LTL27KGEKJ-022A LITEON | Alldatasheet

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LITE-ON Technology Corp. / Optoelectronics No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C. Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto Through Hole Lamp Product Data Sheet LTL27KGEKJ-022A Spec No.: DS20-2013-0317 Effective Date: 02/12/2015 Revision: - BNS-OD-FC001/A4 BNS-OD-FC001/A4 BNS-OD-FC001/A4 BNS-OD-FC001/A4

Part No. : LTL27KGEKJ-022A BNS-OD-FC002 /A4 Through Hole Lamp LTL27KGEKJ-022A Through Hole Lamp LTL27KGEKJ-022A Rev Description By Date P001 Preliminary SPEC (RDR-20131553-01) Norah 11/25/2013 Above data for PD and Customer tracking only - NPPR Received and Upload on OPNC Sasipan 12/03/2013

Part No. : LTL27KGEKJ-022A BNS-OD-FC002 /A4 Through Hole Lamp LTL27KGEKJ-022A 1. Description Through-hole LEDs are offered in a variety of packages such as 3mm, 4mm, 5mm, rectangular and cylinder which are suitable for all applications requiring status indication. There are 3 types of technology base for our LEDs lamps. GaP based technologies for low intensity output requirements; AllnGaP and InGaN technologies for high brightness. Several intensity choices are available in each color for design flexibility. 1. 1. Features  Pb Free and RoHS compliant  Halogen free product (Cl < 900 ppm, Br < 900 ppm, and Cl + Br < 1500 ppm )  Long life solid state reliability  Low power consumption  I.C. compatible  AlInGaP Red / Yellow Green & White Diffused lens 1.2. Applications  Communication  Computer  Consumer  Home appliance  Industrial 2. Outline Dimensions Notes : 1. All dimensions are in millimeters (inches). 2. Tolerance is ± 0.25mm (.010") unless otherwise noted. measured where the leads emerge from the package. 4. Specifications are subject to change without notice.

Part No. : LTL27KGEKJ-022A BNS-OD-FC002 /A4 Through Hole Lamp LTL27KGEKJ-022A 3. Absolute Maximum Ratings at TA=25°C Parameter Red Yellow Green Unit Power Dissipation 130 130 mW Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) 100 100 mA Continuous Forward Current 50 50 mA Operating Temperature Range -40°C to + 85°C Storage Temperature Range -40°C to + 100°C Lead Soldering Temperature [2.0mm(.787") From Body] 260°C for 5 Seconds Max. 4. Electrical / Optical Characteristics at TA=25°C Parameter Symbol Color Min. Typ. Max. Unit Test Condition Luminous Intensity IV Red Yellow Green 125 125 180 180 mcd IF = 50mA Note 1,4 Viewing Angle 2θ1/2 Red Yellow Green - 120 - deg Note2 (Fig.6) Peak Wavelength λp Red Yellow Green - 632 575 - nm Measurement @Peak (Fig.1) Dominant Wavelength λd Red Yellow Green - 625 574 - nm IF = 50mA Note 3 Spectral Line Half-Width Δλ Red Yellow Green - 15 - nm Forward Voltage VF Red Yellow Green - 2.15 2.15 2.6

2.6 V IF = 50mA

NOTE: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve. 2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. Iv classification code is marked on each packing bag. 4. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 5. The Iv guarantee should be added ± 30% .

Part No. : LTL27KGEKJ-022A BNS-OD-FC002 /A4 Through Hole Lamp LTL27KGEKJ-022A 5. Typical Electrical / Optical Characteristics Curves (25°C Ambient Temperature Unless Otherwise Noted)

Part No. : LTL27KGEKJ-022A BNS-OD-FC002 /A4 Through Hole Lamp LTL27KGEKJ-022A 6. Taping Features * Compatible with radial lead automatic insertion equipment. * Most radial lead plastic lead lamps available packaged in tape and folding. * 5mm (0.197") formed lead and 2.54mm (0.1") straight lead spacing available. * Folding packaging simplifies handling and testing . * Reel packaging is available by removing suffix “A” on option. Package Dimensions Specification Item Symbol Minimum Maximum mm inch mm inch Tape Feed Hole Diameter D 3.8 0.149 4.2 0.165 Component Lead Pitch F 2.3 0.091 3.0 0.118 Front to Rear Deflection △H -- -- 2.0 0.078 Feed Hole to Bottom of Component H1 25.5 1.004 26.5 1.043 Feed Hole to Overall Component Height H2 31.3 1.232 32.9 1.295 Lead Length After Component Height L W0 11.0 0.433 Feed Hole Pitch P 12.4 0.488 13.0 0.511 Lead Location P1 4.4 0.173 5.8 0.228 Center of Component Location P2 5.05 0.198 7.65 0.301 Total Tape Thickness T -- -- 0.90 0.035 Feed Hole Location W0 8.5 0.334 9.75 0.384 Adhesive Tape Position W2 0 0 3.0 0.118 Tape Width W3 17.5 0.689 19.0 0.748

Part No. : LTL27KGEKJ-022A BNS-OD-FC002 /A4 Through Hole Lamp LTL27KGEKJ-022A 7. Packing Spec. Total 3,000pcs per inner carton

10 Inner cartons per outer carton

Total 30,000 pcs per outer carton In every shipping lot, only the last pack will be non-full packing

Part No. : LTL27KGEKJ-022A BNS-OD-FC002 /A4 Through Hole Lamp LTL27KGEKJ-022A 8. Bin Table Specification Bin Code Luminous Intensity (Yellow Green) Unit : mcd @50mA Bin Code Luminous Intensity (Red) Unit : mcd @50mA Min. Max. Min. Max. E 70 110 E 70 110 F 110 140 F 110 140 G 140 180 G 140 180 Note: Tolerance of each bin limit is ±30%

