LM301B SAMSUNG | Alldatasheet
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Product Family Data Sheet_Global Rev.10.2 22.04.28 Middle Power LED Series 3030 LM301B CRI 80 Features & Benefits 0.3 W class middle power LED Mold resin for high reliability Standard form factor for design flexibility (3.0 × 3.0 mm)
- Characteristics a) Absolute Maximum Rating Item Symbol Rating Unit Condition Ambient / Operating Temperature Ta -40 ~ +85 ℃ - Storage Temperature Tstg -40 ~ +120 ℃ - LED Junction Temperature Tj 110 ℃ - Forward Current IF 200 mA - Pulse Forward Current IFP 300 mA Duty 1/10, pulse width 10ms Assembly Process Temperature - 260 <10 s ESD (HBM) - 5 kV - b) Electro-optical Characteristics (I F = 65 mA, Ts = 25℃) Item Unit Rank Bin Min. Typ. Max. Forward Voltage (VF) V XA AY 2.6 - 2.7 AZ 2.7 - 2.8 A1 2.8 - 2.9 Reverse Voltage Color Rendering Index (Ra) - 80 - - Thermal Resistance (junction to solder point) ℃/W - 7.5 - Beam Angle ￮ - 120 - Note: Samsung maintains measurement tolerance of: forward voltage = ±0.1 V, luminous flux = ±5 %, CRI = ±3
c) Electro-optical Characteristics (IF = 65 mA, Ts= 25℃) Item CRI Nominal CCT (K) SF SG SH SJ SK SL SM 28 30 30 32 32 34 34 36 36 38 38 40 40 42 Luminous Flux (Φv) 80 2200 2700 3000 3500 4000 5000 5700 6500 Note: Samsung maintains measurement tolerance of: forward voltage = ±0.1V, luminous flux = ±5 %, CRI = ±3
- Product Code Information 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 S P M W H D 3 2 A M D 5 X A R 0 S 0 Digit PKG Information Code Specification 1 2 3 Samsung Package Middle Power SPM 4 5 Color WH White
6 Product Version D Dispensing
7 8 9 Form Factor 32A 3.0 x 3.0 x 0.7 mm; 2 pads;
10 Sorting Current (mA) M 65 mA
11 Chromaticity Coordinates D ANSI Standard, MacAdam 3 step ellipse bin, MacAdam 5 step ellipse bin
12 CRI 5 Min. 80 13 14 Forward Voltage (V) XA 2.6~2.9 Bin Code: AY 2.6~2.7 AZ 2.7~2.8 A1 2.8~2.9 15 16 Color bin Y● 2200 Bin Code YA, YB, YC, YD, YE, YF, YG, YH, YJ, YK, YL, YM W● 2700 WA, WB, WC, WD, WE, WF, WG, WH, WJ, WK, WL, WM V● 3000 VA, VB, VC, VD, VE, VF, VG, VH, VJ, VK, VL, VM U● 3500 UA, UB, UC, UD, UE, UF, UG, UH, UJ, UK, UL, UM T● 4000 TA, TB, TC, TD, TE, TF, TG, TH, TJ, TK, TL, TM R● 5000 RA, RB, RC, RD, RE, RF, RG, RH, RJ, RK, RL, RM Q● 5700 QA, QB, QC, QD, QE, QF, QG, QH, QJ, QK, QL, QM P● 6500 PA, PB, PC, PD, PE, PF, PG, PH, PJ, PK, PL, PM
