M20-269-35 MICROSS | Alldatasheet
Document overview
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Technical content
2 Hellesdon Park Road, Norwich, Norfolk, NR6 5DR • +44 (0)1603 788967 • www.micross.com • chipcomponents@micross.com Component Applications:
- Thin Film & Chip Level / Known Good Die (KGD)
- Passive and Active Chip Components
- Opto Electronics and Mechanical Components Features:
- Static Protective
- Tight Dimensional Pocket Tolerance
- Durable Material Construction X Y A X Z Waffle Tray Diagram Waffle Tray - Dimensions (mm) Technical Spec (mm) X = 6.83mm ±0.13mm pocket size Y = 6.83mm ±0.13mm pocket size Z = 0.89mm ±0.08mm pocket depth A = 30° ±1/2° pocket draft angle No Cross Slots Array = 4 X 4 (16) Overall Tray Size: Size = 50.67mm ±0.25mm Height = 3.94mm +0.08mm -0.13mm Flatness = 0.30mm Waffle Tray – Dimensions (Inches) Technical Spec (inches) X = 0.269” ±0.005” pocket size Y = 0.269” ±0.005” pocket size Z = 0.035” ±0.003” pocket depth A = 30° ±1/2° pocket draft angle No Cross Slots Array = 4 X 4 (16) Overall Tray Size: Flatness = 0.012” Buy M20-269-35 Waffle Tray Pack Online Micross Kit Includes – Tray, Lid, Tyvek Paper and Clip M20-269-35 2” Square / 50.8mm Square Waffle Tray (BLACK) Tray Material Surface Resistivity Static Delay Time (sec.) Temperature Limit Lid Material Clip Material Polypropylene with Carbon Powder and Glass Bead 10 - 10 <0.01 70˚C Polypropylene with Carbon Powder and Glass Bead Polypropylene with Carbon Powder 1 5