VLMS31J1K2-GS08 TO-GRACE | Alldatasheet

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VLMS31.. www.vishay.com Vishay Semiconductors Revision: 1.5, 03-Aug-15 1 Document Number: 81327 For technical questions, contact: LED@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 High Intensity SMD LED PLCC-2

DESCRIPTION

The package of the VLMS31.. is the PLCC-2. It consists of a lead frame which is embedded in a white thermoplast. The reflector inside this package is filled up with clear epoxy. PRODUCT GROUP AND PACKAGE DATA

  • Product group: LED
  • Package: SMD PLCC-2
  • Product series: standard
  • Angle of half intensity: ± 60°

FEATURES

  • SMD LED with exceptional brightness
  • Luminous intensity categorized
  • Compatible with automatic placement equipment
  • EIA and ICE standard package
  • Compatible with IR reflow, vapor phase and wave solder processes according to CECC 00802 and J-STD-020
  • Available in 8 mm tape
  • Low profile package
  • Non-diffused lens: excellent for coupling to light pipes and backlighting
  • Low power consumption
  • Luminous intensity ratio in one packaging unit I Vmax./IVmin. ≤ 1.6
  • Preconditioning according to JEDEC® level 2a
  • ESD-withstand voltage: up to 2 kV according to JESD22-A114-B
  • AEC-Q101 qualified
  • Material categorization: fo r definitions of compliance please see www.vishay.com/doc?99912

APPLICATIONS

  • Automotive: backlighting in dashboards and switches
  • Telecommunication: indica tor and backlighting in telephone and fax
  • Indicator and backlight for audio and video equipment
  • Indicator and backlight in office equipment
  • Flat backlight for LCDs, switches, and symbols
  • General use 19225 PARTS TABLE PART COLOR LUMINOUS INTENSITY (mcd) at IF (mA) WAVELENGTH (nm) at IF (mA) FORWARD VOLTAGE (V) at IF (mA) TECHNOLOGY VLMS31J1L2-GS08 Red 4.5 7.8 18 10 624 630 638 10 - 1.9 2.6 20 GaAsP on GaP VLMS31J1L2-GS18 Red 4.5 7.8 18 10 624 630 638 10 - 1.9 2.6 20 GaAsP on GaP VLMS31J2L1-GS08 Red 5.6 8 14 10 624 630 638 10 - 1.9 2.6 20 GaAsP on GaP VLMS31J2L1-GS18 Red 5.6 8 14 10 624 630 638 10 - 1.9 2.6 20 GaAsP on GaP VLMS31K1L2-GS08 Red 7.1 8.5 18 10 624 630 638 10 - 1.9 2.6 20 GaAsP on GaP VLMS31K1L2-GS18 Red 7.1 8.5 18 10 624 630 638 10 - 1.9 2.6 20 GaAsP on GaP www.to-grace.com QlSøcˆgCNãt•U.LITE-ON:QI€&ÿ 4rGLEDpo{I ÛSãSŸˆÅÿ s°'O›^”ÿ N÷h<OR¿ÿ b€g/e/c u5‹Ýÿ0755-83464948 O wÿ0755-83464076 A ll data sheet.com

VLMS31.. www.vishay.com Vishay Semiconductors Revision: 1.5, 03-Aug-15 2 Document Number: 81327 For technical questions, contact: LED@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Note (1) Driving LED in reverse direction is suitable for short term application Note (1) In one packing unit IVmax./IVmin. ≤ 1.6 Note

  • Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ± 11 %. The above type numbers repres ent the order groups which include only a few brightness groups. Only one group will be shipped on each reel (there will be no mixing of two groups on each reel). In order to ensure availability, single brightness groups will not be orderable. In a similar manner for colors where wavelength groups are measured and binned, single wavelength groups will be shipped on any one reel. In order to ensure availability, single wavelength groups will not be orderable. ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C unless otherwise specified) VLMS31.. PARAMETER TEST CONDITION SYMBOL VALUE UNIT Reverse voltage 1) VR 6V DC forward current Tamb ≤ 85 °C IF 30 mA Surge forward current tp ≤ 10 μs IFSM 0.1 A Power dissipation PV 80 mW Junction temperature Tj 100 °C Operating temperature range Tamb -40 to +100 °C Storage temperature range Tstg -40 to +100 °C Thermal resistance junction / ambient Mounted on PC board (pad size > 16 mm 2)R thJA 400 K/W OPTICAL AND ELECTRICAL CHARACTERISTICS (Tamb = 25 °C unless otherwise specified) VLMS31.., RED PARAMETER TEST CONDITION PART SYMBOL MIN. TYP. MAX. UNIT Luminous intensity 1) IF = 10 mA VLMS31J1K2 I V 4.5 7.8 11.2 mcd VLMS31J1L2 I V 4.5 7.8 18 mcd VLMS31J2L1 I V 5.6 8 14 mcd VLMS31K1L2 I V 7.1 8.5 18 mcd Dominant wavelength IF = 10 mA λd 624 630 638 nm Peak wavelength IF = 10 mA λp - 643 - nm Angle of half intensity IF = 10 mA ϕ -± 6 0- d e g Forward voltage IF = 20 mA VF -1 . 9 2 . 6V Reverse voltage IR = 10 μA VR 5--V Junction capacitance VR = 0, f = 1 MHz Cj -1 5-p F LUMINOUS INTENSITY CLASSIFICATION GROUP LIGHT INTENSITY (mcd) STANDARD OPTIONAL MIN. MAX. J 14 . 5 5 . 6 25 . 6 7 . 1 K 17 . 1 9 . 0 2 9.0 11.2 L 1 11.2 14 21 4 1 8 CROSSING TABLE VISHAY OSRAM VLMS31J1K2 LST670-J1K2 VLMS31J1L2 LST670-J1L2 VLMS31J2L1 LST670-J2L1 VLMS31K1L2 LST670-K1L2 A ll data sheet.com