- : "0" (Whole bin) "3" (MacAdam 3 -step ellipse bin) or "K ” (K Kitting) or “S” (S Kitting) 17 18 Luminous Flux SF SG SH SJ SK SL SM Bin Code: SF, SG, SH, SJ, SK, SL, SM SL + SM / SM+ SM SF 28.0 ~ 30.0 SG 30.0~32.0 SH 32.0~34.0 SJ 34.0~36.0 SK 36.0~38.0 SL 38.0~40.0 SM 40.0~42.0
a) Luminous Flux Bins(IF = 65 mA, Ts= 25℃) CRI (Ra) Min. Nominal CCT (K) Product Code Flux Bin Flux Range (Φv, lm)
2200 SPMWHD32AMD5XAY●S0
SF 28.0~30.0 SG 30.0~32.0 SH 32.0~34.0 2700 SPMWHD32AMD5XAW●S0 SH 32.0~34.0 SJ 34.0 ~36.0 SK 36.0 ~38.0 SPMWHD32AMD5XAW●SJ SJ 34.0 ~36.0 3000 SPMWHD32AMD5XAV●S0 SJ 34.0 ~36.0 SK 36.0 ~38.0 SL 38.0 ~ 40.0 SPMWHD32AMD5XAV●SK SK 36.0 ~38.0 3500 SPMWHD32AMD5XAU●S0 SJ 34.0 ~36.0 SK 36.0 ~38.0 SL 38.0 ~ 40.0 SPMWHD32AMD5XAU●SL SL 38.0 ~ 40.0 4000 SPMWHD32AMD5XAT●S0 SK 36.0 ~38.0 SL 38.0 ~ 40.0 SPMWHD32AMD5XAT●SL SL 38.0 ~ 40.0 5000 SPMWHD32AMD5XAR●S0 SK 36.0 ~38.0 SL 38.0 ~ 40.0 SM 40.0 ~ 42.0 SPMWHD32AMD5XAR●SL SL 38.0 ~ 40.0 SPMWHD32AMD5XAR●L2 SL 38.0 ~ 40.0 SM 40.0 ~ 42.0 5700 SPMWHD32AMD5XAQ●S0 SK 36.0 ~38.0 SL 38.0 ~ 40.0 SPMWHD32AMD5XAQ●SL SL 38.0 ~ 40.0 6500 SPMWHD32AMD5XAP●S0 SK 36.0 ~38.0 SL 38.0 ~ 40.0 SPMWHD32AMD5XAP●SL SL 38.0 ~ 40.0 Note: "●" can be "0" (Whole bin), "3" (MacAdam 3-step ellipse bin), “S” (S Kitting) or "K" (K Kitting) of the color binning
b) Kitting Rule 1) S Kitting Bin Concept 1. Under agreement between customer and SAMSUNG ELECTRONICS, SAMSUNG can supply kitting bin (VF, Color, lm). 2. A forward voltage (VF) of kitting bin is combined by a pair of same VF rank such as (AY+AY), (AZ+AZ) or (A1+A1) 3. A Chromaticity Coordinates of kitting bin is mixed by kitting procedure.(below kitting simulation) 4. A luminous flux(lm) of kitting bin is combined by a pair of IV rank such as (SH+SH), (SH+SJ), (SJ+SJ), (SJ+SK), (SK+SK), (SK+SL), (SL+SL), (SL+SM) or (SM+SM) [Binning Information] Bin #1 Bin #2 Remark VF AY AY AZ AZ A1 A1 CIE A G C E D F B H E G F H MacA. 3step(A, B, C, D) MacA. 3step(A, B, C, D) IV SF SF SF SG SG SG SG SH SH SH SH SJ SJ SJ SJ SK SK SK SK SL SL SL SL SM SM SM
2) K Kitting Bin Concept 1. Under agreement between customer and SAMSUNG ELECTRONICS, SAMSUNG can supply kitting bin (VF, Color, lm). 2. A forward voltage (VF) of kitting bin is combined by a pair of same VF rank such as (AY+AY), (AY+AZ), (AZ+AZ), (AZ+A1) or (A1+A1) 3. A Chromaticity Coordinates of kitting bin is mixed by kitting procedure.(below kitting simulation) 4. A luminous flux(lm) of kitting bin is combined by a pair of IV rank such as (SH+SH), (SH+SJ), (SJ+SJ), (SJ+SK), (SK+SK), (SK+SL), (SL+SL), (SL+SM) or (SM+SM) [Binning Information] Bin #1 Bin #2 Remark VF AY AY AY AZ AZ AZ AZ A1 A1 A1 CIE H K F M E L G J E G F H MacA. 3step(A, B, C, D) MacA. 3step(A, B, C, D) IV SF SF SF SG SG SG SG SH SH SH SH SJ SJ SJ SJ SK SK SK SK SL SL SL SL SM SM SM
