LTV-0501

LTV-0501 LITEON | Alldatasheet

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Technical content

Created Date : 9/18/2009 Revison : 12/5/2011 Photocouplers LTV-0501 Data Sheet Created Date : 01/ 02/ 2012 Revision : 1.0, 01/ 02/ 2012 Lite-on Technology Corp. Optoelectronics SBG http://www.liteon.com/opto

Created Date : 9/18/2009 Revison : 12/5/2011 1. DESCRIPTION The LTV-0501 consists of a high efficient AlGaAs Light Emitting Diode and a high speed optical detector. This design provides excellent AC and DC isolation between the input and output sides of the Optocoupler. Connection for the bias of the photodiode improves the speed that of a conventional phototransistor coupler by reducing the base-collector capacitances. A guaranteed common mode transient immunity is up to 1KV/ µsec.

1.1 Features

/square6 SO8 package /square6 High speed – 1MBd typical /square6 Available in Dual-in-line, Wide lead spacing, Surface mounting package. /square6 Storable output.

1.2 Applications

/square6 High Voltage Isolation /square6 Isolation in line receivers /square6 Feedback element in switching mode power supplier /square6 Power transistor isolation in motor drives /square6 Interface between Microprocessor system, computer and their periphe /square6 Replace pulse transformers. /square6 Replace slower optocoupler isolators.

1.3 Functional Diagram

V B Cathode NC Vo GND Truth Table (Positive Logic) LED OUT ON L OFF H A 0.1 µF bypass Capacitor must be connected between Pin8 and Pin5

Created Date : 9/18/2009 Revison : 12/5/2011 2. PACKAGE DIMENSIONS Part No : LTV-0501 Notes : 1. Date code 2. “V” to represent VDE0884 3. Date code 4. Dimensions are all in Millimeters.

Created Date : 9/18/2009 Revison : 12/5/2011 3. TAPING DIMENSIONS Quantities Per Reel Package Type LTV-0501 Quantities (pcs) 2000 Description Symbol Dimension in mm (inch) Tape wide W 16±0.3 (0.63) Pitch of sprocket holes P 0 4±0.1 (0.15) F 7.5±0.1 (0.295) Distance of compartment P2 2±0.1 (0.079) Distance of compartment to compartment P1 8±0.1 (0.47)

Created Date : 9/18/2009 Revison : 12/5/2011 4. RATING AND CHARACTERISTICS

4.1 Absolute Maximum Ratings at Ta=25° C *1

Parameter Symbol Rating Unit Average Forward Input Current I F 25 mA Reverse Input Voltage V R 5 V Input Power Dissipation P I 45 mW Output Collector Current I O 8 mA Output Collector Voltage V O -0.5~15 V Output Output Collector Power Dissipation Po 100 mW Isolation Voltage Viso 3750 V rms Supply Voltage VCC -0.5~15 V Operating Temperature Topr -55 ~ +100 ℃ Storage Temperature Tstg -55 ~ +125 ℃ Lead Solder Temperature *2 Tsol 260 ℃ 1. Ambient temperature = 25 oC, unless otherwise specified. Stresses exceeding the absolute maximum ratings can cause permanent damage to the device. Exposure to absolute maximum ratings for long periods of time can adversely affect reliability. 2. 260 oC for 10 seconds. Refer to Lead Free Reflow Profile.

