LC87F1M16A SANYO | Alldatasheet

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Technical content

Features

„Flash ROM

  • Capable of on-board programming with a wide range of supply voltages: 3.0 to 5.5V
  • Block-erasable in 128 byte units
  • Writes data in 2-byte units
  • 16384 × 8 bits „RAM
  • 1024 × 9 bits „Bus Cycle Time
  • 83.3ns (When CF=12MHz) Note: The bus cycle time here refers to the ROM read speed. CMOS IC 16K-byte FROM and 1024-byte RAM integrated 8-bit 1-chip Microcontroller with Full-Speed USB * This product is licensed from Silicon Storage Technology, Inc. (USA), and manufactured and sold by SANYO Semiconductor Co., Ltd. Specifications of any and all SANYO Semiconductor Co.,L td. products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer's products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer 'sp r o d u c t so r equipment. Any and all SANYO Semiconductor Co.,Ltd. products described or contained herein are, with regard to "standard application", intended for the use as general el ectronics equipment (home appliances, AV equipment, communication device, office equipment, industrial equipment etc.). The products mentioned herein shall not be intended for use for any "special application" (medica l equipment whose purpose is to sustain life, aerospace instrument, nuclear control device, burning appliances, t ransportation machine, traffic signal system, safety equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives in case of failure or malfunction of the product or may cause har m to human bodies, nor shall they grant any guarantee thereof. If you should intend to use our products for app lications outside the standard applications of our customer who is considering such use and/or outside the scope of our intended standard applications, please consult with us prior to the intended use. If there is n o consultation or inquiry before the intended use, our customer shall be solely responsible for the use.

No.A1909-2/32 „Minimum Instruction Cycle Time (tCYC)

  • 250ns (When CF=12MHz) „Ports
  • I/O ports Ports whose I/O direction can be designated in 1-bit units 35 (P00 to P07, P10 to P17, P20 to P27, P31 to P34, P70 to P73, PWM0, PWM1, XT2)
  • USB ports 2 (D+, D-)
  • Dedicated oscillator ports 2 (CF1, CF2)
  • Input-only port (also used for oscillation) 1 (XT1)
  • Reset pins 1 ( RES)
  • Dedicated debugger port 1 (OWP0)
  • Power supply pins 6 (V SS1 to 3, VDD1 to 3) „Timers
  • Timer 0: 16-bit timer/counter with 2 capture registers. Mode 0: 8-bit timer with an 8-bit programmable prescaler (with two 8-bit capture registers) × 2 channels Mode 1: 8-bit timer with an 8-bit programmable prescaler (with two 8-bit capture registers) + 8-bit counter (with two 8-bit capture registers) Mode 2: 16-bit timer with an 8-bit programmable prescaler (with two 16-bit capture registers) Mode 3: 16-bit counter (with two 16-bit capture registers)
  • Timer 1: 16-bit timer/counter that supports PWM/toggle outputs Mode 0: 8-bit timer with an 8-bit prescaler (with toggle outputs) + 8-bit timer/ counter with an 8-bit prescaler (with toggle outputs) Mode 1: 8-bit PWM with an 8-bit prescaler × 2 channels Mode 2: 16-bit timer/counter with an 8-bit prescaler (with toggle outputs) (toggle outputs also possible from lower-order 8 bits) Mode 3: 16-bit timer with an 8-bit prescaler (with toggle outputs) (lower-order 8 bits may be used as a PWM output)
  • Timer 4: 8-bit timer with a 6-bit prescaler
  • Timer 5: 8-bit timer with a 6-bit prescaler
  • Timer 6: 8-bit timer with a 6-bit prescaler (with toggle outputs)
  • Timer 7: 8-bit timer with a 6-bit prescaler (with toggle outputs)
  • Base timer (1) The clock is selectable from the subclock (32.768kHz crystal oscillation), system clock, and timer 0 prescaler output. (2) Interrupts programmable in 5 different time schemes „SIO
  • SIO0: Synchronous serial interface (1) LSB first/MSB first mode selectable (2) Transfer clock cycle: 4/3 to 512/3 tCYC (3) Automatic continuous data transmission (1 to 256 bits, specifiable in 1-bit units) (Suspension and resumption of data transmission possible in 1 byte units)
  • SIO1: 8-bit asynchronous/synchronous serial interface Mode 0: Synchronous 8-bit serial I/O (2- or 3-wire configuration, 2 to 512 tCYC transfer clocks) Mode 1: Asynchronous serial I/O (half-duplex, 8 data bits, 1 stop bit, 8 to 2048 tCYC baudrates) Mode 2: Bus mode 1 (start bit, 8 data bits, 2 to 512 tCYC transfer clocks) Mode 3: Bus mode 2 (start detect, 8 data bits, stop detect)
  • SIO4: Synchronous serial interface (1) LSB first/MSB first mode selectable (2) Transfer clock cycle: 4/3 to 1020/3 tCYC (3) Automatic continuous data transmission (1 to 1024 bytes, specifiable in 1 byte units, suspension and resumption of data transmission possible in 1 byte or 2 bytes units) (4) Clock polarity selectable (5) CRC16 calculator circuit built in

No.A1909-3/32 „Full Duplex UART

  • UART1 (1) Data length : 7/8/9 bits selectable (2) Stop bits : 1 bit (2 bits in continuous transmission mode) (3) Baud rate : 16/3 to 8192/3 tCYC
  • SCUART (1) Data length : 7/8 bits selectable (2) Stop bits : 1/2 bits selectable (3) Parity bits : None/even parity/odd parity (4) Baud rate : 8/3 to 8192/3 tCYC (5) LSB first/MSB first mode delectable (6) Smartcard interface function „AD Converter: 12 bits × 20 channels
  • 12-/8-bit resolution selectable AD converter „PWM: Multifrequency 12-bit PWM × 2 channels „USB Interface (function controller) (1) Compliant with USB 2.0 Full-Speed (2) Supports a maximum of 6 user-defined endpoints. Endpoint EP0 EP1 EP2 EP3 EP4 EP5 EP6 Control { - - - - - - Transfer Type Max. payload 64 64 64 64 64 64 64 „Watchdog Timer
  • Internal counter watchdog timer (1) Generates an internal reset on an overflow occurring in the timer running on the low-speed RC oscillator clock (approx. 30kHz) or subclock. (2) Operating mode at HALT/HOLD mode is selectable from 3 modes (continue counting/suspend operation/suspend counting with the count value retained) „Clock Output Function (1) Can output a clock with a clock rate of 1/1, 1/2, 1/4, 1/8, 1/16, 1/32, or 1/64 of the source oscillator clock selected as the system clock. (2) Can output the source oscillation clock for the subclock.

