M393B1K70CH0

K4B1G0446E SAMSUNG | Alldatasheet

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• 1 - May. 2010 SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference pur poses only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein re main the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or other- wise. Samsung products are not intended for use in life sup port, critical care, medical, safety equipment, or similar applications where product failure could result in loss of li fe or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. ⓒ 2010 Samsung Electronics Co., Ltd. All rights reserved. Product Guide DDR3 SDRAM Memory

• 2 - Product Guide DDR3 SDRAM Memory May. 2010 1. DDR3 SDRAM MEMORY ORDERING INFORMATION 51 : 512Mb 1G : 1Gb 2G : 2Gb 4G : 4Gb 04 : x 4 08 : x 8 16 : x16 3 : 4 Banks 4 : 8 Banks 5 : 16 Banks 3. DRAM Type 4. Density 5. Bit Organization 6. # of Internal Banks M A B C D E F G H Z H J M C L Y 9. Package Type 8. Revision 10. Temp & Power 1. SAMSUNG Memory : K 2. DRAM : 4 Revision # of Internal Banks Bit Organization Density DRAM Type DRAM SAMSUNG Memory Interface (VDD, VDDQ) Package Type Temp & Power 1 2 3 4 5 6 7 8 9 10 11 Speed B : DDR3 SDRAM : Commercial Temp.( 0°C ~ 85°C) & Normal Power : Commercial Temp.( 0°C ~ 85°C) & Low Power : Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V) : FBGA (Lead-free) : FBGA (Halogen-free & Lead-free) : FBGA (Lead-free, DDP) : FBGA (Halogen-free & Lead-free, DDP) : 1st Gen. : 2nd Gen. : 3rd Gen. : 4th Gen. : 5th Gen. : 6th Gen. : 7th Gen : 8th Gen : 9th Gen 11. Speed K 4 B X X X X X X X - X X X X : DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6) : DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7) : DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9) : DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11) 6 : SSTL (1.5V, 1.5V) 7. Interface ( VDD, VDDQ)

• 3 - Product Guide DDR3 SDRAM Memory May. 2010 2. DDR3 SDRAM Component Product Guide * NOTE : 1.35V product is 1.5V operatable. Density Banks Part Number Package & Power, Temp. (-C/-L) & Speed Org. VDD Voltage PKG Avail. NOTE 1Gb E-die 8Banks K4B1G0446E HC(L)F7/F8/H9/K0 256M x 4 1.5V 78 ball FBGA Now K4B1G0846E HC(L)F7/F8/H9/K0 128M x 8 K4B1G1646E HC(L)F7/F8/H9/K0 64M x 16 96 ball FBGA K4B1G0446E HYF7/F8/H9 256M x 4 1.35V 78 ball FBGAK4B1G0846E HYF7/F8/H9 128M x 8 1Gb F-die 8Banks K4B1G0446F HC(L)F8/H9/K0 256M x 4 1.5V 78 ball FBGA Now K4B1G0846F HC(L)F8/H9/K0 128M x 8 K4B1G0446F HY(L)F8/H9 256M x 4 1.35V K4B1G0846F HY(L)F8/H9 128M x 8 2Gb B-die 8Banks K4B2G0446B HC(L)F7/F8/H9 512M x 4 1.5V 78 ball FBGA Now K4B2G0846B HC(L)F7/F8/H9 256M x 8 K4B2G1646B HC(L)F7/F8/H9 128M x 16 96 ball FBGA K4B2G0446B HYF7/F8/H9 512M x 4 1.35V 78 ball FBGAK4B2G0846B HYF7/F8/H9 256M x 8 2Gb C-die 8Banks K4B2G0446C HC(L)F8/H9/K0 512M x 4 1.5V 78 ball FBGA Now K4B2G0846C HC(L)F8/H9/K0 256M x 8 K4B2G0446C HY(L)F8/H9 512M x 4 1.35V K4B2G0846C HY(L)F8/H9 256M x 8 DDP 2Gb E-die 8Banks K4B2G0446E MC(L)F7/F8/H9 512M x 4 1.5V 78 ball FBGA Now K4B2G0846E MC(L)F7/F8/H9 256M x 8 4Gb A-die 8Banks K4B4G0446A HC(L)F8/H9/K0 1G x 4 1.5V 78 ball FBGA Now K4B2G0846A HC(L)F8/H9/K0 512M x 8 K4B4G0446A HY(L)F8/H9/K0 1G x 4 1.35V K4B2G0846A HY(L)F8/H9/K0 512M x 8 DDP 4Gb B-die 8Banks K4B4G0446B MC(L)F7/F8/H9 1G x 4 1.5V 78 ball FBGA Now K4B2G0846B MC(L)F7/F8/H9 512M x 8 DDP 4Gb C-die 8Banks K4B4G0446C MC(L)F7/F8/H9 1G x 4 1.5V 78 ball FBGA Feb.’10 K4B2G0846C MC(L)F7/F8/H9 512M x 8

