.( 0°C ~ 95°C) & Low Power : Commercial Temp.( 0°C ~ 95°C) & Low Voltage Component Revision # of Banks in Comp. & Interface Depth DRAM Component Type Data bits DIMM Type Memory Module Package Temp & Power Speed M X X X T X X X X X X X - X X X X 1 2 3 4 5 6 7 8 9 10 11 12 13 Bit Organization AMB Vendor 0 : x 4 3 : x 8 4 : x16 6 : x 4 Stack (JEDEC Standard) 7 : x 8 Stack (JEDEC Standard) 8 : x 4 Stack 9 : x 8 Stack 7. Bit Organization 13. AMB Vendor For FBDIMM : Intel : IDT : Montage 6, 8 3, 4 NOTE : PC2-6400(DDR2-800), PC2-5300(DDR2-667) PC2-4200(DDR2-533), PC2-3200(DDR2-400) M B D F I R 1st Gen. 3rd Gen. 5th Gen. 7th Gen. 10th Gen. 18th Gen. A C E G Q 2nd Gen. 4th Gen. 6th Gen. 8th Gen. 17th Gen. Z J Q H M E B FBGA(Lead-free) FBGA DDP (Lead-free) FBGA QDP (Lead-free) FBGA (Lead-free & Halogen-free) FBGA DDP (Lead-free & Halogen-free) FBGA QDP (Lead-free & Halogen-free) FBGA (Lead-free & Halogen-free, Flip Chip) 9. Package

• 5 - Product Guide DDR2 SDRAM Memory Apr. 2010 4. DDR2 SDRAM Module Product Guide 240Pin DDR2 Unbuffered DIMM Org. Density Part Number Speed Composition Comp. Version Internal Banks Rank PKG Height Avail. 64Mx 64 512MB M378T6464QZ(H)3 CE7/F7/E6 64M x 16 * 4pcs 1Gb Q-die 1 84 ball FBGA 30mm Now M378T6464EHS CE7/F7/E6 64M x 16 * 4pcs 1Gb E-die 1 128Mx 64 1GB M378T2863QZ(H)S CE7/F7/E6 128M x 8 * 8pcs 1Gb Q-die 60 ball FBGA 30mm Now M378T2863EHS CE7/F7/E6 1Gb E-die M378T2863FBS CE7/F7/E6 1Gb F-die Jun. ’10 128Mx 72 M391T2863QZ(H)3 CE7/F7/E6 128M x 8 * 9pcs 1Gb Q-die Now M391T2863EH3 CE7/F7/E6 1Gb E-die M391T2863FB3 CE7/F7/E6 1Gb F-die Jun. ’10 256Mx 64 2GB M378T5663QZ(H)3 CE7/F7/E6 128M x 8 * 16pcs 1Gb Q-die 82 60 ball FBGA 30mm Now M378T5663EH3 CE7/F7/E6 1Gb E-die M378T5663FB3 CE7/F7/E6 1Gb F-die Jun. ’10 256Mx 72 M391T5663QZ(H)3 CE7/F7/E6 128M x 8 * 18pcs 1Gb Q-die Now M391T5663EH3 CE7/F7/E6 1Gb E-die M391T5663FB3 CE7/F7/E6 1Gb F-die Jun. ’10 512Mx 64 4GB M378T5263AZ(H)3 CF7/E6 256M x 8 * 16pcs 2Gb A-die 82 68 ball FBGA 30mm Now 512Mx 72 M391T5263AZ(H)3 CF7/E6 256M x 8 * 18pcs 2Gb A-die