No.A1909-4/32 „Interrupts

  • 35 sources, 10 vector addresses (1) Provides three levels (low (L), high (H), and highest (X)) of multiplex interrupt control. Any interrupt requests of the level equal to or lower than the current interrupt are not accepted. (2) When interrupt requests to two or more vector addresses occur at the same time, the interrupt of the highest level takes precedence over the other interrupts. For interrupts of the same level, the interrupt into the smallest vector address takes precedence. No. Vector Address Level Interrupt Source 1 00003H X or L INT0 2 0000BH X or L INT1 3 00013H H or L INT2/T0L/ INT4/USB bus active 4 0001BH H or L INT3/INT5/base timer 5 00023H H or L T0H/INT6 6 0002BH H or L T1L/T1H/INT7 7 00033H H or L SIO0/USB bus reset/USB suspend/UART1 receive complete/ SCUART receive complete 8 0003BH H or L SIO1/USB endpoint/USB-SOF/SIO4/ UART1 buffer empty/UART1 transmit complete/ SCUART buffer empty/SCUART transmit complete 9 00043H H or L ADC/T6/T7 10 0004BH H or L Port 0/PWM0/PWM1/T4/T5
  • Priority levels X > H > L
  • Of interrupts of the same level, the one with the smallest vector address takes precedence. „Subroutine Stack Levels: 512 levels maximum (The stack is allocated in RAM.) „High-speed Multiplication/Division Instructions
  • 16 bits × 8 bits ( 5 tCYC execution time)
  • 24 bits × 16 bits (12 tCYC execution time)
  • 16 bits ÷ 8 bits ( 8 tCYC execution time)
  • 24 bits ÷ 16 bits (12 tCYC execution time) „Oscillation and PLL Circuits
  • RC oscillation circuit (internal) : For system clock (approx. 1MHz)
  • Low-speed RC oscillation circuit (internal) : For watchdog timer (approx. 30kHz)
  • CF oscillation circuit : For system clock
  • Crystal oscillation circuit : For system clock, time-of-day clock
  • PLL circuit (internal) : For USB interface (see Fig.5) „Internal Reset Circuit
  • Power-on reset (POR) function (1) POR reset is generated only at power-on time. (2) The POR release level can be selected from 4 levels (2.57V, 2.87V, 3.86V and 4.35V) through option configuration.
  • Low-voltage detection reset (LVD) function (1) LVD and POR functions are combined to generate resets when power is turned on and when power voltage falls below a certain level. (2) The use/disuse of the LVD function and the voltage threshold level can be selected from 3 levels (2.81V, 3.79V and 4.28V) through option configuration.

No.A1909-5/32 „Standby Function

  • HALT mode: Halts instruction execution while allowing the peripheral circuits to continue operation. (1) Oscillation is not halted automatically. (2) There are three ways of resetting the HOLD mode. 1) Setting the reset pin to the lower level 2) Having the watchdog timer or LVD function generate a reset 3) Having an interrupt generated
  • HOLD mode: Suspends instruction execution and the operation of the peripheral circuits. (1) The PLL base clock generator, CF, RC and crystal oscillators automatically stop operation. Note: The low-speed RC oscillator is controlled directly by the watchdog timer; its oscillation in the standby mode is also controlled by the watchdog timer. (2) There are five ways of resetting the HOLD mode. 1) Setting the reset pin to the lower level 2) Having the watchdog timer or LVD function generate a reset 3) Having an interrupt source established at one of the INT0, INT1, INT2, INT4 or INT5 pins * INT0 and INT1 HOLD mode reset is available only when level detection is set. 4) Having an interrupt source established at port 0 5) Having an bus active interrupt source established in the USB interface circuit
  • X'tal HOLD mode: Suspends instruction execution and the operation of the peripheral circuits except the base timer. (1) The PLL base clock generator, CF and RC oscillator automatically stop operation. Note: The low-speed RC oscillator is controlled directly by the watchdog timer; its oscillation in the standby mode is also controlled by the watchdog timer. (2) The state of crystal oscillation established when the X'tal HOLD mode is entered is retained. (3) There are six ways of resetting the X'tal HOLD mode. 1) Setting the reset pin to the low level 2) Having the watchdog timer or LVD function generate a reset 3) Having an interrupt source established at either INT0, INT1, INT2, INT4 or INT5 * INT0 and INT1 HOLD mode reset is available only when level detection is set. 4) Having an interrupt source established at port 0 5) Having an interrupt source established in the base timer circuit 6) Having an bus active interrupt source established in the USB interface circuit „Package Form
  • SQFP48 (7×7): Lead-/Halogen-free type „Development Tools
  • On-chip debugger: TCB87 type-C (one wire communication cable) + LC87F1M16A

No.A1909-6/32 „Flash ROM Programming Boards Package Programming boards SQFP48(7×7) W87F55256SQ „Flash Programmer Maker Model Supported version Device Flash Support Group, Inc. (FSG) Single Programmer AF9709/AF9709B/AF9709C (Including Ando Electric Co., Ltd. models) Rev 03.32 or later 87F016JU AF9101/AF9103(Main unit) (FSG models) Flash Support Group, Inc. (FSG) Sanyo (Note 1) Onboard Single/Gang Programmer SIB87(Inter Face Driver) (Sanyo model) (Note 2) LC87F1M16A Single/Gang Programmer SKK/SKK Type B (SanyoFWS) Sanyo Onboard Single/Gang Programmer SKK-DBG Type C (SanyoFWS) Application Version 1.06 or later Chip Data Version 2.31 or later LC87F1M16 For information about AF-Series: Flash Support Group, Inc. TEL: +81-53-459-1050 E-mail: sales@j-fsg.co.jp Note1: On-board-programmer from FSG (AF9101/AF9103) and serial interface driver from SANYO (SIB87) together can give a PC-less, standalone on-board-programming capabilities. Note2: It needs a special programming devices and applications depending on the use of programming environment. Please ask FSG or SANYO for the information.

No.A1909-7/32 Package Dimensions unit : mm (typ) 3163B Pin Assignment SANYO: SQFP48(7×7) “Lead-/Halogen-free Type” SANYO : SQFP48(7X7) 7.0 7.0 9.0 9.0 0.15 0.5 (1.5)0.1 1.7max 0.180.5 (0.75) 11 2 2536 VDD3 VSS3 P34/UFILT P33 P32/SCRX P31/SCTX OWP0 P70/INT0/T0LCP/DPUP P71/INT1/T0HCP P72/INT2/T0IN P03/AN3 P02/AN2/TDN2 P01/AN1/TDP1 P00/AN0/TDN1 VSS2 VDD2 PWM0/AN9/TDP0 PWM1/AN8/TDN0 P17/T1PWMH/BUZ P16/T1PWML P15/SCK1 P14/SI1/SB1 LC87F1M16A Top view P27/INT5/AN19/DPUP2 P26/INT5/AN18 P25/INT5/AN17 P24/INT5/INT7/AN16/SCK4 P23/INT4/AN15/SI4 P22/INT4/AN14/SO4 P21/INT4/AN13/URX1 P20/INT4/INT6/AN12/UTX1 P07/AN7/T7O P06/AN6/T6O P05/AN5/CKO P04/AN4 P73/INT3/T0IN RES XT1/AN10 XT2/AN11 VSS1 CF1 CF2 VDD1 P10/SO0 P11/SI0/SB0 P12/SCK0 P13/SO1

