LMA208C FILTRONIC | Alldatasheet
Document overview
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- PDF pages: 3
Technical content
Features
- 9dB Typical Gain
- 18dBm 1-dB Gain Compression Power
- 15dB Inpu t/Output Return Loss Typical
- 2-26GHz Frequency Bandwidth
- DC Decoupled RF Input and Output
- Chip Size : 1.986mm X1.082mm (.078”X.043”)
- Chip Thickness : 100µm
- Pad Dimension : 100µm 2
Description
The Filtronic LMA208C is a medium power PHEMT amplifier that operates from 2 to 26GHz. This 5-stage travelling wave amplifier provides 10dB nominal gain and 1-dB gain compression power output of greater than 19dBm. The LMA208C is designed for use as wideband driver amplifer in ECM (Electronic Counter-Measure) and commercial communication system applications. Ground is provided to the circuitry through vias to the backside metallization. Electrical Specifications at Ta=25°C (VDD =+4.0V, Zin=Zout=50Ω ) Absolute Maximum Ratings Notes: 1. This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these devices. 2. Specifications subject to change without notice. DSS 009 WC Limit Symbol Parameter Test Conditions Min. Typ. Max. Units BW Operating Bandwidth 2 26 GHz S21 Small Signal Gain (2-20GHz) @ .5Idss 7 9 dB S21 Small Signal Gain (20-26GHz) @ .5Idss 6 7 dB Idss Drain Current at Saturation Idss @ Vg=0 V 75 162 225 mA ΔS21 Small Signal Gain Flatness ±1.5 ±2.0 dB RLin Input Return Loss -13 dB RLout Output Return Loss -14 dB S12 Reverse Isolation -30 dB P-1dB 1-dB Gain Compression Power @ .5Idss 16 18 dBm Psat Saturated Output Power 21 dBm Symbol Parameter/Conditions Min. Max. Units Vdd Drain Supply Voltage 7 Volts Idd Total Drain Current 225 mA Pin RF Input Power 12 dBm Pt Power Dissipation 1.6 W Tch Operating Channel Temperature 150 °C Tstg Storage Temperature -65 165 °C Tmax. Max. Assembly Temp. (1 min. max.) 300 °C
Filtronic 2-26 GHz PHEMT Amplifier Solid State LMA208C Phone: (408) 988-1845 Internet: http://www.FiltronicSolidState.comFax: (408) 970-9950 Assembly Diagram 1.) Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter wire. The bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is recommended. Ultrasonic bonding is not recommended. 2.) The recommended die attach is an eutectic 80/20 Gold/Tin solder, using a stage temperature of 285-290°C. Maximum time at temperature is 1 minute. Use of forming gas (90% N 2 , 10% H2 ) for best results. 3.) Bond on bond or stitch bond acceptable. 4.) Conductor over conductor acceptable. Conductors must not short. DSS 009 WC
Filtronic 2-26 GHz PHEMT Amplifier Solid State LMA208C Phone: (408) 988-1845 Internet: http://www.FiltronicSolidState.comFax: (408) 970-9950 Mechanical Outline Notes: 1.) Unless Otherwise specified. 2.) All units are in micron (µm). 3.) All bond pads are 100 X 100 µm 4.) Bias pad (VDD ) size is 100 X 121.5 µm2. DSS 009 WC