• 4 - Product Guide DDR3 SDRAM Memory May. 2010 3. DDR3 SDRAM Module Ordering Information 3 : DIMM 4 : SODIMM Z FBGA(Lead-free) H FBGA(Lead-free & Halogen-free) J FBGA(Lead-free, DDP) M FBGA(Lead-free & Halogen-free, DDP) : 32M 33 : 32M (for 128Mb/512Mb) 64 : 64M 65 : 64M (for 128Mb/512Mb) 28 : 128M 29 : 128M (for 128Mb/512Mb) 56 : 256M 57 : 256M (for 512Mb/2Gb) 51 : 512M 52 : 512M (for 512Mb/2Gb) 1G : 1G 1K : 1G (for 2Gb) 2G : 2G 2K : 2G (for 2Gb) M 1st Gen. A 2nd Gen. B 3rd Gen. C 4th Gen. D 5th Gen. E 6th Gen. F : 7th Gen. G 8th Gen. 0 : None 2 : 2nd Rev. 4 : 4th Rev. B : DDR3 SDRAM (1.5V VDD) 1. Memory Module : M 2. DIMM Type 3. Data Bits 4. DRAM Component Type 5. Depth 12. Speed 11. Temp & Power 10. PCB Revision 9. Package 8. Component Revision 7 : 8Banks & SSTL-1.5V 6. # of Banks in comp. & Interface 1 : 1st Rev. 3 : 3rd Rev. S : Reduced Layer C Y : Commercial Temp.( 0°C ~ 85°C) & Normal Power : Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V) NOTE: PC3-6400(DDR3-800),PC3-8500(DDR3-1066), PC3-10600(DDR3-1333), PC3-12800(DDR3-1600) Component Revision # of Banks in Comp. & Interface Depth DRAM Component Type Data bits DIMM Type Memory Module Package Temp & Power Speed M X X X B X X X X X X X - X X X 1 2 3 4 5 6 7 8 9 10 11 12 Bit Organization 0 : x 4 3 : x 8 4 : x16 7. Bit Organization : DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6) : DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7) : DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9) : DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11) : x64 204pin Unbuffered SODIMM 78 : x64 240pin Unbuffered DIMM 91 : x72 240pin ECC unbuffered DIMM 92 : x72 240pin VLP Registered DIMM 93 : x72 240pin Registered DIMM

• 5 - Product Guide DDR3 SDRAM Memory May. 2010 4. DDR3 SDRAM Module Product Guide 4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product) * NOTE : K0(1600Mbps) will be available by ES level 4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product) * NOTE : 1.35V product is 1.5V operatable. 240Pin DDR3 Unbuffered DIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal Banks Rank PKG Height Avail. NOTE 128Mx 64 1GB M378B2873EH1 CF8/H9 A(1Rx8) 128M x 8 * 8 pcs 1Gb E-die 81 78 ball FBGA 30mm Now M378B2873FH0 CF8/H9/K0* 128M x 8 * 8 pcs 1Gb F-die 128Mx 72 1GB M391B2873EH1 CF8/H9 D(1Rx8) 128M x 8 * 9 pcs 1Gb E-die 81 78 ball FBGA 30mm Now M391B2873FH0 CF8/H9/K0* 128M x 8 * 9 pcs 1Gb F-die 256Mx 64 2GB M378B5673EH1 CF8/H9 B(2Rx8) 128M x 8 * 16 pcs 1Gb E-die 82 78 ball FBGA 30mm NowM378B5673FH0 CF8/H9/K0* 128M x 8 * 16 pcs 1Gb F-die M378B5773CH0 CF8/H9/K0* A(1Rx8) 256M x 8 * 8 pcs 2Gb C-die 8 1 256Mx 72 2GB M391B5673EH1 CF8/H9 E(2Rx8) 128M x 8 * 18 pcs 1Gb E-die 2 78 ball FBGA 30mm NowM391B5673FH0 CF8/H9/K0* 128M x 8 * 18 pcs 1Gb F-die M391B5773CH0 CF8/H9/K0* D(1Rx8) 256M x 8 * 9 pcs 2Gb C-die 1 512Mx 64 4GB M378B5273BH1 CF8/H9 B(2Rx8) 256M x 8 * 16 pcs 2Gb B-die 82 78 ball FBGA 30mm Now M378B5273CH0 CF8/H9/K0* 256M x 8 * 16 pcs 2Gb C-die 512Mx 72 4GB M391B5273BH1 CF8/H9 E(2Rx8) 256M x 8 * 18 pcs 2Gb B-die 82 78 ball FBGA 30mm Now M391B5273CH0 CF8/H9/K0* 256M x 8 * 18 pcs 2Gb C-die 1Gx 64 8GB M378B1G73AH0 CF8/H9/K0* B(2Rx8) 512M x 8 * 16 pcs 4Gb A-die 8 2 78 ball FBGA 30mm Now 1Gx 72 8GB M391B1G73AH0 CF8/H9/K0* E(2Rx8) 512M x 8 * 18 pcs 4Gb A-die 8 2 78 ball FBGA 30mm Now 240Pin DDR3 Unbuffered DIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal Banks Rank PKG Height Avail. NOTE 128Mx 72 1GB M391B2873EH1 YF8/H9 D(1Rx8) 128M x 8 * 9 pcs 1Gb E-die 81 78 ball FBGA 30mm Now M391B2873FH0 YF8/H9 128M x 8 * 9 pcs 1Gb F-die 256Mx 72 2GB M391B5673EH1 YF8/H9 E(2Rx8) 128M x 8 * 18 pcs 1Gb E-die 82 78 ball FBGA 30mm NowM391B5673FH0 YF8/H9 128M x 8 * 18 pcs 1Gb F-die M391B5773CH0 YF8/H9 D(1Rx8) 256M x 8 * 9 pcs 2Gb C-die 8 1 512Mx 72 4GB M391B5273BH1 YF8/H9 E(2Rx8) 256M x 8 * 18 pcs 2Gb B-die 82 78 ball FBGA 30mm Now M391B5273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die 1Gx 72 8GB M391B1G73AH0 YF8/H9 E(2Rx8) 512M x 8 * 18 pcs 4Gb A-die 8 2 78 ball FBGA 30mm Now