No.A1909-8/32 SQFP48 NAME SQFP48 NAME

1 P73/INT3/T0IN 25 P04/AN4

2 RES 26 P05/AN5/CKO

3 XT1/AN10 27 P06/AN6/T6O

4 XT2/AN11 28 P07/AN7/T7O

5 V SS1 29 P20/INT4/INT6/AN12/UTX1

6 CF1 30 P21/INT4/AN13/URX1

7 CF2 31 P22/INT4/AN14/SO4

8 V DD1 32 P23/INT4/AN15/SI4

9 P10/SO0 33 P24/INT5/INT7/AN16/SCK4

10 P11/SI0/SB0 34 P25/INT5/AN17

11 P12/SCK0 35 P26/INT5/AN18

12 P13/SO1 36 P27/INT5/AN19/DPUP2

13 P14/SI1/SB1 37 D-

14 P15/SCK1 38 D+

15 P16/T1PWML 39 V DD3

16 P17/T1PWMH/BUZ 40 V SS3

17 PWM1/AN8/TDN0 41 P34/UFILT

18 PWM0/AN9/TDP0 42 P33

19 V DD2 43 P32/SCRX

20 V SS2 44 P31/SCTX

21 P00/AN0/TDN1 45 OWP0

22 P01/AN1/TDP1 46 P70/INT0/T0LCP/DPUP

23 P02/AN2/TDN2 47 P71/INT1/T0HCP

24 P03/AN3

48 P72/INT2/T0IN

No.A1909-9/32 System Block Diagram Interrupt control FROM Standby control Clock generator CF X’tal RC IR PLA PC Bus interface Port 0 Port 1 ACC B register C register ALU PSW RAR RAM Stack pointer Watchdog timer Base timer Timer 4 PWM1 INT0 to INT7 Noise filter SIO0 Port 2 USB PLL Port 7 Port 3 ADC SIO1 Timer 0 Timer 1 PWM0 Timer 5 Timer 6 Timer 7 UART1 On-chip debugger USB interface SIO4 SCUART High current driver

No.A1909-10/32 Pin Description Pin Name I/O Description Option VSS1,VSS2, VSS3 - - Power supply No VDD1, VDD2 - + Power supply No VDD3 - USB reference voltage Yes Port 0 P00 to P07 I/O • 8-bit I/O ports

  • I/O specifiable in 1-bit units
  • Pull-up resistors can be turned on and off in 1-bit units
  • HOLD reset input
  • Port 0 interrupt input
  • Pin functions AD converter input ports: AN0 to AN7(P00 to P07) P00: High current Nch driver(TDN1) P01: High current Pch driver(TDP1) P02: High current Nch driver(TDN2) P05: System clock output P06: Timer 6 toggle output P07: Timer 7 toggle output Yes Port 1 P10 to P17 I/O • 8-bit I/O port
  • I/O specifiable in 1-bit units
  • Pull-up resistors can be turned on and off in 1-bit units
  • Pin functions P10: SIO0 data output P11: SIO0 data input/bus I/O P12: SIO0 clock I/O P13: SIO1 data output P14: SIO1 data input/bus I/O P15: SIO1 clock I/O P16: Timer 1 PWML output P17: Timer 1 PWMH output/beeper output Yes Port 2 • 8-bit I/O ports
  • I/O specifiable in 1-bit units
  • Pull-up resistors can be turned on and off in 1-bit units
  • Pin functions AD converter input ports: AN12 to AN19(P20 to P27) P20 to P23: INT4 input/HOLD reset input/timer 1 event input/timer 0L capture input/ timer 0H capture input P24 to P27: INT5 input/HOLD reset input/timer 1 event input/timer 0L capture input/ timer 0H capture input P20: INT6 input/timer 0L capture 1 input/UART1 transmit P21: UART1 receive P22: SIO4 date I/O P23: SIO4 date I/O P24: INT7 input/timer 0H capture 1 input/SIO4 clock I/O P27: D+ 1.5kΩ pull-up resistor connect pin Interrupt acknowledge types Rising Falling Rising & Falling H level L level INT4 enable enable enable disable disable INT5 enable enable enable disable disable INT6 enable enable enable disable disable INT7 enable enable enable disable disable P20 to P27 I/O Yes Port 3 P31 to P34 I/O • 4-bit I/O ports
  • I/O specifiable in 1-bit units
  • Pull-up resistors can be turned on and off in 1-bit units
  • Pin functions P31: SCUART transmit P32: SCUART receive P34: USB interface PLL filter pin (see Fig. 5.) Yes Continued on next page.

No.A1909-11/32 Continued from preceding page. Pin Name I/O Description Option Port 7 • 4-bit I/O port

  • I/O specifiable in 1-bit units
  • Pull-up resistors can be turned on and off in 1-bit units
  • Pin functions P70: INT0 input/HOLD reset input/timer 0L capture input/ D+ 1.5kΩ pull-up resistor connect pin P71: INT1 input/HOLD reset input/timer 0H capture input P72: INT2 input/HOLD reset input/timer 0 event input/timer 0L capture input/ high speed clock counter input P73: INT3 input (input with noise filter)/timer 0 event input/timer 0H capture input Interrupt acknowledge types Rising Falling Rising & Falling H level L level INT0 enable enable disable enable enable INT1 enable enable disable enable enable INT2 enable enable enable disable disable INT3 enable enable enable disable disable P70 to P73 I/O No PWM0 PWM1 I/O • PWM0, PWM1 output port
  • Pin functions General-purpose input ports AD converter input ports: AN8(PWM1), AN9(PWM0) PWM0: High current Pch driver(TDP0) PWM1: High current Nch driver(TDN0) No D- I/O • USB data I/O pin D-
  • General-purpose I/O port No D+ I/O • USB data I/O pin D+
  • General-purpose I/O port No RES Input External reset input/internal reset output pin No XT1 Input • 32.768kHz crystal oscillator input
  • Pin functions General-purpose input port AD converter input ports: AN10 No XT2 I/O • 32.768kHz crystal oscillator output
  • Pin functions General-purpose I/O AD converter input port: AN11 No CF1 Input Ceramic resonator input No CF2 Output Ceramic resonator output No OWP0 I/O Dedicated debugger port No

No.A1909-12/32 On-chip Debugger Pin Connection Requirements For the treatment of the on-chip debugger pins, refer to the separately available documents entitled “Rd87 On-chip Debugger Installation Manual” Recommended Unused Pin Connections Recommended Unused Pin Connections Port Name Board Software P00 to P07 Open Output low P10 to P17 Open Output low P20 to P27 Open Output low P31 to P34 Open Output low P70 to P73 Open Output low PWM0, PWM1 Open Output low D+, D- Open Output low XT1 Pulled low with a 100k Ω resistor or less - XT2 Open Output low OWP0 Pulled low with a 100k Ω resistor - Note: P34 and UFILT share the same pin, so if USB function is used, the pin must be set to input mode. Port Output Types The table below lists the types of port outputs and the presence/absence of a pull-up resistor. Data can be read into any input port even if it is in the output mode. Port Name Option selected in units of Option type Output type Pull-up resistor

1 CMOS Programmable P00 to P07

2 Nch-open drain Programmable

P70 - No Nch-open drain Programmable P71 to P73 - No CMOS Programmable PWM0, PWM1 - No CMOS No D+, D- - No CMOS No XT1 - No Input only No XT2 - No 32.768kHz crystal resonator output (N channel open drain when in general-purpose output mode) No

