M30621MCM

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Technical content

Features

142.9ns (f(XIN)=7MH Z, VCC =2.2V to 3.6V, with software one-wait) 2.4V to 2.7V (f(XIN)= 7MHZ, without software wait) 2.2V to 2.4V (f(XIN)= 7MHZ, with software one-wait) interrupt sources; 7 levels (including key input interrupt) 5 channels (2 for UART or clock synchronous, 1 for UART, 2 for clock synchronous) 1 line (P85 shared with NMI pin) (built-in feedback resistor, and external ceramic or quartz oscillator) Note: Memory expansion mode and microprocessor mode are not supported.

Applications

Audio, cameras, office equipment, communications equipment, portable equipment

Description

M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1 2 3 4 5 6 7 8 9 1 01 1 1 21 31 41 51 61 71 81 92 0 41424344454647484950515253545557585960 P43 P56 P55 P54 P53 P52 P57/CLKOUT P63/TXD 0 P65/CLK1 P66/RxD1 P67/TXD 1 P61/CLK0 P62/RxD0 P60/CTS0/RTS0 P64/CTS1/RTS1/CLKS1 P71/RxD2/SCL/TA0IN/TB5IN P50 P51 P70/TxD2/SDA/TA0OUT V CCX IN X OUT V SS RESET CNVss(BYTE) 7/X CIN 6/X COUT P76/TA3OUT 7/TA3 IN 3/DA 0/TB3 IN 4/DA 1/TB4 IN 5/ANEX0/CLK4 2/TB2 IN OUT 2/INT 3/INT 1/TA4 IN 4/INT 0/TA4 OUT NMI P00 P01 P02 P03 P04 P05 P06 VREF AV SS AVcc P100/AN0 P101/AN1 P102/AN2 P103/AN3 P104/AN4/KI0 P105/AN5/KI1 P106/AN6/KI2 P107/AN7/KI3 P96/ANEX1/SOUT 4 P97/ADTRG /SIN4 0/TB0 IN /CLK3 Pin Configuration Figures 1.1.1 show the pin configurations (top view). PIN CONFIGURATION (top view) Package: 80P6S-A Figure 1.1.1. Pin configuration (top view) M16C/62M (80-pin version) group (low voltage version)

M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Item Performance Number of basic instructions 91 instructions Shortest instruction execution time 100ns(f(X IN)=10MH Z, VCC =2.7V to 3.6V) 142.9ns (f(XIN)=7MH Z, VCC =2.2V to 3.6V, with software one- wait) Memory ROM (See the figure 1.1.3. ROM Expansion) capacity RAM 10K to 20K bytes I/O port P0 to P10 (except P85) 8 bits x 6, 7 bits x 2, 4 bits x 2 Input port P8 5 1 bit x 1 Multifunction TA0, TA3, TA4 16 bits x 3 (timer mode, internal/external event count, timer one-shot timer mode and pulse width measurement mode) TB0, TB2, TB3, TB4, TB5 16 bits x 5 (timer mode, internal/external event count and pulse period/pulse width measurement mode) TA1, TA2 16 bits x 2 (timer mode, internal event count and a trigger through one-shot timer mode occurs.) TB1 16 bits x 1 (timer mode and internal event count ) Serial I/O UART0, UART1, UART2 (UART or clock synchronous) x 2, UART x 1(UART2) SI/O3, SI/O4 (Clock synchronous) x 2 (SI/O3 is output only) A-D converter 10 bits x (8 + 2) channels D-A converter 8 bits x 2 DMAC 2 channels (trigger: 24 sources) CRC calculation circuit CRC-CCITT Watchdog timer 15 bits x 1 (with prescaler) Interrupt 25 internal and 5 external sources, 4 software sources, 7 levels Clock generating circuit 2 built-in clock generation circuits (built-in feedback resistor, and external ceramic or quartz oscillator) Supply voltage 2.7V to 3.6V (f(X IN)=10MH Z, without software wait) 2.4V to 2.7V (f(XIN)= 7MHZ, without software wait) 2.2V to 2.4V (f(XIN)= 7MHZ, with software one-wait) Power consumption 28.5mW (f(XIN) = 10MHZ, VCC =3V with software one-wait) I/O I/O withstand voltage 3V characteristics Output current 1mA Device configuration CMOS high performance silicon gate Package 80-pin plastic mold QFP Note : M16C/62M (80-pin version) group (low voltage version) does not support memory expansion or microprocessor mode. Table 1.1.1. Performance outline of M16C/62M (80-pin version) group (low voltage version) Performance Outline Table 1.1.1 is a performance outline of M16C/62M (80-pin version) group (low voltage version).