VLMS31.. www.vishay.com Vishay Semiconductors Revision: 1.5, 03-Aug-15 3 Document Number: 81327 For technical questions, contact: LED@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) Fig. 1 - Forward Current vs. Ambient Temperature Fig. 2 - Forward Current vs. Pulse Length Fig. 3 - Relative Luminous Intensity vs. Angular Displacement Fig. 4 - Relative Luminous Intensity vs. Wavelength Fig. 5 - Forward Current vs. Forward Voltage Fig. 6 - Relative Luminous Intensity vs. Forward Current IF - Forward Current (mA) 95 10905 Tamb - Ambient Temperature (°C) 10080604020 0 0.01 0.1 1 10 100 1000 10 000 tp - Pulse Length (ms) 100 95 9985 IF - Forward Current (mA) DC tp/T = 0.005 0.5 0.2 0.1 0.01 0.05 0.02 Tamb < 60 °C 0.4 0.2 0 95 10319 0.6 0.9 0.8 30° 10° 20° 40° 50° 60° 70° 80° 0.7 1.0 IV rel - Relative Luminous Intensity ϕ - Angular Displacement 0.0 0.2 0.4 0.6 0.8 1.0 1.2 550 590 630 670 710 750

16639 IV rel - Relative Luminous Intensity

  • Wavelength (nm) super red 0.1 100 VF - Forward Voltage (V)16634 IF - Forward Current (mA) super red 5 4 3 21 0.01 0.1 1 10 100 IF - Forward Current (mA)16638 IV rel - Relative Luminous Intensity super red A ll data sheet.com

VLMS31.. www.vishay.com Vishay Semiconductors Revision: 1.5, 03-Aug-15 4 Document Number: 81327 For technical questions, contact: LED@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Fig. 7 - Relative Luminous Intensity vs. Ambient Temperature Fig. 8 - Change of Dominant Wavelength vs. Ambient Temperature Fig. 9 - Change of Forward Voltage vs. Ambient Temperature 0.0 0.4 0.8 1.2 1.6 2.0 0 2 04 06 08 0 1 0 0 T amb - Ambient Temperature (°C)16635 IV rel - Relative Luminous Intensity super red - 3 - 2 - 1 0 2 04 06 08 0 1 0 0 Tamb - Ambient Temperature (°C)16637 - Change of Dom. Wavelength (nm)d - 300 - 250 - 200 - 150 - 100 - 50 100 150 200 0 2 04 06 08 0 1 0 0 Tamb - Ambient T emperature (°C)16636 V - Change of Forward Voltage (mV)F A ll data sheet.com

VLMS31.. www.vishay.com Vishay Semiconductors Revision: 1.5, 03-Aug-15 5 Document Number: 81327 For technical questions, contact: LED@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PACKAGE DIMENSIONS in millimeters Drawing-No.: 6.541-5067.01-4 specifications according to DIN Technical drawings Issue: 6; 23.09.13 Dimensions in mmC A Ø2.4 Pin identification 3.5±0.2 1.75±0.1 0.9 2.8±0.15 2.2 +0.15 0.8 Mounting Pad Layout 1.2 2.6 (2.8) 1.6 (1.9) Dimensions: Reflow and vapor phase (wave soldering) Area covered with solderresist A ll data sheet.com