No.A1909-13/32 User Option Table Option Name Option Type Flash Version Opti on Selected in Units of Option Selection CMOS P00 to P07 enable 1 bit Nch-open drain CMOS P10 to P17 enable 1 bit Nch-open drain CMOS P20 to P27 enable 1 bit Nch-open drain CMOS Port output form P31 to P34 enable 1 bit Nch-open drain 00000h Program start address - enable - 03E00h USE USB Regulator enable - NONUSE USE USB Regulator (at HOLD mode) enable - NONUSE USE USB Regulator USB Regulator (at HALT mode) enable - NONUSE ENABLE Main clock 8MHz selection - enable - DISABLE Enable: Use Detect function enable - Disable: Not Used Low-voltage detection reset function Detect level enable - 3-level Power-on reset function Power-On reset level enable - 4-level

No.A1909-14/32 USB Reference Power Option When a voltage 4.5 to 5.5V is supplied to VDD1 and the internal USB reference voltage circuit is activated, the reference voltage for USB port output is generated. The active/inactive state of the reference voltage circuit can be switched by option select. The procedure for marking the option selection is described below. (1) (2) (3) (4) USB regulator USE USE USE NONUSE USB regulator at HOLD mode USE NONUSE NONUSE NONUSE Option settings USB regulator at HALT mode USE NONUSE USE NONUSE Normal mode active active active inactive HOLD mode active inactive inactive inactive Reference voltage circuit state HALT mode active inactive active inactive

  • When the USB reference voltage circuit is made inactive, the level of the reference voltage for USB port output is equal to VDD1.
  • Selection (2) or (3) can be used to set the reference voltage circuit inactive in HOLD or HALT mode.
  • When the reference voltage circuit is activated, the current drain increases by approximately 100μA compared with when the reference voltage circuit is inactive. Example 1: VDD1=VDD2=3.3V
  • Inactivating the reference voltage circuit (selection (4)).
  • Connecting VDD3 to VDD1 and VDD2. Example 2: VDD1=VDD2=5.0V
  • Activating the reference voltage circuit (selection (1)).
  • Isolating VDD3 from VDD1 and VDD2, and connecting capacitor between VDD3 and VSS. VSS1 VSS2 VSS3 VDD1 VDD2 VDD3 Power supply 3.3V LSI UFILT To USB connector 27 to 33Ω 5pF 2.2μF 1.5kΩ P70/P27 2.2μF VSS1 VSS2 VSS3 VDD1 VDD2 VDD3 Power supply LSI UFILT 2.2μF To USB connector27 to 33Ω 5pF 1.5kΩ P70/P27 2.2μF 0.1µF

No.A1909-15/32 Specification Parameter Symbol Pin/Remarks Conditions VDD[V] min typ max unit Maximum supply voltage VDD max V DD1, VDD2, VDD3 V DD1= VDD2= VDD3 -0.3 +6.5 Input voltage V I(1) XT1, CF1, RES -0.3 V DD+0.3 Input/output voltage VIO(1) Ports 0, 1, 2, 3, 7 PWM0, PWM1 XT2 -0.3 V DD+0.3 V IOPH(1) P00, P02 to P07 Ports 1, 2

  • When CMOS output type is selected
  • Per 1 applicable pin -10 IOPH(2) PWM1 Per 1 applicable pin -20 IOPH(3) PWM0(TDP0) P01(TDP1)
  • When CMOS output type is selected
  • Per 1 applicable pin -50 Peak output current IOPH(4) Port 3 P71 to P73
  • When CMOS output type is selected
  • Per 1 applicable pin IOMH(1) P00, P02 to P07 Ports 1, 2
  • When CMOS output type is selected
  • Per 1 applicable pin -7.5 IOMH(2) PWM1 Per 1 applicable pin -15 IOMH(3) PWM0(TDP0) P01(TDP1)
  • When CMOS output type is selected
  • Per 1 applicable pin -30 Average output current (Note 1-1) IOMH(4) Port 3 P71 to P73
  • When CMOS output type is selected
  • Per 1 applicable pin ΣIOAH(1) P00, P02 to P07 Ports 2 Total current of all applicable pins -25 ΣIOAH(2) Port 1 PWM1 Total current of all applicable pins -25 ΣIOAH(3) PWM0(TDP0) P01(TDP1) Total current of all applicable pins -50 ΣIOAH(4) Ports 0, 1, 2 PWM0, PWM1 Total current of all applicable pins -100 ΣIOAH(5) Port 3 P71 to P73 Total current of all applicable pins -10 High level output current Total output current ΣIOAH(6) D+, D- Total current of all applicable pins -25 mA Note 1-1: The average output current is an average of current values measured over 100ms intervals. Continued on next page.

No.A1909-16/32 Continued from preceding page. Specification Parameter Symbol Pin/Remarks Conditions VDD[V] min typ max unit IOPL(1) P03 to P07 Ports 1, 2 PWM0 Per 1 applicable pin IOPL(2) P01 Per 1 applicable pin 30 IOPL(3) PWM1(TDN0) P00(TDN1) P02(TDN2) Per 1 applicable pin Peak output current IOPL(4) Ports 3, 7 XT2 Per 1 applicable pin 10 IOML(1) P03 to P07 Ports 1, 2 PWM0 Per 1 applicable pin IOML(2) P01 Per 1 applicable pin 20 IOML(3) PWM1(TDN0) P00(TDN1) P02(TDN2) Per 1 applicable pin Average output current (Note 1-1) IOML(4) Ports 3, 7 XT2 Per 1 applicable pin 7.5 ΣIOAL(1) P01, P03 to P07 Ports 2 Total current of all applicable pins 45 ΣIOAL(2) Port 1 PWM0 Total current of all applicable pins 45 ΣIOAL(3) PWM1(TDN0) P00(TDN1) P02(TDN2) Total current of all applicable pins 50 ΣIOAL(4) Ports 0, 1, 2 PWM0, PWM1 Total current of all applicable pins 140 ΣIOAL(5) Ports 3, 7 XT2 Total current of all applicable pins 15 Low level output current Total output current ΣIOAL(6) D+, D- Total current of all applicable pins 25 mA Ta=-30 to +70°C 190Allowable power Dissipation Pd max SQFP48(7 ×7) Ta=-40 to +85°C 140 mW Operating ambient Temperature Topr -40 +85 Storage ambient temperature Tstg -55 +125 Note 1-1: The average output current is an average of current values measured over 100ms intervals.