• 6 - Product Guide DDR3 SDRAM Memory May. 2010 4.3 204Pin DDR3 SoDIMM (1.5V Product) 4.4 204Pin DDR3 SoDIMM (1.35V Product) * NOTE : 1.35V product is 1.5V operatable. 204Pin DDR3 SODIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal Banks Rank PKG Height Avail. NOTE 128Mx 64 1GB M471B2873EH1 CF8/H9 B(1Rx8) 128M x 8 * 8 pcs 1Gb E-die 8 1 78 ball FBGA 30mm NowM471B2874EH1 CF8/H9 A(2Rx16) 64M x 16 * 8 pcs 1Gb E-die 8 2 96 ball M471B2873FHS CF8/H9 B(1Rx8) 64M x 16 * 8 pcs 1Gb F-die 8 1 78 ball FBGA 256Mx 64 2GB M471B5673EH1 CF8/H9 F(2Rx8) 128M x 8 * 16 pcs 1Gb E-die 82 78 ball FBGA 30mm NowM471B5673FH0 CF8/H9 128M x 8 * 16 pcs 1Gb F-die M471B5773CHS CF8/H9 B(1Rx8) 256M x 8 * 8 pcs 2Gb C-die 8 1 512Mx 64 4GB M471B5273BH1 CF8/H9 F(2Rx8) 256M x 8 * 16 pcs 2Gb B-die 82 78 ball FBGA 30mm Now M471B5273CH0 CF8/H9 256M x 8 * 16 pcs 2Gb C-die 1Gx 64 8GB M471B1G73AH0 CF8/H9 F(2Rx8) 512M x 8 * 16 pcs 4Gb A-die 8 2 78 ball FBGA 30mm Now 204Pin DDR3 SODIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal Banks Rank PKG Height Avail. NOTE 128Mx 64 1GB M471B2873FHS YF8/H9 B(1Rx8) 128M x 8 * 8 pcs 1Gb F-die 8 1 78 ball FBGA 30mm Now 256Mx 64 2GB M471B5673FH0 YF8/H9 F(2Rx8) 128M x 8 * 16 pcs 1Gb F-die 8 2 78 ball FBGA 30mm Now M471B5773CHS YF8/H9 B(1Rx8) 256M x 8 * 8 pcs 2Gb C-die 8 1 512Mx 64 4GB M471B5273BH1 YF8/H9 F(2Rx8) 256M x 8 * 16 pcs 2Gb B-die 82 78 ball FBGA 30mm Now M471B5273CH0 YF8/H9 256M x 8 * 16 pcs 2Gb C-die 1Gx 64 8GB M471B1G73AH0 YF8/H9 F(2Rx8) 512M x 8 * 16 pcs 4Gb A-die 8 2 78 ball FBGA 30mm Now

