LTE-C9501 LITEON | Alldatasheet
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LITE-ON Technology Corp. / Optoelectronics No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C. Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto IR Emitter and Detector Product Data Sheet LTE-C9501 Spec No.: DS50-2013-0070 Effective Date: 01/08/2014 Revision: A BNS-OD-FC001/A4 BNS-OD-FC001/A4 BNS-OD-FC001/A4 BNS-OD-FC001/A4
Part No. : LTE-C9501 BNS-OD-FC 002 /A4 IR Emitter and Detector LTE-C9501 1. Description Lite-On offers a broad range of discrete infrared components for application such as remote control, IR wireless data transmission, security alarm & etc. Customers need infrared solutions featuring high power, high speed and wide viewing angels. The product line includes GaAs 940nm IREDs, AlGaAs high speed 850nm IREDs, PIN Photodiodes and Phototransistors. Photodiodes and Phototransistors can be provided with a filter that reduces digital light noise in the sensor function, which enables a high signal-to-noise ratio. 1. 1. Features Meet RoHS, Green Product. Package In 12mm Carrier Tape On 7" Diameter Reels.. Compatible With Automatic Placement Equipment. Compatible With Infrared Reflow Solder Process. EIA STD package. Peak wavelength λp=940nm Water clear plastic with top view lens. 1.2. Applications Infrared emitter PCB Mounted Infrared Sensor 2. Outline Dimensions Notes : 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1mm (.004") unless otherwise noted. 3. Specifications are subject to change without notice.
Part No. : LTE-C9501 BNS-OD-FC 002 /A4 IR Emitter and Detector LTE-C9501 3. Absolute Maximum Ratings at TA=25℃ Parameter Maximum Rating Unit Power Dissipation 100 mW Peak Forward Current(300pps, 10μs pulse) 800 mA DC Forward Current 60 mA Reverse Voltage 5 V Operating Temperature Range -40°C to + 85°C Storage Temperature Range -55°C to + 100°C Infrared Soldering Condition 260°C for 10 Seconds Max. Suggestion IR Reflow Profile For Pb Free Process :
Part No. : LTE-C9501 BNS-OD-FC 002 /A4 IR Emitter and Detector LTE-C9501 4. Electrical / Optical Characteristics at TA=25℃ Parameter Symbol Min. Typ. Max. Unit Test Condition Radiant Intensity IE 1.0 - 6.0 mW/sr IF = 20mA Peak Emission Wavelength λPeak - 940 - nm IF = 20mA Spectral Line Half-Width Δλ - 50 - nm IF = 20mA Forward Voltage VF 1.1 1.2 1.5 V IF = 20mA Reverse Current IR - - 10 μA VR = 5V Viewing Angle 2θ1/2 - 20 - deg Note: 1. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 2. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 3. Reverse voltage (VR) condition is applied for IR test only. The device is not designed for reverse operation. 5. Bin Code List Bin Code Radiant Intensity mW/sr @ IF=20mA Min Max BIN A 1.0 2.0 BIN B 2.0 3.0 BIN C 3.0 6.0 Tolerance on each intensity bin is +/-15%
Part No. : LTE-C9501 BNS-OD-FC 002 /A4 IR Emitter and Detector LTE-C9501 6. Typical Electrical / Optical Characteristics Curves (25℃ Ambient Temperature Unless Otherwise Noted) 100 0.5 1.0 1040940840 120 100 Relative Radiant Intensity Wavelength (nm) FIG.1 SPECTRAL DISTRIBUTION Forward Current IF (mA) AMBIENT TEMPERATURE FIG.2 FORWARD CURRENT VS. Ambient Temperature Ta ( C) o 100-40 0-20 20 6040 80 Ambient Temperature Ta ( C) VS. AMBIENT TEMPERATURE FIG.4 RELATIVE RADIANT INTENSITY -20 Output Power Relative ToValue at IF=20mA 0.6 0.2 0.4 0.8 1.0 1.2 6040200 o Forward Current (mA) 1.6 FORWARD VOLTAGE FIG.3 FORWARD CURRENT VS. Forward Voltage (V) 1.20 2.82.42.0 Value at IF=20mAOutput Power Relative To 2.0 4.0 6.0 8.0 10.0 VS. FORWARD CURRENT FIG.5 RELATIVE RADIANT INTENSITY Foward Current (mA) 400 160120 200 Relative Radiant Intensity FIG.6 RADIATION DIAGRAM 0 2010 oo o o o o o o o o 0.9 0.7 0.8 1.0 Forw ard C urrent IF (m A) A M BIEN T TE M PE R ATU R E FIG .2 FO R W AR D C U R R EN T VS. A m bient Tem perature Ta ( C ) o 100-40 0-20 20 6040 80 V alue at IF=20m A O utput Pow er R elative To 1.0 2.0 3.0 4.0 5.0 VS. FO R W AR D C U R R EN T FIG .5 R ELATIVE R AD IAN T IN TEN SITY Fow ard C urrent (m A) 200 8060 100
Part No. : LTE-C9501 BNS-OD-FC 002 /A4 IR Emitter and Detector LTE-C9501 7. Suggest Soldering Pad Dimensions 8. Package Dimensions Of Tape And Reel Note: All dimensions are in millimeters (inches). Hole
Part No. : LTE-C9501 BNS-OD-FC 002 /A4 IR Emitter and Detector LTE-C9501 Note: 1. Empty component pockets sealed with top cover tape. 2. 7 inch reel- 1500 pieces per reel. 3. The maximum number of consecutive missing parts is two. 4. In accordance with ANSI/EIA 481-1-A-1994 specifications. 8. CAUTIONS 8.1. Application The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).Consult Liteon’s Sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices). 8.2. Storage The package is sealed: The LEDs should be stored at 30°C or less and 90%RH or less. And the LEDs are limited to use within one year, while the LEDs is packed in moisture-proof package with the desiccants inside. The package is opened: The storage ambient for the LEDs should not exceed 30°C temperature or 60% relative humidity. It is recommended that LEDs out of their original packaging are IR-reflowed within one week hrs. For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient. LEDs stored out of their original packaging for more than one week hrs should be baked at about 60 deg C for at least 20 hours before solder assembly.
Part No. : LTE-C9501 BNS-OD-FC 002 /A4 IR Emitter and Detector LTE-C9501 8.3. Cleaning Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary. 8.4. Soldering Recommended soldering conditions: Reflow Soldering Soldering iron Pre-heat Pre-heat time Peak temperature Soldering time 150~200°C 120 seconds Max. 260°C Max. 10 seconds Max.(Max. two times) Temperature Soldering time 300°C Max. 3 seconds Max. (one time one) Because different board designs use different number and types of devices, solder pastes, reflow ovens, and circuit boards, no single temperature profile works for all possible combinations. However, you can successfully mount your packages to the PCB by following the proper guidelines and PCB-specific characterization. LITE-ON Runs both component-level verification using in-house KYRAMX98 reflow chambers and board-level assembly. The results of this testing are verified through post-reflow reliability testing. Profiles used at LITE-ON are based on JEDEC standards to ensure that all packages can be successfully and reliably surface mounted. Figure on page3 shows a sample temperature profile compliant to JEDEC standards. You can use this example as a generic target to set up your reflow process. You should adhere to the JEDEC profile limits as well as specifications and recommendations from the solder paste manufacturer to avoid damaging the device and create a reliable solder joint. 8.5. Drive Method An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as shown in Circuit A below. Circuit model (A) Circuit model (B) LED LED (A) Recommended circuit (B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs. 9. Others The appearance and specifications of the product may be modified for improvement, without prior notice.