LC9949G

LC9949G SANYO | Alldatasheet

Document overview

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Technical content

Features

• Effective number of pixels (total pixels): 384H · 492V (410H · 500V)
• Number of optical black pixels: Horizontal direction: Front: 5 pixels Back: 21 pixels Vertical direction: Front: 5 pixels Back: 3 pixels
• Dummy bits: Horizontal direction: 4 pixels
• Horizontal resolution: 280 TV lines
• Supports miniature, compact camera designs.
• Package: 20-pin half-pitch transparent DIP
• Horizontal shift register: 5 V drive
• Supports variable-speed electronic shutter operation Device Structure
• 1/6" type frame transfer CCD image sensor
• Unit cell size: 6.5 µm (H) · 3.8 µm (V)
• Chip size: 3.79 mm (H) · 4.44 mm (V)
• Parallel gate CCD sensor
• Built-in high-sensitivity output amplifier Specifications Absolute Maximum Ratings at Ta = 25°C Package Dimensions unit: mm 3218 Preliminary [LC9949G] Parameter Symbol Conditions Ratings Unit VDD VPW = 0 V –0.3 to +18 V VGG VPW = 0 V –0.3 to +5 V Maximum supply voltage NSUB-PW –0.3 to +50 V NSUB - ø1 to ø4, –0.3 to +55 VøS1 to øS4: Horizontal clock pin øR V PW = 0 V –0.3 to +18 V Other clock pins V PW = 0 V –15 to +18 V Other pins V PW = 0 V –0.3 to +10 V Operating temperature Topr –10 to +60 °C Storage temperature Tstg –30 to +80 °C

No. 5217-2/10 LC9949G

No. 5217-3/10 LC9949G Pin No. Symbol Function Pin No. Symbol Function

1 NSUB N-substrate 20 NSUB N-substrate

2 VPW P-well 19 øS4

3 ø4 18 øS1 Storage area clock 4 ø3 Image clock 17 øS2 5 ø2 16 øS3 6 ø1 15 øH1 Horizontal clock 7 øR Reset gate 14 øH2

8 VDD Supply voltage 13 VOG CCD output gate

9 VOUT CCD output 12 VGG Load gate

10 NSUB N-substrate 11 NSUB N-substrate

Note: 1. Design applications so that this level never exceeds the substrate pulse low level VLSUB. 2. These are high-impedance inputs. DC Characteristics DC operating current Note: VP: pulse amplitude VL: low level Figure 3 Pulse Waveform No. 5217-5/10 LC9949G Parameter Symbol Conditions min typ max Unit P-well VPW 0 V Output circuit voltage VDD *1 14.5 15.0 15.5 V VGG *2 0.5 0.8 1.1 V OG bias VOG *2 4.5 5.0 5.5 V Parameter Symbol Conditions min typ max Unit DC operating current IDD 0.5 1.5 2.5 mA Symbol tWH tWL tr tf Conditions Unit typ typ typ typ ø1 167 99 6.5 6.5 ø2 146 120 6.5 6.5 During frame drive ns ø3 167 99 6.5 6.5 When the frame shift frequency is 3.58 MHz ø4 146 120 6.5 6.5 øS1 146 120 6.5 6.5 øS2 146 120 6.5 6.5 During frame drive ns øS3 146 120 6.5 6.5 When the frame shift frequency is 3.58 MHz øS4 146 120 6.5 6.5 øS1 1.36 62.1 30 30 øS2 1.36 62.1 30 30 The values enclosed in dark lines are in µs units and apply ns øS3 62.1 1.36 30 30 during 1H line transfers. øS4 62.1 1.36 30 30 øR 29 104 3.5 3.5 Reset pulse øH1 67 67 3 3 During horizontal transfers ns øH2 67 67 3 3

Note: * When the frame shift frequency is 3.58 MHz and the storage time is 1/60 second Test Procedures The Sanyo evaluation board must be used for the following tests. 1. Sensitivity Use a CCV31F pattern box (manufactured by Dai Nippon Printing Co., Ltd.) set up at a brightness of 1300 NT and color temperature of 3100°K with no pattern. Image the pattern box with an HF16A lens (manufactured by Fujinon) with a 1 mm thick C-500 IR cut filter in front of that lens. Set the lens f-stop to f11 and set the lens to be 50 cm from the pattern box. Measure the CCD output signal from the center of the image with this setup. 2. Uniformity of Output Signal Measure under the following conditions.

• Standard drive conditions (See the specifications document.)
• Use a 3200°K color temperature halogen lamp as the light source.
• Use a 1 mm thick C-500 IR cut filter. Set the CCD surface illumination to 7 lux, and divide the image into 45 areas as shown in Figure 4. Measure the average value for each block, and determine the maximum, minimum, and mean of those values. Determine the ratio of the range of the block average values to the mean of the block average values. VF = Figure 4 3. Saturated Signal Saturate the output signal by removing the lens in the test setup for item 1. Measure the CCD output signal from the center of the image in this state. maximum block average value – minimum block average value mean block average value No. 5217-6/10 LC9949G Parameter Symbol Test method Conditions min typ max Unit Sensitivity S 1 110 mV Video signal imbalance VF 2 15 % Saturated signal Vsat 3 500 mV Smear SM 4 * 0.04 % Dark signal Vdrk 5 55°C 7 mV Gamma characteristics g 1 —

CCD B/W Camera Block Diagram Figure 7 Block Descriptions No. 5217-8/10 LC9949G OSC Generates the reference frequency for synchronization signal and timing pulse generation: 14.318 MHz Generates the pulses required for video signal processing (SYNC, blanking, and other signals) and the Timing pulse generation IC pulses required for CCD drive. Includes a built-in CCD horizontal driver circuit. Provides an electronic iris function Driver IC Amplifies the above pulses to their stipulated amplitudes to drive the CCD element. Level shift circuit Level shift of driving pulse Signal-processing IC Video signal processing, including sample and hold, clamp, AGC, gamma correction, white clipping, and pedestal addition.

