M393A1G40DB0-CPB SAMSUNG | Alldatasheet

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DISPLAYS, MEMORY AND STORAGE 1H 2015 cont acts Displa ys s torage M cp Fl ash - ss D D ra M

To access our online sales portal, visit: https://smarttools.ssi.samsung.com www.samsung.com/us/ oem-solutions MOBILE/WIRELESS NOTEBOOK PCs/ ULTRABOOKS™ DESKTOP PCs/ WORKSTATIONS NETWORKING/ COMMUNICATIONS CONSUMER ELECTRONICS Markets DRAM SSD FLASH ASIC LOGIC TFT/LCD ODD SERVERS Samsung continues to lead the industry with the broadest portfolio of memory products and display technology. Its display panels, DRAM, flash, mobile and graphics memory are found in many computers – from ultrabooks to powerful servers – and in a wide range of handheld devices such as smartphones and tablets. Samsung is also a leader in TV displays. In addition, Samsung provides the industry’s widest line of storage products from the consumer to enterprise levels. These include optical disc drives as well as flash storage, such as Solid State Drives, and a range of embedded flash storage products. Samsung Semiconductor, Inc.

DraM PAGES 4–13 samsung.com/ dram

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  • eMMC • Solid St ate Drives (SSD) MUlti-chip pacKa ge s PAGES 16–17 samsung.com/mcp
  • eMMC + LPDDR3 storage PAGES 18–20 samsung.com/flash-ssd tsstodd.com
  • Solid St ate Drives • Op tical Disc Drives Displa ys PAGES 21–22 samsungdisplay.com
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  • T o access our online sales portal, visit: https://smarttools.ssi.samsung.com DraM

samsung.com/ dram4 1H 2015 DDR4 SDRAM samsung.com/ dram DDR4 SDRAM REGISTERED MODULES Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 8GB 1.2V 1G x 72 M393A1G40DB0-CPB 4Gb (1G x4) * 18 Lead Free & Halogen Free, Flip Chip 2133 1 Now M393A1G40DB1-CRC 4Gb (1G x4) * 18 Lead Free & Halogen Free, Flip Chip 2400 1 CS: '15, Mar M393A1G43DB0-CPB 4Gb (512M x8) * 18 Lead Free & Halogen Free, Flip Chip 2133 2 Now M393A1G43DB1-CRC 4Gb (512M x8) * 18 Lead Free & Halogen Free, Flip Chip 2400 2 CS: '15, Apr 16GB 1.2V 2G x 72 M393A2G40DB0-CPB 4Gb (1G x4) * 36 Lead Free & Halogen Free, Flip Chip 2133 2 Now M393A2G40DB1-CRC 4Gb (1G x4) * 36 Lead Free & Halogen Free, Flip Chip 2400 2 CS: '15, Feb M393A2K40BB0-CPB 8Gb (2G x4) * 18 Lead Free & Halogen Free, Flip Chip 2133 1 Now M393A2K40BB1-CRC 8Gb (2G x4) * 18 Lead Free & Halogen Free, Flip Chip 2400 1 1Q'15 M393A2K43BB1-CPB/CRC 8Gb (1G x8) * 18 Lead Free & Halogen Free, Flip Chip 2133/2400 2 CS: '15, Apr 32GB 1.2V 4G x 72 M393A4K40BB0-CPB 8Gb (2G x4) * 36 Lead Free & Halogen Free, Flip Chip 2133 2 Now M393A4K40BB1-CRC 8Gb (2G x4) * 36 Lead Free & Halogen Free, Flip Chip 2400 2 CS: '15, Mar 64GB TSV 1.2V 8G x 72 M393A8G40D40-CRB 4Gb (4G x4) * 36 Lead Free & Halogen Free, 4High TSV 2133 8 Now M393A8G40D41-CTC 4Gb (4G x4) * 36 Lead Free & Halogen Free, 4High TSV 2400 8 CS: '15, 2Q Notes: DDR4 4Gb based 0 = IDT 2 = Montage PB = DDR4-2133(15-15-15) RB = DDR4-2133(17-15-15) 0 = IDT 4 = Montage RC = DDR4-2400(17-17-17) TC = DDR4-2400(19-17-17) DDR4 8Gb based 0 = IDT 4 = Montage PB = DDR4-2133(15-15-15) RB = DDR4-2400(17-15-15) 0 = IDT 4 = Montage RC = DDR4-2400(17-17-17) TC = DDR4-2400(19-17-17) DDR4 SDRAM COMPONENTS Density Voltage Organization Part Number # Pins-Package Compliance Speed (Mbps) Dimensions Production 4Gb 1.2V 1G x 4 K4A4G045WD-BCRC/PB 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 2400/2133 7.5x11mm Now 512M x 8 K4A4G085WD-BCRC/PB 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 2400/2133 7.5x11mm Now 256M x 16 K4A4G165WD-BCRC/PB 96 Ball -FBGA Lead Free & Halogen Free, Flip Chip 2400/2133 7.5x13.3mm Now 8Gb 1.2V 2G x 4 K4A8G045WB-BCRC/PB 78 ball FBGA Lead Free & Halogen Free, Flip Chip 2400/2133 7.5x11mm Now 1G x 8 K4A8G085WB-BCRC/PB 78 ball FBGA Lead Free & Halogen Free, Flip Chip 2400/2133 7.5x11mm Now 512M x16 K4A8G165WB-BCRC/PB 96 Ball -FBGA Lead Free & Halogen Free, Flip Chip 2400/2133 7.5x13.3mm CS: '15, 1Q DDR4 SDRAM LOAD REDUCED MODULES Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 32GB 1.2V 4G x 72 M386A4G40DM0-CPB 4Gb DDP (2Gx4) * 36 Lead Free & Halogen Free, DDP 2133 4 Now M386A4G40DM1-CRC 4Gb DDP (2Gx4) * 36 Lead Free & Halogen Free, DDP 2400 4 CS: '15, May 64GB 1.2V 8G x 72 M386A8K40BM1-CPB 8Gb DDP (4Gx4) * 36 Lead Free & Halogen Free, DDP 2133 4 CS: '15, Mar M386A8K40BM1-CRC 8Gb DDP (4Gx4) * 36 Lead Free & Halogen Free, DDP 2400 4 CS: '15, May Notes: DDR4 4Gb based 0 = IDT 2 = Montage PB = DDR4-2133(15-15-15) 5 = IDT 4 = Montage RC = DDR4-2400(17-17-17) DDR4 8Gb based 0 = IDT 4 = Montage PB = DDR4-2133(15-15-15) 5 = IDT 4 = Montage RC = DDR4-2400(17-17-17) DDR4 SDRAM VLP REGISTERED MODULES Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 16GB 1.2V 2G x 72 M392A2G40DM0-CPB 4Gb DDP (2G x4) * 18 Lead Free & Halogen Free, DDP 2133 2 Now M392A2K43BB1-CPB/RC 8Gb (1G x8) * 18 Lead Free & Halogen Free, Flip Chip 2133/2400 2 CS: '15, July 32GB 1.2V 4G x 72 M392A4K40BM0-CPB/RC 8Gb DDP (4G x4) * 18 Lead Free & Halogen Free, DDP 2133/2400 2 CS: '15, Apr DDR4 SDRAM UNBUFFERED MODULES Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 4GB 1.2V 512M x 64 M378A5143DB0-CPB 4Gb (512M x8) *8 Lead Free & Halogen Free 2133 1 Now M378A5143DB1-CRC 4Gb (512M x8) *8 Lead Free & Halogen Free 2400 1 CS: '15, Apr 8GB 1.2V 1G x 64 M378A1G43DB0-CPB 4Gb (512M x8) *16 Lead Free & Halogen Free 2133 2 Now M378A1G43DB1-CRC 4Gb (512M x8) *16 Lead Free & Halogen Free 2400 2 CS: '15, Apr 16GB 1.2V 2G x 64 M378A2K43BB1-CPB/CRC 8Gb (1G x8) * 16 Lead Free & Halogen Free 2133/2400 2 CS: '15, Feb Notes: PB = DDR4-2133(15-15-15) RC = DDR4-2400(17-17-17)