c) Color Bins (IF = 65 mA, Ts= 25℃) min. CRI (Ra) Nominal CCT (K) Product Code Color Rank Chromaticity Bins 2200 SPMWHD32AMD5XAY0S★ Y0 Whole bin YA, YB, YC, YD, YE, YF, YG, YH, YJ, YK, YL, YM SPMWHD32AMD5XAY3S★ Y3 MacAdam 3-step ellipse bin YA, YB, YC, YD SPMWHD32AMD5XAYSS★ YS S Kitting YA, YB, YC, YD, YE, YF, YG, YH, SPMWHD32AMD5XAYKS★ YK K Kitting YA, YB, YC, YD, YE, YF, YG, YH, YJ, YK, YL, YM 2700 SPMWHD32AMD5XAW0S★ W0 Whole bin WA, WB, WC, WD, WE, WF, WG, WH, WJ, WK, WL, WM SPMWHD32AMD5XAW3S★ W3 MacAdam 3-step ellipse bin WA, WB, WC, WD SPMWHD32AMD5XAWSS★ WS S Kitting WA, WB, WC, WD, WE, WF, WG, WH SPMWHD32AMD5XAWKS★ WK K Kitting WA, WB, WC, WD, WE, WF, WG, WH, WJ, WK, WL, WM 3000 SPMWHD32AMD5XAV0S★ V0 Whole bin VA, VB, VC, VD, VE, VF, VG, VH, VJ, VK, VL, VM SPMWHD32AMD5XAV3S★ V3 MacAdam 3-step ellipse bin VA, VB, VC, VD SPMWHD32AMD5XAVSS★ VS S Kitting VA, VB, VC, VD, VE, VF, VG, VH SPMWHD32AMD5XAVKS★ VK K Kitting VA, VB, VC, VD, VE, VF, VG, VH, VJ, VK, VL, VM 3500 SPMWHD32AMD5XAU0S★ U0 Whole bin UA, UB, UC, UD, UE, UF, UG, UH, UJ, UK, UL, UM SPMWHD32AMD5XAU3S★ U3 MacAdam 3-step ellipse bin UA, UB, UC, UD SPMWHD32AMD5XAUSS★ US S Kitting UA, UB, UC, UD, UE, UF, UG, UH SPMWHD32AMD5XAUKS★ UK K Kitting UA, UB, UC, UD, UE, UF, UG, UH, UJ, UK, UL, UM 4000 SPMWHD32AMD5XAT0S★ T0 Whole bin TA, TB, TC, TD, TE, TF, TG, TH, TJ, TK, TL, TM SPMWHD32AMD5XAT3S★ T3 MacAdam 3-step ellipse bin TA, TB, TC, TD SPMWHD32AMD5XATSS★ TS S Kitting TA, TB, TC, TD, TE, TF, TG, TH SPMWHD32AMD5XATKS★ TK K Kitting TA, TB, TC, TD, TE, TF, TG, TH, TJ, TK, TL, TM 5000 SPMWHD32AMD5XAR0*★ R0 Whole bin RA, RB, RC, RD, RE, RF, RG, RH, RJ,RK,RL,RM SPMWHD32AMD5XAR3S★ R3 MacAdam 3-step ellipse bin RA, RB, RC, RD SPMWHD32AMD5XARS*★ RS S Kitting RA, RB, RC, RD, RE, RF, RG, RH SPMWHD32AMD5XARK*★ RK K Kitting RA, RB, RC, RD, RE, RF, RG, RH, RJ,RK,RL,RM 5700 SPMWHD32AMD5XAQ0S★ Q0 Whole bin QA, QB, QC, QD, QE, QF, QG, QH, QJ,QK,QL,QM SPMWHD32AMD5XAQ3S★ Q3 MacAdam 3-step ellipse bin QA, QB, QC, QD SPMWHD32AMD5XAQSS★ QS S Kitting QA, QB, QC, QD, QE, QF, QG, QH SPMWHD32AMD5XAQKS★ QK K Kitting QA, QB, QC, QD, QE, QF, QG, QH, QJ,QK,QL,QM 6500 SPMWHD32AMD5XAP0S★ P0 Whole bin PA, PB, PC, PD, PE, PF, PG, PH, PJ,PK,PL,PM SPMWHD32AMD5XAP3S★ P3 MacAdam 3-step ellipse bin PA, PB, PC, PD SPMWHD32AMD5XAPSS★ PS S Kitting PA, PB, PC, PD, PE, PF, PG, PH SPMWHD32AMD5XAPKS★ PK K Kitting PA, PB, PC, PD, PE, PF, PG, PH, PJ,PK,PL,PM “*” can be “S” or “L” of the luminous flux