VLMS31.. www.vishay.com Vishay Semiconductors Revision: 1.5, 03-Aug-15 6 Document Number: 81327 For technical questions, contact: LED@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 METHOD OF TAPING / POLARITY AND TAPE AND REEL SMD LED (VLM3-SERIES) Vishay’s LEDs in SMD packages are available in an antistatic 8 mm blister tape (in accordance with DIN IEC 40 (CO) 564) for automatic compo nent insertion. The blister tape is a plastic strip with impressed component cavities, covered by a top tape. TAPING OF VLM.3.. Fig. 10 - Tape Dimensions in mm for PLCC-2 REEL PACKAGE DIMENSION IN MILLIMETERS FOR SMD LEDS, TAPE OPTION GS08 (= 1500 PCS.) Fig. 11 - Reel Dimensions - GS08 REEL PACKAGE DIMENSION IN MILLIMETERS FOR SMD LEDS, TAPE OPTION GS18 (= 8000 PCS.) PREFERRED Fig. 12 - Reel Dimensions - GS18 SOLDERING PROFILE Fig. 13 - Vishay Lead (Pb)-free Reflow Soldering Profile (acc. to J-STD-020) Fig. 14 - Double Wave Soldering of Opto Devices (all Packages) Adhesive tape Component cavity Blister tape 94 8670 1.85 1.65 4.0 3.6 3.6 3.4 2.05 1.95 1.6 1.4 4.1 3.9 4.1 3.9 5.75 5.25 8.3 7.7 3.5 3.1 2.2 2.0 0.25 94 8668 180 178 4.5 3.5 2.5 1.5 13.00 12.75 63.5 60.5 14.4 max. 10.0 9.0120° 94 8665 Identification Label: Vishay type group tape code production code quantity 321 329 Identification 4.5 3.5 2.5 1.5 13.00 12.75 62.5 60.0 14.4 max. 10.4 8.4120° 18857 Label: Vishay type group tape code production code quantity 100 150 200 250 300 0 50 100 150 200 250 300 Time (s) Temperature (°C) 240 °C 245 °C max. 260 °C max. 120 s max. 100 s 217 °C max. 30 s max. ramp up 3 °C/s max. ramp down 6 °C/s 19885 IR Reflow Soldering Profile for Lead (Pb)-free Soldering Preconditioning acc. to JEDEC level 2a max. 2 cycles allowed 255 °C 235 °C to 260 °C

2 K/s

ca. 200 K/s second wave first wave 5 s full line: typical dotted line: process limits Time (s) Temperature (°C) lead temperature 300 250 200 150 100 0 50 100 150 200 250 948626-1 TTW Soldering (acc. to CECC00802) 100 °C to 130 °C forced cooling ca. 2 K/s ca. 5 K/s A ll data sheet.com

VLMS31.. www.vishay.com Vishay Semiconductors Revision: 1.5, 03-Aug-15 7 Document Number: 81327 For technical questions, contact: LED@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 BAR CODE PRODUCT LEVEL A) Type of component B) Manufacturing plant C) SEL - selection code (bin): e.g.: J1 = code for luminous intensity group D) Date code year / week E) Day code (e.g. 3: Wednesday) F) Batch no. G) Total quantity H) Company code DRY PACKING The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. FINAL PACKING The sealed reel is packed into a cardboard box. A secondary cardboard box is used for shipping purposes. RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the aluminium bag has been opened to preve nt moisture absorption. The following conditions should be observed, if dry boxes are not available:

  • Storage temperature 10 °C to 30 °C
  • Storage humidity ≤ 60 % RH max. After more than 672 h under these conditions moisture content will be too high for reflow soldering. In case of moisture absorptio n, the devices will recover to the former condition by drying under the following condition: 192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air / nitrogen) or 96 h at 60 °C + 5 °C and < 5 % RH for all device containers or 24 h at 100 °C + 5 °C not suitable for reel or tubes. An EIA JEDEC standard JESD22 -A112 level 2a label is included on all dry bags. Example of JESD22-A112 level 2a label ESD PRECAUTION Proper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the antistatic shielding bag. Electrostatic sensitive devices warning labels are on the packaging. VISHAY SEMICONDUCTORS STANDARD BAR CODE LABELS The Vishay Semiconductors st andard bar code labels are printed at final packing areas. The labels are on each packing unit and contain Vishay Semiconductors specific data. 106 VISHAY A H BC D E F G 20127 Aluminum bag Label Reel 15973 L E V E L CAUTION This bag contains MOISTURE –SENSITIVE DEVICES 1. Shelf life in sealed bag 12 months at <40°C and < 90% relative humidity (RH) 2. After this bag is opened devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. 260°C) must be: a) Mounted within 672 hours at factory condition of < 30°C/60%RH or b) Stored at <10% RH. 3. Devices require baking before mounting if: a) Humidity Indicator Card is >10% when read at 23°C + 5°C or b) 2a or 2b is not met. 4. If baking is required, devices may be baked for: 192 hours at 40°C + 5°C/-0°C and <5%RH (dry air/nitrogen) or 96 hours at 60±5 o Cand <5%RH For all device containers or 24 hours at 100±5°C Not suitable for reels or tubes (If blank, see bar code label) Note: LEVEL defined by EIA JEDEC Standard JESD22-A113 19786 A ll data sheet.com

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