• 6 - Product Guide DDR2 SDRAM Memory Apr. 2010 200Pin DDR2 SODIMM Org. Density Part Number Speed Composition Comp. Version Internal Banks Rank PKG Height Avail. 64Mx 64 512MB M470T6464QZ(H)3 C(L)E7/F7/E6 64M x 16 * 4pcs 1Gb Q-die 81 84 ball FBGA 30mm NowM470T6464EHS C(L)E7/F7/E6 1Gb E-die M470T6554IH3 CE6 32M x 16 * 8pcs 512Mb I-die 4 2 128Mx 64 1GB M470T2864QZ(H)3 C(L)E7/F7/E6 64M x 16 * 8pcs 1Gb Q-die 2 84 ball FBGA 30mm NowM470T2864EH3 C(L)E7/F7/E6 1Gb E-die M470T2863EH3 C(L)E7/F7/E6 128M x 8 * 8pcs 1 60 ball FBGAM470T2863FB3 CE7/F7/E6 1Gb F-die May. ’10 256Mx 64 2GB M470T5663QZ(H)3 C(L)E7/F7/E6 128M x 8 * 16pcs 1Gb Q-die 60 ball FBGA 30mm Now M470T5663EH3 C(L)E7/F7/E6 1Gb E-die M470T5663FB3 CE7/F7/E6 1Gb F-die May. ’10 512Mx 64 4GB M470T5267AZ(H)3 C(L)F7/E6 st.512M x 8 * 8pcs 2Gb A-die 8 2 83 ball FBGA 30mm Now

• 7 - Product Guide DDR2 SDRAM Memory Apr. 2010 240Pin DDR2 Registered DIMM Org. Density Part Number Speed Composition Comp. Version Internal Banks Rank PKG Height Avail. 128Mx 72 1GB M393T2863QZ(H)3 CD5/CC 128M x 8 * 9pcs 1Gb Q-die 8 1 60 ball FBGA 30mm Now M393T2863QZ(H)A CE7/F7/E6 M393T2863FB3 CE7/F7/E6 1Gb F-die 8 1 Jun. ’10 256Mx 72 2GB M393T5663QZ3 CD5/CC 128M x 8 * 18pcs 1Gb Q-die 60 ball FBGA 30mm Now M393T5663QZ(H)A CE7/F7/E6 M393T5660QZ3 CD5/CC 256M x 4 * 18pcs 1M393T5660QZ(H)A CE7/F7/E6 M393T5660FB3 CE7/F7/E6 1Gb F-die Jun. ’10 512Mx 72 4GB M393T5160QZ3 CD5/CC 256M x 4 * 36pcs 1Gb Q-die 2 60 ball FBGA 30mm Now M393T5160QZ(H)A CE7/F7/E6 M393T5160FB3 CE7/F7/E6 1Gb F-die Jun. ’10 M393T5260AZ(H)A CF7/E6 512M x 4 * 18pcs 2Gb A-die 1 68 ball FBGA Now 1Gx 72 8GB M393T1G60QJ(M)A CE6/D5 DDP 512M x 4 * 36pcs 1Gb Q-die 4 63 ball FBGA 30mm Now M393T1K66AZ(H)A CF7/E6 st.1G x 4 * 18pcs 2Gb A-die 2 83 ball FBGA

• 8 - Product Guide DDR2 SDRAM Memory Apr. 2010 240Pin DDR2 VLP Registered DIMM Org. Density Part Number Speed Composition Comp. Version Internal Banks Rank PKG Height Avail. 64Mx 72 512MB M392T6553GZA CF7/E6 64M x 8 * 9pcs 512Mb G-die 4 1 60 ball FBGA 18.3mm Now 128Mx 72 1GB M392T2863QZ(H)A CF7/E6 128M x 8 * 9pcs 1Gb Q-die 81 60 ball FBGA 18.3mm Now M392T2863FBA CE7/F7/E6 1Gb F-die Jun. ’10 256Mx 72 2GB M392T5660QZ(H)A CF7/E6 256M x 4 * 18pcs 1Gb Q-die 60 ball FBGA 18.3mm Now M392T5660FBA CE7/F7/E6 1Gb F-die Jun. ’10 M392T5663QZ(H)A CF7/E6 128M x 8 * 18pcs 1Gb Q-die Now M392T5663FBA CE7/F7/E6 1Gb F-die Jun. ’10 512Mx 72 4GB M392T5160QJ(M)A CF7/E6 DDP 512M x 4 * 18pcs 1Gb Q-die 8 2 63 ball FBGA 18.3mm Now 1Gx 72 8GB M392T1G60QQ(E)A CE6/D5 QDP 1G x 4 * 18pcs 1Gb Q-die 8 4 65 ball FBGA 18.3mm Now

