M366S0823DTS SAMSUNG | Alldatasheet

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SERIAL PRESENCE DETECT PC100 Unbuffered DIMM Rev 0.1 Jan. 2000 PC100 Unbuffered DIMM(168pin) SPD Specification(64Mb D-die base) Rev. 0.1 Jan. 2000

SERIAL PRESENCE DETECT PC100 Unbuffered DIMM Rev 0.1 Jan. 2000 M366S0424DTS-C80/C1H/C1L Byte # Function Described Function Supported Hex value Note 0 # of bytes written into serial memory at module manufacturer 128bytes 80h

1 Total # of bytes of SPD memory device 256bytes (2K-bit) 08h

2 Fundamental memory type SDRAM 04h

3 # of row address on this assembly 12 0Ch 1 4 # of column address on this assembly 8 08h 1 5 # of module rows on this assembly 1 row 01h

6 Data width of this assembly 64 bits 40h

8 Voltage interface standard of this assembly LVTTL 01h

9 SDRAM cycle time @CAS latency of 3 8ns 10ns 10ns 80h A0h A0h 2

10 SDRAM access time from clock @CAS latency of 3 6ns 6ns 6ns 60h 60h 60h 2

11 DIMM configuration type Non parity 00h

12 Refresh rate & type 15.625us, support self refresh 80h

13 Primary SDRAM width x16 10h

14 Error checking SDRAM width None 00h

15 Minimum clock delay for back-to-back random column address tCCD = 1CLK 01h

16 SDRAM device attributes : Burst lengths supported 1, 2, 4, 8 & full page 8Fh

17 SDRAM device attributes : # of banks on SDRAM device 4 banks 04h

18 SDRAM device attributes : CAS latency 2 & 3 06h

19 SDRAM device attributes : CS latency 0 CLK 01h

20 SDRAM device attributes : Write latency 0 CLK 01h

21 SDRAM module attributes Non-buffered, non-registered

& redundant addressing 00h

22 SDRAM device attributes : General

+/- 10% voltage tolerance, Burst Read Single bit Write precharge all, auto precharge 0Eh

23 SDRAM cycle time @CAS latency of 2 10ns 10ns 12ns A0h A0h C0h 2

24 SDRAM access time from clock @CAS latency of 2 6ns 6ns 7ns 60h 60h 70h 2

25 SDRAM cycle time @CAS latency of 1 - - - 00h 00h 00h

26 SDRAM access time from clock @CAS latency of 1 - - - 00h 00h 00h

27 Minimum row precharge time (=t RP ) 20ns 20ns 20ns 14h 14h 14h

28 Minimum row active to row active delay (t RRD ) 16ns 20ns 20ns 10h 14h 14h

29 Minimum RAS to CAS delay (=t RCD ) 20ns 20ns 20ns 14h 14h 14h

30 Minimum activate precharge time (=t RAS ) 48ns 50ns 50ns 30h 32h 32h

31 Module row density 1 row of 32MB 08h

32 Command and address signal input setup time 2ns 2ns 2ns 20h 20h 20h

33 Command and address signal input hold time 1ns 1ns 1ns 10h 10h 10h

34 Data signal input setup time 2ns 2ns 2ns 20h 20h 20h

  • Organization : 4Mx64
  • Composition : 4Mx16 *4
  • Used component part # : K4S641632D-TC80/ TC1H/ TC1L
  • # of rows in module : 1 row
  • # of banks in component : 4 banks
  • Feature : 1,000mil height & single sided component
  • Refresh : 4K/64ms
  • Contents ;

SERIAL PRESENCE DETECT PC100 Unbuffered DIMM Rev 0.1 Jan. 2000 Byte # Function Described Function Supported Hex value Note

35 Data signal input hold time 1ns 1ns 1ns 10h 10h 10h

36~61 Superset information (maybe used in future) - 00h 62 SPD data revision code PC100 SPD Spec.Ver.1.2A 12h

63 Checksum for bytes 0 ~ 62 - DEh 04h 34h

64 Manufacturer JEDEC ID code Samsung CEh

72 Manufacturing location Onyang Korea 01h

73 Manufacturer part # (Memory module) M 4Dh

74 Manufacturer part # (DIMM configuration) 3 33h

75 Manufacturer part # (Data bits) Blank 20h

78 Manufacturer part # (Mode & operating voltage) S 53h

79 Manufacturer part # (Module depth) 0 30h

81 Manufacturer part # (Refresh, # of banks in Comp. & interface) 2 32h

82 Manufacturer part # (Composition component) 4 34h

83 Manufacturer part # (Component revision) D 44h

84 Manufacturer part # (Package type) T 54h

85 Manufacturer part # (PCB revision & type) S 53h

86 Manufacturer part # (Hyphen) " - " 2Dh

87 Manufacturer part # (Power) C 43h

88 Manufacturer part # (Minimum cycle time) 8 1 1 38h 31h 31h

89 Manufacturer part # (Minimum cycle time) 0 H L 30h 48h 4Ch

90 Manufacturer part # (TBD) Blank 20h

91 Manufacturer revision code (For PCB) S 53h

93 Manufacturing date (Week) - - 3

94 Manufacturing date (Year) - - 3

95~98 Assembly serial # - - 4 99~125 Manufacturer specific data (may be used in future) Undefined - 5