Notes on Mounting and Handling 1. Preventing Electrostatic Discharge (ESD) Since CCD sensors are easily destroyed by ESD, the antistatic measures described below should be employed when handling this device.

• All tools and personnel must be grounded when handling CCDs. Note that a 1 MΩ resistor should be inserted in series between personnel and ground for safety. (We recommend using wrist straps for personnel grounding.)
• Personnel should handle CCD devices with either bare hands or antistatic gloves. Use antistatic materials for work garments. Personnel should wear conductive shoes.
• Lay conductive mats on the floor and benches in the workplace so that static charges do not accumulate.
• We recommend using ionized air blowers (or other static removal techniques) when handling CCD sensors.
• Use antistatic boxes when transporting boards that have CCD sensors mounted on them.
• Do not leave packing materials or fittings made from plastic materials (such as Styrofoam) that easily collect static charges on or near workplace tables.
• Ground all tools, test equipment, conveyors, soldering irons, and other objects used in the workplace. Inspect grounding regularly to assure that it is complete.
• Do not handle this IC in the vicinity of TV monitors or other equipment that generates high static voltages. If unavoidable, install antistatic filters in front of monitor screens and take all other possible antistatic measures.
• Static charges accumulate easily in workplaces with a low relative humidity. Manufacturing operations should be carried out in an environment with a relative humidity of at least 50%. 2. Soldering
• The CCD package temperature must not exceed 80°C.
• Since CCD sensors are sensitive to thermal stress as well as ESD, the soldering iron temperature should be under 300°C. Aim for a soldering time of 2 seconds per pin.
• Use soldering irons that include an adjustable temperature control function that holds the soldering iron tip at a constant temperature.
• Be especially careful to assure that the device package temperature does not exceed 80°C when repairing or redoing solder joints or when removing CCD sensors from printed circuit boards. 3. Soiling and Contamination Prevention
• CCD sensors should be handled in a clean workplace. (A class 1000 level is appropriate.)
• Do not touch the package surface and do not allow any object to contact the package surface. Use compressed air to remove any foreign objects (such as dust) that land on the package surface. (We recommend using an ionized air blower if possible.)
• Use a cotton swab dipped in ethyl alcohol to remove oily contamination, being especially careful not to scratch the package surface.
• Use special-purpose cases to prevent soiling and contamination. Warm or cool CCD sensors in advance to prevent condensation when transporting between rooms with radically differing temperatures.
• For CCD sensors that are shipped with protective tape applied, only remove that tape immediately prior to use in an environment in which ESD prevention measures have been fully implemented. Do not reuse protective tape that has been removed from a CCD sensor. 4. Storage
• Do not allow sunlight or other bright light to fall on CCD sensors for extended periods.
• Since harsh conditions such as high temperatures or high humidities can adversely influence device characteristics, do not use or store these devices in environments with such conditions. Samples should be stored in places where the temperature and humidity fall in normal ranges, i.e., 5 to 35°C and 45 to 75% RH.
• Since CCD sensors are precision optical components, they should not be subjected to mechanical shocks.
• Avoid locations with corrosive atmospheres or high dust levels.
• Avoid locations subject to rapid temperature changes.
• Do not place heavy objects on top of boxes containing CCD sensors during storage.
• Use materials that cannot accumulate static charges for containers used to hold samples.
• Do not subject magazines holding CCD sensors to mechanical shocks, since this could adversely influence reliability during mounting due to pin bending and other problems. No. 5217-9/10 LC9949G

PS No. 5217-10/10 LC9949G 5. Notes on Mounting

• Flare can occur if a lens with an optical size larger than 1/5" is used. Consult your Sanyo sales representative in advance when selecting lenses.
• This product is mounted in a fully transparent plastic package, and is easily influenced by light that passes through the mounting board from the back to the front. Design end-products to adequately block out extraneous light. 6. Shipping
• Do not drop or throw packages containing CCD sensors.
• Do not allow packages containing CCD sensors to become wet due to rain or snow.
• Protect packages containing CCD sensors from mechanical shock and vibration as much as possible during shipping. This catalog provides information as of February, 1996. Specifications and information herein are subject to change without notice. n No products described or contained herein are intended for use in surgical implants, life-support systems, aerospace equipment, nuclear power control systems, vehicles, disaster/crime-prevention equipment and the like, the failure of which may directly or indirectly cause injury, death or property loss. n Anyone purchasing any products described or contained herein for an above-mentioned use shall: À Accept full responsibility and indemnify and defend SANYO ELECTRIC CO., LTD., its affiliates, subsidiaries and distributors and all their officers and employees, jointly and severally, against any and all claims and litigation and all damages, cost and expenses associated with such use: \` Not impose any responsibility for any fault or negligence which may be cited in any such claim or litigation on SANYO ELECTRIC CO., LTD., its affiliates, subsidiaries and distributors or any of their officers and employees jointly or severally. n Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for volume production. SANYO believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties.