LTM4643

LTM4661 LINER | Alldatasheet

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Technical content

4661fFor more information www.linear.com/LTM4661 TYPICAL APPLICATION FEATURES DESCRIPTION 15V, 4A Step-Up µModule Regulator The LT M®4661 is a synchronous step-up switching mode µModule® (power module) regulator in a 6.25mm × 6.25mm × 2.42mm BGA package. Included in the package are the switching controller , power FETs, inductor and all support components. Operating over an input voltage of 1.8V to 5.5V, down to 0.7V after start-up, the LTM4661 regulates an output voltage of 2.5V to 15V set by an external resistor . It provides up to 4A switch current. Only bulk input and output capacitors are needed. The LTM4661 1MHz switching frequency and dual phase single output architecture enable fast transient response to line and load changes and a significant reduction of output ripple voltage. It supports frequency synchronization, PolyPhase ® operation and selectable Burst Mode operation. The LTM4661 features a true output disconnect during shutdown and inrush current limit at start-up. It also has short-circuit, overvoltage and overtemperature protection. The LTM4661 is Pb-free and RoHS compliant. 5V/2A DC/DC Step-Up µModule Regulator Efficiency vs Output Current at 3.3V Input

APPLICATIONS

n Complete Solution in <1cm2 (Single-Sided PCB) or 0.5cm2 (Dual-Sided PCB) n Input Voltage Range: 1.8V to 5.5V, Down to 0.7V After Start-Up n Output Voltage Range: 2.5V to 15V n 4A Switch Current n Dual Phase Operation n ±3% Maximum Total DC Output Voltage Regulation Over Load, Line and Temperature n Output Disconnect in Shut Down n Inrush Current Limit n External Frequency Synchronization n Selectable Burst Mode® Operation n Output Overvoltage and Overtemperature Protection n 6.25mm × 6.25mm × 2.42mm BGA package n RF Microwave Power Amplifiers n Battery Powered DC Motors n 3.3V Bus Telecom T ransceivers All registered trademarks and trademarks are the property of their respective owners. 22µF ×2 16V 22µF ×2 6.3V 2.2µF 31.6k

4661 TA01a

3.3V LOAD CURRENT (A) EFFICIENCY (%) 100 1 1.80.6 1.4

4661 TA01b

VOUT = 5V

4661f For more information www.linear.com/LTM4661 PIN CONFIGURATIONABSOLUTE MAXIMUM RATINGS 3V to INTVCC 3V to 6V Operating Internal Temperature Range C to 125°C C (Note 1) SDB FB GND COMP INTV CC FREQ SYNC/MODE GND V IN E D C B A BGA PACKAGE 25-Lead (6.25mm × 6.25mm × 2.42mm) BGA PACKAGE 25-Lead (6.25mm × 6.25mm × 2.42mm) TOP VIEW VOUT TJMAX = 125°C, θJCtop = 17°C/W , θJCbottom = 11°C/ W, θJB + θBA = 22°C/W , θJA = 22°C/W WEIGHT = 0.25g ORDER INFORMATION (See Pin Functions, Pin Configuration Table) http://www.linear .com/product/LTM4661#orderinfo PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE TYPE MSL RATING TEMPERATURE RANGE (Note 2)DEVICE FINISH CODE LTM4661EY#PBF SAC305 (RoHS) LTM4661Y e1 BGA 4 –40°C to 125°C LTM4661IY#PBF SAC305 (RoHS) LTM4661Y e1 BGA 4 –40°C to 125°C LTM4661IY SnPb (63/37) LTM4661Y e0 BGA 4 –40°C to 125°C

• Consult Marketing for parts specified with wider operating temperature ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609.
• Terminal Finish Part Marking: www.linear .com/leadfree
• Recommended BGA PCB Assembly and Manufacturing Procedures: www .linear .com/umodule/pcbassembly
• BGA Package and T ray Drawings: www.linear .com/packaging