Created Date : 9/18/2009 Revison : 12/5/2011

4.2 ELECTRICAL OPTICAL CHARACTERISTICS at Ta=25° C

*All Typical at T A =25 ْC Parameter Symbol Min. Typ. Max. Unit Test Conition Input Input Forward Voltage V F — — 1.8 V IF=16mA, T A=2 5℃ Input Reverse Voltage BV R 5.0 — — V IR = 10 µA Detector 19 24 50 IF=16mA;Vcc=4.5V; TA=25 ℃;Vo=0.4V Current transfer ratio CTR 15 25 — IF=16mA;Vcc=4.5V; TA=25 ℃;Vo=0.5V — 0.1 0.4 IF=16mA;Vcc=4.5V; Io=3.0mA; T A=25 ℃ Logic low output voltage output voltage VOL — 0.1 0.5 V IF=16mA;Vcc=4.5V; Io=2.4mA; T A=25 ℃ — 0.003 0.5 IF=0mA, Vo=Vcc=5.5V TA=25 ℃ — 0.01 1 IF=0mA, Vo=Vcc=15V TA=25 ℃ Logic high output current IOH — — 50 μA Vo = Vcc = 15 V Logic low supply current IccL — 50 200 μA IF=16mA,V o=open (Vcc=15V) Logic high supply current I ccH — 0.02 1 μA IF=0mA,V o=open ; TA=25 ℃ (Vcc=15V)

Created Date : 9/18/2009 Revison : 12/5/2011 5. SWITCHING SPECIFICATION T A =0~70 ℃℃ ℃℃, Vcc=5V, unless otherwise specified. *All Typical at T A =25℃ Parameter Symbol Min. Typ. Max. Unit Test Conition Propagation Delay Time to Low Output Level tPHL — 0.2 0.8 μs TA=25 ℃ (R L=1.9K Ω, I F=16mA) Propagation Delay Time to High Output Level tPLH — 0.6 0.8 μs TA=25 ℃ (R L=1.9K Ω, I F=16mA Logic High Common Mode Transient Immunity |CM H | — 1 — KV/ µs IF=0mA;V CM =10Vp-p; C L = 15 pF; T A=25C Logic Low Common Mode Transient Immunity |CM L| 1 — KV/ µs IF=0mA;V CM =10Vp-p; C L = 15 pF; T A=25C

Created Date : 9/18/2009 Revison : 12/5/2011 6. ISOLATION CHARACTERISTIC *All Typical at T A =25℃ Notes 1. A 0.1µF or bigger bypass capacitor for V CC is needed as shown in Fig.1 2. Current Transfer Ratio is defined as the ratio of output collector current Io , to the forward LED input current IF, times 100. Parameter Symbol Min. Typ. Max. Unit Test Conition Input-Output Insulation Leakage Current II-O — — 1.0 µA 45% RH, t = 5s, V I-O = 3kV DC, T A = 25 oC Withstand Insulation Test Voltage VISO 3750 — — VRMS RH ≤ 50%, t = 1min, TA = 25 oC Input-Output Resistance R I-O — 10 12 — Ω V I-O = 500V DC

Created Date : 9/18/2009 Revison : 12/5/2011 9. TEMPERATURE PROFILE OF SOLDERING

9.1 IR Reflow soldering (JEDEC-STD-020C compliant)

One time soldering reflow is recommended within the condition of temperature and time profile shown below. Do not solder more than three times. Profile item Conditions Preheat - Temperature Min (T Smin ) - Temperature Max (T Smax ) - Time (min to max) (ts) 150˚C 200˚C 90±30 sec Soldering zone - Temperature (T - Time (t L) 217˚C 60 sec Peak Temperature (T P) 260˚C Ramp-up rate 3˚C / sec max. Ramp-down rate 3~6˚C / sec 60 ~ 120 sec 25 C 150 C 200 C 260 C 217 C 60 sec Time (sec) Temperature ( C) 20 sec Tsmax ts (Preheat) tL (Soldering) Tsmin TL TP Ramp-down Ramp-up 35~70 sec

Created Date : 9/18/2009 Revison : 12/5/2011

9.2 Wave soldering (JEDEC22A111 compliant)

One time soldering is recommended within the condition of temperature. Temperature: 260+0/-5˚C Time: 10 sec. Preheat temperature:25 to 140˚C Preheat time: 30 to 80 sec

9.3 Hand soldering by soldering iron

Allow single lead soldering in every single process. One time soldering is recommended. Temperature: 380+0/-5˚C Time: 3 sec max. 10. Notes: Specifications of the products displayed herein are subject to change without notice. The products shown in this publication are designed for the general use in electronic applications such as office automation equipment, communications devices, audio/visual equipment, electrical instrumentation and application. For equipment/devices where high reliability or safety is required, such as space applications, nuclear power control equipment, medical equipment, etc, please contact our sales representatives.