LC895125Q SANYO | Alldatasheet
Document overview
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Technical content
Features
- On-chip SCSI interface (with built-in SCAM selection register)
- Supports 8· playback - Using ·16 80-ns DRAMs
- Supports 4· playback - Using ·16 80-ns DRAMs or ·8 70-ns DRAMs
- Transfer rates: 10 MB/s (synchronous), 5 MB/s (asynchronous) using ·16 80-ns DRAMs*1
- Transfer rates: 8.467 MB/s (synchronous), 4.2336 MB/s (asynchronous) using ·8 70-ns DRAMs*2
- Supports the connection of up to 32 Mb of buffer RAM (using DRAM)
- The user can freely set the CD main channel, C2 flag, and other areas in buffer RAM.
- Batch transfer function (transfers the CD main channel and C2 flag data in a single operation)
- Multi-block transfer function (automatically transfers multiple blocks in a single operation)
- High-speed transfer mode supports a 10-MB/s (synchronous) transfer rate using ·8 80-ns DRAMs
- Subcode ECC function Note: 1. For speeds up to 8· speed, use a SCSI master clock frequency of 20 MHz. Note: 2. For speeds up to 4· speed, use a SCSI master clock frequency of 16.9344 MHz. Package Dimensions unit: mm 3182-QIP128E unit: mm 3214-SQFP144 Preliminary SANYO: QIP128E [LC895125Q] SANYO: SQFP144 [LC895125W] LC895125Q, 895125W SANYO Electric Co.,Ltd. Semiconductor Bussiness Headquarters TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-0005 JAPAN CD-ROM Driver with On-Chip SCSI Interface and Subcode Functions CMOS LSI Specifications Absolute Maximum Ratings at VSS = 0 V Parameter Symbol Conditions Ratings Unit Maximum supply voltage V DD max Ta = 25°C –0.3 to +7.0 V I/O voltages V I, VO Ta = 25°C –0.3 to V DD + 0.3 V Allowable power dissipation Pd max Ta ≤ 70°C 450 mW Operating temperature Topr –30 to +70 °C Storage temperature Tstg –55 to +125 °C Soldering heat resistance (pins only) 10 seconds 260 °C
Allowable Operating Ranges at Ta = –30 to +70°C, VSS = 0 V DC Characteristics at VSS = 0 V, VDD = 4.5 to 5.5 V, Ta = –30 to +70°C SCSI Pin Input Characteristics Sample Recommended Oscillator Circuit R1 = 120 kΩ R2 = 47 Ω C1 = 30 pF Crystal oscillator frequencies: XTALCK0 = 16.9344 MH Z and XTALCK1 = 20 MHz or: R1 = 3.3 kΩ R2 = None C1 = 5 pF Crystal oscillator frequency: XTALCK0 = 33.8688 MHz If third harmonic overtones appear when using a 33.8688 MHz frequency with the recommended circuit example, consult with the manufacturer of the crystal element, since detailed values of the circuit constants will be influenced by the printed circuit board. No. 5241-2/11 LC895125Q, 895125W Parameter Symbol Applicable Pins* (See below) min typ max Unit Input high level voltage VIH1 All input pins other than (1), (3), and XTALCK 2.2 V Input low level voltage VIL1 0.8 V Input high level voltage VIH2 