• 9 - Product Guide DDR2 SDRAM Memory Apr. 2010 240Pin DDR2 Fully Buffered DIMM(1.8V) Org. Density Part Number Speed AMB Composition Comp. Version Internal Banks Rank PKG Height Avail. 64Mx 72 512MB M395T6553GZ4 CE7/F7/E6 6 : IDT C1 64M x 8 * 9pcs 512Mb G-die 4 1 60 ball FBGA 30.35mm Now CE6 5 : Intel D1 128Mx 72 1GB M395T2863QZ(H)4 CE7/F7/E6 6 : IDT C1 128M x 8 * 9pcs 1Gb Q-die 60 ball FBGA 30.35mm NowCE7/F7/E6 8: IDT L4 CE6 5 : Intel D1 M395T2863FB4 CE7/F7/E6 6 : IDT C1 1Gb F-die Jun. ’10 8: IDT L4 256Mx 72 2GB M395T5663QZ(H)4 CE7/F7/E6 6 : IDT C1 128M x 8 * 18pcs 1Gb Q-die 60 ball FBGA 30.35mm Now CE7/F7/E6 8: IDT L4 CE6 5 : Intel D1 3: Montage D3 M395T5663FB4 CE7/F7/E6 6 : IDT C1 1Gb F-die Jun. ’10 8: IDT L4 512Mx 72 4GB M395T5160QZ(H)4 CE7/F7/E6 6 : IDT C1 256M x 4 * 36pcs 1Gb Q-die 60 ball FBGA 30.35mm Now CE6 8: IDT L4 CE6 5 : Intel D1 3: Montage D3 M395T5160FB4 CE7/F7/E6 6 : IDT C1 1Gb F-die Jun. ’10 8: IDT L4 M395T5163QZ(H)4 CE7/F7/E6 8: IDT L4 128M x 8 * 36pcs 1Gb Q-die Now M395T5163FB4 CE7/F7/E6 6 : IDT C1 1Gb F-die Jun. ’10 8: IDT L4 M395T5263AZ(H)4 CF7/E6 6 : IDT C1 256M x 8 * 18pcs 2Gb A-die 2 68 ball FBGA Now CF7/E6 8: IDT L4 1Gx 72 8GB M395T1G60QJ(M)4 CE6/F7 8: IDT L4 DDP 512M x 4 * 36pcs 1Gb Q-die 63 ball FBGA 30.35mm Now M395T1K66AZ(H)4 CF7/E6/D5 6 : IDT C1 st.1G x 4 * 18pcs 2Gb A-die 2 83 ball FBGACF7/E6 8: IDT L4

• 10 - Product Guide DDR2 SDRAM Memory Apr. 2010 240Pin DDR2 Fully Buffered DIMM(1.55V) Org. Density Part Number Speed AMB Composition Comp. Version Internal Banks Rank PKG Height Avail. 128Mx 72 1GB M395T2863QZ(H)4 YE6 8: IDT L4 64M x 8 * 18pcs 1Gb Q-die 8 1 60 ball FBGA 30.35mm Now 256Mx 72 2GB M395T5663QZ(H)4 YE6 8: IDT L4 128M x 8 * 18pcs 1Gb Q-die 8 2 60 ball FBGA 30.35mm Now 512Mx 72 4GB M395T5160QZ(H)4 YE6 8: IDT L4 256M x 4 * 36pcs 1Gb Q-die 26 0 b a l l FBGA 30.35mm Now M395T5163QZ(H)4 YE6 8: IDT L4 128M x 8 * 36pcs 4 M395T5263AZ(H)4 YE6 8: IDT L4 256M x 8 * 18pcs 2Gb A-die 2 68 ball FBGA 1Gx 72 8GB M395T1K66AZ(H)4 YE6 8: IDT L4 st.1G x 4 * 18pcs 2Gb A-die 8 2 83 ball FBGA 30.35mm Now