samsung.com/ dram DRAM 1H 2015DDR3 SDRAM DDR4 SDRAM ECC UNBUFFERED MODULES Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 8GB 1.2V 1G x72 M391A1G43DB0-CPB 4Gb (512M x8) * 18 Lead Free & Halogen Free, Flip Chip 2133 2 Now M391A1G43DB1-CRC 4Gb (512M x8) * 18 Lead Free & Halogen Free, Flip Chip 2400 2 CS: '15, May 16GB 1.2V 2G x72 M391A2K43BB1-CPB/CRC 8Gb (1G x8) * 18 Lead Free & Halogen Free, Flip Chip 2133/2400 2 CS: '15, Mar Notes: PB = DDR4-2133(15-15-15) RC = DDR4-2400(17-17-17) DDR4 SDRAM ECC SODIMM MODULES Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 8GB 1.2V 1G x 72 M474A1G43DB0-CPB 4Gb (512M x8) * 18 Lead Free & Halogen Free, Flip Chip 2133 2 Now M474A1G43DB1-CRC 4Gb (512M x8) * 18 Lead Free & Halogen Free, Flip Chip 2400 2 CS: '15, May 16GB 1.2V 2G x 72 M474A2K43BB1-CPB/RC 8Gb (1G x8) * 18 Lead Free & Halogen Free, Flip Chip 2133/2400 2 CS: '15, Mar DDR4 SDRAM SODIMM MODULES Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 4GB 1.2V 512M x 64 M471A5143DB0-CPB 4Gb (512M x8) * 8 Lead Free & Halogen Free 2133 1 Now M471A5143DB1-CRC 4Gb (512M x8) * 8 Lead Free & Halogen Free 2400 1 CS: '15, Apr 8GB 1.2V 1G x 64 M471A1G43DB0-CPB 4Gb (512M x8) * 16 Lead Free & Halogen Free 2133 2 Now M471A1G43DB1-CRC 4Gb (512M x8) * 16 Lead Free & Halogen Free 2400 2 CS: '15, Apr 16GB 1.2V 2G x 64 M471A2K43BB1-CPB/CRC 8Gb (1G x8) * 16 Lead Free & Halogen Free 2133/2400 2 CS: '15, Feb Notes: PB = DDR4-2133(15-15-15) RC = DDR4-2400(17-17-17) DDR3 SDRAM REGISTERED MODULES Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 8GB 1.5V 1G x 72 M393B1K70QB0-CMA (08/09) 2Gb (512M x4) * 36 Lead Free & Halogen Free, Flip Chip 1866 2 Now M393B1G70QH0-CMA (08/09) 4Gb (1G x4) * 18 Lead Free & Halogen Free 1866 1 Now M393B1G73QH0-CMA (08/09) 4Gb (512M x8) * 18 Lead Free & Halogen Free 1866 2 Now 16GB 1.5V 2G x 72 M393B2G70QH0-CMA (08/09) 4Gb (1G x4) * 36 Lead Free & Halogen Free 1866 2 Now M393B2G70DB0-CMA (02/03) 4Gb (1G x4) * 36 Lead Free & Halogen Free, Flip Chip 1866 2 Now M393B2G70EB0-CMA (02/03) 4Gb (1G x4) * 36 Lead Free & Halogen Free, Flip Chip 1866 2 Now 8GB 1.35V 1G x 72 M393B1K70QB0-YK0 (08/09) 2Gb (512M x4) * 36 Lead Free & Halogen Free, Flip Chip 1600 2 Now M393B1G70QH0-YK0 (08/09) 4Gb (1G x4) * 18 Lead Free & Halogen Free 1600 1 Now 16GB 1.35V 2G x 72 M393B2G70QH0-YK0 (08/09) 4Gb (1G x4) * 36 Lead Free & Halogen Free 1600 2 Now M393B2G70DB0-YK0 (02/03) 4Gb (1G x4) * 36 Lead Free & Halogen Free, Flip Chip 1600 2 Now M393B2G70EB0-YK0 (02/03) 4Gb (1G x4) * 36 Lead Free & Halogen Free, Flip Chip 1600 2 Now 32GB 1.35V 4G x 72 M393B4G70DM0-YH9(02/03) 4Gb DDP (2G x4) * 36 Lead Free & Halogen Free. DDP 1333 4 Now Notes: 8 = IDT A1 Evergreen 9 = Inphi UVGS02 2 = IDT Alpine 3 = Inphi XV-GS02 K0 = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13) DDR3 SDRAM Load Reduced REGISTERED MODULES Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 32GB 1.35V 4G x 72 M386B4G70DM0-YK0(3/4) 4Gb DDP (2G x4) * 36 Lead Free & Halogen Free, DDP 1600 4 Now 1.5V M386B4G70DM0-CMA(3/4) 4Gb DDP (2G x4) * 36 Lead Free & Halogen Free, DDP 1866 4 Now 64GB 1.35V 8G x 72 M386B8G70DE0-YH9(4) 4Gb QDP (4G x4) * 36 Lead Free & Halogen Free, QDP 1333 8 Now 1.5V M386B8G70DE0-CK0(4) 4Gb QDP (4G x4) * 36 Lead Free & Halogen Free, QDP 1600 8 Now Notes: 3 = Inphi iMB GS02B 4 = Montage C1

samsung.com/ dram6 1H 2015 DDR3 SDRAM & DDR2 SDRAM DDR3 SDRAM ECC SODIMM MODULES Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 8GB 1.5V 1024M x 72 M474B1G73QH0-CMA 4Gb (512M x8) * 18 Lead Free & Halogen Free 1866 2 Now 1.35V M474B1G73QH0-YK0 4Gb (512M x8) * 18 Lead Free & Halogen Free 1600 2 Now DDR3 SDRAM UNBUFFERED MODULES Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 2GB 1.5V 256M x 64 M378B5773QB0-CK0/MA 2Gb (256M x8) * 8 Lead Free & Halogen Free 1600/1866 1 Now 4GB 1.5V 512M x 64 M378B5173QH0-CK0/MA 4Gb (512M x8) * 8 Lead Free & Halogen Free 1600/1866 1 Now M378B5173DB0-CK0/MA 4Gb (512M x8) * 8 Lead Free & Halogen Free 1600/1866 1 Now M378B5173EB0-CK0/MA 4Gb (512M x8) * 8 Lead Free & Halogen Free 1600/1866 1 Now 1.35V M378B5173QH0-YK0 4Gb (512M x8) * 8 Lead Free & Halogen Free 1600 1 2Q'15 M378B5173EB0-YK0 4Gb (512M x8) * 8 Lead Free & Halogen Free 1600 1 2Q'15 8GB 1.5V 1024M x 64 M378B1G73QH0-CK0/MA 4Gb (512M x8) * 16 Lead Free & Halogen Free 1600/1866 2 Now M378B1G73DB0-CK0/MA 4Gb (512M x8) * 16 Lead Free & Halogen Free 1600/1866 2 Now M378B1G73EB0-CK0/MA 4Gb (512M x8) * 16 Lead Free & Halogen Free 1600/1866 2 Now 1.35V M378B1G73QH0-YK0 4Gb (512M x8) * 16 Lead Free & Halogen Free 1600 2 2Q'15 M378B1G73EB0-YK0 4Gb (512M x8) * 16 Lead Free & Halogen Free 1600 2 2Q'15 Notes: K0 = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13) DDR3 SDRAM VLP REGISTERED MODULES Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 8GB 1.5V 1G x 72 M392B1G70DB0-CMA (03/04) 4Gb (1Gx4) * 18 Lead Free & Halogen Free, Flip Chip 1866 1 Now 1.35V M392B1G70DB0-YK0 (03/04) 4Gb (1Gx4) * 18 Lead Free & Halogen Free, Flip Chip 1600 1 Now 1.5V M392B1G73DB0-CMA (03/04) 4Gb (512M x8) * 18 Lead Free & Halogen Free, Flip Chip 1866 2 Now 1.35V M392B1G73DB0-YK0 (03/04) 4Gb (512M x8) * 18 Lead Free & Halogen Free, Flip Chip 1600 2 Now 16GB 1.5V 2G x 72 M392B2G70DM0-CMA (03/04) 4Gb DDP (2G x4) * 18 Lead Free & Halogen Free, DDP 1866 2 Now 1.35V M392B2G70DM0-YK0 (03/04) 4Gb DDP (2G x4) * 18 Lead Free & Halogen Free, DDP 1600 2 Now 32GB 1.35V 4G x 72 M392B4G70DE0-YH9 (03/04) 4Gb QDP (4G x4) * 18 Lead Free & Halogen Free, QDP 1333 4 Now Notes: 2 = IDT Alpine 3 = Inphi XV-GS02 K0 = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13) DDR3 SDRAM UNBUFFERED MODULES (ECC) Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 8GB 1.5V 1024M x 72 M391B1G73QH0-CMA 4Gb (512M x8) * 18 Lead Free & Halogen Free 1866 2 Now 1.35V M391B1G73QH0-YK0 4Gb (512M x8) * 18 Lead Free & Halogen Free 1600 2 Now Notes: H9 = DDR3-1333 (9-9-9) K0 = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13) DDR3 SDRAM SODIMM MODULES Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 2GB 1.35V 256M x 64 M471B5674QH0-YK0 4Gb (256M x16) * 4 Lead Free & Halogen Free 1600 1 Now 4GB 1.35V 512M x 64 M471B5173QH0-YK0 4Gb (512M x8) * 8 Lead Free & Halogen Free 1600 1 Now M471B5173DB0-YK0 4Gb (512M x8) * 8 Lead Free & Halogen Free 1600 1 Now M471B5173EB0-YK0 4Gb (512M x8) * 8 Lead Free & Halogen Free 1600 1 Now 8GB 1.35V 1024M x 64 M471B1G73QH0-YK0 4Gb (512M x8) * 16 Lead Free & Halogen Free 1600 2 Now M471B1G73DB0-YK0 4Gb (512M x8) * 16 Lead Free & Halogen Free 1600 2 Now M471B1G73EB0-YK0 4Gb (512M x8) * 16 Lead Free & Halogen Free 1600 2 Now Notes: H9 = DDR3-1333 (9-9-9) K0 = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13)