4661fFor more information www.linear.com/LTM4661

ELECTRICAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS Switching Regulator Section: per Channel VIN Input DC Voltage VOUT ≥ 2.5V l 0.7 5.5 V VIN(MIN) Minimum Start-Up Voltage V OUT = 0V l 1.6 1.8 VOUT(RANGE) Output Voltage Range l 2.5 15 V VOUT(DC) Output Voltage, Total Variation with Line and Load RFB = 31.6k, SYNC/MODE = INTVCC VIN = 3.3V, VOUT = 5V, IOUT = 0A to 2A l 4.85 5 5.15 V IQ(VIN) Input Supply Bias Current V IN = 3.3V, VOUT = 5V, SYNC/MODE = INTVCC, IOUT = 5mA VIN = 3.3V, VOUT = 5V, SYNC/MODE = GND, IOUT = 5mA Shutdown, SDB = 0, VIN = 3.3V 8.5 0.5 mA mA µA I S(VIN) Input Supply Current V IN = 3.3V, VOUT = 5V, IOUT = 2A 3.7 A IOUT(DC) Output Continuous Current Range V IN = 3.3V, VOUT = 5V (Note 4) VIN = 3.3V, VOUT = 12V 0.7 A A ΔV OUT (Line)/VOUT Line Regulation Accuracy V OUT = 12V, VIN = 1.8V to 5.5V, IOUT = 0A l 0.1 0.5 %/V ΔVOUT (Load)/VOUT Load Regulation Accuracy V IN = 3.3V, VOUT = 5V, IOUT = 0A to 2A l 0.1 2 % VOUT(AC) Output Ripple Voltage I OUT = 0A, COUT = 2×22µF Ceramic VIN = 3.3V, VOUT = 5V 3 mV ΔVOUT(START) Turn-On Overshoot I OUT = 0A, COUT = 2×22µF Ceramic, VIN = 3.3V, VOUT = 5V 30 mV tSTART Turn-On Time COUT = 100µF Ceramic, No Load, VIN = 3.3V, VOUT = 5V 10 ms ΔVOUTLS Peak Deviation for Dynamic Load Load: 0% to 25% to 0% of Full Load C OUT = 100µF Ceramic, VIN = 3.3V, VOUT = 5V 200 mV tSETTLE Settling Time for Dynamic Load Step Load: 0% to 25% to 0% of Full Load C OUT = 100µF Ceramic, VIN = 3.3V, VOUT = 5V 500 uS VFB Voltage at VFB Pin IOUT = 0A, VIN = 3.3V, VOUT = 5V, SYNC/MODE = INTVCC l 1.17 1.2 1.23 V IFB Current at VFB Pin (Note 7) 1 50 nA RFBHI Resistor Between VOUT and VFB Pins 99.5 100 100.5 kΩ Duty(MIN) Minimum Duty Cycle FB = 1.4V (Note 7) 0 % Duty(MAX) Maximum Duty Cycle FB = 1.0V (Note 7) 90 94 % SDB Input Voltage SDB Input High SDB Input Low 1.2 0.35 V V I SDB SDB Input Current SDB = 5.5V 1 2 uA VINTVCC Internal VCC Voltage V IN < 2.8V, VOUT>5V 3.9 4.25 4.6 V fOSC Switching Frequency 1 MHz SYNC Range SYNC Frequency Range 0.5 1.5 MHz MODE/SYNC Sync Input High Voltage Sync Input Low Voltage 1.6 0.35 V V I MODE/SYNC SDB = 5.5V 1 2 uA The l denotes the specifications which apply over the specified internal operating temperature range, otherwise specifications are at TA = 25°C (Note 2), VIN = 3.3V, per the typical application.

4661f For more information www.linear.com/LTM4661 TYPICAL PERFORMANCE CHARACTERISTICS Efficiency vs Output Current, VIN = 3.3V Efficiency vs Output Current, V IN = 5V Burst vs Continuous Mode Efficiency, V IN = 3.3V 5V Output Load T ransient Response 12V Output Load T ransient Response Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The LTM4661 is tested under pulsed load conditions such that T J ≈ TA. The LTM4661E is guaranteed to meet performance specifications over the 0°C to 125°C internal operating temperature range. Specifications over the full –40°C to 125°C internal operating temperature range are assured by design, characterization and correlation with statistical process controls. The LTM4661I is guaranteed to meet specifications over the full –40°C to 125°C internal operating temperature range. Note that the maximum ambient temperature consistent with these specifications is determined by specific operating conditions in conjunction with board layout, the rated package thermal resistance and other environmental factors. Note 3: The minimum on-time condition is specified for a peak-to-peak inductor ripple current of ~40% of I MAX Load. (See the Applications Information section) Note 4: See output current derating curves for different VIN, VOUT and TA. Note 5: Limit current into the RUN pin to less than 2mA. Note 6: Guaranteed by design. Note 7: 100% tested at wafer level. Note 8: The LTM4661 includes overtemperature protection that is intended to protect the device during momentary overload conditions. Junction temperature will exceed 170°C when overtemperature shutdown is active. Continuous operation above the specified maximum operation junction temperature may result in device degradation or failure. LOAD CURRENT (A) EFFICIENCY (%) 1 1.80.6 1.4