M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Description Mitsubishi plans to release the following products in the M16C/62M (80-pin version) group (low voltage version): (1) Support for mask ROM version and flash memory version (2) ROM capacity (3) Package 80P6S-A : Plastic molded QFP (mask ROM and flash memory versions) The M16C/62M (80-pin version) group (low voltage version) products currently supported are listed in Table 1.1.2. Table 1.1.2. M16C/62M (80-pin version) group (low voltage version) ROM Size (Byte) External ROM 128K 96K 64K 32K Mask ROM version Flash memory version 256K M30621MCM-XXXGP M30625MGM-XXXGP M30625FGMGP M30621FGMGP 80K RAM capacityROM capacity Package type RemarksType No As of June 2000 mask ROM version Flash memory 3V version M30625MGM-XXXGP 80P6S-A256 Kbytes 20 Kbytes M30621MCM-XXXGP 80P6S-A128 Kbytes 10 Kbytes M30621FGMGP 80P6S-A 128 Kbytes 10 Kbytes M30625FGMGP 80P6S-A 256 Kbytes 20 Kbytes Figure 1.1.3. ROM expansion

M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Package type: GP : Package 80P6S-A ROM No. Omitted for flash memory version ROM capacity: C : 128K bytes G: 256K bytes Memory type: M : Mask ROM version F : Flash memory version Type No. M 3 0 6 2 3 M C M – X X X G P M16C/62 Group M16C Family Shows RAM capacity, pin count, etc (The value itself has no specific meaning) Figure 1.1.4. Type No., memory size, and package

M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Description About the M16C/62M (80-pin version) group (low voltage version) The M16C/62M (80-pin version) group (low voltage version) is packaged in a 80-pin plastic mold pack- age. The number of pins in comparison with the 100-pin package products is decreased. So be careful about the following. (a) The M16C/62M (80-pin version) group (low voltage version) supports single chip mode alone. It supports neither memory expansion mode nor microprocessor mode. (b) The input/output ports given below are absent from the M16C/62M (80-pin version) group (low voltage version). To stabilize the internal state, set to output mode the direction register of each input/output port. Failing in setting to output mode involves an increase in current consumption. <Pins absent from the 80-pin version> 0 to P17, P44 to P47, P72 to P75, P91 (c) INT3 to INT5 allocated to P15 to P17 cannot be used. Keep the INT3 interrupt control register disabled for interrupts. The INT4 interrupt control register and the INT5 interrupt control register are shared with SI/O3 and SI/O4. When the user don’t use them as SI/O3 and SI/4, set them disabled for interrupts. (d) The output pins of timers A1 and A2 - TA1 IN, TA1OUT , TA2IN and TA2OUT - allocated to P72 to P75 cannot be used. In connection with this, the gate function and pulse outputting function of timers A1 and A2 cannot be used. Use timer mode and internal event count, or use as trigger signal genera- tion in one-shot timer mode. (e) The UART2 input/output pins - CLK2 and CTS/RTS - allocated to P72 and P73 cannot be used. In connection with this, UART2 solely as UART of the internal clock can be used. (f) The input pin TB1IN of timer B1 allocated to P91 cannot be used. With timer B1 under this state, use only timer mode or the internal event count. (g) The input pin SIN3 of serial I/O3 allocated to P91 cannot be used. In connection with this, use serial I/O3 as a serial I/O exclusive to transmission. (h) The output pins for three-phase motor control allocated to P72 to P75 cannot be used. So set to 0 (ordinary mode) the mode select bit (bit 2) of three-phase PWM control register 0.

Electrical characteristics (Vcc = 3V) Mitsubishi microcomputers M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Table 1.20.1. Absolute maximum ratings Note: Specify a product of -40 to 85°C to use it. VREF , XIN VO -0.3 to Vcc+0.3 -0.3 to Vcc+0.3 Pd Ta=25 -0.3 to 4.6 -0.3 to 4.6 V V V VI AVcc Vcc Tstg Topr mW V -65 to 150 300 -20 to 85 / -40 to 85(Note) P30 to P37, P40 to P43, P50 to P57, P60 to P67, P76 to P77, P80 to P87, P00 to P07, P20 to P27, P30 to P37,P40 to P43, P50 to P57, P60 to P67,P76 to P77, P80 to P84, P00 to P07, P20 to P27, RESET, CNV SS (BYTE) P90, P92 to P97, P100 to P107, P86, P87, P90, P92 to P97, P100 to P107, XOUT P70, P71 -0.3 to 4.6 -0.3 to 4.6 V V VCC =AV CC VCC =AV CC C C C Symbol Parameter Condition Rated value Unit Supply voltage Analog supply voltage Input voltage Output voltage Power dissipation Operating ambient temperature Storage temperature P70, P71