samsung.com/ dram DRAM 1H 2015 DDR3 SDRAM COMPONENTS Density Voltage Organization Part Number # Pins- Package Compliance Speed (Mbps) Dimensions Production 1Gb 1.5V 128M x 8 K4B1G0846G-BC(H9/K0/MA) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1333/1600/1866 7.5x11mm Now 128M x 16 K4B1G1646G-BC(H9/K0/MA/NB) 96 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1333/1600/1866/2133 7.5x13.3mm Now 2Gb 1.5V 256M x 8 K4B2G0846Q-BC(K0/MA/NB) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600/1866/2133 7.5x11mm Now 128M x 16 K4B2G1646Q-BC(K0/MA/NB) 96 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600/1866/2133 7.5x13.3mm Now 512M x 8 K4B4G0846D-BC(K0/MA/NB) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600/1866/2133 7.5x11mm Now 256M x 16 K4B4G1646D-BC(K0/MA/NB) 96 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600/1866/2133 7.5x13.3mm Now 512M x 8 K4B4G0846E-BC(K0/MA/NB) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600/1866/2133 7.5x11mm Now 256M x 16 K4B4G1646E-BC(K0/MA/NB) 96 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600/1866/2133 7.5x13.3mm Now 8Gb 1.5V 512M x 16 K4B8G1646Q-MCK0/MA 96 Ball -FBGA Lead Free & Halogen Free 1600/1866 11x13.3mm Now 1Gb 1.35V 128M x 8 K4B1G0846G-BY(H9/K0) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1333/1600 7.5x11mm Now 128M x 16 K4B1G1646G-BY(H9/K0) 96 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1333/1600 7.5x13.3mm Now 2Gb 1.35V 512M x 4 K4B2G0446Q-BYK0 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600 7.5x11mm Now 256M x 8 K4B2G0846Q-BYK0/MA 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600/1866 7.5x11mm Now 128M x 16 K4B2G1646Q-BYK0/MA 96 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600/1866 7.5x13.3mm Now 4Gb 1.35V 1G x 4 K4B4G0446Q-HYK0 78 Ball -FBGA Lead Free & Halogen Free 1600 10x11mm Now 512M x 8 K4B4G0846Q-HYK0 78 Ball -FBGA Lead Free & Halogen Free 1600 10x11mm Now 256M x 16 K4B4G1646Q-HYK0 96 Ball -FBGA Lead Free & Halogen Free 1600 10x13.3mm Now 1G x 4 K4B4G0446D-BYK0 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600 7.5x11mm Now 512M x 8 K4B4G0846D-BYK0 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600 7.5x11mm Now 256M x 16 K4B4G1646D-BYK0/MA 96 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600/1866 7.5x13.3mm Now 1G x 4 K4B4G0446E-BY(K0/MA) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600 7.5x11mm Now 512M x 8 K4B4G0846E-BY(K0/MA) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600/1866 7.5x11mm Now 256M x 16 K4B4G1646E-BY(K0/MA) 96 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600/1866 7.5x13.3mm Now 8Gb 1.35V 512M x 16 K4B8G1646Q-MYK0 96 Ball -FBGA Lead Free & Halogen Free 1600 11x13.3mm Now Notes: H9 = DDR3-1333 (9-9-9) K0 = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13) NB = DDR3-2133 (14-14-14) DDR2 SDRAM COMPONENTS Density Organization Part Number # Pins-Package Dimensions Package Speed (Mbps) Production 512Mb 64M x 8 K4T51083QQ-BC(E6/F7/E7/F8) 60-FBGA 7.5x9.5mm Lead free & Halogen free , Flip chip 667/800/1066 Now 32M x 16 K4T51163QQ-BC(E6/F7/E7/F8) 84-FBGA 7.5x12.5mm Lead free & Halogen free , Flip chip 667/800/1066 Now 1Gb 128M x 8 K4T1G084QG-BC(E6/F7/E7/F8) 60-FBGA 7.5x9.5mm Lead free & Halogen free , Flip chip 667/800/1066 Now 64M x 16 K4T1G164QG-BC(E6/F7/E7/F8) 84-FBGA 7.5x12.5mm Lead free & Halogen free , Flip chip 667/800/1066 Now Graphics DRAM

samsung.com/ dram8 1H 2015 Mobile DRAM MOBILE DRAM COMPONENTS Type Density Organization Part Number Package Power Production LPDDR3 8Gb 1CH x 32 K4E8E304EE-EGCE 178-FBGA, 11x11.5, DDP , 1600Mbps 1.8V/1.2V/1.2V Now 1CH x 32 K4E8E304EE-AGCE 168-FBGA, 12x12, DDP , 1600Mbps 1.8V/1.2V/1.2V Now 2CH x 32 K3QF1F10EM-AGCE 253-FBGA, 11x11.5, DDP , 1600Mbps 1.8V/1.2V/1.2V Now 2CH x 32 K3QF1F10EM-BGCE 216-FBGA, 12x12, DDP , 1600Mbps 1.8V/1.2V/1.2V Now 2CH x 32 K3QF1F10EM-FGCE 256-FBGA, 14x14, DDP , 1600Mbps 1.8V/1.2V/1.2V Now 12Gb 1CH x 32 K4E2E304EE-AGCE 168-FBGA, 12x12, TDP , 1600Mbps 1.8V/1.2V/1.2V Now 16Gb 1CH x 32 K4E6E304EE-EGCE 178-FBGA, 11x11.5, QDP , 1600Mbps 1.8V/1.2V/1.2V Now 1CH x 32 K4E6E304EE-AGCE 168-FBGA, 12x12, QDP , 1600Mbps 1.8V/1.2V/1.2V Now 2CH x 32 K3QF2F20EM-AGCE 253-FBGA, 11x11.5, QDP , 1600Mbps 1.8V/1.2V/1.2V Now 2CH x 32 K3QF2F20EM-BGCE 216-FBGA, 12x12 PoP , QDP , 1600Mbps 1.8V/1.2V/1.2V Now 2CH x 32 K3QF2F20EM-FGCE 256-FBGA, 14x14 PoP , QDP , 1600Mbps 1.8V/1.2V/1.2V Now 2CH x 32 K3QF2F20EM-QGCE 216-FBGA, 15x15 PoP , QDP , 1600Mbps 1.8V/1.2V/1.2V Now 24Gb 2CH x 32 K3QF6F60MM-BGCE 216-FBGA, 12x12 PoP , QDP , 1600Mbps 1.8V/1.2V/1.2V ES 2CH x 32 K3QF6F60MM-FGCE 256-FBGA, 14x14 PoP , QDP , 1600Mbps 1.8V/1.2V/1.2V Now 2CH x 32 K3QF6F60MM-QGCE 216-FBGA, 15x15 PoP , QDP , 1600Mbps 1.8V/1.2V/1.2V Now 2CH x 32 K3MF9F90MM-MGCE 504-FBGA, 15x15 PoP , QDP , 1600Mbps 1.8V/1.2V/1.2V Now LPDDR4 24Gb x 64 K3RG3G30MM-MGCH 366-FBGA, 15x15, QDP , 3200Mbps 1.8V/1.1V/1.1V Now 32Gb x 64 K3RG2G20BM-MGCH 366-FBGA, 15x15, QDP , 3200Mbps 1.8V/1.1V/1.1V ES GRAPHICS DRAM COMPONENTS Type Density Organization Part Number Package VDD/VDDQ Speed Bin (MHz) Production GDDR5 8Gb 256M x 32 K4G80325FB-HC(04/03/28/25) 170-FCFBGA 1.5V/1.5V 5000/6000/7000/8000 CS: '15,2Q K4G80325FB-HC(04/03/28/25) 170-FCFBGA 1.35V/1.35V 4000/5000/6000/(TBD) CS: '15,2Q 4Gb 128M x 32 K4G41325FC-HC(04/03/28) 170-FCFBGA 1.35V/1.35V 4000/5000/5500 Now 2Gb 64M x 32 K4G20325FS-HC(04/03) 170-FBGA 1.5V/1.5V 5000/6000 Now K4G20325FS-HC(04/03) 170-FBGA 1.35V/1.35V 4000/5000 Now K4G20325FD-FC(04/03) 170-FBGA 1.35V/1.35V 4000/5000 Now gDDR3 4Gb 256M x 16 K4W4G1646E-BC(1A/1B) 96-FCFBGA 1.5V/1.5V 2133/2400 Now K4W4G1646E-BC(1A/1B) 96-FCFBGA 1.35V/1.35V 1866/2133 Now K4W4G1646D-BC(12/11/1A) 96-FCFBGA 1.5V/1.5V 1600/1866/2133 Now K4W4G1646D-BC(1A) 96-FCFBGA 1.35V/1.35V 1866 Now K4W4G1646D-BY(12) 96-FCFBGA 1.35V/1.35V 1600 Now 2Gb 128M x 16 K4W2G1646Q-BC(12/11/1A) 96-FCFBGA 1.5V/1.5V 1600/1866/2133 Now K4W2G1646Q-BC(1A) 96-FCFBGA 1.35V/1.35V 1866 Now K4W2G1646Q-BY(12) 96-FCFBGA 1.35V/1.35V 1600 Now Notes: Package (1) Speeds (clock cycle - speed bin) H: FBGA (Halogen Free & Lead Free) (DDR3) B: FCFBGA (Halogen Free & Lead Free) (DDR3) H: FCFBGA (Halogen Free & Lead Free) (GDDR5) F: FBGA (Halogen Free & Lead Free) (GDDR5) 25: 0.25ns (8000Mbps) 28: 0.28ns (7000Mbps) 03: 0.3ns (6000Mbps) 04: 0.4ns (5000Mbps) 05: 0.5ns (4000Mbps) 1B: 8.3ns (2400Mbps gDDR3) 1A: 1.0ns (2133Mbps gDDR3) 11: 1.1ns (1866Mbps) 12: 1.25ns (1600Mbps)