No.A1909-17/32 Allowable Operating Conditions at Ta = -40°C to +85°C, VSS1 = VSS2 = VSS3 = 0V Specification Parameter Symbol Pin/Remarks Conditions VDD[V] min typ max unit 0.245μs ≤ tCYC ≤ 200μs 3.0 5.5 0.490μs ≤ tCYC ≤ 200μs Except in onboard programming mode 2.7 5.5 Operating supply voltage (Note 2-1) VDD(1) V DD1=VDD2=VDD3 0.245μs ≤ CYC ≤ 0.383μs USB circuit active 3.0 5.5 Memory sustaining supply voltage VHD V DD1=VDD2=VDD3 RAM and register contents sustained in HOLD mode. 2.0 5.5 VIH(1) Port 0, 1, 2, 3, 7 PWM0, PWM1 2.7 to 5.5 0.3VDD +0.7 V DD High level input voltage VIH(2) XT1, XT2, CF1, RES 2.7 to 5.5 0.75V DD V DD VIL(1) 4.0 to 5.5 V SS 0.1VDD +0.4 VIL(2) Port 1, 2, 3, 7 2.7 to 4.0 V SS 0.2V DD VIL(3) 4.0 to 5.5 V SS 0.15VDD +0.4 VIL(4) Port 0 PWM0, PWM1 2.7 to 4.0 V SS 0.2V DD Low level input voltage VIL(5) XT1, XT2, CF1, RES 2.7 to 5.5 V SS 0.25V DD V 3.0 to 5.5 0.245 200 Except for onboard programming mode 2.7 to 5.5 0.490 200 Instruction cycle time (Note 2-2) tCYC USB circuit active 3.0 to 5.5 0.245 0.383 μs

  • CF2 pin open
  • System clock frequency division ratio=1/1
  • External system clock duty =50±5% 3.0 to 5.5 0.1 12 External system clock frequency FEXCF(1) CF1
  • CF2 pin open
  • System clock frequency division ratio=1/1
  • External system clock duty =50±5% 2.7 to 5.5 0.1 6 MHzFmCF CF1, CF2 When 12M Hz ceramic oscillation See Fig. 1. 3.0 to 5.5 12 MHz FmSLRC Internal low-speed RC oscillation 2.7 to 5.5 15 30 60 Oscillation frequency range (Note 2-3) FsX’tal XT1, XT2 32.768kHz crystal oscillation kHz Note 2-1: VDD must be held greater than or equal to 3.0V in the flash ROM onboard programming mode. Note 2-2: Relationship between tCYC and oscillation frequency is 3/FmCF at a division ratio of 1/1 and 6/FmCF at a division ratio of 1/2. Note 2-3: See Tables 1 and 2 for the oscillation constants.

No.A1909-18/32 Specification Parameter Symbol Pin/Remarks Conditions VDD[V] min typ max unit IIH(1) Ports 0, 1, 2, 3, 7 RES PWM0, PWM1 D+, D- Output disabled Pull-up resistor off VIN=VDD (Including output Tr's off leakage current) 2.7 to 5.5 1 IIH(2) XT1, XT2 Input port configuration VIN=VDD 2.7 to 5.5 1 High level input current IIH(3) CF1 V IN=VDD 2.7 to 5.5 15 IIL(1) Ports 0, 1, 2, 3, 7 RES PWM0, PWM1 D+, D- Output disabled Pull-up resistor off VIN=VSS (Including output Tr's off leakage current) 2.7 to 5.5 -1 IIL(2) XT1, XT2 Input port configuration VIN=VSS 2.7 to 5.5 -1 Low level input current IIL(3) CF1 V IN=VSS 2.7 to 5.5 -15 μA VOH(1) I OH=-1mA 4.5 to 5.5 V DD-1 VOH(2) I OH=-0.4mA 3.0 to 5.5 V DD-0.4 VOH(3) Ports 0, 1, 2, 3 P71 to P73 IOH=-0.2mA 2.7 to 5.5 V DD-0.4 VOH(4) I OH=-10mA 4.5 to 5.5 V DD-1.5 VOH(5) I OH=-1.6mA 3.0 to 5.5 V DD-0.4 VOH(6) PWM0, WM1 P05(CKO when using system clock output function) IOH=-1mA 2.7 to 5.5 V DD-0.4 High level output voltage VOH(7) PWM0, P01 (when using high current driver) IOH=-30mA 4.5 to 5.5 V DD-0.5 VDD-0.15 VOL(1) I OL=30mA 4.5 to 5.5 1.5 VOL(2) I OL=5mA 3.0 to 5.5 0.4 VOL(3) P00, P01 IOL=2.5mA 2.7 to 5.5 0.4 VOL(4) I OL=10mA 4.5 to 5.5 1.5 VOL(5) I OL=1.6mA 3.0 to 5.5 0.4 VOL(6) Ports 0, 1, 2 PWM0, PWM1 XT2 IOL=1mA 2.7 to 5.5 0.4 VOL(7) I OL=1.6mA 3.0 to 5.5 0.4 VOL(8) Ports 3, 7 IOL=1mA 2.7 to 5.5 0.4 Low level output voltage VOL(9) PWM1, P00, P02 (when using high current driver) IOL=30mA 4.5 to 5.5 0.15 0.5 V Rpu(1) 4.5 to 5.5 15 35 80Pull-up resistance Rpu(2) Ports 0, 1, 2, 3, 7 V OH=0.9VDD 2.7 to 5.5 18 50 150 kΩ Hysteresis voltage VHYS RES Port 1, 2, 3, 7 2.7 to 5.5 0.1VDD V Pin capacitance CP All pins For pins other than that under test: VIN=VSS f=1MHz Ta=25°C 2.7 to 5.5 10 pF

No.A1909-19/32 Serial I/O Characteristics at Ta = -40°C to +85°C, VSS1 = VSS2 = VSS3 = 0V 1. SIO0 Serial I/O Characteristics (Note 4-1-1) Specification Parameter Symbol Pin/ Remarks Conditions VDD[V] min typ max unit Frequency tSCK(1) Low level pulse width tSCKL(1) 1 tSCKH(1) See Fig. 8. tSCKHA(1a) • Continuous data transmission/ reception mode

  • USB nor SIO4 are not in use simultaneous.
  • See Fig. 8.
  • (Note 4-1-2) tSCKHA(1b) • Continuous data transmission/ reception mode
  • USB is in use simultaneous
  • SIO4 is not in use simultaneous.
  • See Fig. 8.
  • (Note 4-1-2) Input clock High level pulse width tSCKHA(1c) SCK0(P12)
  • Continuous data transmission/ reception mode
  • USB and SIO4 are in use simultaneous.
  • See Fig. 8.
  • (Note 4-1-2) 2.7 to 5.5 Frequency tSCK(2) tCYC Low level pulse width tSCKL(2) tSCKH(2)
  • CMOS output selected
  • See Fig. 8. tSCK tSCKHA(2a) • Continuous data transmission/ reception mode
  • USB nor SIO4 are not in use simultaneous.
  • CMOS output selected
  • See Fig. 8. tSCKH(2) +2tCYC tSCKH(2) +(10/3) tCYC tSCKHA(2b) • Continuous data transmission/ reception mode
  • USB is in use simultaneous
  • SIO4 is not in use simultaneous.
  • CMOS output selected
  • See Fig. 8. tSCKH(2) +2tCYC tSCKH(2) +(19/3) tCYC Serial clock Output clock High level pulse width tSCKHA(2c) SCK0(P12)
  • Continuous data transmission/ reception mode
  • USB and SIO4 are in use simultaneous.
  • CMOS output selected
  • See Fig. 8. 2.7 to 5.5 tSCKH(2) +2tCYC tSCKH(2) +(25/3) tCYC tCYC Note 4-1-1: These specifications are theoretical values. Add margin depending on its use. Note 4-1-2: To use serial-clock-input in continuous trans/rec mode, a time from SI0RUN being set when serial clock is "H" to the first negative edge of the serial clock must be longer than tSCKHA. Continued on next page.