M16C / 62M (80-pin version) Group (Low voltage version) Note 1: The mean output current is the mean value within 100ms. Note 2: The total IOL (peak) for all ports must be 80mA max. The total IOH (peak) for all ports must be 80mA max. Note 3: Specify a product of –40°C to 85°C to use it. Note 4: Relationship between main clock oscillation frequency and supply voltage. to 85oC / – 40oC to 85oC(Note3) unless otherwise specified) Main clock input oscillation frequency (With wait) /LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines /LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines /LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines /LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines /LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines /LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines /LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines /LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines 2.2 2.7 3.6 Operating maximum frequency [MH Supply voltage[V] (BCLK: no division) 6 X VCC –6.2MHZ Main clock input oscillation frequency (No wait) /LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines /LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines /LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines /LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines /LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines /LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines /LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines /LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines/LiteDiagLines 10.0 3.5 0.0Operating maximum frequency [MH Supply voltage[V] (BCLK: no division)

10 X VCC –17MH Z

2.4 7.0 2.2 2.7 3.62.4 10.0 0.0 7.0

17.5 X VCC

–35MH Z 2.2 3.6 Typ. Max. UnitParameter Vcc 3.0Supply voltage Symbol Min. Standard Analog supply voltage VccAVcc V 0Analog supply voltage Supply voltage VIH IOH (avg) HIGH average output current mA mA Vss AVss 0.8Vcc V V V Vcc 0.2Vcc0 LOW input voltage IOH (peak) HIGH peak output current HIGH input voltage P76, P77, P80 to P87,P90, P92 to P97, P100 to P107, –5.0 –10.0 P00 to P07, P20 to P27, P00 to P07, P20 to P27,P30 to P37, P40 to P43, P50 to P57, P60 to P67, P76, P77, P80 to P84, P86, P87, P90, P92 to P97, P100 to P107 P30 to P37, P40 to P43, P50 to P57, P60 to P67, LOW peak output current 10.0 5.0 mA f (XIN) Main clock input oscillation frequency (Note 5) LOW average output current IOL (peak) mAIOL (avg) f (XcIN) Subclock oscillation frequency kHz5032.768 V XIN, RESET, CNVSS (BYTE) P80 to P87, P90, P92 to P97, P100 to P107, P40 to P43, P50 to P57, P60 to P67, P70, P71,P76, P77, XIN, RESET, CNVSS (BYTE) P00 to P07, P20 to P27, P30 to P37, P00 to P07, P20 to P27, P30 to P37, P40 to P43, P50 to P57, P60 to P67, P76, P77, P80 to P84, P86, P87, P90, P92 to P97, P100 to P107 P00 to P07, P20 to P27,P30 to P37, P40 to P43, P50 to P57, P60 to P67, P70, P71, P76, P77 P80 to P84, P86, P87, P90, P92 to P97, P100 to P107 P00 to P07, P20 to P27,P30 to P37, P40 to P43, P50 to P57, P60 to P67, P70, P71, P76, P77 P70 , 0.8Vcc 4.6 VP71 VIL No wait 10 X Vcc –17 Vcc=2.7V to 3.6V Vcc=2.4V to 2.7V MHz MHz with wait 6 X Vcc –6.2 Vcc=2.7V to 3.6V Vcc=2.2V to 2.7V MHz MHz P80 to P84, P86, P87, P90, P92 to P97, P100 to P107 –35Vcc=2.2V to 2.4V 0 MHz Note 5: Execute case without wait, program / erase of flash memory by VCC =2.7V to 3.6V and f(BCLK) £ 6.25 MHz. Execute case with wait, program / erase of flash memory by VCC =2.7V to 3.6V and f(BCLK) £ 10.0 MHz. Flash program voltage Flash read operation voltage VCC =2.7V to 3.6V V CC =2.4V to 3.6V VCC =2.7V to 3.4V V CC =2.2V to 2.4V Flash memory version program voltage and read operation voltage characteristics

Electrical characteristics (Vcc = 3V) Mitsubishi microcomputers M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER mstSAMP Sampling time 0.3 Min. Typ. Max. tsu R O Resolution Absolute accuracy Setup time Output resistance Reference power supply input current Bits kW mAIVREF 1.0 1.5 Symbol Parameter Measuring condition Unit 20104 ms (Note) Standard Note 1: Connect AVCC pin to VCC pin and apply the same electric potential. Note 2: Specify a product of -40°C to 85°C to use it. Page program time Block erase time Erase all unlocked blocks time Lock bit program time