RESET, IO0 to IO15, D0 to D7, RD, CS, WR, WFCK, 2.5 V Input low level voltage VIL2 SBSO, SCOR (1) 0.6 V Input high level voltage VIH3 Input pins (3), ACK, and ATN 2.0 V Input low level voltage VIL3 0.8 V Output high level voltage VOH 1 IOH 1 = –2 mA: All output pins except (2), (3), 2.4 Vand XTALCK, IO0 to IO15, and D0 to D7 Output low level voltage VOL 1 IOL 1 = 2 mA: All output pins except (2), (3), 0.4 Vand XTALCK, IO0 to IO15, and D0 to D7 Output low level voltage VOL 2 IOL 2 = 2 mA: INT1, INT0, and ZSWAIT 0.4 V(open-drain outputs with pull-up resistors) (2) Output low level voltage VOL 3 IOL 3 = 48 mA: DB0, to DB7, DBP, BSY, I/O, MSG, 0.4 VSEL, RST, REQ, C/D (3) Input leakage current IL VI= VSS , VDD : All input pins –25 +25 µA Pull-up resistance R UP IO0 to IO15, D0 to D7, INT0, INT1, ZSWAIT 40 80 160 kΩ Parameter Symbol Conditions min typ max Unit Supply voltage VDD 4.5 5.0 5.5 V Input voltage range VIN 0 VDD V Parameter Symbol Conditions min typ max Unit Input threshold voltage Vt + t1 VDD = 4.5 to 5.5 V 1.60 2.00 V Vt – t1 0.80 1.11 V Hysteresis width ∆Vtt1 VDD = 5.0 V 0.41 0.49 V
Note: 1. WFCK, SBSO, SCOR 2. BCK, SDATA, LRCK, C2PO 3. DB0 to DB7, DBP, BSY, MSG, SEL, RST, REQ, I/O, C/D 4. ACK, ATN 5. ZRD, ZWR, SUA0 to SUA6, ZCS, CSCTRL 6. D0 to D7 7. IO0 to IO15 8. RA0 to RA16, ZRAS0, ZRAS1, ZCAS0, ZCAS1, ZOE, ZUWE, ZLWE Note: IO8 to IO15 and RA9 to RA16 are the same pins. No. 5241-3/11 LC895125Q, 895125W
Pin Functions (LC895125Q) Type: I: Input pin, O: Output pin, B: Bidirectional pin, P: Power supply pin, NC: No connection pin Note: 1. NC pins must be left open. Do not connect any signal to these pins. 2. Pin names that start with Z are negative-logic signals. 3. VSS0 is the logic system ground and VSS1 is the SCSI interface ground. 4. Applications that use DRAM must insert resistors in the CAS and RAS lines, connect capacitors between these lines and ground, and take any other measures necessary to prevent undershoot in the DRAM related circuits. 5. Since these circuits include buffers that sink 48 mA, adequate noise prevention measures must be applied. No. 5241-4/11 LC895125Q, 895125W Pin No. Symbol Type Function
1 VDD P
2 VSS0 P
3 RA5 O
4 RA6 O
Address outputs for the buffer RAM
5 RA7 O
6 RA8 O
7 RA9 (IO15) B Address outputs for the buffer RAM or data I/O pins
8 RA10 (IO14) B The pin circuits include pull-up resistors.
9 VSS0 P
10 RA11 (IO13) B
11 RA12 (IO12) B
12 RA13 (IO11) B Address outputs for the buffer RAM or data I/O pins
13 RA14 (IO10) B The pin circuits include pull-up resistors.
14 RA15 (IO9) B
15 RA16 (IO8) B
16 IO7 B Buffer RAM data I/O. The pin circuit includes a pull-up resistor.
17 VSS0 P
18 IO6 B
19 IO5 B
20 IO4 B
Buffer RAM data I/O.21 IO3 B The pin circuits include pull-up resistors.