4661 G01

VOUT = 5V , 2A DC VOUT = 8V , 1A DC VOUT = 12V , 0.65A DC VOUT = 15V , 0.5A DC LOAD CURRENT (A) EFFICIENCY (%) 1 1.80.6 1.4

4661 G02

VOUT = 8V , 1.7A DC VOUT = 12V , 1A DC VOUT = 15V , 0.8A DC 500µs/DIV VOUT (AC) 200mV/DIV LOAD STEP 500mA TO 1A

4661 G04

VIN = 3.3V, VOUT = 5V fS = 1MHz (DEFAULT) 500mA TO 1A LOAD STEP COUT = 2×22µF CERAMIC 500µs/DIV VOUT (AC) 200mV/DIV LOAD STEP 200mA TO 400mA

4661 G05

VIN = 3.3V, VOUT = 12V fS = 1MHz (DEFAULT) 200mA TO 400mA LOAD STEP C OUT = 2×22µF CERAMIC LOAD CURRENT (A) EFFICIENCY (%) 100 0.1

4661 G03

4661fFor more information www.linear.com/LTM4661 Steady State Output Ripple Start-Up Waveform with No Load Applied Start-Up Waveform with 0.5A Load Applied Short-Circuit Response TYPICAL PERFORMANCE CHARACTERISTICS 500µs/DIV VOUT (AC) 5mV/DIV

4661 G06

VIN = 3.3V, VOUT = 5V fS = 1MHz (DEFAULT) COUT = 2×22µF CERAMIC 500µs/DIV VIN 2V/DIV IIN 200mA/DIV RUN 2V/DIV VOUT 10V/DIV

4661 G07

VIN = 3.3V, VOUT = 12V fS = 1MHz (DEFAULT) COUT = 2×22µF CERAMIC 500µs/DIV VIN 2V/DIV IIN 200mA/DIV RUN 2V/DIV VOUT 10V/DIV

4661 G08

VIN = 3.3V, VOUT = 12V fS = 1MHz (DEFAULT) COUT = 2×22µF CERAMIC 500µs/DIV IIN 1A/DIV VOUT 5V/DIV

4661 G09

VIN = 3.3V, VOUT = 12V fS = 1MHz (DEFAULT) COUT = 2×22µF CERAMIC

4661f For more information www.linear.com/LTM4661 PIN FUNCTIONS VIN (A1, B1, C1, D1, E1): Power Input Pins. Apply input voltage between these pins and GND pins. Recommend placing input decoupling capacitance directly between VIN pins and GND pins. VOUT (A4, A5, B5, C5): Power Output Pins of the Switch- ing Mode Regulator . Apply output load between these pins and GND pins. Recommend placing output decoupling capacitance directly between these pins and GND pins. GND (A2, A3, B2 to B4, C2 to C4, D4, E2): Power Ground Pins for Both Input and Output Returns. SYNC/MODE (D2): Burst Mode Operation Selection Pin and External Synchronization Input to Phase Detector Pin. Connect this pin to INTV CC to operate the module in forced continuous mode. Connect this pin to GND to enable Burst Mode operation. A clock more than 100ns on the pin will force the module operating in continuous mode and synchronized to the external clock applied to this pin. The external clock frequency must be higher than the self-running frequency programmed by FREQ pin. See frequency programming in the Applications Information section. INTV CC (D3): Internal Regulator Output. The internal power drivers and control circuits are powered from this volt - age. Decouple this pin to power ground with a minimum of 2.2µF low ESR ceramic capacitor . The INTVCC voltage is regulated at the lower of VIN and 4.25V. When VIN falls below 3V and VOUT is higher than VIN, INTVCC will regulate to the lower of approximately V OUT and 4.25V. A UVLO event occurs if INTVCC drops below 1.5V, typical. FREQ (E3): Frequency Set Internally to 1MHz. An external resistor can be placed from this pin to ground to increase frequency or from this pin to INTV CC to reduce frequency. See the Applications Information section for frequency adjustment. SDB ( D5): Shutdown Control Input of the µModule Regulator. Pulling this pin above 1.6V enables normal, free-running operation. Forcing this pin below 0.25V shuts the regulator off, with quiescent current below 1µA. Do not leave this pin floating. COMP (E4): Current Control Threshold and Error Amplifier Compensation Point of the Switching Mode Regulator . Tie the COMP pins together for parallel operation. The device is internal compensated. FB (E5): The Negative Input of the Error Amplifier for the Switching Mode Regulator . Internally, this pin is connected to V OUT with a 100kΩ 0.5% precision resistor . Different output voltages can be programmed with an additional resistor between FB and GND pins. In PolyPhase operation, tying the FB pins together allows for parallel operation. See the Applications Information section for details.