50 X n (Note)

600 X n (Note)

Min. Typ. Max Unit Note 1: This applies when using one D-A converter, with the D-A register for the unused D-A converter set to “0016”. The A-D converter's ladder resistance is not included. Also, when DA register contents are not “00”, the current I VREF always flows even though Vref may have been set to be unconnected by the A-D control register. Note 2: Specify a product of -40°C to 85°C to use it. Note : n denotes the number of block erases. R LADDER Ladder resistance ms9.8 VCC Conversion time(8bit), sample & hold function not available tCONV VREF = VCC Standard Min. Typ. Max Resolution Absolute accuracy, sample & hold function not available (8 bit) Bits LSB VREF = VCC Parameter Measuring condition Unit VREF = VCC = 3V, fAD = f(XIN)/2 kW Reference voltage VVREF 2.4 V CC Analog input voltageVIA V0V REF Symbol VREF = VCC = 3V, fAD = f(XIN) =fAD /2 = 5MHz VCC = 3V AVSS = 0V at Ta = – 20oC to 85oC / – 40oC to 85oC(Note2), f(XIN) = 10MHz unless otherwise specified) VREF = 3V, at Ta = – 20oC to 85oC / – 40oC to 85oC(Note2), f(XIN) = 10MHz unless otherwise specified) Table 1.20.5. Flash memory version electrical characteristics (referenced to VCC = 2.7V to 3.6V, at Ta =0oC to 60oC unless otherwise specified) Table 1.20.6. Flash memory version program voltage and read operation voltage characteristics (Ta =0oC to 60oC) Flash program voltage Flash read operation voltage VCC =2.7V to 3.6V V CC =2.4V to 3.6V VCC =2.7V to 3.4V V CC =2.2V to 2.4V

Electrical characteristics (Vcc = 3V) Mitsubishi microcomputers M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER VO H VO H VO L VO L V VXO U T 2 . 5 2 . 5 V0 . 5 VXO U T 0 . 5 0 . 5 2 . 5IO H = – 1 m A IO H = – 0 . 1 m A IO H = – 5 0 m A IO L= 1 m A IO L= 0 . 1 m A IO L= 5 0 m A P 00 t o P 07, P 20 t o P 27, P 30 t o P 37, P 00 t o P 07, P 20 t o P 27, P 30 t o P 37, P 40 t o P 43, P 50 t o P 57, P 60 t o P 67, P 40 t o P 43, P 50 t o P 57, P 60 t o P 67, P 76, P 77, P 80 t o P 84, P 86, P 87, H I G H P O W E R L O W P O W E R P 90, P 92 t o P 97, P 1 00 t o P 1 07 H I G H P O W E R L O W P O W E R P 70, P 71, P 76, P 77, P 80 t o P 84, P 86, P 87, P 90, P 92 t o P 97, P 1 00 t o P 1 07 H I G H P O W E R L O W P O W E R XC O U T W i t h n o l o a d a p p l i e d W i t h n o l o a d a p p l i e d 3 . 0 1 . 6 V S y m b o lP a r a m e t e r S t a n d a r d T y p . M a x . U n i tM i n .M e a s u r i n g c o n d i t i o n H I G H o u t p u t v o l t a g e H I G H o u t p u t v o l t a g e H I G H o u t p u t v o l t a g e L O W o u t p u t v o l t a g e L O W o u t p u t v o l t a g e II H II L VR A M VT -VT VT -VT 0 . 20 . 8V 0 . 21 . 8V P 00 t o P 07, P 20 t o P 27, P 30 t o P 37, 4 . 0 m A m A R E S E T XI N , R E S E T , C N V s s ( B Y T E ) T A 0I N , T A 3I N , T A 4I N , T B 0I N , T B 2I N t o T B 5I N , I N T0 t o I N T2, VI= 3 V VI= 0 V– 4 . 0 P 00 t o P 07, P 20 t o P 27, P 30 t o P 37, XI N , R E S E T , C N V s s ( B Y T E ) R f X I N R f X C I N XI N XC I N 1 0 . 0 3 . 0M W M W P 90, P 92 t o P 97, P 1 00 t o P 1 07 P 70, P 71, P 76, P 77, P 80 t o P 87, P 40 t o P 43, P 50 t o P 57, P 60 t o P 67, P 90, P 92 t o P 97, P 1 00 t o P 1 07 P 70, P 71, P 76, P 77, P 80 t o P 87, P 40 t o P 43, P 50 t o P 57, P 60 t o P 67, C L K4, T A 3O U T, T A 4O U T N M I , K I0 t o K I3, I c c A D T R G , C T S0, C T S1 C L K0, C L K1, C L K3, 2 . 0 VW h e n c l o c k i s s t o p p e d H y s t e r e s i s H y s t e r e s i s H I G H i n p u t c u r r e n t L O W i n p u t c u r r e n t F e e d b a c k r e s i s t a n c e F e e d b a c k r e s i s t a n c e R A M r e t e n t i o n v o l t a g e P o w e r s u p p l y c u r r e n t T h e o u t p u t p i n s a r e o p e n a n d o t h e r p i n s a r e VS S SI N 4, R XD 0 t o R XD 2 N o t e 1 : S p e c i f y a p r o d u c t o f - 4 0 ° C t o 8 5 ° C t o u s e i t . N o t e W i t h o n e t i m e r o p e r a t e d u s i n g f C S q u a r e w a v e f ( XC I N ) = 3 2 k H z 4 5 . 0 m A S q u a r e w a v e , n o d i v i s i o n f ( XI N ) = 1 0 M H z m A9. 5 2 1 . 2 5M a s k R O M v e r s i o n S q u a r e w a v e , n o d i v i s i o n f ( XI N ) = 1 0 M H z m A1 2 . 0 2 1 . 2 5F l a s h m e m o r y 3 V v e r s i o n M a s k R O M v e r s i o n F l a s h m e m o r y V v e r s i o n S q u a r e w a v e , d i v i s i o n b y 2 f ( XI N ) = 1 0 M H z mA F l a s h m e m o r y 3 V v e r s i o n Pr o g r a m 1 . 0 m A 2 0 . 0 0 . 9 m A 2 . 8 m A f ( XC I N ) = 3 2 k H z f ( XC I N ) = 3 2 k H z T a C w h e n c l o c k i s s t o p p e d T a C w h e n c l o c k i s s t o p p e d W h e n a W A I T i n s t r u c t i o n i s e x e c u t e d O s c i l l a t i o n c a p a c i t y H i g h N o t e W h e n a W A I T i n s t r u c t i o n i s e x e c u t e d O s c i l l a t i o n c a p a c i t y L o w N o t e S q u a r e w a v e , d i v i s i o n b y 2 f ( XI N ) = 1 0 M H z 1 7 . 0 mA F l a s h m e m o r y 3 V v e r s i o n Er a s e 1 4. 0 P 00 t o P 07, P 20 t o P 27, P 30 t o P 37, P 40 t o P 43, P 50 t o P 57, P 60 t o P 67, P 76, P 77, P 80 t o P 84, P 86, P 87, P 90, P 92 t o P 97, P 1 00 t o P 1 07 KW20 7 5 3 0 0VI= 0 VR P U L L U P P u l l u p r e s i s t a n c e M a s k R O M v e r s i o n F l a s h m e m o r y V v e r s i o n VXC OU T W i t h n o l o a d a p p l i e d W i t h n o l o a d a p p l i e d H I G H P O W E R L O W P O W E R L O W o u t p u t v o l t a g e VCC = 3V to 85oC / – 40oC to 85oC(Note 1), f(XIN) = 10MHz without wait unless otherwise specified)