samsung.com/ dram DRAM 1. Memor y (K) DRAM: 4 DRAM T ype B: DDR3 SDRAM D: GDDR SDRAM G: GDDR5 SDRAM H: DDR SDRAM J: GDDR3 SDRAM M: Mobile SDRAM N: SDDR2 SDRAM S: SDRAM T: DDR SDRAM U: GDDR4 SDRAM V: Mobile DDR SDRAM Power Efficient Address W: SDDR3 SDRAM X: Mobile DDR SDRAM Y: XDR DRAM Z: Value Added DRAM 4. Density 10: 1G, 8K/32ms 16: 16M, 4K/64ms 26: 128M, 4K/32ms 28: 128M, 4K/64ms 32: 32M, 2K/32ms 50: 512M, 32K/16ms 51: 512M, 8K/64ms 52: 512M, 8K/32ms 54: 256M, 16K/16ms 55: 256M, 4K/32ms 56: 256M, 8K/64ms 62: 64M, 2K/16ms 64: 64M, 4K/64ms 68: 768M, 8K/64ms 1G: 1G, 8K/64ms 2G: 2G, 8K/64ms 4G: 4G, 8K/64ms 5. Bit Organization 02: x 2 04: x 4 06: x 4 Stack (Flexframe) 07: x 8 Stack (Flexframe) 08: x 8 15: x 16 (2CS) 16: x 16 26: x 4 Stack (JEDEC Standard) 27: x 8 Stack (JEDEC Standard) 30: x 32 (2CS, 2CKE) 31: x 32 (2CS) 32: x 32 6. # of Internal Banks 2: 2 Banks 3: 4 Banks 4: 8 Banks 5: 16 Banks 7. Interf ace ( VDD, VDDQ) 2: LVTTL, 3.3V, 3.3V 4: LVTTL, 2.5V, 2.5V 5: SSTL-2 1.8V, 1.8V 6: SSTL-15 1.5V, 1.5V 8: SSTL-2, 2.5V, 2.5V A: SSTL, 2.5V, 1.8V F: POD-15 (1.5V,1.5V) H: SSTL_2 DLL, 3.3V, 2.5V M: LVTTL, 1.8V, 1.5V N: LVTTL, 1.5V, 1.5V P: LVTTL, 1.8V, 1.8V Q: SSTL-2 1.8V, 1.8V R: SSTL-2, 2.8V, 2.8V U: DRSL, 1.8V, 1.2V 8. Generation A: 2nd Generation B: 3rd Generation C: 4th Generation D: 5th Generation E: 6th Generation F: 7th Generation G: 8th Generation H: 9th Generation I: 10th Generation J: 11th Generation K: 12th Generation M: 1st Generation N: 14th Generation Q: 17th Generation 9. P ackage Type DDR2 DRAM L: TSOP II (Lead-free & Halogen-free) H: FBGA (Lead-free & Halogen-free) F: FBGA for 64Mb DDR (Lead-free & Halogen-free) 6: sTSOP II (Lead-free & Halogen-free) T: TSOP II N: sTSOP II G: FBGA U: TSOP II (Lead-free) V: sTSOP II (Lead-free) Z: FBGA (Lead-free) DDR2 SDRAM Z: FBGA (Lead-free) J: FBGA DDP (Lead-free) Q: FBGA QDP (Lead-free) H: FBGA (Lead-free & Halogen-free) M: FBGA DDP (Lead-free & Halogen-free) E: FBGA QDP (Lead-free & Halogen-free) T: FBGA DSP (Lead-free & Halogen-free, Thin) DDR3 SDRAM Z: FBGA (Lead-free) H: FBGA (Halogen-free & Lead-free) Graphics Memory Q: TQFP U: TQFP (Lead Free) G: 84/144 FBGA V: 144 FBGA (Lead Free) Z: 84 FBGA (Lead Free) T: TSOP L: TSOP (Lead Free) A: 136 FBGA B: 136 FBGA (Lead Free) H: FBGA (Hologen Free & Lead Free) E: 100 FBGA (Hologen Free & Lead Free) SDRAM L TSOP II (Lead-free & Halogen-free) N: STSOP II T: TSOP II U: TSOP II (Lead-free) V: sTSOP II (Lead-free) COMPONENT DRAM ORDERING INFORMATION 1 2 3 4 5 6 7 8 9 10 11 K 4 T XX XX X X X X X XX SAMSUNG Memory DRAM DRAM Type Density Bit Organization Speed Temp & Power Package Type Generation Interface (VDD, VDDQ) Number of Internal Banks

samsung.com/ dram10 COMPONENT DRAM ORDERING INFORMATION 1 2 3 4 5 6 7 8 9 10 11 K 4 T XX XX X X X X X XX XDR DRAM J: BOC(LF) P: BOC Mobile DRAM Leaded/Lead Free G/A: 52balls FBGA Mono R/B: 54balls FBGA Mono X/Z: 54balls BOC Mono J/V: 60(72)balls FBGA Mono 0.5pitch L /F: 60balls FBGA Mono 0.8pitch S/D: 90balls FBGA Monolithic (11mm x 13mm) F/H: Smaller 90balls FBGA Mono Y/P: 54balls CSP DDP M/E: 90balls FBGA DDP 10. Temp & Power - COMMON emp, Power) C: Commercial, Normal (0’C – 95’C) & Normal Power C: (Mobile Only) Commercial (-25 ~ 70’C), Normal Power J: Commercial, Medium L: Commercial, Low (0’C – 95’C) & Low Power L: (Mobile Only) Commercial, Low, i-TCSR F: Commercial, Low, i-TCSR & PASR & DS E: Extended (-25~85’C), Normal N: Extended, Low, i-TCSR G: Extended, Low, i-TCSR & PASR & DS I: Industrial, Normal (-40’C – 85’C) & Normal Power P: Industrial, Low (-40’C – 85’C) & Low Power H: Industrial, Low, i-TCSR & PASR & DS 11. Speed (Wafer/Chip Biz/BGD: 00) DDR SDRAM CC: DDR400 (200MHz @ CL=3, tRCD=3, tRP=3) B3: DDR333 (166MHz @ CL=2.5, tRCD=3, tRP=3) *1 A2: DDR266 (133MHz @ CL=2 , tRCD=3, tRP=3) B0: DDR266 (133MHz @ CL=2.5, tRCD=3, tRP=3) Note 1: "B3" has compatibility with "A2" and "B0" DDR2 SDRAM CC: DDR2-400 (200MHz @ CL=3, tRCD=3, tRP=3) D5: DDR2-533 (266MHz @ CL=4, tRCD=4, tRP=4) E6: DDR2-667 (333MHz @ CL=5, tRCD=5, tRP=5) F7: DDR2-800 (400MHz @ CL=6, tRCD=6, tRP=6) E7: DDR2-800 (400MHz @ CL=5, tRCD=5, tRP=5) DDR3 SDRAM F7: DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6) F8: DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7) G8: DDR3-1066 (533MHz @ CL=8, tRCD=8, tRP=8) H9: DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9) K0: DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11) MA: DDR3-1866 (933MHz @ CL=13, tRCD=13, tRP=13) NB: DDR3-2133 (1067MHz @ CL=14, tRCD=14, tRP=14) Graphics Memory 18: 1.8ns (550MHz) 04: 0.4ns (2500MHz) 20: 2.0ns (500MHz) 05: 0.5ns (2000MHz) 22: 2.2ns (450MHz) 5C: 0.56ns (1800MHz) 25: 2.5ns (400MHz) 06: 0.62ns (1600MHz) 2C: 2.66ns (375MHz) 6A: 0.66ns (1500MHz) 2A: 2.86ns (350MHz) 07: 0.71ns (1400MHz) 33: 3.3ns (300MHz) 7A: 0.77ns (1300MHz) 36: 3.6ns (275MHz) 08: 0.8ns (1200MHz) 40: 4.0ns (250MHz) 09: 0.9ns (1100MHz) 45: 4.5ns (222MHz) 1 : 1.0ns (1000MHz) 50/5A: 5.0ns (200MHz) 1 : 1.1ns (900MHz) 55: 5.5ns (183MHz) 12: 1.25ns (800MHz) 60: 6.0ns (166MHz) 14: 1.4ns (700MHz) 16: 1.6ns (600MHz) SDRAM (Default CL=3) 50: 5.0ns (200MHz CL=3) 60: 6.0ns (166MHz CL=3) 67: 6.7ns 75: 7.5ns PC133 (133MHz CL=3) XDR DRAM A2: 2.4Gbps, 36ns, 16Cycles B3: 3.2Gbps, 35ns, 20Cycles C3: 3.2Gbps, 35ns, 24Cycles C4: 4.0Gbps, 28ns, 24Cycles DS: Daisychain Sample Mobile-SDRAM 60: 166MHz, CL 3 75: 133MHz, CL 3 80: 125MHz, CL 3 1H: 105MHz, CL 2 1L: 105MHz, CL 3 15: 66MHz, CL 2 & 3 Mobile-DDR C3: 133MHz, CL 3 C2: 100MHz, CL 3 C0: 66MHz, CL 3 Note: All Lead-free and Halogen-free products are in compliance with RoHS SAMSUNG Memory DRAM DRAM Type Density Bit Organization Speed Temp & Power Package Type Generation Interface (VDD, VDDQ) Number of Internal Banks