d) Voltage Bins (IF = 65 mA, Ts = 25℃) CRI (Ra) Min. Nominal CCT (K) Product Code Voltage Rank Voltage Bin Voltage Range (V) 80 - - XA AY 2.6 ~ 2.7 AZ 2.7 ~ 2.8 A1 2.8 ~ 2.9
e) Chromaticity Region & Coordinates (I F = 65 mA, Ts = 25℃)
f) Chromaticity Region & Coordinates (I F = 65 mA, Ts = 25℃) MacAdam Ellipse ( Y3, Y5) MacAdam Ellipse (W3, W5 ) Step CIE x CIE y a b Step Step CIE x CIE y a b MacAdam Ellipse (V3, V5) MacAdam Ellipse (U3, U5) Step CIE x CIE y a b Step CIE x CIE y a b MacAdam Ellipse (T3, T5) MacAdam Ellipse (R3,R5) Step CIE x CIE y a b Step CIE x CIE y a b MacAdam Ellipse (Q3, Q5) MacAdam Ellipse (P3, P5) Step CIE x CIE y a b Step CIE x CIE y a b Note: Samsung maintains measurement tolerance of: Cx, Cy = ±0.005 CIE x,y
- Typical Characteristics Graphs a) Spectrum Distribution (I F = 65 mA, Ts = 25℃) CCT : 2200K (80 CRI) CCT : 2700K (80 CRI) CCT : 3000K (80 CRI) CCT : 3500K (80 CRI) CCT : 4000K (80 CRI) CCT : 5000K (80 CRI)
CCT : 5700K (80 CRI) CCT : 6500K (80 CRI) b) Forward Current Characteristics (Ts = 25℃) c) Temperature Characteristics (IF = 65 mA)
d) Color Shift Characteristics, Ts = 25℃, IF = 65 mA e) Derating Curve f) Beam Angle Characteristics (Ts = 25℃, IF = 65 mA)
- Outline Drawing & Dimension Notes: 1) This LED has built-in ESD protection device(s) connected in parallel to LED chip(s). 2) Ts point and measurement method: ① Measure one point at the cathode pad, if necessary remove PSR of PCB to reach Ts point. ② All pads must be soldered to the PCB to dissipate heat properly, otherwise the LED can be damaged. Precautions: 1) Pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be taken to avoid strong pressure on the LEDs. Do not put stress on the LEDs during heating. 2) Re-soldering should not be done after the LEDs have been soldered. If re-soldering is unavoidable, LED\`s characteristics should be carefully checked before and after such repair . 3) Do not stack assembled PCBs together . Since materials of LEDs is soft, abrasion between two PCB assembled with LED might cause catastrophic failure of the LEDs.