Electrical characteristics (Vcc = 3V) Mitsubishi microcomputers M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Timing requirements (referenced to VCC = 3V, VSS = 0V at Ta = – 20oC to 85oC / – 40oC to 85oC (*) unless otherwise specified) ns ns tc tw(H) tw(L) tr tf Max.Min.ParameterSymbol UnitStandard External clock rise time External clock input cycle time External clock input HIGH pulse width External clock input LOW pulse width External clock fall time ns100 ns40 ns40 VCC = 3V * : Specify a product of -40°C to 85°C to use it. Table 1.20.8. External clock input

Electrical characteristics (Vcc = 3V) Mitsubishi microcomputers M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER VCC = 3V Timing requirements (referenced to VCC = 3V, VSS = 0V at Ta = – 20oC to 85oC / – 40oC to 85oC (*) unless otherwise specified) * : Specify a product of -40°C to 85°C to use it. Standard Max.Min. UnitParameterSymbol nstw(TAL) TAiIN input LOW pulse width 60 nstc(TA) TAiIN input cycle time 150 nstw(TAH) TAiIN input HIGH pulse width 60 Standard Max.Min. UnitParameterSymbol nstc(TA) TAiIN input cycle time 600 nstw(TAH) TAiIN input HIGH pulse width 300 nstw(TAL) TAiIN input LOW pulse width 300 Standard Max.Min. UnitParameterSymbol nstc(TA) TAiIN input cycle time 300 nstw(TAH) TAiIN input HIGH pulse width 150 nstw(TAL) TAiIN input LOW pulse width 150 Standard Max.Min. UnitParameterSymbol nstw(TAH) TAiIN input HIGH pulse width 150 nstw(TAL) TAiIN input LOW pulse width 150 Standard Max.Min. UnitParameterSymbol nstc(UP) TAiOUT input cycle time 3000 nstw(UPH) TAiOUT input HIGH pulse width 1500 nstw(UPL) TAiOUT input LOW pulse width 1500 nstsu(UP-TIN) TAiOUT input setup time 600 nsth(TIN-UP) TAiOUT input hold time 600 Table 1.20.10. Timer A input (gating input in timer mode) Table 1.20.11. Timer A input (external trigger input in one-shot timer mode) Table 1.20.12. Timer A input (external trigger input in pulse width modulation mode) Table 1.20.13. Timer A input (up/down input in event counter mode) Table 1.20.9. Timer A input (counter input in event counter mode)