22 IO2 B
23 IO1 B
24 IO0 B
25 VSS0 P
26 TEST0 I
27 TEST1 I
28 TEST2 I Test pins. These pins must be connected to VSS0 .
29 TEST3 I
30 TEST4 I
31 ZRESET I LSI reset. The LSI is reset on a 0 input.
32 VDD P
33 VSS0 P
34 CSCTRL I Selects active-high or active-low for the microcontroller CS logic.
35 XTALCK0 I Crystal oscillator input
36 XTAL0 O Crystal oscillator output
37 VSS0 P
38 D0 B
39 D1 B
40 D2 B
41 D3 B
Microcontroller data signals
42 D4 B
43 D5 B
44 D6 B
45 D7 B
46 VSS0 P
47 ZSWAIT O WAIT signal output to the microcontroller
48 ZINT0 O Interrupt request output to the microcontroller (ECC side. Set with a register.)
49 VDD P
50 ZINT1 O Interrupt request output to the microcontroller (SCSI side. Set with a register.) Continued on next page.
Continued from preceding page. Type: I: Input pin, O: Output pin, B: Bidirectional pin, P: Power supply pin, NC: No connection pin Note: 1. NC pins must be left open. Do not connect any signal to these pins. 2. Pin names that start with Z are negative-logic signals. 3. VSS0 is the logic system ground and VSS1 is the SCSI interface ground. 4. Applications that use DRAM must insert resistors in the CAS and RAS lines, connect capacitors between these lines and ground, and take any other measures necessary to prevent undershoot in the DRAM related circuits. 5. Since these circuits include buffers that sink 48 mA, adequate noise prevention measures must be applied. No. 5241-5/11 LC895125Q, 895125W Pin No. Symbol Type Function
51 ZRD I Microcontroller data read signal input
52 ZWR I Microcontroller data write signal input
53 ZCS I Register chip select signal from the microcontroller
54 SUA0 I
55 SUA1 I
56 SUA2 I
57 SUA3 I Microcontroller register selection signals
58 SUA4 I
59 SUA5 I
60 SUA6 I
61 VSS0 P
62 X1EN I Selection pin that must be set to 1 when XTALCK1 is used. 63 XTALCK1 I SCSI block oscillator circuit input. Selected by X1EN. 64 XTAL1 O SCSI block oscillator circuit output.
65 VDD P
66 VSS1 P
67 DB0 B
68 DB1 B
69 VSS1 P
70 DB2 B
71 DB3 B
72 VDD P
73 VSS1 P
74 DB4 B
75 DB5 B
76 VSS1 P
77 DB6 B
78 DB7 B
79 VSS1 P
80 DBP B SCSI connection
81 VSS1 P
82 ATN B SCSI connection
83 VDD P
84 BSY B
85 ACK B
86 VSS1 P
87 RST B
88 MSG B
89 VDD P
90 SEL B
91 C/D B
92 VSS1 P
93 REQ B
94 I/O B
95 VSS1 P
96 VDD P
97 VSS0 P
99 VSS0 P
100 VSS0 P
Continued on next page.
Continued from preceding page. Type: I: Input pin, O: Output pin, B: Bidirectional pin, P: Power supply pin, NC: No connection pin Note: 1. NC pins must be left open. Do not connect any signal to these pins. 2. Pin names that start with Z are negative-logic signals. 3. VSS0 is the logic system ground and VSS1 is the SCSI interface ground. 4. Applications that use DRAM must insert resistors in the CAS and RAS lines, connect capacitors between these lines and ground, and take any other measures necessary to prevent undershoot in the DRAM related circuits. 5. Since these circuits include buffers that sink 48 mA, adequate noise prevention measures must be applied. No. 5241-6/11 LC895125Q, 895125W Pin No. Symbol Type Function