samsung.com/ dram DRAM MODULE DRAM ORDERING INFORMATION 1 2 3 4 5 6 7 8 9 10 11 12 13 M X XX T XX X X X X X X XX X 1. Memor y Module: M 2. DIMM Type 3: DIMM 4: SODIMM 3. Data bits 12: x 72 184pin Low Profile Registered DIMM 63: x 63 PC100/PC133 μSODIMM with SPD for 144pin 64: x 64 PC100/PC133 SODIMM with SPD for 144pin (Intel/JEDEC) 66: x 64 Unbuffered DIMM with SPD for 144pin/168pin (Intel/JEDEC) 68: x 64 184pin Unbuffered DIMM 70: x 64 200pin Unbuffered SODIMM 71: x 64 204pin Unbuffered SODIMM 74: x 72/ECC Unbuffered DIMM with SPD for 168pin (Intel/JEDEC) 77: x 72/ECC PLL + Register DIMM with SPD for 168pin (Intel PC100) 78: x 64 240pin Unbuffered DIMM 81: x 72 184pin ECC unbuffered DIMM 83: x 72 184pin Registered DIMM 90: x 72/ECC PLL + Register DIMM 91: x 72 240pin ECC unbuffered DIMM 92: x 72 240pin VLP Registered DIMM 93: x 72 240pin Registered DIMM 95: x 72 240pin Fully Buffered DIMM with SPD for 168pin (JEDEC PC133) 4. DRAM Component Type B: DDR3 SDRAM (1.5V VDD) L: DDR SDRAM (2.5V VDD) S: SDRAM T: DDR2 SDRAM (1.8V VDD) 5. Depth 09: 8M (for 128Mb/512Mb) 17: 16M (for 128Mb/512Mb) 16: 16M 28: 128M 29: 128M (for 128Mb/512Mb) 32: 32M 33: 32M (for 128Mb/512Mb) 51: 512M 52: 512M (for 512Mb/2Gb) 56: 256M 57: 256M (for 512Mb/2Gb) 59: 256M (for 128Mb/512Mb) 64: 64M 65: 64M (for 128Mb/512Mb) 1G: 1G 1K: 1G (for 2Gb) 6. # of Banks in Comp. & Interface 1: 4K/64mxRef., 4Banks & SSTL-2 2 : 8K/64ms Ref., 4Banks & SSTL-2 2: 4K/64ms Ref., 4Banks & LVTTL (SDR Only) 5: 8K/64ms Ref., 4Banks & LVTTL (SDR Only) 5: 4Banks & SSTL-1.8V 6: 8Banks & SSTL-1.8V 7. Bit Organization 0: x 4 3: x 8 4: x16 6: x 4 Stack (JEDEC Standard) 7: x 8 Stack (JEDEC Standard) 8: x 4 Stack 9: x 8 Stack 8. Generation A: 2nd Gen. B: 3rd Gen. C: 4th Gen. D: 5th Gen. E: 6th Gen. F: 7th Gen. G: 8th Gen. M: 1st Gen. Q: 17th Gen. 9. Package E: FBGA QDP (Lead-free & Halogen-free) G: FBGA H: FBGA (Lead-free & Halogen-free) J: FBGA DDP (Lead-free) M: FBGA DDP (Lead-free & Halogen-free) N: sTSOP Q: FBGA QDP (Lead-free) T: TSOP II (400mil) U: TSOP II (Lead-Free) V: sTSOP II (Lead-Free) Z: FBGA (Lead-free) 10. PCB Revision 0: Mother PCB 1: 1st Rev 2: 2nd Rev. 3: 3rd Rev. 4: 4th Rev. A: Parity DIMM S: Reduced PCB U: Low Profile DIMM 11. Temp & Power C: Commercial Temp. (0°C ~ 95°C) & Normal Power L: Commercial Temp. (0°C ~ 95°C) & Low Power 12. Speed CC: (200MHz @ CL=3, tRCD=3, tRP=3) D5: (266MHz @ CL=4, tRCD=4, tRP=4) E6: (333MHz @ CL=5, tRCD=5, tRP=5) F7: (400MHz @ CL=6, tRCD=6, tRP=6) E7: (400MHz @ CL=5, tRCD=5, tRP=5) F8: (533MHz @ CL=7, tRCD=7, tRP=7) G8: (533MHz @ CL=8, tRCD=8, tRP=8) H9: (667MHz @ CL=9, tRCD=9, tRP=9) K0: (800MHz @ CL=10, tRCD=10, tRP=10) 7A: (133MHz CL=3/PC100 CL2) 13. AMB Vendor for FBDIMM 0, 5: Intel 1, 6, 8: IDT 9: Montage Note: All Lead-free and Halogen-free products are in compliance with RoHS SAMSUNG Memory DIMM Data bits DRAM Component Type Depth Number of Banks Bit Organization AMB Vendor Speed Temp & Power Package Generation

samsung.com/ dram12 1H 2015 1. Memor y Module: M 2. DIMM T ype 3: R/LRDIMM 4: SODIMM 3. Data bits 74: x 72 260pin SODIMM 86: x 72 288pin Load Reduced DIMM 93: x 72 288pin Registered DIMM 4. DRAM Component T ype A: DDR4 SDRAM (1.2V VDD) 5. Depth 1G: 1G 2G: 2G 4G: 4G 8G: 8G 1K: 1G (for 8Gb) 2K: 2G (for 8Gb) 6. # of Banks in Comp . & Interface 4: 16Banks & POD-1.2V 7. Bit Organization 0: x 4 3: x 8 8. Component Revision M: 1st Gen. A: 2nd Gen. B: 3rd Gen. C: 4th Gen. D: 5th Gen. E: 6th Gen. F: 7th Gen. G: 8th Gen. 9. Package B: FBGA (Halogen-free & Lead-free, Flip Chip) M: FBGA (Halogen-free & Lead-free, DDP) 10. PCB Revision 0: None 1: 1st Rev. 2: 2nd Rev. 3: 3rd Rev. 4: 4th Rev. 11. T emp & Power C: Commercial Temp. (0°C ~ 85°C) & Normal Power 12. Speed PB: DDR4-2133 (1066MHz @ CL=15, tRCD=15, tRP=15) DDR4 SDRAM MODULE ORDERING INFORMATION 1 2 3 4 5 6 7 8 9 10 11 12 M X XX A XX X X X X X X XX Memory Module DIMM Type Data bits DRAM Component Type Depth # of Banks in Comp. & Interface Bit Organization Speed Temp & Power Package Component Revision DDR4 SDRAM Module Ordering Information

samsung.com/ dram DRAM 1H 2015 1. Samsung Memor y: K 2. DRAM: 4 3. DRAM T ype A: DDR4 SDRAM 4. Density 4G: 4Gb 8G: 8Gb 5. Bit Organization 04: x 4 08: x 8 6. # of Internal Banks 5: 16Banks 7. Interf ace (V dd, Vddq) W: POD (1.2V, 1.2V) 8. Revision M: 1st Gen. A: 2nd Gen. B: 3rd Gen. C: 4th Gen. D: 5th Gen. E: 6th Gen. F: 7th Gen. G: 8th Gen. H: 9th Gen. 9. P ackage Type B: FBGA (Halogen-free & Lead-free, Flip Chip) M: FBGA (Halogen-free & Lead-free, DDP) 10. T emp & Power C: Commercial Temp. (0°C ~ 85°C) & Normal Power 11. Speed PB: DDR4-2133 (1066MHz @ CL=15, tRCD=15, tRP=15) RC: DDR4-2400 (1200MHz @ CL=17, tRCD=17, tRP=17) DDR4 SDRAM MEMORY ORDERING INFORMATION 1 2 3 4 5 6 7 8 9 10 11 K 4 A XX XX X X X X X XX Samsung Memory DRAM DRAM Type Density Bit Organization Speed Temp & Power Package Type Revision Interface (Vdd, Vddq) #of Internal Banks DDR4 SDRAM Memory Ordering Information

