LMA442 FILTRONIC | Alldatasheet
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Technical content
Phone: (408) 988-1845 http:// www.filss.com Revised: 06/21/01 Fax: (408) 970-9950 Email: sales@filss.com
- FEATURES ♦ 26.5 GHz to 29.5 GHz Frequency Band ♦ +22 dBm Output Power at 1dB Compression ♦ 19 dB Gain ♦ +5 V Dual Bias Supply
- DESCRIPTION AND APPLICATIONS The LMA442 is a medium power pHEMT amplifier that operates from 26.5 to 29.5 GHz. This 3- stage amplifier provides 19 dB linear power gain with 1-dB gain compression power output of greater than +22 dBm. The LMA442 is designed for LMDS/LMCS applications. Ground is provided to the circuitry through vias to the backside metallization.
- ELECTRICAL SPECIFICATIONS @ TAmbient = 25°°C (V DD = +5.0V, Z IN = Z OUT = 50 Ω ) Parameter Symbol Test Conditions Min Typ Max Units Frequency Band F 26.5 29.5 GHz Power at 1-dB Compression P-1dB 75% I DSS 21 22 dBm Power at Saturation P SAT 75% I DSS 23 24 dBm Small Signal Gain S 21 75% I DSS 18 19 dB Small Signal Gain Flatness ΔS 21 ±1 ±2 dB Input Return Loss S 11 -8.5 -10 dB Output Return Loss S 22 -7.5 -10 dB Reverse Isolation S 12 -30 -40 dB Saturated Drain Current I DSS 250 350 450 mA
Phone: (408) 988-1845 http:// www.filss.com Revised: 06/21/01 Fax: (408) 970-9950 Email: sales@filss.com
- ABSOLUTE MAXIMUM RATINGS Parameter Symbol Test Conditions Min Max Units Drain Voltage V D T Ambient = 22 ± 3 °C 6 V Operating Current I OP T Ambient = 22 ± 3 °C 495 mA RF Input Power P IN T Ambient = 22 ± 3 °C 12 dBm Total Power Dissipation P TOT T Ambient = 22 ± 3 °C 4 W Channel Operating Temperature T CH T Ambient = 22 ± 3 °C 150 ºC Storage Temperature T STG — -65 165 ºC Maximum Assembly Temperature (1 min. max.) T MAX — 300 ºC Notes:
- Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device.
- Recommended Continuous Operating Limits should be observed for reliable device operation.
- Power Dissipation defined as: P TOT ≡ (P DC + P IN ) – P OUT , where P DC : DC Bias Power P IN : RF Input Power P OUT : RF Output Power
- This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these devices.
Phone: (408) 988-1845 http:// www.filss.com Revised: 06/21/01 Fax: (408) 970-9950 Email: sales@filss.com
- ASSEMBLY DRAWING Notes:
- Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter wire. The bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is recommended. Ultrasonic bonding is not recommended.
- The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150°C for 45 minutes.
- Bond on bond or stitch bond acceptable.
- Conductor over conductor acceptable. Conductors must not short.
Phone: (408) 988-1845 http:// www.filss.com Revised: 06/21/01 Fax: (408) 970-9950 Email: sales@filss.com
- MECHANICAL OUTLINE Notes:
- All units are in microns (µm).
- All bond pads are 100 X 100 µm 2 .
- Bias pad (V DD ) size is 100 X 121.5 µm 2 .
- Unless otherwise specified.
- HANDLING PRECAUTIONS To avoid damage to the devices care should be exercised during handling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. These devices should be treated as Class 1A (0-500 V). Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263. All information and specifications are subject to change without notice.