4661fFor more information www.linear.com/LTM4661 BLOCK DIAGRAM FB INTVCC SYNC/MODE SDB COMP FREQ V IN VOUT VIN 3.3V VOUT 5V/2A 4661 BD 2.2µF2.2µF 4.7µF 2.2µF 22µF 47µF 28k 31.6k 100k GND VOUT INTERNAL COMP POWER CONTROL 2.2µH 2.2µH VIN OPERATION The LTM4661 is a dual-phase single-output standalone non-isolated step-up switching mode DC/DC power supply. This module provides a precisely regulated output voltage programmable via one external resistor from 1.2V to 15V and provides up to 4A switch current (see Table 1) with few external input and output ceramic capacitors. It also offers the unique ability to start up from inputs as low as 1.8V and continue to operate from inputs as low as 0.7V for output voltages greater than 2.5V. The typical applica- tion schematic is shown in Figure 17. The LTM4661 contains an integrated fixed frequency, cur- rent mode regulator , power MOSFETs, inductor and other supporting discrete components. The default switching frequency is 1MHz . For switching noise-sensitive applica- tions, the switching frequency can be adjusted by external resistors and the µModule regulator can be externally synchronized to a clock at least 100ns minimum. With current mode control and internal feedback loop compensation, the LTM4661 module has sufficient stabil- ity margins and good transient performance with a wide range of output capacitors, even with all ceramic output capacitors. Pulling the SDB pin above 1.6V enables module opera - tion and forcing it below 0.25V shuts the module off with quiescent current below 1µA. At light load currents, Burst Mode operation can be enabled to achieve higher efficiency compared to continuous mode (CCM) by setting the SYNC/ MODE pin to GND. An internal 10ms soft-start limits inrush current during start-up and simplifies the design process while minimizing the number of external components.

Figure 17. External component selection is primarily de- and the maximum duty cycle, which is clamped at 94%. delivery capability of the converter . different output current capability of the LTM4661 module. Table 1. Output Current Capability vs Input Voltage feedback resistor connects V OUT and FB pins together .

• 100k

Table 2. VFB Resistor Value vs Various Output Voltages

• 100k N Multiphase Operation The LTM4661 uses a unique dual-phase single-output architecture, rather than the conventional single phase of other boost converters. By interleaving two phases equally spaced 180° apart, both input and output current ripple get significantly reduced as well as the amount of input and output decoupling capacitor required.

4661 F01

Figure 1. Comparison of Output Ripple Current with for output ripple, stability and transient response analysis. is commanded during soft-start.