Electrical characteristics (Vcc = 3V) Mitsubishi microcomputers M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Timing requirements (referenced to VCC = 3V, VSS = 0V at Ta = – 20oC to 85oC / – 40oC to 85oC (*) unless otherwise specified) * : Specify a product of -40°C to 85°C to use it. VCC = 3V Standard Max.Min.ParameterSymbol Unit nstc(TB) TBiIN input cycle time (counted on one edge) 150 nstw(TBH) TBiIN input HIGH pulse width (counted on one edge) 60 nstw(TBL) TBiIN input LOW pulse width (counted on one edge) 60 tw(TBH) nsTBiIN input HIGH pulse width (counted on both edges) 160 tw(TBL) nsTBiIN input LOW pulse width (counted on both edges) 160 tc(TB) nsTBiIN input cycle time (counted on both edges) 300 Standard Max.Min. ParameterSymbol Unit nstc(TB) TBiIN input cycle time 600 nstw(TBH) TBiIN input HIGH pulse width 300 tw(TBL) nsTBiIN input LOW pulse width 300 Standard Max.Min.ParameterSymbol Unit nstc(TB) TBiIN input cycle time 600 nstw(TBH) TBiIN input HIGH pulse width 300 tw(TBL) nsTBiIN input LOW pulse width 300 Standard Max.Min. ParameterSymbol Unit nstc(AD) AD TRG input cycle time (trigger able minimum) 1500 nstw(ADL) AD TRG input LOW pulse width 200 Standard Max.Min. ParameterSymbol Unit nstw(INH) INTi input HIGH pulse width 380 nstw(INL) INTi input LOW pulse width 380 Standard Max.Min. ParameterSymbol Unit nstc(CK) CLKi input cycle time 300 nstw(CKH) CLKi input HIGH pulse width 150 nstw(CKL) CLKi input LOW pulse width 150 th(C-Q) nsTxDi hold time 0 tsu(D-C) nsRxDi input setup time 50 th(C-D) nsRxDi input hold time 90 td(C-Q) nsTxDi output delay time 160 Table 1.20.14. Timer B input (counter input in event counter mode) Table 1.20.15. Timer B input (pulse period measurement mode) Table 1.20.16. Timer B input (pulse width measurement mode) Table 1.20.17. A-D trigger input Table 1.20.18. Serial I/O Table 1.20.19. External interrupt INTi inputs

Electrical characteristics (Vcc = 3V) Mitsubishi microcomputers M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER VCC = 3V tsu(D–C) TAiIN input TAiOUT input During event counter mode TBiIN input CLKi TxDi RxDi tc(TA) tw(TAH) tw(TAL) tc(UP) tw(UPH) tw(UPL) tc(TB) tw(TBH) tw(TBL) tc(AD) tw(ADL) tc(CK) tw(CKH) tw(CKL) tw(INL) tw(INH) td(C–Q) th(C–D) th(C–Q) th(TIN–UP) tsu(UP–TIN) TAiIN input (When count on falling edge is selected) TAiIN input (When count on rising edge is selected) TAiOUT input (Up/down input) INTi input AD TRG input Figure 1.20.2. Vcc=3V timing diagram

M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Timer A (timer mode) Usage Precaution Timer A (event counter mode) (1) Reading the timer Ai register while a count is in progress allows reading, with arbitrary timing, the value of the counter. Reading the timer Ai register with the reload timing gets “FFFF16” by underflow or “000016” by overflow. Reading the timer Ai register after setting a value in the timer Ai register with a count halted but before the counter starts counting gets a proper value. (2) When stop counting in free run type, set timer again. (1) Reading the timer Ai register while a count is in progress allows reading, with arbitrary timing, the value of the counter. Reading the timer Ai register with the reload timing gets “FFFF16”. Reading the timer Ai register after setting a value in the timer Ai register with a count halted but before the counter starts counting gets a proper value. (1) Setting the count start flag to “0” while a count is in progress causes as follows:

• The counter stops counting and a content of reload register is reloaded.
• The TAi OUT pin outputs “L” level.
• The interrupt request generated and the timer Ai interrupt request bit goes to “1”. (2) The timer Ai interrupt request bit goes to “1” if the timer's operation mode is set using any of the following procedures:
• Selecting one-shot timer mode after reset.
• Changing operation mode from timer mode to one-shot timer mode.
• Changing operation mode from event counter mode to one-shot timer mode. Therefore, to use timer Ai interrupt (interrupt request bit), set timer Ai interrupt request bit to “0” after the above listed changes have been made. Timer A (one-shot timer mode) (1) The timer Ai interrupt request bit becomes “1” if setting operation mode of the timer in compliance with any of the following procedures:
• Selecting PWM mode after reset.
• Changing operation mode from timer mode to PWM mode.
• Changing operation mode from event counter mode to PWM mode. Therefore, to use timer Ai interrupt (interrupt request bit), set timer Ai interrupt request bit to “0” after the above listed changes have been made. (2) Setting the count start flag to “0” while PWM pulses are being output causes the counter to stop counting. If the TAi OUT pin is outputting an “H” level in this instance, the output level goes to “L”, and the timer Ai interrupt request bit goes to “1”. If the TAiOUT pin is outputting an “L” level in this instance, the level does not change, and the timer Ai interrupt request bit does not becomes “1”. Timer A (pulse width modulation mode) Timer B (timer mode, event counter mode) (1) Reading the timer Bi register while a count is in progress allows reading , with arbitrary timing, the value of the counter. Reading the timer Bi register with the reload timing gets “FFFF16”. Reading the timer Bi register after setting a value in the timer Bi register with a count halted but before the counter starts counting gets a proper value.