• 7 - Product Guide DDR3 SDRAM Memory May. 2010 4.5 240Pin DDR3 Registered DIMM (1.5V Product) 240Pin DDR3 Registered DIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal Banks Rank PKG Height Avail. NOTE 128Mx 72 1GB M393B2873EH1 CF8/H9 A(1Rx8) 128M x 8 * 9 pcs 1Gb E-die 81 78 ball FBGA 30mm Now M393B2873FH0 CF8/H9 128M x 8 * 9 pcs 1Gb F-die 256Mx 72 2GB M393B5673EH1 CF8/H9 B(2Rx8) 128M x 8 * 18 pcs 1Gb E-die 78 ball FBGA 30mm Now M393B5673FH0 CF8/H9 128M x 8 * 18 pcs 1Gb F-die M393B5670EH1 CF8/H9 C(1Rx4) 256M x 4 * 18 pcs 1Gb E-die 1M393B5670FH0 CF8/H9 256M x 4 * 18 pcs 1Gb F-die M393B5773CH0 CF8/H9 A(1Rx8) 256M x 8 * 9 pcs 2Gb C-die 512Mx 72 4GB M393B5173EH1 CF8 H(4Rx8 128M x 8 * 36 pcs 1Gb E-die 78 ball FBGA 30mm Now M393B5173FH0 CF8/H9 128M x 8 * 36 pcs 1Gb F-die M393B5170EH1 CF8/H9 E(2Rx4) 256M x 4 * 36 pcs 1Gb E-die M393B5170FH0 CF8/H9 256M x 4 * 36 pcs 1Gb F-die M393B5273BH1 CF8/H9 B(2Rx8) 256M x 8 * 18 pcs 2Gb B-die M393B5273CH0 CF8/H9 256M x 8 * 18 pcs 2Gb C-die M393B5270BH1 CF8/H9 C(1Rx4) 512M x 4 * 18 pcs 2Gb B-die M393B5270CH0 CF8/H9 512M x 4 * 18 pcs 2Gb C-die 1Gx 72 8GB M393B1G70EM1 CF8 F(4Rx4) DDP 512M x 4 * 36 pcs 1Gb E-die 78 ball FBGA 30mm Now M393B1K73BH1 CF8 H(4Rx8) 256M x 8 * 36 pcs 2Gb B-die M393B1K73CH0 CF8/H9 256M x 8 * 36 pcs 2Gb C-die M393B1K70BH1 CF8/H9 E(2Rx4) 512M x 4 * 36 pcs 2Gb B-die M393B1K70CH0 CF8/H9 512M x 4 * 36 pcs 2Gb C-die 2Gx 72 16GB M393B2K70BM1 CF8 F(4Rx4) DDP 1G x 4 * 36 pcs 2Gb B-die 78 ball FBGA 30mm NowM393B2K70CM0 CF8/H9 DDP 1G x 4 * 36 pcs 2Gb C-die M393B2G70AH0 CF8/H9 E(2Rx4) 1G x 4 * 36 pcs 4Gb A-die 2 M393B2G73AH0 CF8/H9 H(4Rx8) 512M x 8 * 36 pcs 4Gb A-die 4 4Gx 72 32GB M393B4G70AH0 CF8/H9 AB(4Rx4) DDP 2G x 4 * 36 pcs 4Gb A-die 8 4 78 ball FBGA 30mm Now