4661 F02

Figure 2. Burst Mode Output Current vs VIN

4661f For more information www.linear.com/LTM4661 Burst Mode operation, energy is delivered to the output until the nominal regulation value is reached, then the LTM4661 transitions into a very low quiescent current sleep state. In sleep, the output switches are turned off and the LT M4661 consumes only 25µA of quiescent current. When the output voltage droops approximately 1%, switching resumes. This maximizes efficiency at very light loads by minimizing switching and quiescent losses. Output voltage ripple in Burst Mode operation is typically 1% to 2% peak-to-peak. Additional output capacitance ( 22µF or greater), or the addition of a small feedforward capacitor (10pF to 50pF) connected between V OUT and FB, can help further reduce the output ripple. Operation Frequency The operating frequency of the LTM4661 is optimized to achieve the compact package size and the minimum output ripple voltage while still keeping high efficiency. The default operating frequency is internally set to 1MHz. In most ap- plications, no additional frequency adjusting is required. If any operating frequency other than 1MHz is required by application, the operating frequency can be increased by adding a resistor , RFSET, between the FREQ pin and GND, as shown in Figure 18. The operating frequency can be calculated as: fs MHz( ) = 28 + RF SET kΩ( ) RF SET kΩ( ) Frequency Synchronization The switching frequency of the LTM4661 can be synchro- nized to a desired frequency by applying a clock of twice the desired frequency to the SYNC/MODE pin. Also, the free running frequency needs to be adjusted to a frequency approximately 80% of the desired frequency. Please use the equation in the Operation Frequency section to calculate the external R FSET resistor value. For example, if the LTM4661 needs to be synchronized to 1.5MHz switching frequency, an external clock of 3MHz needs to supply to SYNC/MODE pin while adding a 140kΩ R FSET resistor between FREQ pin and GND to program the free run frequency to 1.2MHz. Shutdown The boost converter is disabled by pulling SDB below 0.25V and enabled by pulling SDB above 1.6V. Note that SDB pin can be driven above V IN or VOUT, as long as it is limited to less than its absolute maximum rating. Thermal Shutdown If the die temperature exceeds 170°C typical, the LTM4661 will go into thermal shutdown (TSD). All switches will be shut off until the die temperature drops by approximately 7°C, when the device reinitiates a soft-start and switching is re-enabled. Output Disconnect The LTM4661’s output disconnect feature eliminates body diode conduction of the internal P-channel MOSFET recti- fiers. This feature allows for V OUT to discharge to 0V during shutdown and draw no current from the input source. Inrush current will also be limited at turn-on, minimizing surge currents seen by the input supply. The output disconnect feature also allows V OUT to be pulled high, without back- feeding the power source connected to VIN. Short-Circuit Protection The LTM4661 output disconnect feature allows output short-circuit protection while maintaining a maximum set current limit. To reduce power dissipation under overload and short-circuit conditions, the peak switch current limits are reduced to approximately 2A. Once V OUT exceeds approximately 1.5V, the current limits are reset to their nominal values of 3.5A peak switching current per phase. Output Overvoltage Protection An overvoltage condition occurs when V OUT exceeds approximately 16.5V. Switching is disabled and the in - ternal soft-start ramp is reset. Once V OUT drops below approximately 16V, a soft-start is initiated and switching is allowed to resume. If the boost converter output is lightly loaded such that the time constant of the output capacitance, C OUT and the output load resistance, ROUT is near or greater than the soft-start time of approximately 10ms, the soft-start ramp may end before or soon after APPLICATIONS INFORMATION

4661fFor more information www.linear.com/LTM4661 switching resumes, defeating the inrush current limiting of the closed-loop soft-start following an overvoltage event. Thermal Considerations and Output Current Derating The thermal resistances reported in the Pin Configuration section of the data sheet are consistent with those param- eters defined by JESD51-9 and are intended for use with finite element analysis (FEA) software modeling tools that leverage the outcome of thermal modeling, simulation and correlation to hardware evaluation performed on a µModule package mounted to a hardware test board—also defined by JESD51-9 (“Test Boards for Area Array Surface Mount Package Thermal Measurements”). The motivation for providing these thermal coefficients in found in JESD51-12 (“Guidelines for Reporting and Using Electronic Package Thermal Information”). Many designers may opt to use laboratory equipment and a test vehicle such as the demo board to anticipate the µModule regulator’s thermal performance in their ap- plication at various electrical and environmental operating conditions to compliment any FEA activities. Without FEA software, the thermal resistances reported in the Pin Con- figuration section are in and of themselves not relevant to providing guidance of thermal performance ; instead, the derating curves provided in the data sheet can be used in a manner that yields insight and guidance pertaining to one’s application usage and can be adapted to correlate thermal performance to one’s own application. The Pin Configuration section typically gives four thermal coefficients explicitly defined in JESD51-12; these coef - ficients are quoted or paraphrased below: θJA, the thermal resistance from junction to ambi - ent, is the natural convection junction-to-ambient air thermal resistance measured in a one cubic foot sealed enclosure. This environment is sometimes referred to as “still air” although natural convection causes the air to move. This value is determined with the part mounted to a JESD51-9 defined test board, which does not reflect an actual application or viable operating condition. θJCbottom, the thermal resistance from junction to ambient, is the natural convection junction-to-ambient air thermal resistance measured in a one cubic foot sealed enclosure. This environment is sometimes referred to as “still air” although natural convection causes the air to move. This value is determined with the part mounted to a JESD51-9 defined test board, which does not reflect an actual application or viable operating condition. θJCtop, the thermal resistance from junction to top of the product case, is determined with nearly all of the component power dissipation flowing through the top of the package. As the electrical connections of the typical µModule are on the bottom of the package, it is rare for an application to operate such that most of the heat flows from the junction to the top of the part. As in the case of θ JCbottom, this value may be useful for comparing packages but the test conditions don’t generally match the user’s application. θJB, the thermal resistance from junction to the printed circuit board, is the junction-to-board thermal resistance where almost all of the heat flows through the bottom of the µModule and into the board, and is really the sum of the θ JCbottom and the thermal re- sistance of the bottom of the part through the solder joints and through a portion of the board. The board temperature is measured a specified distance from the package, using a two sided, two layer board. This board is described in JESD51-9. A graphical representation of the aforementioned ther - mal resistances is given in Figure 3; blue resistances are contained within the µModule regulator , whereas green resistances are external to the µModule. A s a practical matter, it should be clear to the reader that no individual or subgroup of the four thermal resistance parameters defined by JESD51-12 or provided in the Pin Configuration section replicates or conveys normal op - erating conditions of a μModule. For example, in normal bo ard-mounted applications, never does 100% of the device’s total power loss (heat) thermally conduct exclu- sively through the top or exclusively through bottom of the APPLICATIONS INFORMATION