No.A1909-20/32 Continued from preceding page. Specification Parameter Symbol Pin/ Remarks Conditions VDD[V] min typ max unit Data setup time tsDI(1) 0.03 Serial input Data hold time thDI(1) SB0(P11), SI0(P11)

  • Must be specified with respect to rising edge of SIOCLK.
  • See Fig. 8. 2.7 to 5.5 0.03 tdD0(1)
  • Continuous data transmission/ reception mode
  • (Note 4-1-3) (1/3)tCYC +0.05 Input clock tdD0(2)
  • Synchronous 8-bit mode
  • (Note 4-1-3) 1tCYC +0.05 Serial output Output clock Output delay time tdD0(3) SO0(P10), SB0(P11) (Note 4-1-3) 2.7 to 5.5 (1/3)tCYC +0.05 μs Note 4-1-3: Must be specified with respect to falling edge of SIOCLK. Must be specified as the time to the beginning of output state change in open drain output mode. See Fig. 8. 2. SIO1 Serial I/O Characteristics (Note 4-2-1) Specification Parameter Symbol Pin/ Remarks Conditions VDD[V] min typ max unit Frequency tSCK(3) Low level pulse width tSCKL(3) 1 Input clock High level pulse width tSCKH(3) SCK1(P15) See Fig. 8. 2.7 to 5.5 Frequency tSCK(4) tCYC Low level pulse width tSCKL(4) 1/2 Serial clock Output clock High level pulse width tSCKH(4) SCK1(P15) • When CMOS output type is selected
  • See Fig. 8. 2.7 to 5.5 tSCK Data setup time tsDI(2) (1/3)tCYC +0.01 Serial input Data hold time thDI(2) SB1(P14), SI1(P14)
  • Must be specified with respect to rising edge of SIOCLK.
  • See Fig. 8. 2.7 to 5.5 0.01 Serial output Output delay time tdD0(4) SO1(P13), SB1(P14)
  • Must be specified with respect to falling edge of SIOCLK.
  • Must be specified as the time to the beginning of output state change in open drain output mode.
  • See Fig. 8. 2.7 to 5.5 (1/2)tCYC +0.05 μs Note 4-2-1: These specifications are theoretical values. Add margin depending on its use.

No.A1909-21/32 3. SIO4 Serial I/O Characteristics (Note 4-3-1) Specification Parameter Symbol Pin/ Remarks Conditions VDD[V] min typ max unit Frequency tSCK(5) Low level pulse width tSCKL(5) 1 tSCKH(5) See Fig.8. tSCKHA(5a) • USB nor continuous data transmission/reception mode of SIO0 are not in use simultaneous.

  • See Fig.8.
  • (Note 4-3-2) tSCKHA(5b) • USB is in use simultaneous.
  • Do not use SIO0 continuous data transmission mode at the same time.
  • See Fig.8.
  • (Note 4-3-2) Input clock High level pulse width tSCKHA(5c) SCK4(P24)
  • USB and continuous data transmission/ reception mode of SIO0 are in use simultaneous.
  • See Fig.8.
  • (Note 4-3-2) 2.7 to 5.5 Frequency tSCK(6) tCYC Low level pulse width tSCKL(6) tSCKH(6)
  • CMOS output selected
  • See Fig.8 tSCK tSCKHA(6a) • USB nor continuous data transmission/reception mode of SIO0 are not in use simultaneous.
  • CMOS output selected
  • See Fig.8. tSCKH(6) +(5/3) tCYC tSCKH(6) +(10/3) tCYC tSCKHA(6b) • USB is in use simultaneous.
  • Do not use SIO0 continuous data transmission mode at the same time.
  • CMOS output selected
  • See Fig8. tSCKH(6) +(5/3) tCYC tSCKH(6) +(19/3) tCYC Serial clock Output clock High level pulse width tSCKHA(6c) SCK4(P24)
  • USB and continuous data transmission/reception mode of SIO0 are in use simultaneous.
  • CMOS output selected
  • See Fig.8. 2.7 to 5.5 tSCKH(6) +(5/3) tCYC tSCKH(6) +(28/3) tCYC tCYC Data setup time tsDI(3) 2.7 to 5.5 0.03 Serial input Data hold time thDI(3) SO4(P22), SI4(P23)
  • Must be specified with respect to rising edge of SIOCLK.
  • See Fig.8. 2.7 to 5.5 0.03 μs Note 4-3-1: These specifications are theoretical values. Add margin depending on its use. Note 4-3-2: To use serial-clock-input in continuous trans/rec mode, a time from SI4RUN being set when serial clock is "H" to the first negative edge of the serial clock must be longer than tSCKHA. Continued on next page.

No.A1909-22/32 Continued from preceding page. Specification Parameter Symbol Pin/ Remarks Conditions VDD[V] min typ max unit Serial output Output delay time tdD0(5) SO4(P22), SI4(P23)

  • Must be specified with respect to rising edge of SIOCLK.
  • Must be specified as the time to the beginning of output state change in open drain output mode.
  • See Fig.8. 2.7 to 5.5 (1/3)tCYC +0.05 μs Pulse Input Conditions at Ta = -40°C to +85°C, VSS1 = VSS2 = VSS3 = 0V Specification Parameter Symbol Pin/Remarks Conditions VDD[V] min typ max unit tP1H(1) tP1L(1) INT0(P70), INT1(P71), INT2(P72), INT4(P20 to P23), INT5(P24 to P27), INT6(P20), INT7(P24)
  • Interrupt source flag can be set.
  • Event inputs for timer 0 or 1 are enabled. 2.7 to 5.5 1 tPIH(2) tPIL(2) INT3(P73) when noise filter time constant is
  • Interrupt source flag can be set.
  • Event inputs for timer 0 are enabled. 2.7 to 5.5 2 tPIH(3) tPIL(3) INT3(P73) when noise filter time constant is
  • Interrupt source flag can be set.
  • Event inputs for timer 0 are nabled. 2.7 to 5.5 64 tPIH(4) tPIL(4) INT3(P73) when noise filter time constant is
  • Interrupt source flag can be set.
  • Event inputs for timer 0 are enabled. 2.7 to 5.5 256 tCYC High/low level pulse width tPIL(5) RES Resetting is enabled. 2.7 to 5.5 200 μs