101 VSS0 P
104 C2PO I
105 SDATA I
106 BCK I
107 LRCK I
108 MCK O Outputs the XTALCK0 frequency, or that frequency divided by 2.
109 VSS0 P
110 EXCK O
111 WFCK I Subcode I/O
112 SBSO I
113 VDD P
114 SCOR I Subcode I/O
115 VSS0 P
116 ZRAS0 O Buffer RAM RAS signal output pin 0 (Normally, pin 0 is used)
117 ZRAS1 O Buffer RAM RAS signal output pin 1
118 ZCAS0 O Buffer RAM CAS signal output pin 0 (Normally, pin 0 is used)
119 ZCAS1 O Buffer RAM CAS signal output pin 1
120 ZOE O Buffer RAM output enable
121 ZUWE O Buffer RAM upper write enable
122 ZLWE O Buffer RAM lower write enable
123 VSS0 P
124 RA0 O
125 RA1 O
126 RA2 O Buffer RAM address signal outputs
127 RA3 O
128 RA4 O
Pin Functions (LC895125W) Type: I: Input pin, O: Output pin, B: Bidirectional pin, P: Power supply pin, NC: No connection pin Note: 1. NC pins must be left open. Do not connect any signal to these pins. 2. Pin names that start with Z are negative-logic signals. 3. VSS0 is the logic system ground and VSS1 is the SCSI interface ground. 4. Applications that use DRAM must insert resistors in the CAS and RAS lines, connect capacitors between these lines and ground, and take any other measures necessary to prevent undershoot in the DRAM related circuits. 5. Since these circuits include buffers that sink 48 mA, adequate noise prevention measures must be applied. No. 5241-7/11 LC895125Q, 895125W Pin No. Symbol Type Function
1 VSS0 P
2 VDD P
3 VSS0 P
4 RA5 O
5 RA6 O
Buffer RAM address signal outputs
6 RA7 O
7 RA8 O
8 RA9 (IO15) B Address outputs for the buffer RAM or data I/O pins
9 RA10 (IO14) B The pin circuits include pull-up resistors.
10 VSS0 P
11 RA11 (IO13) B
12 RA12 (IO12) B
13 RA13 (IO11) B Address outputs for the buffer RAM or data I/O pins
14 RA14 (IO10) B The pin circuits include pull-up resistors.
15 RA15 (IO9) B
16 RA16 (IO8) B
17 IO7 B Buffer RAM data I/O. The pin circuit includes a pull-up resistor.
18 VDD P
19 VSS0 P
21 IO6 B
22 IO5 B
23 IO4 B
Buffer RAM data I/O.24 IO3 B The pin circuit includes a pull-up resistor.
25 IO2 B
26 IO1 B
27 IO0 B
28 VSS0 P
29 TEST0 I
30 TEST1 I
31 TEST2 I Test pins. These pins must be connected to VSS0 .
32 TEST3 I
33 TEST4 I
34 ZRESET I LSI reset. The LSI is reset on a 0 input.
35 VDD P
36 VSS0 P
37 VDD P
38 VSS0 P
39 CSCTRL I Selects active-high or active-low for the microcontroller CS logic.
40 XTALCK0 I Crystal oscillator input
41 XTAL0 O Crystal oscillator output
42 VSS0 P
43 D0 B
44 D1 B
45 D2 B
46 D3 B
Microcontroller data signals
47 D4 B
48 D5 B
49 D6 B
50 D7 B
Continued on next page.
Continued from preceding page. Type: I: Input pin, O: Output pin, B: Bidirectional pin, P: Power supply pin, NC: No connection pin Note: 1. NC pins must be left open. Do not connect any signal to these pins. 2. Pin names that start with Z are negative-logic signals. 3. VSS0 is the logic system ground and VSS1 is the SCSI interface ground. 4. Applications that use DRAM must insert resistors in the CAS and RAS lines, connect capacitors between these lines and ground, and take any other measures necessary to prevent undershoot in the DRAM related circuits. 5. Since these circuits include buffers that sink 48 mA, adequate noise prevention measures must be applied. No. 5241-8/11 LC895125Q, 895125W Pin No. Symbol Type Function
51 VSS0 P
52 ZSWAIT O WAIT signal output to the microcontroller
53 ZINT0 O Interrupt request output to the microcontroller (ECC side. Set with a register.)
54 VDD P
55 VSS0 P
56 ZINT1 O Interrupt request output to the microcontroller (SCSI side. Set with a register.)
57 ZRD I Microcontroller data read signal input
59 ZWR I Microcontroller data write signal input
60 ZCS I Input for the register chip select signal from the microcontroller
61 SUA0 I
62 SUA1 I
63 SUA2 I
64 SUA3 I Microcontroller register selection signals
65 SUA4 I
66 SUA5 I
67 SUA6 I
68 VSS0 P
69 X1EN I Selection pin that must be set to 1 when XTALCK1 is used
70 XTALCK1 I SCSI block oscillator circuit input. Selected by X1EN.
71 XTAL1 O SCSI block oscillator circuit output
72 VSS0 P
73 VDD P
74 VSS1 P
75 DB0 B
76 DB1 B
77 VSS1 P
78 DB2 B
79 DB3 B
81 VDD P
82 VSS1 P
83 DB4 B
84 DB5 B
85 VSS1 P
86 DB6 B
87 DB7 B
88 VSS1 P
89 DBP B SCSI connection
90 VDD P
91 VSS1 P
93 ATN B SCSI connection
94 VDD P
95 BSY B
96 ACK B
97 VSS1 P
98 RST B
99 MSG B
100 VDD P
Continued on next page.
Continued from preceding page. Type: I: Input pin, O: Output pin, B: Bidirectional pin, P: Power supply pin, NC: No connection pin Note: 1. NC pins must be left open. Do not connect any signal to these pins. 2. Pin names that start with Z are negative-logic signals. 3. VSS0 is the logic system ground and VSS1 is the SCSI interface ground. 4. Applications that use DRAM must insert resistors in the CAS and RAS lines, connect capacitors between these lines and ground, and take any other measures necessary to prevent undershoot in the DRAM related circuits. 5. Since these circuits include buffers that sink 48 mA, adequate noise prevention measures must be applied. No. 5241-9/11 LC895125Q, 895125W Pin No. Symbol Type Function
101 SEL B
102 C/D B
103 VSS1 P
104 REQ B
105 I/O B
106 VSS1 P
107 VDD P
108 VSS0 P
109 VDD P
110 VSS0 P
112 VSS0 P
113 VSS0 P
114 VSS0 P
117 C2PO I
118 SDATA I
119 BCK I
120 LRCK I
121 MCK O Outputs the XTALCK0 frequency, or that frequency divided by 2.
122 VSS0 P
123 EXCK O
124 WFCK I Subcode I/O
125 SBSO I
126 VDD P
127 VSS0 P
128 SCOR I Subcode I/O
129 VSS0 P
131 ZRAS0 O Buffer RAM RAS signal output pin 0 (Normally, pin 0 is used)
132 ZRAS1 O Buffer RAM RAS signal output pin 1
133 ZCAS0 O Buffer RAM CAS signal output pin 0 (Normally, pin 0 is used)
134 ZCAS1 O Buffer RAM CAS signal output pin 1
135 ZOE O Buffer RAM output enable
136 ZUWE O Buffer RAM upper write enable
137 ZLWE O Buffer RAM lower write enable
138 VSS0 P
139 RA0 O
140 RA1 O
141 RA2 O Buffer RAM address signal outputs
142 RA3 O
143 RA4 O
144 VDD P
- SCSI Pins
- BSY, ACK, MSG, SEL, REQ, ATN, I/O, C/D (input and output) SCSI bus control pins.
- DB0 to DB7, DBPB (input and output) These are the SCSI data bus pins. 2. Microcontroller Interface Pins
- ZCS (input) Microcontroller chip select line
- CSCTRL (input) Microcontroller chip select logic selection signal High - ZCS is an active low signal. Low - ZCS is an active high signal.
- ZRD, ZWR, SUA0 to SUA6 (input) Microcontroller interface control signal The SUA0 to SUA6 pins are used for addressing.
- ZSWAIT (output) When the microcontroller accesses RAM, it must wait if this pin is low. This is a built-in pull-up resistor open-drain output.
- D7 to D0 (input and output) Microcontroller data bus. Pull-up resistors are built in.
- ZINT0, ZINT1 (output) Interrupt request output to the microcontroller. A SCSI-side interrupt can be output from ZINT1 by setting the C register (bit 7 in R11). This is a built-in pull-up resistor open-drain output. 3. Buffer RAM Pins
- IO0 to IO15 (input and output) Buffer RAM data bus. Pull-up resistors are built in. The IO8 to IO15 pins have shared functions as the RA9 to RA16 pins. This means that 16-bit PSRAM cannot be used.
- RA0 to RA16 (output) Buffer RAM address lines. RA9 to RA16 have shared functions as the IO8 to IO15 pins. This means that 16-bit PSRAM cannot be used.
- ZRAS0, ZRAS1, (ZCS0), (ZCS1) (output) Buffer DRAM RAS outputs. Normally, ZRAS0 is used. However, when two 1-MB (64k · 16-bit) DRAM chips are used, the respective DRAM RAS pins are connected to ZRAS0 and ZRAS1. Connected to the CS pin if PSRAM is used.
- ZCAS0, ZCAS1 (output) Buffer DRAM CAS outputs. Normally, ZCAS0 is used. However, when two 1-MB (64k · 16-bit) DRAM chips are used, the respective DRAM CAS pins are connected to ZCAS0.
- ZOE (output) Buffer RAM read output signal
- ZUWE, ZLWE (output) Buffer RAM write output signals. Connected to the corresponding pins on the RAM chip. Leave ZUWE open if an 8-bit RAM is used. 4. Subcode Interface Pins
- EXCK, WFCK, SBSO, SCOR (input and output) Subcode interface pins. Connecting a CD DSP using these pins allows the LC895125 to read in subcode data and transfer it to the host. No. 5241-10/11 LC895125Q, 895125W
PS No. 5241-11/11 LC895125Q, 895125W This catalog provides information as of February, 1996. Specifications and information herein are subject to change without notice. n No products described or contained herein are intended for use in surgical implants, life-support systems, aerospace equipment, nuclear power control systems, vehicles, disaster/crime-prevention equipment and the like, the failure of which may directly or indirectly cause injury, death or property loss. n Anyone purchasing any products described or contained herein for an above-mentioned use shall: À Accept full responsibility and indemnify and defend SANYO ELECTRIC CO., LTD., its affiliates, subsidiaries and distributors and all their officers and employees, jointly and severally, against any and all claims and litigation and all damages, cost and expenses associated with such use: \` Not impose any responsibility for any fault or negligence which may be cited in any such claim or litigation on SANYO ELECTRIC CO., LTD., its affiliates, subsidiaries and distributors or any of their officers and employees jointly or severally. n Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for volume production. SANYO believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties. 5. CD DSP Data Pins
- BCK, SDATA, LRCK, C2PO (input) The LC895125 reads in CD-ROM data over these pins connected to a CD DSP. C2PO is the C2 flag pin. 6. Other Pins
- ZRESET (input) Reset input to the LC895125. The LC895125 is reset by a low-level input. This pin must be held low for a period of at least 1 µs when power is first applied.
- XTALCK0, XTAL0 The main clock for the ECC and SCSI blocks. These pins support frequencies from 16.9344 to 25 MHz. When a double-frequency input is used, these pins accept frequencies up to 38 MHz. Use a double-frequency input when a ceramic oscillator and DRAM are used. (This is because the internal clock must have a 50% duty.) An external clock may input to the XTALCK pin. The SCSI block main clock can also be provided from XTALCK1 and XTAL1 if so specified by the setting of X1EN (pin 89).
- XTALCK1, XTAL1 The main clock for the ECC and SCSI blocks. These pins are enabled for oscillator operation by setting X1EN (pin 89). The LC895125 is designed so that the ECC and SCSI blocks can also be operated asynchronously. This means that precise 10-MB/s synchronous transfers can be achieved by providing a 20-MHz input to XTALCK1 and XTAL1. A ceramic oscillator may be used here since only the rising edge of this signal is used. In applications that do not use these pins, XTALCK1 must be tied to V SS and XTAL1 must be left open.
- X1EN (input) Set this pin to 1 to us use XTALCK1 and XTAL1 for the SCSI block main clock. Set this pin to 0 to drive both the ECC and SCSI blocks from XTALCK0 and XTAL0.
- MCK (output) Outputs either the XTALCK0 frequency or that frequency divided by 2. This pin’s output can also be stopped if desired.