heat flow is into the board. no airflow or heat sinking in a properly defined chamber . put voltage ranges for correlating the thermal resistance. Figure 3. Graphical Representation of JESD51-12 Thermal Coefficients

4661 F03

PCB dimensions are 65mm × 65mm. Figure 4. 5V Output Power Loss Figure 5. 8V Output Power Loss Figure 6. 12V Output Power Loss Figure 7. 15V Output Power Loss Figure 8. 3.3V to 5V Derating Figure 9. 3.3V to 8V Derating

4661 F04

4661 F05

4661 F08

4661 F06

4661 F09

4661 F07

Figure 10. 5V Input to 8V Output Figure 11. 3.3V Input to 12V Output Figure 12. 5V Input to 12V Output Figure 13. 3.3V Input to 15V Output Figure 14. 5V Input to 15V Output

4661 F10

4661 F11

4661 F14

4661 F12

4661 F13

DC current with 200LFM airflow and no heat sink. shutdown and overcurrent protection.

• Use large PCB copper areas for high current paths, including V IN, GND and VOUT. It helps to minimize the PCB conduction loss and thermal stress.
• Place high frequency ceramic input and output capaci- tors next to the VIN, PGND and VOUT pins to minimize high frequency noise.
• Place a dedicated power ground layer underneath the unit. To minimize the via conduction loss and reduce module thermal stress, use multiple vias for interconnection between top layer and other power layers. Do not put vias directly on the pad, unless they are capped or plated over . For parallel modules, tie the V OUT, V FB and COMP pins together. Use an internal layer to closely connect these pins together . Bring out test points on the signal pins for monitoring. Figure 16 gives a good example of the recommended layout. APPLICATIONS INFORMATION

Figure 16. Recommended PCB Layout

4661 F16

Figure 17. 3.3V Input to 5V Output, at 2A Design Figure 18. 3.3V to 5V Input, 12V Output Design with External Clock Figure 19. T wo LTM4661 Module Parallel Design for 8V/2A Output Running at 1.2MHz

4661 F17

4661 F18

4661 F19

4661f For more information www.linear.com/LTM4661 PACKAGE DESCRIPTION LTM4661 Component BGA Pinout PIN ID FUNCTION PIN ID FUNCTION PIN ID FUNCTION PIN ID FUNCTION PIN ID FUNCTION A1 VIN A2 GND A3 GND A4 V OUT A5 V OUT B1 VIN B2 GND B3 GND B4 GND B5 V OUT C1 VIN C2 GND C3 GND C4 GND C5 V OUT D1 VIN D2 SYNC/MODE D3 INTV CC D4 GND D5 SDB E1 VIN E2 GND E3 FREQ E4 COMP E5 FB PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULL Y .