• 8 - Product Guide DDR3 SDRAM Memory May. 2010 4.6 240Pin DDR3 Registered DIMM (1.35V Product) * NOTE : 1.35V product is 1.5V operatable. 240Pin DDR3 Registered DIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal Banks Rank PKG Height Avail. NOTE 128Mx 72 1GB M393B2873EH1 YF8/H9 A(1Rx8) 128M x 8 * 9 pcs 1Gb E-die 81 78 ball FBGA 30mm Now M393B2873FH0 YF8/H9 128M x 8 * 9 pcs 1Gb F-die 256Mx 72 2GB M393B5673EH1 YF8/H9 B(2Rx8) 128M x 8 * 18 pcs 1Gb E-die 78 ball FBGA 30mm Now M393B5673FH0 YF8/H9 128M x 8 * 18 pcs 1Gb F-die M393B5670EH1 YF8/H9 C(1Rx4) 256M x 4 * 18 pcs 1Gb E-die 81M393B5670FH0 YF8/H9 256M x 4 * 18 pcs 1Gb F-die M393B5773CH0 YF8/H9 A(1Rx8) 256M x 8 * 9 pcs 2Gb C-die 512Mx 72 4GB M393B5173EH1 YF8 H(4Rx8) 128M x 8 * 36 pcs 1Gb E-die 78 ball FBGA 30mm Now M393B5173FH0 YF8/H9 128M x 8 * 36 pcs 1Gb F-die M393B5170EH1 YF8/H9 E(2Rx4) 256M x 4 * 36 pcs 1Gb E-die M393B5170FH0 YF8/H9 256M x 4 * 36 pcs 1Gb F-die M393B5273BH1 YF8/H9 B(2Rx8) 256M x 8 * 18 pcs 2Gb B-die M393B5273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die M393B5270BH1 YF8/H9 C(1Rx4) 512M x 4 * 18 pcs 2Gb B-die M393B5270CH0 YF8/H9 512M x 4 * 18 pcs 2Gb C-die 1Gx 72 8GB M393B1G70EM1 YF8 F(4Rx4) DDP 512M x 4 * 36 pcs 1Gb E-die 8 4 78 ball FBGA 30mm Now M393B1K73BH1 YF8 H(4Rx8) 256M x 8 * 36 pcs 2Gb B-die M393B1K73CH0 YF8/H9 256M x 8 * 36 pcs 2Gb C-die M393B1K70BH1 YF8/H9 E(2Rx4) 512M x 4 * 36 pcs 2Gb B-die M393B1K70CH0 YF8/H9 512M x 4 * 36 pcs 2Gb C-die 2Gx 72 16GB M393B2K70BM1 YF8 F(4Rx4) DDP 1G x 4 * 36 pcs 2Gb B-die 84 78 ball FBGA 30mm NowM393B2K70CM0 YF8/H9 DDP 1G x 4 * 36 pcs 2Gb C-die M393B2G70AH0 YF8/H9 E(2Rx4) 1G x 4 * 36 pcs 4Gb A-die M393B2G73AH0 YF8/H9 H(4Rx8) 512M x 8 * 36 pcs 4Gb A-die 4Gx 72 32GB M393B4G70AH0 YF8/H9 AB(4Rx4) DDP 2G x 4 * 36 pcs 4Gb A-die 8 4 78 ball FBGA 30mm Now

• 9 - Product Guide DDR3 SDRAM Memory May. 2010 4.7 240Pin DDR3 VLP Registered DIMM (1.5V Product) 240Pin DDR3 VLP Registered DIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal Banks Rank PKG Height Avail. NOTE 128Mx 72 1GB M392B2873EH1 CF8/H9 K(1Rx8) 128M x 8 * 9 pcs 1Gb E-die 81 78 ball FBGA 18.75mm Now M392B2873FH0 CF8/H9 128M x 8 * 9 pcs 1Gb F-die 256Mx 72 2GB M392B5673EH1 CF8/H9 L(2Rx8 128M x 8 * 18 pcs 1Gb E-die 78 ball FBGA 18.75mm Now M392B5673FH0 CF8/H9 128M x 8 * 18 pcs 1Gb F-die M392B5670EH1 CF8/H9 M(1Rx4) 256M x 4 * 18 pcs 1Gb E-die M392B5670FH0 CF8/H9 256M x 4 * 18 pcs 1Gb F-die M392B5773CH0 CF8/H9 K(1Rx8) 128M x 8 * 9 pcs 1Gb F-die 1 512Mx 72 4GB M392B5170EM1 CF8/H9 N(2Rx4) DDP 512M x 4 * 18 pcs 1Gb E-die 78 ball FBGA 18.75mm Now M392B5170FM0 CF8/H9 DDP 512M x 4 * 18 pcs 1Gb F-die M392B5273BH1 CF8/H9 L(2Rx8) 256M x 8 * 18 pcs 2Gb B-die M392B5273CH0 CF8/H9 256M x 8 * 18 pcs 2Gb C-die M392B5270BH1 CF8/H9 M(1Rx4) 512M x 4 * 18 pcs 2Gb B-die M392B5270CH0 CF8/H9 512M x 4 * 18 pcs 2Gb C-die 1Gx 72 8GB M392B1K73BM1 CF8 V(4Rx8) DDP 512M x 8 * 18 pcs 2Gb B-die 78 ball FBGA 18.75mm Now M392B1K73CM0 CF8/H9 DDP 512M x 8 * 18 pcs 2Gb C-die M392B1K70BM1 CF8/H9 N(2Rx4) DDP 1G x 4 * 18 pcs 2Gb B-die M392B1K70CM0 CF8/H9 DDP 1G x 4 * 18 pcs 2Gb C-die 2Gx 72 16GB M392B2G70AM0 CF8/H9 N(2Rx4) DDP 2G x4 * 18 pcs 4Gb A-die 78 ball FBGA 18.75mm Jun.’10 M392B2G73AM0 CF8/H9 V(4Rx8) DDP 1G x8 * 18 pcs 4Gb A-die 4 Jun.’10