No.A1909-23/32 AD Converter Characteristics at Ta = -40°C to +85°C, VSS1 = VSS2 = VSS3 = 0V <12-bits AD Converter Mode> Specification Parameter Symbol Pin/Remarks Conditions VDD[V] min typ max unit Resolution N 3.0 to 5.5 12 bit Absolute accuracy ET (Note 6-1) 3.0 to 5.5 ±16 LSB 4.5 to 5.5 32 115Conversion time TCAD See conversion time calculation formulas. (Note 6-2) 3.0 to 5.5 64 115 μs Analog input voltage range VAIN 3.0 to 5.5 V SS V DD V IAINH VAIN=V DD 3.0 to 5.5 1Analog port input current IAINL AN0(P00) to AN7(P07), AN8(PWM1), AN9(PWM0), AN10(XT1), AN11(XT2), AN12(P20) to AN19(P27) VAIN=VSS 3.0 to 5.5 -1 μA <8-bits AD Converter Mode> Specification Parameter Symbol Pin/Remarks Conditions VDD[V] min typ max unit Resolution N 3.0 to 5.5 8 bit Absolute accuracy ET (Note 6-1) 3.0 to 5.5 ±1.5 LSB 4.5 to 5.5 20 90Conversion time TCAD See conversion time calculation formulas. (Note 6-2) 3.0 to 5.5 40 90 μs Analog input voltage range VAIN 3.0 to 5.5 V SS V DD V IAINH VAIN=V DD 3.0 to 5.5 1Analog port input current IAINL AN0(P00) to AN7(P07), AN8(PWM1), AN9(PWM0), AN10(XT1), AN11(XT2), AN12(P20) to AN19(P27) VAIN=VSS 3.0 to 5.5 -1 μA Conversion time calculation formulas : 12-bits AD Converter Mode : TCAD (Conversion time) = ((52/(AD division ratio))+2) × (1/3) × tCYC 8-bits AD Converter Mode : TCAD (Conversion time) = ((32/(AD division ratio))+2) × (1/3) × tCYC <Recommended Operating Conditions> Conversion Time (TCAD)[μs] External oscillator FmCF[MHz] Supply Voltage Range VDD[V] System Clock Division (SYSDIV) Cycle Time tCYC [ns] AD Frequency Division Ratio (ADDIV) 12-bit AD 8-bit AD 4.0 to 5.5 1/1 250 1/8 34.8 21.5 3.0 to 5.5 1/1 250 1/16 69.5 42.8 Note 6-1: The quantization error (±1/2LSB) must be excluded from the absolute accuracy. The absolute accuracy must be measured in the microcontroller's state in which no I/O operations occur at the pins adjacent to the analog input channel. Note 6-2: The conversion time refers to the period from the time an instruction for starting a conversion process till the time the conversion results register(s) are loaded with a complete digital conversion value corresponding to the analog input value. The conversion time is 2 times the normal-time conversion time when:

  • The first AD conversion is performed in the 12-bit AD conversion mode after a system reset.
  • The first AD conversion is performed after the AD conversion mode is switched from 8-bit to 12-bit conversion mode.

No.A1909-24/32 Power-on Reset (POR) Characteristics at Ta = -40°C to +85°C, VSS1 = VSS2 = VSS3 = 0V Specification Parameter Symbol Conditions Option selected voltage min typ max unit 2.57V 2.45 2.57 2.69 2.87V 2.75 2.87 2.99 3.86V 3.73 3.86 3.99 POR release voltage PORRL Select from option (Note 7-1) 4.35V 4.21 4.35 4.49 Detection voltage unknown state POUKS See Fig.11 V Power supply rise time PORIS Power supply rise time from 0V to 1.6V 100 ms Note 7-1: The POR release level can be selected out of 4 levels only when the LVD reset function is disabled. Note 7-2: POR is in unknown state before transistor start operation. Low Voltage Detection Reset (LVD) Characteristics at Ta = -40°C to +85°C, VSS1 = VSS2 = VSS3 = 0V Specification Parameter Symbol Conditions Option selected voltage min typ max unit 2.81V 2.71 2.81 2.91 3.79V 3.69 3.79 3.89 LVD reset voltage (Note 8-2) LVDET 4.28V 4.18 4.28 4.38 V 2.81V 55 3.79V 60 LVD hysteresis width LVHYS Select from option See Fig.12 (Note 8-1) (Note 8-3) 4.28V 60 mV Detection voltage unknown state LVUKS See Fig.12 (Note 8-4) 0.7 0.95 V Low voltage detection minimum width (Reply sensitivity). TLVDW LVDET-0.5V See Fig.13 0.2 ms Note 8-1: The LVD reset level can be selected out of 3 levels only when the LVD reset function is enabled. Note 8-2: LVD reset voltage specification values do not include hysteresis voltage. Note 8-3: LVD reset voltage may exceed its specification values when port output state changes and and/or when a large current flows through port. Note 8-4: LVD is in unknown state before transistor start operation.

No.A1909-25/32 Consumption Current Characteristics at Ta = -40°C to +85°C, VSS1 = VSS2 = VSS3 = 0V Specification Parameter Symbol Pin/ Remarks Conditions VDD[V] min typ max unit IDDOP(1) 4.5 to 5.5 8.8 16 IDDOP(2)

  • FmCF=12MHz ceramic oscillation mode
  • FsX'tal=32.768kHz crystal oscillation mode
  • System clock set to 12MHz side
  • Internal PLL oscillation stopped
  • Internal RC oscillation stopped
  • USB circuit stopped
  • 1/1 frequency division ratio 3.0 to 3.6 5.1 9.2 IDDOP(3) 4.5 to 5.5 13 23 IDDOP(4)
  • FmCF=12MHz ceramic oscillation mode
  • FsX'tal=32.768kHz crystal oscillation mode
  • System clock set to 12MHz side
  • Internal PLL oscillation mode active
  • Internal RC oscillation stopped
  • USB circuit active
  • 1/1 frequency division ratio 3.0 to 3.6 7.0 13 IDDOP(5) 4.5 to 5.5 5.6 9.5 IDDOP(6) 3.0 to 3.6 3.6 6.0 IDDOP(7)
  • FmCF=12MHz ceramic oscillation mode
  • FsX'tal=32.768kHz crystal oscillation mode
  • System clock set to 6MHz side
  • Internal RC oscillation stopped
  • 1/2 frequency division ratio 2.7 to 3.0 3.0 4.8 IDDOP(8) 4.5 to 5.5 0.76 2.8 IDDOP(9) 3.0 to 3.6 0.43 1.5 IDDOP(10)
  • FmCF=0Hz(oscillation stopped)
  • FsX'tal=32.768kHz crystal oscillation mode
  • System clock set to internal RC oscillation
  • 1/2 frequency division ratio 2.7 to 3.0 0.36 1.2 mA IDDOP(11) 4.5 to 5.5 48 140 IDDOP(12) 3.0 to 3.6 18 55 Normal mode consumption current (Note 9-1) (Note 9-2) IDDOP(13)
  • FmCF=0Hz(oscillation stopped)
  • FsX'tal=32.768kHz crystal oscillation mode
  • System clock set to crystal oscillation. (32.768kHz)
  • Internal RC oscillation stopped
  • 1/2 frequency division ratio 2.7 to 3.0 14 40 μA IDDHALT(1) 4.5 to 5.5 4.3 7.6 IDDHALT(2)
  • HALT mode
  • FmCF=12MHz ceramic oscillation mode
  • FsX'tal=32.768kHz crystal oscillation mode
  • System clock set to 12MHz side
  • Internal PLL oscillation stopped
  • Internal RC oscillation stopped
  • USB circuit stopped
  • 1/1 frequency division ratio 3.0 to 3.6 2.2 4.0 IDDHALT(3) 4.5 to 5.5 8.1 15 IDDHALT(4)
  • HALT mode
  • FmCF=12MHz ceramic oscillation mode
  • FsX'tal=32.768kHz crystal oscillation mode
  • System clock set to 12MHz side
  • Internal PLL oscillation mode active
  • Internal RC oscillation stopped
  • USB circuit active
  • 1/1 frequency division ratio 3.0 to 3.6 4.2 7.5 IDDHALT(5) 4.5 to 5.5 2.7 4.8 IDDHALT(6) 3.0 to 3.6 1.3 2.4 IDDHALT(7)
  • HALT mode
  • FmCF=12MHz ceramic oscillation mode
  • FsX'tal=32.768kHz crystal oscillation mode
  • System clock set to 6MHz side
  • Internal RC oscillation stopped
  • 1/2 frequency division ratio 2.7 to 3.0 1.1 1.8 IDDHALT(8) 4.5 to 5.5 0.48 1.9 IDDHALT(9) 3.0 to 3.6 0.22 0.81 HALT mode consumption current (Note9-1) (Note9-2) IDDHALT(10) VDD1 =VDD2 =VDD3
  • HALT mode
  • FmCF=0Hz(oscillation stopped)
  • FsX'tal=32.768kHz crystal oscillation mode
  • System clock set to internal RC oscillation.
  • 1/2 frequency division ratio 2.7 to 3.0 0.17 0.57 mA Note 9-1: The consumption current value includes none of the currents that flow into the output transistors and internal pull-up resistors. Note9-2: Unless otherwise specified, the consumption current for the LVD circuits is not included. Continued on next page.