4661fFor more information www.linear.com/LTM4661 Information furnished by Analog Devices is believed to be accurate and reliable. However , no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. PACKAGE DESCRIPTION Please refer to http://www.linear .com/product/LTM4661#packaging for the most recent package drawings. PACKAGE TOP VIEW PIN “A1” CORNER Y X aaa Z aaa Z DETAIL A PACKAGE BOTTOM VIEW SEE NOTES SUGGESTED PCB LAYOUT TOP VIEW 0.000 2.540 1.270 1.270 2.540 0.630 ±0.025 2.540 1.270 2.540 1.270 0.3175 0.3175 0.000 E D C B A 1 2 3 4 5 PIN 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS BALL DESIGNATION PER JESD MS-028 AND JEP95 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE Øb (25 PLACES) A DETAIL B PACKAGE SIDE VIEW M X Y Z ddd M Z eee D E e b F G DETAIL A 0.3175 0.3175 BGA 25 0517 REV A L TMXXXXXX µModule TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION COMPONENT PIN “A1” 25-Lead (6.25mm × 6.25mm × 2.42mm) (Reference LTC DWG # 05-08-1502 Rev A) SEE NOTES SYMBOL A b D E e F G aaa bbb ccc ddd eee MIN 2.22 0.50 1.72 0.60 0.60 0.27 1.45 NOM 2.42 0.60 1.82 0.75 0.63 6.25 6.25 1.27 5.08 5.08 0.32 1.50 MAX 2.62 0.70 1.92 0.90 0.66 0.37 1.55 0.15 0.10 0.20 0.30 0.15 TOTAL NUMBER OF BALLS: 25 DIMENSIONS NOTES BALL HT BALL DIMENSION PAD DIMENSION SUBSTRATE THK MOLD CAP HT Z 5. PRIMARY DATUM -Z- IS SEATING PLANE

6 PACKAGE ROW AND COLUMN LABELING MAY VARY

AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULL Y DETAIL B SUBSTRATE ccc Z Z // bbb Z MOLD CAP

4661f For more information www.linear.com/LTM4661 LT 1117 • PRINTED IN USA www.linear.com/LTM4661  ANALOG DEVICES, INC. 2017 DESIGN RESOURCES SUBJECT DESCRIPTION µModule Design and Manufacturing Resources Design:

• Selector Guides
• Demo Boards and Gerber Files
• Free Simulation Tools Manufacturing:
• Quick Start Guide
• PCB Design, Assembly and Manufacturing Guidelines
• Package and Board Level Reliability µModule Regulator Products Search 1. Sort table of products by parameters and download the result as a spread sheet. 2. Search using the Quick Power Search parametric table. TechClip Videos Quick videos detailing how to bench test electrical and thermal performance of µModule products. Digital Power System Management Analog Devices’s family of digital power supply management ICs are highly integrated solutions that offer essential functions, including power supply monitoring, supervision, margining and sequencing, and feature EEPROM for storing user configurations and fault logging. RELATED PARTS PACKAGE PHOTO PART NUMBER DESCRIPTION COMMENTS LTM8054 36VIN, 5.4A Buck-Boost µModule Regulator 5V ≤ VIN ≤ 36V, 1.2V ≤ VOUT ≤ 36V, 11.25mm × 15mm × 3.42mm BGA LTM8045 SEPIC (Boost) or Inverting µModule Regulator 2.8V ≤ V IN ≤ 18V. ±2.5V ≤ VOUT ≤ ±15V, IOUT is up to 700mA. 6.25mm × 11.25mm x 4.92mm BGA LTM8049 Dual, SEPIC (Boost) and/or Inverting µModule Regulator 2.6V ≤ VIN ≤ 20V, ±2.5V ≤ VOUT ≤ ±24V, IOUT is up to 1.5A, 9mm × 15mm × 2.42mm BGA LTM4622 Ultrathin, 20VIN, Dual 2.5A Step-Down µModule Regulator 6.25mm × 6.25mm × 2.42mm BGA LTM4643 Ultrathin, 20VIN, Quad 3A Step-Down µModule Regulator 4V ≤ VIN ≤ 20V, 0.6V ≤ VOUT ≤ 3.3V, 9mm × 15mm × 1.82mm LGA, 9mm × 15mm × 2.42mm BGA