samsung.com/flash14 1H 2015 Mainstream eMMC & High-Performance eMMC MAINSTREAM eMMC Density Flash MMC* Part Number Seq R/W Perf (MB/s) Random R/W IOPS Package Size (mm) Status 8GB 64Gb*1 5 KLM8G1WEPD-B0310** 140/8 5000/600 11.5 x 13.0 x 0.8 MP 16GB 64Gb*2 5 KLMAG2WEPD-B0310** 150/12 5000/1200 11.5 x 13.0 x 0.8 MP 32GB 64Gb*4 5 KLMBG4WEBD-B0310** 260/45 5500/6000 11.5 x 13.0 x 1.0 MP 64GB 64Gb*8 5 KLMCG8WEBD-B0310** 260/45 5500/6000 11.5 x 13.0 x 1.0 MP 128GB 64Gb*16 5 KLMDGAWEBD-B0310** 250/45 5300/5000 11.5 x 13.0 x 1.4 MP *MMC5.0 is backwards compatible with 4.51 & 4.4 HIGH-PERFORMANCE eMMC Density Flash MMC* Part Number Seq R/W Perf (MB/s) Random R/W IOPS Package Size (mm) Status 4GB 32Gb*1 5 KLM4G1FEPD-B0310** 120/20 3000/700 11.0 x 10.0 x 0.8 MP 8GB 64Gb*1 5 KLM8G1GEND-B0310** 160/25 5000/2500 11.5 x 13.0 x 1.0 MP 16GB 64Gb*2 5 KLMAG2GEND-B0310** 230/50 6000/6000 11.5 x 13.0 x 1.0 MP 32GB 64Gb*4 5 KLMBG4GEND-B0310** 250/100 6000/12000 11.5 x 13.0 x 1.0 MP 64GB 64Gb*8 5 KLMCG8GEND-B0310** 250/100 6000/12000 11.5 x 13.0 x 1.0 MP *MMC5.0 is backwards compatible with 4.51 & 4.41 ***Denotes bucket code for latest firmware patch Specifications

  • Density: 4GB to 128GB
  • Flash: 32Gb/64Gb
  • Package Type: FBGA
  • Package Size: 11x10mm, 11.5x13mm
  • eMMC: 4.5/5.0 Simple Block Diagram LTE Modem uSD SlotAP + DRAM (POP) Samsung eMMC Industry-Leading Smartphone and Tablet Design
  • Industry’s fastest eMMC
  • Fully-managed NAND
  • Low active and standby power
  • High density in small form factor (11.5x13mm pkg)
  • 4GB to 128GB capacities
  • JEDEC standard MMC 5.0
  • Leading edge 10nm-class NAND Flash Performance Specs 32GB, 64GB eMMC 4.5 eMMC 5.0 Interface Speed 200MB/s 400MB/s Random R/W 3500/2000 IOPS 6000/12000 IOPS Sequential R/W 150/50 MB/s 250/100 MB/s * Device performance condition: x8 Bus, Cache-On mode, without host overhead. eMMC Key Features

Applications

eMMC is the most optmized flash solution for tablets and smartphones, as well as applications from eReaders, HD cameras and smart TVs to PNDs, multi-media players and gaming devices. New 10nm-class eMMC

samsung.com/flash FLASH - SSD 1H 2015Solid State Drives SOLID STATE DRIVES (SSD) Drive Type Drive Name Interface Form Factor Connector Power-loss Protection Write Endurance Density Part Number Client PC/ Embedded CM851 SATA III - 6Gb/s M.2 22x42 mm M.2 No PC Workload 16GB MZAPF016HCDD-00000 32GB MZAPF032HCFV-00000 mSATA Mini PCIe MZMPF032HCFV-00000 64GB MZMPF064HCGM-00000 PM871 SATA III - 6Gb/s M.2 22x80 mm M.2 No PC Workload 128GB MZNLN128HCGR-00000 256GB MZNLN256HCHP-00000 512GB MZNLN512HCJH-00000 2.5" 7mmT SFF-8223 128GB MZ7LN128HCHP-00000 256GB MZ7LN256HCHP-00000 512GB MZ7LN512HCHP-00000 SM951 PCIe Gen 3 - SATAe M.2 22x80 mm M.2 No PC Workload 128GB MZHPV128HDGM-00000 256GB MZHPV256HDGL-00000 512GB MZHPV512HDGL-00000 PCIe Gen 3 - NVMe 128GB MZVPV128HDGM-00000 256GB MZVPV256HDGL-00000 512GB MZVPV512HDGL-00000 Data Center PM863 SATA III - 6Gb/s 2.5" 7mmT SFF-8223 Yes 0.8 DWPD 120GB MZ7LM120HCFD-00003 240GB MZ7LM240HCGR-00003 480GB MZ7LM480HCHP-00003 960GB MZ7LM960HCHP-00003 1920GB MZ7LM1T9HCJM-00003 3840GB MZ7LM3T8HCJM-00003 SM843Tn SATA III - 6Gb/s 2.5" 7mmT SFF-8223 Yes 1.8 DWPD 120GB MZ7WD120HCFV-00003 240GB MZ7WD240HCFV-00003 480GB MZ7WD480HCGM-00003 SV843 SATA III - 6Gb/s 2.5" 7mmT SFF-8223 Yes 3.6 DWPD 480GB MZ7WD480HMHP-00003 960GB MZ7WD960HMHP-00003 Enterprise PM1633 SAS 3.0 - 12 Gb/s 2.5" 15mmT SFF-8680 Yes 1.0 DWPD 480GB MZILS480HCGR-00003 960GB MZILS960HCHP-00003 1920GB MZILS1T9HCHP-00003 SM1635 SAS 3.0 - 12 Gb/s 2.5" 15mmT SFF-8680 Yes 10 DWPD 3840GB MZILS3T8HCJM-00003 400GB MZIES400HMGR-00003 800GB MZIES800HMHP-00003 1600GB MZIES1T6HMJH-00003 SM1715 PCIe Gen 3 - NVMe 2.5" 15mmT SFF-8639 Yes 10 DWPD 800GB MZWKI800HMHP-00003 1600GB MZWKI1T6HMHP-00003 3200GB MZWKI3T2HMJM-00003 Half-Height Half-Length Add-In Card (HHHL AIC) PCIe Edge-Connector Yes 10 DWPD 1600GB MZPKI1T6HMHP-00003 3200GB MZPKI3T2HMJM-00003

samsung.com/mcp16 1H 2015 Multi-Chip Packages Samsung has a portfolio of eMCP products for a variety of devices, such as mobile phones and tablets. The following illustration shows Samsung’s lineup of eMCP memory solutions, which can be deployed in almost any application. eMCP = eMMC + LPDDR3 Samsung eMCP product suite with different densities and types of Mobile DRAM and eMMC 4G 6G 8G 12G 16G 24G 64GB 32GB 8GB 4GB 2GB 16GB ROM RAM

samsung.com/mcp 17 1H 2015 Multi-Chip Packages eMCP: eMMC + LPDDR3 Memory eMMC Density DRAM Density/Organization Voltage (eMMC-DRAM) Package eMMC & MDRAM 8GB 16GB 32GB

samsung.com/flash-ssd 1H 2015 Solid State Drives Samsung Solid State Drives Which SSD is right for you? For more information, email: SSD@ssi.samsung.com Client Data Center Enterprise SATA PCIe SATA SAS PCIe Mainstream Extreme Performance STANDARD DATA CENTER SERIES Read- Intensive Environments DELUXE ENTERPRISE SERIES High-Write Environments ENTERPRISE STORAGE SERIES High Redundancy Environments EXTREME PERFORMANCE SERIES Data Cache Environments Samsung PM871 Samsung SM951 Samsung PM863 Samsung SV843 Samsung PM1633 Samsung SM1715 Capacity (GB) 128/256/512 128/256/512 120/240/480/ 960/1920/ 3840 480/960 480/960/ 800/1600/ 3200 Host Interface Serial ATA 3 (6 Gb/s) PCIe Gen3 x4 Serial ATA 3 (6 Gb/s) Serial ATA 3 (6 Gb/s) SAS 3 (12 Gb/s) PCIe Gen3 x4 Uncorrectable Bit Error Rate (UBER) 1 in 10 15 1 in 1015 1 in 1017 1 in 1017 1 in 1017 1 in 1017 Power Consumption Power Consumption (Idle) 50mW 50mW 1.3W 1.0W 4.0W 10.0W Random Reads (up to) 97,000 IOPS 90,000 IOPS 99,000 IOPS 88,000 IOPS 180,000 IOPS 750,000 IOPS Random Writes (up to) 90,000 IOPS 70,000 IOPS 18,000 IOPS 14,000 IOPS 15,000 IOPS 185,000 IOPS Sequential Reads (up to) 540 MB/s 2,150MB/s 540 MB/s 530 MB/s 1,100 MB/s 3,000 MB/s Sequential Writes (up to) 510 MB/s 1,500 MB/s 480 MB/s 480 MB/s 1,000 MB/s 2,200 MB/s Endurance (up to) Client workload Client workload 0.8 DWPD 3.6 DWPD 1 DWPD 10 DWPD Physical Dimensions 100 x 70 x 7mm (2.5") 80 x 22 x 3.7mm (M.2) 80 x 22 x 3.7mm 100 x 70 x 7mm 100 x 70 x 7mm 100 x 70 x 15mm 100 x 70 x 15mm (2.5") 168 x 70 x 19mm (HHHL) Weight 54g (2.5"), 8.5g (M.2) 10g 60g 62g 140g 210g