• 11 - Product Guide DDR2 SDRAM Memory Apr. 2010 5. Package Dimension 11.00 ± 0.10 9.00 ± 0.10 #A1 0.50±0.05 0.35±0.05 1.10±0.10 (0.95) # A1 INDEX MARK (1.90) 11.00 ± 0.10 0.80 x 10 = 8.00 0.80 987654321 9.00 ± 0.10 1.60 0.80 x 8 = 6. 40 1.60 0.80 A B A B C D E F H J K L G 0.10MAX 60Ball FBGA for 1Gb Q-die (x4/x8) Bottom Top 84Ball FBGA for 1Gb Q-die (x16) (0.95) # A1 INDEX MARK (1.90) 13.00 ± 0.10 0.80 x 14 = 11.20 0.80 987654321 1.60 0.80 x 8 = 6. 40 1.60 0.80 A B A B C D E F H J K L M N P R G 13.00 ± 0.10 9.00 ± 0.10 #A1 0.50±0.05 0.35±0.05 1.10±0.10 0.10MAX 9.00 ± 0.10 Bottom Top

• 12 - Product Guide DDR2 SDRAM Memory Apr. 2010 60Ball FBGA for 1Gb E-die (x4/x8) (0.95) # A1 INDEX MARK (1.90) 9.50 ± 0.10 0.80 x 10 = 8.00 0.80 7.50 ± 0.10 1.60 0.80 x 8 = 6. 40 4.00 0.80 A B A B C D E F H J K L G 3.20 0.80 987654321 60-∅0.45 Solder ball

0.2 M AB

(Post reflow 0.50 ± 0.05) MOLDING AREA (Datum A) (Datum B) 9.50 ± 0.10 7.50 ± 0.10 #A1 0.35±0.05 1.10±0.10 0.10MAX Bottom Top 84Ball FBGA for 1Gb E-die (x16) (0.95) # A1 INDEX MARK (1.90) 12.50 ± 0.10 0.80 x 14 = 11.20 0.80 7.50 ± 0.10 1.60 0.80 x 8 = 6. 40 4.00 0.80 A B A B C D E F H J K L G 3.20 0.80 987654321 84-∅0.45 Solder ball (Post reflow 0.50 ± 0.05) MOLDING AREA (Datum A) (Datum B) M N P R 12.50 ± 0.10 7.50 ± 0.10 #A1 0.35±0.05 1.10±0.10 0.10MAX Bottom Top

• 13 - Product Guide DDR2 SDRAM Memory Apr. 2010 60Ball FBGA for 1Gb F-die (x4/x8) Bottom Top Bottom Top 84Ball FBGA for 1Gb F-die (x16) (0.30) # A1 INDEX MARK (0.60) 9.50 ± 0.10 0.80 x 10 = 8.00 0.80 7.50 ± 0.10 1.60 0.80 x 8 = 6. 40 4.00 0.80 A B A B C D E F H J K L G 3.20 0.80 987654321 60-∅0.48 Solder ball

(Post reflow 0.50 ± 0.05) MOLDING AREA (Datum A) (Datum B) 9.50 ± 0.10 7.50 ± 0.10 #A1 0.37±0.05 1.10±0.10 0.10MAX 12.50 ± 0.10 7.50 ± 0.10 #A1 0.37±0.05 1.10±0.10 0.10MAX (0.30) # A1 INDEX MARK (0.60) 12.50 ± 0.10 0.80 x 14 = 11.20 0.80 7.50 ± 0.10 1.60 0.80 x 8 = 6. 40 5.60 0.80 A B A B C D E F H J K L G 3.20 0.80 987654321 84-∅0.48 Solder ball (Post reflow 0.50 ± 0.05) MOLDING AREA (Datum A) (Datum B) M N P R

• 14 - Product Guide DDR2 SDRAM Memory Apr. 2010 Bottom Top #A1 (0.95) # A1 INDEX MARK (1.90) 18.00 ± 0.10 8.000.80 11.00 ± 0.10 0.80 1.60 3.20 0.80 x 18 = 14.40 7.20 18.00 ± 0.10 11.00 ± 0.10 0.10MAX 0.35 ± 0.05 1.10 ± 0.10 987654321 A B C D E F H J K L M N P R G T U V W 68-∅0.45 Solder ball

(Post reflow 0.50 ± 0.05) 0.80 x 8 = 6.40 (Datum A) (Datum B) MOLDING AREA 68Ball FBGA for 2Gb A-die (x4/x8)