• 10 - Product Guide DDR3 SDRAM Memory May. 2010 4.8 240Pin DDR3 VLP Registered DIMM (1.35V Product) * NOTE : 1.35V product is 1.5V operatable. 240Pin DDR3 VLP Registered DIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal Banks Rank PKG Height Avail. NOTE 128Mx 72 1GB M392B2873EH1 YF8/H9 K(1Rx8) 128M x 8 * 9 pcs 1Gb E-die 81 78 ball FBGA 18.75mm Now M392B2873FH0 YF8/H9 128M x 8 * 9 pcs 1Gb F-die 256Mx 72 2GB M392B5673EH1 YF8/H9 L(2Rx8) 128M x 8 * 18 pcs 1Gb E-die 78 ball FBGA 18.75mm Now M392B5673FH0 YF8/H9 128M x 8 * 18 pcs 1Gb F-die M392B5670EH1 YF8/H9 M(1Rx4) 256M x 4 * 18 pcs 1Gb E-die 81M392B5670FH0 YF8/H9 256M x 4 * 18 pcs 1Gb F-die M392B5773CH0 YF8/H9 K(1Rx8) 512M x 4 * 9 pcs 2Gb C-die 512Mx 72 4GB M392B5170EM1 YF8/H9 N(2Rx4) DDP 512M x 4 * 18 pcs 1Gb E-die 8 2 78 ball FBGA 18.75mm Now M392B5170FM0 YF8/H9 N(2Rx4) 512M x 4 * 18 pcs 1Gb F-die 82M392B5273BH1 YF8/H9 L(2Rx8) 256M x 8 * 18 pcs 2Gb B-die M392B5273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die M392B5270BH1 YF8/H9 M(1Rx4) 512M x 4 * 18 pcs 2Gb B-die M392B5270CH0 YF8/H9 512M x 4 * 18 pcs 2Gb C-die 1Gx 72 8GB M392B1K73BM1 YF8 V(4Rx8) DDP 512M x 8 * 18 pcs 2Gb B-die 78 ball FBGA 18.75mm Now M392B1K73CM0 YF8 DDP 512M x 8 * 18 pcs 2Gb C-die M392B1K70BM1 YF8/H9 N(2Rx4) DDP 1G x 4 * 18 pcs 2Gb B-die M392B1K70CM0 YF8/H9 DDP 1G x 4 * 18 pcs 2Gb C-die 2Gx 72 16GB M392B2G70AM0 YF8/H9 N(2Rx4) DDP 2G x4 * 18 pcs 4Gb A-die 78 ball FBGA 18.75mm Now M392B2G73AM0 YF8/H9 V(4Rx8) DDP 1G x8 * 18 pcs 4Gb A-die 4 Jun.’10

• 11 - Product Guide DDR3 SDRAM Memory May. 2010 5. RDIMM RCD Information 5.1 5.1 RCD Identification in JEDEC Description in Module Label 5.2 5.2 Label Example

5.3 RCD Information

• Example Voltage Vendor Revision Module P/N JEDEC Description On Label 1.5V Inphi LV GS02 C0 M393B5170EH1-CH9 4GB 2Rx4 PC3-10600R-09-10-E1-P1 IDT LV DDR3 B0 M393B5170EH1-CH9 4GB 2Rx4 PC3-10600R-09-10-E1-D2 1.35V Inphi LV GS02 C0 M393B5170EH1-YF8 4GB 2Rx4 PC3L-8500R-07-10-E1-P1 IDT LV DDR3 B0 M393B5170EH1-YF8 4GB 2Rx4 PC3L-8500R-07-10-E1-D2 4GB 2Rx4 PC3 - 10600R - 09 - 10 - E1 - P1 Made in Korea M393B5170EH1-CH9 0920

• 12 - Product Guide DDR3 SDRAM Memory May. 2010 6. Package Dimension 78Ball FBGA for 1Gb E-die (x4/x8) / 1Gb F-die (x4/x8) / 2Gb C-die (x4/x8) A B C D E F G H M N 7.50 ± 0.10 0.80 x 12 = 9.60 0.80 x 8 = 6.40 3.200.80 4.80 78 - ∅0.45 Solder ball

0.2 ABM

(Datum B) (Datum A) 1.60 MOLDING AREA #A1 INDEX MARK B A 11.00 ± 0.10 J K L 0.80 0.80 (Post Reflow ∅0.05 ± 0.05) (0.95) (1.90) Bottom Top #A1 7.50 ± 0.10 11.00 ± 0.10 0.10MAX 0.50 ± 0.05 1.10 ± 0.10 0.35 ± 0.05 876543219 96Ball FBGA for 1Gb E-die (x16) Bottom Top A B C D E F G H J L M N P R T 7.50 ± 0.10 6.00(Datum B) (Datum A) #A1 INDEX MARK 13.30 ± 0.10 K 0.80 x 15 = 12.00 B A 0.80 0.40 96 - ∅0.45 Solder ball MOLDING AREA(Post Reflow ∅0.05 ± 0.05) (0.95) (1.90) #A1 7.50 ± 0.10 13.30 ± 0.10 0.10MAX 0.50 ± 0.05 1.10 ± 0.10 0.35 ± 0.05 0.80 x 8 = 6.40 3.200.80 1.60 876543219