STORAGEsamsung.com/flash-ssd 1H 2015 Solid State Drives SOLID STATE DRIVES (SSD) Drive Type Drive Name Interface Form Factor Connector Power-loss Protection Write Endurance Density Part Number Client PC/ Embedded CM851 SATA III - 6Gb/s M.2 22 x 42 mm M.2 No PC Workload 16GB MZAPF016HCDD-00000 32GB MZAPF032HCFV-00000 mSATA Mini PCIe MZMPF032HCFV-00000 64GB MZMPF064HCGM-00000 PM871 SATA III - 6Gb/s M.2 22 x 80 mm M.2 No PC Workload 128GB MZNLN128HCGR-00000 256GB MZNLN256HCHP-00000 512GB MZNLN512HCJH-00000 2.5" 7mmT SFF-8223 128GB MZ7LN128HCHP-00000 256GB MZ7LN256HCHP-00000 512GB MZ7LN512HCHP-00000 SM951 PCIe Gen 3 - SATAe M.2 22 x 80 mm M.2 No PC Workload 128GB MZHPV128HDGM-00000 256GB MZHPV256HDGL-00000 512GB MZHPV512HDGL-00000 PCIe Gen 3 - NVMe 128GB MZVPV128HDGM-00000 256GB MZVPV256HDGL-00000 512GB MZVPV512HDGL-00000 Data Center PM863 SATA III - 6Gb/s 2.5" 7mmT SFF-8223 Yes 0.8 DWPD 120GB MZ7LM120HCFD-00003 240GB MZ7LM240HCGR-00003 480GB MZ7LM480HCHP-00003 960GB MZ7LM960HCHP-00003 1920GB MZ7LM1T9HCJM-00003 3840GB MZ7LM3T8HCJM-00003 SM843Tn SATA III - 6Gb/s 2.5" 7mmT SFF-8223 Yes 1.8 DWPD 120GB MZ7WD120HCFV-00003 240GB MZ7WD240HCFV-00003 480GB MZ7WD480HCGM-00003 SV843 SATA III - 6Gb/s 2.5" 7mmT SFF-8223 Yes 3.6 DWPD 480GB MZ7WD480HMHP-00003 960GB MZ7WD960HMHP-00003 Enterprise PM1633 SAS 3.0 - 12 Gb/s 2.5" 15mmT SFF-8680 Yes 1.0 DWPD 480GB MZILS480HCGR-00003 960GB MZILS960HCHP-00003 1920GB MZILS1T9HCHP-00003 3840GB MZILS3T8HCJM-00003 SM1635 SAS 3.0 - 12 Gb/s 2.5" 15mmT SFF-8680 Yes 10 DWPD 400GB MZIES400HMGR-00003 800GB MZIES800HMHP-00003 1600GB MZIES1T6HMJH-00003 SM1715 PCIe Gen 3 - NVMe 2.5" 15mmT SFF-8639 Yes 10 DWPD 800GB MZWKI800HMHP-00003 1600GB MZWKI1T6HMHP-00003 3200GB MZWKI3T2HMJM-00003 Half-Height Half-Length Add-In Card (HHHL AIC) PCIe Edge-Connector Yes 10 DWPD 1600GB MZPKI1T6HMHP-00003 3200GB MZPKI3T2HMJM-00003

samsung.com/flash-ssd 1H 2015Optical Disc Drives Blu-ray Writer SLIM EXTERNAL Interface Speed Type Loading Model USB 2.0 BD Writer 6X Slim Tray SE-506CB DVD-W H/H Interface Speed Type Loading Model SATA DVD Write 24X H/H Tray SH-224FB DVD-W SLIM Interface Speed Type Loading Model SATA DVD Write 8X Slim Tray SN-208FB DVD-W SLIM EXTERNAL Interface Speed Type Loading Model USB 2.0 DVD Write 8X Ultra Slim Tray SE-218GN Slim SE-208GB tsstodd.com

samsungdisplay.com 21 1H 2015 DID Panel Lineup, Tablets & Monitors Public Information Display (PID) Product Classification Why PID instead of TV? COMMERCIAL (PID) CONSUMER (TV) WARRANTY 18 months to 2 years 90 days to 1 year RELIABILITY Public environments 20+ hours daily duty cycle Variety of temperatures & location 5-8 hour daily duty cycle Designed for in-home use in controlled environment In-home living room PRODUCTION LIFECYCLE 24-36 months 12-15 months PICTURE QUALITY Designed to resist image retention LCD backlight covers a wider color spectrum necessary for PC source integration, giving better picture quality AGAR coating for public viewing 120Hz / 240Hz for full-motion video Designed for TV signals Gloss surface treatment LOCATION Most models portrait capable Can only be oriented in landscape mode Product Segmentation Type Class Warranty Bezel Suggested Run Time Brightness Usage Applications Value Tier UNB / SNB Ultra / Super Narrow Bezel 2 years 3.9mm - 5.9mm A-to-A 20+ hours 500-700 nits Heavy Video Walls Premium commercial range Indoor PID Indoor Commercial Panels 2 years Narrow 20+ hours 600/700 nits Medium Semi-Outdoor Mid-price range E-Board Value, Large Format 18 months Normal 12 hours 450 nits Daily Indoor, e-Board High-value commercial range Outdoor PID High Bright, Wide Temp 2 years Normal 20+ hours 2500-5000 nits Heavy Outdoor Premium commercial range Super Narrow Bezel (SNB)/ Ultra Narrow Bezel (UNB) » UNB: 3.9mm A-to-A» SNB: 5.9mm A-to-A» Video Wall » Narrow BezelIndoor PID » 700 nits Brightness» 40"/46"/55"/75" » Landscape OrientationE-Board PID » AGAR Surface Treatment» 55"/70"/82" Edge LED » High BrightnessOutdoor PID » 110°C Clearing Point» Full High Definition Product Segmentation HEAVY USE LIGHT USE SNB / UNB Professional Indoor Events Billboard

  • Control Room
  • Simulation
  • Scoreboard
  • Sports Broadcasting
  • Dynamic Signage Indoor PID Entertainment Transportation Communication
  • Casino
  • Theatre
  • Menu
  • Airport
  • Train/Bus Station
  • Conference Room E-Board PID Commercial Education Hospitality
  • Kiosk
  • Conference Systems
  • Interactive FPD • Hotel Signage Outdoor PID Commercial Education Hospitality
  • Kiosk
  • Conference Systems
  • Interactive FPD • Hotel Signage