- Reliability Test Items & Conditions a) Test Items Test Item Test Condition Test Hour / Cycle Sample No. Room Temperature Life Test 25℃, DC 200 mA 1000 h 22 High Temperature Life Test 85℃, DC 200 mA 1000 h 22 High Temperature Humidity Life Test 85℃, 85 % RH, DC 200 mA 1000 h 22 Low Temperature Life Test -40℃, DC 200 mA 1000 h 22 Powered Temperature Cycle Test -40 ℃ ~ 85℃, each 10 min, On/Off 5min , Temp. Change Time 20min, DC 200 mA 100 cycles 22 Thermal Cycle -45℃ / 15 min ↔ 125℃ / 15 min → Hot plate 180℃ 500 cycles 100 High Temperature Storage 120℃ 1000 h 11 Low Temperature Storage -40℃ 1000 h 11 ESD (HBM) R1: 10 M Ω R2: 1.5 k Ω C: 100 pF V: ±5 kV 5 times 30 ESD (MM) R1: 10 M Ω R2: 0 C: 200 pF V: ±0.5 kV 5 times 30 Vibration Test 20~2000~20 Hz, 200 m/s2, sweep 4 min X, Y , Z 3 direction, each 1 cycle 4 cycles 11 Mechanical Shock Test 1500 g, 0.5 ms 3 shocks each X-Y-Z axis 5 cycles 11 b) Criteria for Judging the Damage Item Symbol Test Condition (Ts = 25℃) Limit Min Max Forward Voltage VF IF = 65 mA Init. Value * 0.9 Init. Value * 1.1 Luminous Flux Φv IF = 65 mA Init. Value * 0.7 Init. Value * 1.1
- Soldering Conditions a) Reflow Conditions (Pb free) Reflow frequency: 2 times max. b) Manual Soldering Conditions Not more than 5 seconds @ max. 300℃, under soldering iron.
- Tape & Reel a) Taping Dimension (unit: mm) Taping Direction 500 mm 500 mm
b) Reel Dimension (unit: mm) Notes: 1) Quantity: The quantity/reel is 4,000 pcs 2) Cumulative Tolerance: Cumulative tolerance / 10 pitches is ±0.2 mm 3) Adhesion Strength of Cover Tape: Adhesion strength is 0.1 -0.7 N when the cover tape is turned off from the carrier tape at 10° angle to the carrier tape 4) Packaging: P/N, Manufacturing data code no. and quantity are indicated on the aluminum packing bag
SPMWHD32AMD5XAR0S0 AZRASL 00 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAEC4001 / I001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Bin Code Product Code Lot Number SPMWHD32AMD5XAR0S0 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAEC4001 / 4,000 pcs QUANITY : 8,000 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIII GLAEC4002 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII AZRASL SPMWHD32AMD5XAR0S0 AZRASL 00 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII ①②③④⑤⑥⑦⑧⑨/Iⓐⓑⓒ/ 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII 8. Label Structure a) Label Structure Note: Denoted bin code and product code above is only an example (see description on page 5) Bin Code: ⓐⓑ: Forwa rd Voltage bin (refer to page 3) ⓒⓓ: Chroma ticity bin (refer to page 9-12) ⓔⓕ: Luminous Flux bin (refer to page 4, 6) b) Lot Number The lot number is composed of the following characters: ①②③③②③④⑤⑥⑦⑧⑨ / Iⓐⓑⓒ / 4,000 pcs ①② : Production site (GL: Tianjin, China, G4: Guangzhou, China, EH : Hanoi, Vietnam ) ※ Sample product (SL: Kiheung, Korea) ③ : Product state (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample) ④ : Year (C : 2018, D : 2019, E : 2020 …) ⑤ : Month (1~9, A, B, C) ⑥ : Day (1~9, A, B~V) ⑦⑧⑨ : Serial number (001 ~ 999) ⓐⓑⓒ : Reel number (001 ~ 999)
SPMWHD32AMD5XAR0S0 AZRASL 00 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAEC4001 / I001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII AZRASL SPMWHD32AMD5XAR0S0 AZRASL 00 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAEC4001 / I001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII AZRASL SPMWHD32AMD5XAR0S0 AZRASL 00 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAEC4001 / I001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII 9. Packing Structure a) Packing Process (The quantity of PKG on the Reel to be Max 4,000pcs) Material: Paper (SW3B(B)) Type Size (mm) Note L W H 7 inch L 245 ± 5 220 ± 5 182 ± 5 Up to 10 reels 7 inch S 245 ± 5 220 ± 5 86 ± 5 Up to 5 reels Reel Aluminum Vinyl Packing Bag Outer Box LED H W L ① Side Label