M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Stop Mode and Wait Mode A-D Converter (1) If changing the measurement mode select bit is set after a count is started, the timer Bi interrupt request bit goes to “1”. (2) When the first effective edge is input after a count is started, an indeterminate value is transferred to the reload register. At this time, timer Bi interrupt request is not generated. Timer B (pulse period/pulse width measurement mode) Interrupts (1) Write to each bit (except bit 6) of A-D control register 0, to each bit of A-D control register 1, and to bit 0 of A-D control register 2 when A-D conversion is stopped (before a trigger occurs). In particular, when the Vref connection bit is changed from “0” to “1”, start A-D conversion after an elapse of 1 ms or longer. (2) When changing A-D operation mode, select analog input pin again. (3) Using one-shot mode or single sweep mode Read the correspondence A-D register after confirming A-D conversion is finished. (It is known by A- D conversion interrupt request bit.) (4) Using repeat mode, repeat sweep mode 0 or repeat sweep mode 1 Use the undivided main clock as the internal CPU clock. (1) Reading address 00000

• When maskable interrupt is occurred, CPU read the interrupt information (the interrupt number and interrupt request level) in the interrupt sequence. The interrupt request bit of the certain interrupt written in address 0000016 will then be set to “0”. Reading address 0000016 by software sets enabled highest priority interrupt source request bit to “0”. Though the interrupt is generated, the interrupt routine may not be executed. Do not read address 00000 16 by software. (2) Setting the stack pointer
• The value of the stack pointer immediately after reset is initialized to 000016. Accepting an interrupt before setting a value in the stack pointer may become a factor of runaway. Be sure to set a value in the stack pointer before accepting an interrupt. When using the NMI interrupt, initialize the stack point at the beginning of a program. Concerning the first instruction immediately after reset, generating any interrupts including the NMI interrupt is prohibited. (3) The NMI interrupt
• The NMI interrupt can not be disabled. Be sure to connect NMI pin to Vcc via a pull-up resistor if unused.
• Do not get either into stop mode with the NMI pin set to “L”. (1) When returning from stop mode by hardware reset, RESET pin must be set to “L” level until main clock oscillation is stabilized. (2) When switching to either wait mode or stop mode, instructions occupying four bytes either from the WAIT instruction or from the instruction that sets the every-clock stop bit to “1” within the instruction queue are prefetched and then the program stops. So put at least four NOPs in succession either to the WAIT instruction or to the instruction that sets the every-clock stop bit to “1”.

M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER (4) External interrupt

• When the polarity of the INT0 to INT2 pins is changed, the interrupt request bit is sometimes set to "1". After changing the polarity, set the interrupt request bit to "0". Example 1: INT_SWITCH1: FCLR I ; Disable interrupts. AND.B #00h, 0055h ; Clear TA0IC int. priority level and int. request bit. NOP NOP FSET I ; Enable interrupts. Example 2: INT_SWITCH2: FCLR I ; Disable interrupts. AND.B #00h, 0055h ; Clear TA0IC int. priority level and int. request bit. MOV.W MEM, R0 ; Dummy read. FSET I ; Enable interrupts. Example 3: INT_SWITCH3: PUSHC FLG ; Push Flag register onto stack FCLR I ; Disable interrupts. AND.B #00h, 0055h ; Clear TA0IC int. priority level and int. request bit. POPC FLG ; Enable interrupts. The reason why two NOP instructions or dummy read are inserted before FSET I in Examples 1 and 2 is to prevent the interrupt enable flag I from being set before the interrupt control register is rewritten due to effects of the instruction queue. (5) Rewrite the interrupt control register
• To rewrite the interrupt control register, do so at a point that does not generate the interrupt request for that register. If there is possibility of the interrupt request occur, rewrite the interrupt control register after the interrupt is disabled. The program examples are described as follow:
• When a instruction to rewrite the interrupt control register is executed but the interrupt is disabled, the interrupt request bit is not set sometimes even if the interrupt request for that register has been generated. This will depend on the instruction. If this creates problems, use the below instructions to change the register. Instructions : AND, OR, BCLR, BSET Noise (1) Insert bypass capacitor between VCC and VSS pin for noise and latch up countermeasure.
• Insert bypass capacitor (about 0.1 mF) and connect short and wide line between VCC and VSS lines.