samsungdisplay.com22 1H 2015 DID Panel Lineup, Tablets & Monitors SAMSUNG DIGITAL INFORMATION DISPLAY (DID) PANEL LINEUP Category Model Size Model Resolution Bezel Backlight Brightness (typical) Contrast Ratio Response Time Frequency MP* Comment SNB / UNB LTI460HN01 46" FHD Super narrow D-LED 700 nits 3,000:1 8ms 60Hz Now 5.9mm Active to Active, LED LTI460HN09 46" FHD Super narrow D-LED 500 nits 3,000:1 8ms 60Hz Now 5.9mm Active to Active, LED LTI460HN10 46" FHD Ultra narrow D-LED 700 nits 3,000:1 8ms 60Hz Now 3.9mm Active to Active, LED LTI460HN11 46" FHD Ultra narrow D-LED 500 nits 3,000:1 8ms 60Hz Now 3.9mm Active to Active, LED LTI550HN01 55" FHD Super narrow D-LED 700 nits 3,000:1 8ms 60Hz Now 5.9mm Active to Active, LED LTI550HN08 55" FHD Super narrow D-LED 500 nits 3,000:1 8ms 60Hz Now 5.7mm Active to Active, LED LTI550HN09 55" FHD Ultra narrow D-LED 700 nits 3,000:1 8ms 60Hz Now 3.9mm Active to Active, LED LTI550HN11-V 55" FHD Ultra narrow D-LED 500 nits 3,000:1 8ms 60Hz Now 3.9mm Active to Active, LED Indoor PID LTI400HA10 40" FHD Narrow eLED 700 nits 3,000:1 8ms 60Hz Now eLED LTI460HN08 46" FHD Narrow eLED 700 nits 4,000:1 8ms 60Hz Now eLED LTI550HN06 55" FHD Narrow eLED 700 nits 4,000:1 8ms 60Hz Now eLED LTI550HN07 55" FHD Narrow eLED 450 nits 4,000:1 8ms 60Hz Now E-Board; Landscape/Portrait LTI750HF02-0 75" FHD Normal D-LED 400 nits 3,500:1 8ms 120Hz Now Landscape / Portrait LTI750FJ01 75" UHD Normal D-LED 500 nits 5,000:1 8ms 120Hz Now Landscape / Portrait E-Board LTI700HA02 70" FHD Normal eLED 400 nits 4,000:1 8ms 60Hz Now E-Board; Landscape/Portrait LTI820HA01 82" FHD Normal eLED 450 nits 3,000:1 8ms 60Hz Now E-Board; Landscape mode only Outdoor LTI460HZ01 46" FHD Narrow D-LED 5,000 nits 4,000:1 8ms 60Hz Now High Bright, Hi Temp LC, 1/4λ Pol. LTI460HF01-V 46" FHD Narrow D-LED 2,500 nits 3,000:1 8ms 120Hz Now High Bright, Hi Temp LC, 1/4λ Pol. LTH550HF04-V 55" FHD Narrow D-LED 2,500 nits 3,000:1 8ms 120Hz Now High Bright, Hi Temp LC, 1/4λ Pol. LTI750HF01-V 75" FHD Narrow D-LED 3,500 nits 3,000:1 8ms 120Hz Now High Bright, Hi Temp LC, 1/4λ Pol. TABLETS Size PN Mode Resolution H(RGB) V Aspect Ratio PPI Brightness (nits) MP 7" LTL070NL01 PLS WSVGA 1024 600 16:09 170 400 Now 8.0" Open Cell LTL080AL01 PLS WXGA 1280 800 16:09 189 Open Cell Now 10.1" LTL101AL06 PLS WXGA 1280 800 16:10 149 400 Now 10.1" LTL101DL03 PLS WQXGA 2560 1600 16:10 300 370 Now MONITORS Size PN Mode Resolution H(RGB) V Aspect Ratio PPI Brightness (nits) MP 23" LTM230HL07 PLS FHD 1920 1080 16:09 96 300 Now 23.6" LTM236FL01 PLS UHD 3840 2160 16:09 193 300 Now 27" LTM270HT10 TN FHD 1920 1080 16:09 82 300 Now LTM270DL02 PLS QHD 2560 1440 16:09 109 300 Now LTM270HL02 PLS FHD 1920 1080 16:09 82 350 Now LTM270FL01 PLS UHD 3840 2160 16:09 164 350 Now 31.5" LTM315FL01 PLS UHD 3840 2160 16:09 140 350 Now LTM315FL02 PLS UHD 3840 2160 16:09 140 350 Now

samsung.com/semiconductor/sales-network Adelsa | www.adetronics.com.mx PRODUCTS ADDRESS MAIN PHONE FAX Memory SLSI LCD MEXICO Hacienda Corralejo #80 Bosque de Echegaray Naucalpan, Mexico 53310 52-555-560-5002 GUADALAJARA OFFICE 52-333-122-3054 MONTERREY OFFICE 52-818-214-0011 CD. JUAREZ OFFICE 52-656-613-3517 REYNOSA OFFICE 52-899-922-5540 ATMI Sales | www.atmisales.com PRODUCTS ADDRESS MAIN PHONE FAX Memory SLSI LCD OREGON 4900 S.W. Griffith Drive Suite 253 Beaverton, OR 97005 1-800-898-2446 503-643-8307 503-643-4364 503-643-4364 WASHINGTON 8581 154th Avenue NE Redmond WA 98052 425-869-7636 425-869-9841 Bear VAI Technology | www.bearvai.com PRODUCTS ADRRESS MAIN PHONE FAX Memory SLSI LCD MAIN OFFICE - BRECKSVILLE, OHIO

6910 Treeline Drive

Brecksville, OH 44141 440-526-1991 440-526-5426 MAIN OFFICE - INDIANA

11451 Overlook Drive

Fishers, IN 46037 440-832-7637 317-845-8650 SOUTHERN OHIO/PITTSBURGH/KENTUCKY/MICHIGAN OFFICES 440-526-1991 440-526-5426 Core Sales, Inc. | www.coresales.com PRODUCTS ADDRESS MAIN PHONE FAX Memory SLSI LCD

901 Warrenville Road

Lisle, IL 60532 847-843-8888 Crestone Technology Group | www.crestonegroup.com PRODUCTS ADDRESS MAIN PHONE FAX Memory SLSI LCD COLORADO 7108 S. Alton Way Building L Centennial, CO 80112 303-280-7202 720-482-2220 UTAH OFFICE Contacts Feel free to contact your local distributor or sales representative with any Samsung sales inquiries. Contacts

samsung.com/semiconductor/sales-network 1H 2015 Contacts Customer 1st | www.customer1st.com PRODUCTS ADDRESS MAIN PHONE FAX Memory SLSI LCD MINNESOTA

2950 Metro Drive

Bloomington, MN 55425 952-851-7909 952-851-7907 KANSAS 2111 E. Crossroad Lane #202 Olathe, KS 66062 InTELaTECH | www.intelatech.com PRODUCTS ADDRESS MAIN PHONE FAX Memory SLSI ONTARIO - CANADA

5225 Orbitor Drive

21 Concourse Gate

Ottawa, ONT K2E 7S4 905-629-0082 613-221-9160 ALBERTA - CANADA 14939 Mt. McKenzie Drive SE Calgary, Alberta T2Z 2M6 905-629-0082 403-686-6926 QUEBEC - CANADA

620 St-Jean Boulevard

Pointe Claire Quebec H9R 3K2 905-629-0082 905-629-0082 BRITISH COLUMBIA - CANADA

5811 Cooney Road

Suite 305, South Tower Vancouver, BC V5X 3M1 905-629-0082 905-629-1795 I-Squared Incorporated | www.isquared.com PRODUCTS ADDRESS MAIN PHONE FAX Memory SLSI LCD 2635 N. 1st Street Suite 128 San Jose, CA 95134 408-988-3400 408-988-2079

1250 B Street

Petaluma, CA 94952 Neptune Electronics (necco) | www.neccoelect.com PRODUCTS ADDRESS MAIN PHONE FAX Memory SLSI LCD

11 Oval Drive

Islandia, NY 11749 631-234-2525 631-234-2707 New Elpis, Inc. | www.newelpis.com PRODUCTS ADDRESS MAIN PHONE FAX LCD 165 Dundas Street, W Suite 702 Mississauga, ON Canada L5B 2N6 905-275-3516 905-275-4109

samsung.com/semiconductor/sales-networkContacts New Tech Solutions PRODUCTS ADDRESS MAIN PHONE FAX Memory SLSI LCD

26 Ray Avenue

Burlington, MA 01803 781-229-8888 781-229-1614 Rep One Associates, Inc. | www.repone.com PRODUCTS ADDRESS MAIN PHONE FAX Memory SLSI LCD ALABAMA

303 Williams Avenue

Huntsville, AL 35801 256-539-7371 256-533-4509 GEORGIA

3000 Langford Road

Norcross, GA 30071 770-209-9242 678-591-6753 770-209-9245 NORTH CAROLINA

5540 Centerview Drive

Raleigh, NC 27606 704-846-5744 919-424-3866

10800 Sikes Place

Charlotte, NC 28277 704-846-5744 704-846-25 FLORIDA

128 Ledbury Drive

Longwood, FL 32779 Tech Coast Sales | www.tc-sales.com PRODUCTS ADDRESS MAIN PHONE EMAIL Memory SLSI LCD MAIN OFFICE

23121 Verdugo Drive

Laguna Hills, CA 92653 949-305-6869 sales@tc-sales.com West Associates | www.westassociates.com PRODUCTS ADDRESS MAIN PHONE FAX Memory SLSI LCD AUSTIN / SAN ANTONIO

4100 Duval Road

Building 1, Suite 102 Austin, TX 78759 512-343-1199 512-343-1922 DALLAS / OKLAHOMA / ARKANSAS

2745 Dallas Parkway

Plano, TX 75093 972-680-2800 972-699-0330 HOUSTON / VALLEY / LOUISIANA

24624 Interstate 45 North

Spring, TX 77386 512-343-1199 512-343-1922 For all product information please visit: samsung.com/us/oem-solutions To access our online sales portal, visit: https://smarttools.ssi.samsung.com

1H 2015 samsung.com/semiconductor/sales-network Notes

1H 2015samsung.com/semiconductor/sales-network Notes

Disclaimer: The information in this publication has been carefully checked and is believed to be accurate at the time of publication. Samsung assumes no responsibility, however, for possible errors or omissions, or for any consequences resulting from the use of the information contained herein. Samsung reserves the right to make changes in its products or product specifications with the intent to improve function or design at any time and without notice and is not required to update this documentation to reflect such changes. This publication does not convey to a purchaser of semiconductor devices described herein any license under the patent rights of Samsung or others. Samsung makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Samsung assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability, including without limitation any consequential or incidental damages. brands may be claimed as the property of others. The appearance of all products, dates, figures, diagrams and tables are subject to change at any time, without notice. BR-15-ALL-001 | Printed 4/15 Samsung Semiconductor, Inc.

601 McCarthy Boulevard

Milpitas, CA 95035 samsung.com/us/ oem-solutions