126 System frequency for 100MHz 100MHz 64h

127 PC100 specification details Detailed 100MHz Information ADh AFh ADh

128+ Unused storage locations Undefined - 5 1. The bank select address is excluded in counting the total # of addresses. 2. This value is based on the component specification. 3. These bytes are programmed by code of Date Week & Date Year with BCD format. 4. These bytes are programmed by Samsung ′s own Assembly Serial # system. All modules may have different unique serial #. 5. These bytes are Undefined and can be used for Samsung ′s own purpose. Note :

SERIAL PRESENCE DETECT PC100 Unbuffered DIMM Rev 0.1 Jan. 2000 M366S0823DTS-C80/C1H/C1L Byte # Function Described Function Supported Hex value Note 0 # of bytes written into serial memory at module manufacturer 128bytes 80h 3 # of row address on this assembly 12 0Ch 1 4 # of column address on this assembly 9 09h 1 5 # of module rows on this assembly 1 row 01h 12 Refresh rate & type 15.625us, support self refresh 80h

13 Primary SDRAM width x8 08h

& redundant addressing 00h +/- 10% voltage tolerance, Burst Read Single bit Write precharge all, auto precharge 0Eh

31 Module row density 1 row of 64MB 10h

  • Organization : 8Mx64
  • Composition : 8Mx8 *8
  • Used component part # : K4S640832D-TC80/C1H/C1L
  • # of rows in module : 1 row
  • # of banks in component : 4 banks
  • Feature : 1,375mil height & single sided component
  • Refresh : 4K/64ms
  • Contents ;

SERIAL PRESENCE DETECT PC100 Unbuffered DIMM Rev 0.1 Jan. 2000 Byte # Function Described Function Supported Hex value Note 36~61 Superset information (maybe used in future) - 00h 62 SPD data revision code PC100 SPD Spec. Ver. 1.2A 12h

63 Checksum for bytes 0 ~ 62 - DFh 05h 35h

81 Manufacturer part # (Refresh, # of banks in Comp. & interface) 2 32h

82 Manufacturer part # (Composition component) 3 33h

95~98 Assembly serial # - - 4 99~125 Manufacturer specific data (may be used in future) Undefined - 5 128+ Unused storage locations Undefined - 5 1. The bank select address is excluded in counting the total # of addresses. 2. This value is based on the component specification. 3. These bytes are programmed by code of Date Week & Date Year with BCD format. 4. These bytes are programmed by Samsung ′s own Assembly Serial # system. All modules may have different unique serial #. 5. These bytes are Undefined and can be used for Samsung ′s own purpose. Note :

SERIAL PRESENCE DETECT PC100 Unbuffered DIMM Rev 0.1 Jan. 2000 M374S0823DTS-C80/C1H/C1L Byte # Function Described Function Supported Hex value Note 0 # of bytes written into serial memory at module manufacturer 128bytes 80h 3 # of row address on this assembly 12 0Ch 1 4 # of column address on this assembly 9 09h 1 5 # of module rows on this assembly 1 row 01h

6 Data width of this assembly 72 bits 48h

11 DIMM configuration type ECC 02h

12 Refresh rate & type 15.625us, support self refresh 80h

14 Error checking SDRAM width x8 08h

& redundant addressing 00h +/- 10% voltage tolerance, Burst Read Single bit Write precharge all, auto precharge 0Eh

  • Organization : 8Mx72
  • Composition : 8Mx8 *9
  • Used component part # : K4S640832D-TC80/C1H/C1L
  • # of rows in module : 1 row
  • # of banks in component : 4 banks
  • Feature : 1,375mil height & single sided component
  • Refresh : 4K/64ms
  • Contents ;

SERIAL PRESENCE DETECT PC100 Unbuffered DIMM Rev 0.1 Jan. 2000 Byte # Function Described Function Supported Hex value Note 36~61 Superset information (maybe used in future) - 00h 62 SPD data revision code PC100 SPD Spec. Ver. 1.2A 12h

63 Checksum for bytes 0 ~ 62 - F1h 17h 47h

81 Manufacturer part # (Refresh, # of banks in Comp. & interface) 2 32h 95~98 Assembly serial # - - 4 99~125 Manufacturer specific data (may be used in future) Undefined - 5 128+ Unused storage locations Undefined - 5 1. The bank select address is excluded in counting the total # of addresses. 2. This value is based on the component specification. 3. These bytes are programmed by code of Date Week & Date Year with BCD format. 4. These bytes are programmed by Samsung ′s own Assembly Serial # system. All modules may have different unique serial #. 5. These bytes are Undefined and can be used for Samsung ′s own purpose. Note :