SPMWHD32AMD5XARSS0 AYRDSK 00 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAEC4001 / I001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII AYRDSK SPMWHD32AMD5XARSS0 AYRDSK 00 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAEC4001 / I001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII AYRFSK SPMWHD32AMD5XARSS0 AYRFSK 00 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAEC4002 / I001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII AYRFSK SPMWHD32AMD5XARSS0 AYRFSK 00 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAEC4002 / I001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII AYRDSK SPMWHD32AMD5XARSS0 AYRDSK 00 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAEC4001 / I001 / 20,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII [BOX Label] AYRFSK SPMWHD32AMD5XARSS0 AYRFSK 00 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAEC4002 / I001 / 20,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII [BOX Label] SPMWHD32AMD5XARSS0 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAEC4001 / 4,000 pcs QUANITY : 8,000 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIII GLEC94002 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII b) Packing Process for kitting (The quantity of PKG on the Reel to be Max 4,000pcs) Material: Paper (SW3B(B)) Type Size (mm) Note L W H 7 inch L 245 ± 5 220 ± 5 182 ± 5 Up to 10 reels Reel Kitting ‘A’ Kitting ‘A’ Kitting ‘B’ Aluminum Vinyl Packing Bag Kitting ‘A’ Kitting ‘B’ Kitting ‘B’ Outer Box Kitting ‘A’ Kitting ‘B’ Note: "★" can be Nominal CCT code. A B A B A B A B A B LED Kitting ‘B’ (back Side) B A B Kitting ‘B’ (Back Side) H W L
c) Aluminum Vinyl Packing Bag c) Silica Gel & Humidity Indicator Card inside Aluminum Vinyl Bag (This image is for reference only. Silica gel and humidity indicator shapes may be different.) AZRASL SPMWHD32AMD5XAR0S0 AZRASL 00 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAEC4001 / I001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
- Precautions in Handling & Use 1) For over-current protection, users are recommended to apply resistors connected in series with the LEDs to mitigate sudden change of the forward current caused by shift of forward voltage. 2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the device. 3) When the device is in operation, the forward current should be carefully determined considering the maximum ambient temperature and corresponding junction temperature. 4) LEDs must be stored in a clean environment. Shelf life of sealed bags is 12 months at temperature 0~40 ºC, 0~90 % RH. 5) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be: a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH*Note 1, or b. Mounted within 24 hours (1 day) at an assembly line with a condition of more than 30 ºC / 70 % RH*Note 2, or c. Stored at <10 % RH. *Note 1, 2: IPC/JEDEC J-STD-033A, Recommended Equivalent Total Floor Life Table 6) Repack unused devices with anti-moisture packing, fold to close any opening and then store in a dry place. 7) Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC. 8) Devices must be baked for 10~24 hours at 60 ± 5 ºC, if baking is required. 9) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 10) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical properties of materials used in luminaires and they must be carefully selected. 11) Risk of sulfurization (or tarnishing) The LED from Samsung uses a silver-plated lead frame and its surface color may change to black (or dark colored) when it is exposed to sulfur (S), chlorine (Cl) or other halogen compound. Sulfurization of lead frame may cause intensity degradation, change of chromaticity coordinates and, in extreme cases, open circuit. It requires caution. Due to possible sulfurization of lead frame, LED should not be used and stored together with oxidizing substances made of materials such as rubber, plain paper, lead solder cream, etc.
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