• 13 - Product Guide DDR3 SDRAM Memory May. 2010 78Ball FBGA for 2Gb B-die (x4/x8) A B C D E F G H M N 9.00 ± 0.10 0.80 x 12 = 9.60 3.200.80 4.80 78 - ∅0.45 Solder ball

(Datum B) (Datum A) 1.60 MOLDING AREA #A1 INDEX MARK B A Bottom 11.50 ± 0.10 J K L 0.80 0.80 (Post Reflow ∅0.50 ± 0.05) (0.95) (1.90) 0.10MAX 1.10 ± 0.10 #A1 9.00 ± 0.10 11.50 ± 0.10 0.35 ± 0.05 Top 876543219 96Ball FBGA for 2Gb B-die (x16) A B C D E F G H J L M N P R T 9.00 ± 0.10 3.200.80 6.00(Datum B) (Datum A) 1.60 #A1 INDEX MARK 13.30 ± 0.10 K 0.80 x 12 = 12.00 B A0.80 0.40 96 - ∅0.45 Solder ball MOLDING AREA(Post Reflow ∅0.50 ± 0.05) (0.95) (1.90) Bottom 0.10MAX 1.10 ± 0.10 #A1 9.00 ± 0.10 13.30 ± 0.10 0.35 ± 0.05 Top 876543219

• 14 - Product Guide DDR3 SDRAM Memory May. 2010 78Ball DDP for 1Gb E-die (x4/x8) Bottom Top A B C D E F G H M N 9.00 ± 0.10 0.80 x 12 = 9.60 0.80 x 8 = 6.40 3.200.80 4.80 78 - ∅0.45 Solder ball

(Datum B) (Datum A) 876543219 1.60 #A1 INDEX MARK B A 11.50 ± 0.10 J K L 0.80 0.80 (Post Reflow ∅0.50 ± 0.05) 0.10MAX 1.40 ± 0.10 #A1 9.00 ± 0.10 11.50 ± 0.10 0.35 ± 0.05 78Ball DDP for 2Gb B-die (x4/x8) Bottom Top A B C D E F G H M N 10.00 ± 0.10 0.80 x 12 = 9.60 0.80 x 8 = 6.40 3.200.80 4.80 78 - ∅0.45 Solder ball (Datum B) (Datum A) 876543219 1.60 #A1 INDEX MARK B A 11.50 ± 0.10 J K L 0.80 0.80 (Post Reflow ∅0.50 ± 0.05) 0.10MAX 1.40 ± 0.10 #A1 10.00 ± 0.10 11.50 ± 0.10 0.35 ± 0.05

• 15 - Product Guide DDR3 SDRAM Memory May. 2010 78Ball DDP for 2Gb C-die (x4/x8) 78Ball for 4Gb A-die (x4/x8) TOP VIEW A B C D E F G H M N 8.00 ± 0.10 0.80 x 12 = 9.60 0.80 x 8 = 6.40 3.200.80 4.80 78 - ∅0.45 Solder ball

(Datum B) (Datum A) 876543219 1.60 #A1 INDEX MARK B A BOTTOM VIEW 11.00 ± 0.10 J K L 0.80 0.80 (Post Reflow ∅0.50 ± 0.05) 0.10MAX 1.40 ± 0.10 #A1 8.00 ± 0.10 11.00 ± 0.10 0.35 ± 0.05 TOP VIEW A B C D E F G H M N 0.80 x 12 = 9.60 3.20 0.80 4.80 78 - ∅0.45 Solder ball (Datum B) (Datum A) 1.60 MOLDING AREA #A1 INDEX MARK B BOTTOM VIEW 12.50 ± 0.10 J K L 0.80 0.80 (Post Reflow ∅0.50 ± 0.05) (0.95) (1.90) 876543219 x 8 = 6.40 A 0.80 10.00 ± 0.10 0.10MAX 1.10 ± 0.10 #A1 10.00 ± 0.10 12.50 ± 0.10 0.35 ± 0.05