M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Mask ROM number MITSUBISHI ELECTRIC-CHIP 16-BIT MICROCOMPUTER M30621MCM-XXXGP MASK ROM CONFIRMATION FORM GZZ-SH13-96B<02A0> Date : TEL ( ) Receipt Section head signature Supervisor signature Customer Company name Date issued Date : Note : Please complete all items marked h . h Issuance signature Submitted by Supervisor h 1. Check sheet Mitsubishi processes the mask files generated by the mask file generation utilities out of those held on the floppy disks you give in to us, and forms them into masks. Hence, we assume liability provided that there is any discrepancy between the contents of these mask files and the ROM data to be burned into products we produce. Check thoroughly the contents of the mask files you give in. Prepare 3.5 inches 2HD (IBM format) floppy disks. And store only one mask file in a floppy disk. h 2. Mark specification The mark specification differs according to the type of package. After entering the mark specification on the separate mark specification sheet (for each package), attach that sheet to this masking check sheet for submission to Mitsubishi. For the M30621MCM-XXXGP, submit the 80P6S mark specification sheet. h 3. Usage Conditions For our reference when of testing our products, please reply to the following questions about the usage of the products you ordered. (1) Which kind of XIN-XOUT oscillation circuit is used? Ceramic resonator Quartz-crystal oscillator External clock input Other ( ) What frequency do not use? f(X IN) = MH Z Microcomputer type No. : M30621MCM-XXXGP File code : (hex) Mask file name : .MSK (alpha-numeric 8-digit)

M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER GZZ-SH13-96B<02A0> MITSUBISHI ELECTRIC-CHIP 16-BIT MICROCOMPUTER M30621MCM-XXXGP MASK ROM CONFIRMATION FORM Mask ROM number (2) Which kind of XCIN-XCOUT oscillation circuit is used? Ceramic resonator Quartz-crystal oscillator External clock input Other ( ) What frequency do not use? f(X CIN) = kH Z (3) Which operating supply voltage do you use? (Circle the operating voltage range of use) (4) Which operating ambient temperature do you use? (Circle the operating temperature range of use) -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 (°C) (5) Do you use I2C (Inter IC) bus function? Not use Use (6) Do you use IE (Inter Equipment) bus function? Not use Use Thank you cooperation. h 4. Special item (Indicate none if there is not specified item) (V)

M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Mask ROM number MITSUBISHI ELECTRIC-CHIP 16-BIT MICROCOMPUTER M30625MGM-XXXGP MASK ROM CONFIRMATION FORM GZZ-SH13-49B<98A1> Date : TEL ( ) Receipt Section head signature Supervisor signature Customer Company name Date issued Date : Note : Please complete all items marked h . h Issuance signature Submitted by Supervisor h 1. Check sheet Mitsubishi processes the mask files generated by the mask file generation utilities out of those held on the floppy disks you give in to us, and forms them into masks. Hence, we assume liability provided that there is any discrepancy between the contents of these mask files and the ROM data to be burned into products we produce. Check thoroughly the contents of the mask files you give in. Prepare 3.5 inches 2HD (IBM format) floppy disks. And store only one mask file in a floppy disk. h 2. Mark specification The mark specification differs according to the type of package. After entering the mark specification on the separate mark specification sheet (for each package), attach that sheet to this masking check sheet for submission to Mitsubishi. For the M30625MGM-XXXGP, submit the 80P6S mark specification sheet. h 3. Usage Conditions For our reference when of testing our products, please reply to the following questions about the usage of the products you ordered. (1) Which kind of XIN-XOUT oscillation circuit is used? Ceramic resonator Quartz-crystal oscillator External clock input Other ( ) What frequency do not use? f(X IN) = MH Z Microcomputer type No. : M30625MGM-XXXGP File code : (hex) Mask file name : .MSK (alpha-numeric 8-digit)

M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER GZZ-SH13-49B<98A1> MITSUBISHI ELECTRIC-CHIP 16-BIT MICROCOMPUTER M30625MGM-XXXGP MASK ROM CONFIRMATION FORM Mask ROM number (2) Which kind of XCIN-XCOUT oscillation circuit is used? Ceramic resonator Quartz-crystal oscillator External clock input Other ( ) What frequency do not use? f(X CIN) = kH Z (3) Which operating supply voltage do you use? (Circle the operating voltage range of use) (4) Which operating ambient temperature do you use? (Circle the operating temperature range of use) -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 (°C) (5) Do you use I2C (Inter IC) bus function? Not use Use (6) Do you use IE (Inter Equipment) bus function? Not use Use Thank you cooperation. h 4. Special item (Indicate none if there is not specified item) (V)

Keep safety first in your circuit designs! Notes regarding these materials l Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap. l These materials are intended as a reference to assist our customers in the selection of the Mitsubishi semiconductor product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party. l Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. l All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Mitsubishi Electric Corporation by various means, including the Mitsubishi Semiconductor home page (http:// www.mitsubishichips.com). l When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. l Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. l The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part these materials. l If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. l Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semicon ductor product distributor for further details on these materials or the products con tained therein.

M16C/62M Group (80-pin) Specification REV.A June. First Edition 2000 Editioned by Committee of editing of Mitsubishi Semiconductor Published by Mitsubishi Electric Corp., Kitaitami Works This book, or parts thereof, may not be reproduced in any form without permission of Mitsubishi Electric Corporation. ©2000 MITSUBISHI ELECTRIC CORPORATION