Part No. : LTL27KGEKJ-022A BNS-OD-FC002 /A4 Through Hole Lamp LTL27KGEKJ-022A 9. CAUTIONS 9.1. Application This LED lamp is good for application of indoor and outdoor sign, also ordinary electronic equipment. 9.2. Storage The storage ambient for the LEDs should not exceed 30° C temperature or 70% relative humidity. It is recommended that LEDs out of their original packaging are used within three months. For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient. 9.3. Cleaning Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary. 9.4. Lead Forming & Assembly During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens. Do not use the base of the lead frame as a fulcrum during forming. Lead forming must be done before soldering, at normal temperature. During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress. 9.5. Soldering When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point. Dipping the lens into the solder must be avoided. Do not apply any external stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering conditions: Soldering iron Wave soldering Temperature Soldering time Position 350° C Max. 3 seconds Max. (one time only) No closer than 2mm from the base of the epoxy bulb Pre-heat Pre-heat time Solder wave Soldering time Dipping Position 100° C Max. 60 seconds Max. 260° C Max. 5 seconds Max. No lower than 2mm from the base of the epoxy bulb Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic failure of the LED. IR reflow is not suitable process for through hole type LED lamp product. 9.6. Drive Method An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as shown in Circuit A below. Circuit model (A) Circuit model (B) LED LED (A) Recommended circuit (B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs.

Part No. : LTL27KGEKJ-022A BNS-OD-FC002 /A4 Through Hole Lamp LTL27KGEKJ-022A 9.7. ESD (Electrostatic Discharge) Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage:  Use a conductive wrist band or anti- electrostatic glove when handling these LEDs  All devices, equipment, and machinery must be properly grounded  Work tables, storage racks, etc. should be properly grounded  Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic lens as a result of friction between LEDs during storage and handing Suggested checking list: Training and Certification 9.7.1.1. Everyone working in a static-safe area is ESD-certified? 9.7.1.2. Training records kept and re-certification dates monitored? Static-Safe Workstation & Work Areas 9.7.2.1. Static-safe workstation or work-areas have ESD signs? 9.7.2.2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V? 9.7.2.3. All ionizer activated, positioned towards the units? 9.7.2.4. Each work surface mats grounding is good? Personnel Grounding 9.7.3.1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or conductive shoes with conductive flooring? 9.7.3.1. If conductive footwear used, conductive flooring also present where operator stand or walk? 9.7.3.2. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*? 9.7.3.3. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs? 9.7.3.4. All wrist strap or heel strap checkers calibration up to date? Note: *50V for Blue LED. Device Handling 9.7.4.1. Every ESDS items identified by EIA-471 labels on item or packaging? 9.7.4.2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation? 9.7.4.4. All flexible conductive and dissipative package materials inspected before reuse or recycle? Others 9.7.5.1. Audit result reported to entity ESD control coordinator? 9.7.5.2. Corrective action from previous audits completed? 9.7.5.3. Are audit records complete and on file?

Part No. : LTL27KGEKJ-022A BNS-OD-FC002 /A4 Through Hole Lamp LTL27KGEKJ-022A 10. Reliability Test Classification Test Item Test Condition Sample Size Reference Standard Endurance Test Operation Life Ta = Under room temperature IF = per datasheet maximum drive current Test Time= 1000hrs

22 PCS

(CL=90%; LTPD=10%) MIL-STD-750D:1026 (1995) MIL-STD-883G:1005 (2006) High Temperature High Humidity storage Ta = 60°C RH = 90% Test Time= 240hrs (CL=90%; LTPD=10%) MIL-STD-202G:103B (2002) JEITA ED-4701:100 103 (2001) High Temperature Storage Ta= 105 ± 5°C Test Time= 1000hrs (CL=90%; LTPD=10%) MIL-STD-750D:1031 (1995) MIL-STD-883G:1008 (2006) JEITA ED-4701:200 201 (2001) Low Temperature Storage Ta= -55 ± 5°C Test Time= 1000hrs (CL=90%; LTPD=10%) JEITA ED-4701:200 202 (2001) Environmental Test Temperature Cycling 30mins 5mins 30mins 5mins

30 Cycles

(CL=90%; LTPD=10%) MIL-STD-750D:1051 (1995) MIL-STD-883G:1010 (2006) JEITA ED-4701:100 105 (2001) JESD22-A104C (2005) Thermal Shock 15mins 15mins (<20 secs transfer) (CL=90%; LTPD=10%) MIL-STD-750D:1056 (1995) MIL-STD-883G:1011 (2006) MIL-STD-202G:107G (2002) JESD22-A106B (2004) Solder Resistance T.sol = 260 ± 5°C Dwell Time= 10± 1 seconds 3mm from the base of the epoxy bulb

11 PCS

(CL=90%; LTPD=18.9 MIL-STD-750D:2031(1995) JEITA ED-4701: 300 302 (2001) Solderability T. sol = 245 ± 5°C Dwell Time= 5 ± 0.5 seconds (Lead Free Solder, Coverage ≧95% of the dipped surface) (CL=90%; LTPD=18.9 MIL-STD-750D:2026 (1995) MIL-STD-883G:2003 (2006) MIL-STD-202G:208H (2002) IPC/EIA J-STD-002 (2004) Soldering Iron T. sol = 350 ± 5°C Dwell Time= 3.5 ± 0.5 seconds (CL=90%; LTPD=18.9 MIL-STD-202G:208H (2002) JEITA ED-4701:300 302 (2001) 11. Others The appearance and specifications of the product may be modified for improvement, without prior notice.