• 16 - Product Guide DDR3 SDRAM Memory May. 2010 7. Module Dimension x64/x72 240pin DDR3 SDRAM Unbuffered DIMM 133.35 ± 0.15 Max 4.0 54.675 Units : Millimeters 9.50 128.95 (2) (4X)3.00 ± 0.1 30.00 ± 0.15 2.30 17.30 A B 47.00 71.00 2.50 1.00 0.2 ± 0.15 2.50 ± 0.20 Detail B 5.00 Detail A 1.50±0.10 0.80 ± 0.05 3.80 2x 2.10 ± 0.15 2.50 SPD N/A (for x72) (for x64) ECC 1.270 ± 0.10 N/A (for x64) (for x72) ECC

• 17 - Product Guide DDR3 SDRAM Memory May. 2010 x64 204pin DDR3 SDRAM Unbuffered SODIMM

0.25 MAX

2.55 Detail BDetail A 1.00 ± 0.10 0.45 ± 0.03 4.00 ± 0.10 67.60 SPD

0.10 ABM C

2X 4.00 ± 0.10 2X 1.80 (OPTIONAL HOLES) 0.60 Units : Millimeters 21.00 24.80 63.60 39.00 A B 1.65 30.00 ± 0.15 20.00 Max 3.8 1.00 ± 0.10

• 18 - Product Guide DDR3 SDRAM Memory May. 2010 x72 240pin DDR3 SDRAM Registered DIMM Register Address, Command and Control lines AB 47.00 71.00 Units : Millimeters 9.50 128.95 (2X)3.00 17.30 Register 1.00 0.2 ± 0.15 2.50 ± 0.20 Detail B 5.00 Detail A 1.50±0.10 0.80 ± 0.05 3.80 2.50 C Detail C 10.9 R 0.50 0.4 2x 2.10 ± 0.15 2.30 1.27 ± 0.10 1.0 max 133.35 ± 0.15 2.50 30.00 ± 0.15 Max 4.0 54.675

• 19 - Product Guide DDR3 SDRAM Memory May. 2010 133.15 ± 0.2 4.65± 0.12 130.45 ± 0.15 127 ± 0.12 23.6 ± 0.15 25.6 ± 0.15 7.45 119.29 80.78 Green Line : TIM Attatch Line 0.4 1+0/ -0.3 0.65 ± 0.2 R0.2 R0. 25.6 ± 0.150.15 1.3 1.3 2 2 ± 0.1 2.6 ± 0.2 1. FRONT PART Reg. pedestal line Outside Inside Green Line : TIM Attatch Line Outside Inside 2. BACK PART 29.7731.411.9 9.26 128.5 Registered DIMM Heat Spreader Design

• 20 - Product Guide DDR3 SDRAM Memory May. 2010 19 ± 0.1 39.3 ± 0.2 D E (Clip open size) K text mark ’B’ or ’K’ punch press_stamp B A 39.3 ± 0.2 29.77 R1. 0.1 ~ 0.3 Upper Bending Tilting Gap 0.5 3. CLIP PART C 1.05 132.95 ± 133.45 1.27 4. DDR3 RDIMM ASS’Y View Reference thickness total (Maximum) : Mono Package : 7.55mm, DDP Package 7.71mm (With Clip thickness)

• 21 - Product Guide DDR3 SDRAM Memory May. 2010 133.35 ± 0.15 Units : Millimeters Register 18.10 12.60 Register Address, Command and Control linesVTT VTT A B 47.00 71.00 128.95 C SPD/TS 1.00 0.2 ± 0.15 2.50 ± 0.20 Detail B 5.00 Detail A 1.50±0.10 0.80 ± 0.05 3.80 2.50 9.9 0.6 R 0 .50 Detail C VTT VTT SPD/TS 18.75 ± 0.15 54.675 1.27 ± 0.10 1.0 max Max 4.0 x72 240pin DDR3 SDRAM VLP Registered DIMM

• 22 - Product Guide DDR3 SDRAM Memory May. 2010 1. FRONT PART Outside Inside 2. BACK PART 14.3 DRIVER IC 0.18 -0/+0.1 130.45 Driver IC(DP:0.18mm) 0.4 Driver IC(DP:0.18mm) Outside Inside Driver IC(DP:0.18mm) Driver IC(DP:0.18mm) VLP Registered DIMM Heat Spreader Design

• 23 - Product Guide DDR3 SDRAM Memory May. 2010 * Dimension Index Mono DDP Note C -5 . 8- -6 . 3- E (Clip open size) 2.5 - 3.6 2.6 - 3.8 3. CLIP PART 4. ASS’Y VIEW 7.71 TIM Thickness 0.25 9.16 35.827.4 ± 0.1 9.16 ± 0.12 Clip open size 3.2~4.5 SIDE-L 7.4 ± 0.1 9.16 ± 0.12 0.1 SIDE-RFRONT Reference thickness total (Maximum) : 7.71 (With Clip thickness)