No.A1909-26/32 Continued from preceding page. Specification Parameter Symbol Pin/ Remarks Conditions VDD[V] min typ max unit IDDHALT(11) 4.5 to 5.5 35 120 IDDHALT(12) 3.0 to 3.6 9.5 39 HALT mode consumption current (Note 9-1) (Note 9-2) IDDHALT(13) VDD1 =VDD2 =VDD3

  • HALT mode
  • FmCF=0MHz (oscillation stopped)
  • FsX'tal=32.768kHz crystal oscillation mode
  • System clock set to crystal oscillation. (32.768kHz)
  • Internal RC oscillation stopped
  • 1/2 frequency division ratio 2.7 to 3.0 6.4 27 IDDHOLD(1) 4.5 to 5.5 0.08 24 IDDHOLD(2) 3.0 to 3.6 0.03 11 IDDHOLD(3)
  • HOLD mode
  • CF1=VDD or open (External clock mode) 2.7 to 3.0 0.02 9.6 IDDHOLD(4) 4.5 to 5.5 2.9 29 IDDHOLD(5) 3.0 to 3.6 2.2 15 IDDHOLD(6)
  • HOLD mode
  • LVD option selected
  • CF1=VDD or open (External clock mode) 2.7 to 3.0 2.1 12 IDDHOLD(7) 4.5 to 5.5 2.9 32 IDDHOLD(8) 3.0 to 3.6 1.4 16 HOLD mode consumption current (Note 9-1) (Note 9-2) IDDHOLD(9)
  • HOLD mode
  • Watchdog timer operation mode (internal low-speed RC oscillation circuit operation)
  • CF1=VDD or open (External clock mode) 2.7 to 3.0 1.2 14 IDDHOLD(10) 4.5 to 5.5 31 110 IDDHOLD(11) 3.0 to 3.6 7.0 34 Timer HOLD mode consumption current (Note 9-1) (Note 9-2) IDDHOLD(12) VDD1
  • Timer HOLD mode
  • CF1=VDD or open (External clock mode)
  • FsX’tal=32.768kHz crystal oscillation mode 2.7 to 3.0 4.3 22 μA Note 9-1: The consumption current value includes none of the currents that flow into the output transistors and internal pull-up resistors. Note9-2: Unless otherwise specified, the consumption current for the LVD circuits is not included. USB Characteristics and Timing at Ta = -40°C to +85°C, VSS1 = VSS2 = VSS3 = 0V Specification Parameter Symbol Conditions min typ max unit High level output V OH(USB) • 15kΩ±5% to GND 2.8 3.6 V Low level output V OL(USB) • 1.5kΩ±5% to 3.6V 0.0 0.3 V Output signal crossover voltage V CRS 1.3 2.0 V Differential input sensitivity V DI • ⏐(D+)-(D-)⏐ 0.2 V Differential input common mode range V CM 0.8 2.5 V High level input V IH(USB) 2.0 V Low level input V IL(USB) 0.8 V USB data rise time t R • RS=27 to 33Ω, CL=50pF
  • VDD3=3.0 to 3.6V 4 20 ns USB data fall time t F • RS=27 to 33Ω, CL=50pF
  • VDD3=3.0 to 3.6V 4 20 ns F-ROM Programming Characteristics at Ta = +10°C to +55°C, VSS1 = 0V Specification Parameter Symbol Pin/ Remarks Conditions VDD[V] min typ max unit Onboard programming current IDDFW(1) V DD1 • Excluding power dissipation in the microcontroller block 3.0 to 5.5 5 10 mA tFW(1) • Erase operation 20 30 ms Programming time tFW(2)
  • Write operation 3.0 to 5.5 40 60 μs

No.A1909-27/32 Characteristics of a Sample Main System Clock Oscillation Circuit Given below are the characteristics of a sample main system clock oscillation circuit that are measured using a SANYO-designated oscillation characteristics evaluation board and external components with circuit constant values with which the oscillator vendor confirmed normal and stable oscillation. Table 1 Characteristics of a Sample Main System Clock Oscillator Circuit with a Ceramic Oscillator at Ta = -40°C to +85°C Circuit Constant Oscillation Stabilization Time Nominal Frequency Vendor Name Oscillator Name [pF] [pF] Rd1 [Ω] Operating Voltage Range [V] typ [ms] max [ms] Remarks 12MHz MURATA CSTCE12M0GH5L**-R0 (33) (33) 470 3.0 to 5.5 0.1 0.5 C1 and C2 integrated SMD type The oscillation stabilization time refers to the time interval that is required for the oscillation to get stabilized in the following cases (see Figure 4):

  • Till the oscillation gets stabilized after VDD goes above the operating voltage lower limit.
  • Till the oscillation gets stabilized after the instruction for starting the main clock oscillation circuit is executed.
  • Till the oscillation gets stabilized after the HOLD mode is reset.
  • Till the oscillation gets stabilized after the X'tal HOLD mode is reset with CFSTOP (OCR register, bit 0) set to 0. Characteristics of a Sample Subsystem Clock Oscillator Circuit Given below are the characteristics of a sample subsystem clock oscillation circuit that are measured using a SANYO- designated oscillation characteristics evaluation board and external components with circuit constant values with which the oscillator vendor confirmed normal and stable oscillation. Table 2 Characteristics of a Sample Subsystem Clock Oscillator Circuit with a Crystal Oscillator Circuit Constant Oscillation Stabilization Time Nominal Frequency Vendor Name Oscillator Name [pF] [pF] Rf [Ω] Rd2 [Ω] Operating Voltage Range [V] typ [s] max [s] Remarks 32.768kHz EPSON TOYOCOM MC-306 18 18 OPEN 680k 2.7 to 5.5 1.1 3.0 Applicable CL value=12.5pF SMD type The oscillation stabilization time refers to the time interval that is required for the oscillation to get stabilized in the following cases (see Figure 4):
  • Till the oscillation gets stabilized after the instruction for starting the subclock oscillation circuit is executed.
  • Till the oscillation gets stabilized after the HOLD mode is reset with EXTOSC (OCR register, bit 6) set to 1. Note: The components that are involved in oscillation should be placed as close to the IC and to one another as possible because they are vulnerable to the influences of the circuit pattern. Figure 1 CF Oscillator Circuit Figure 2 Crystal Oscillator Circuit Rf Rd2 XT1 XT2 C4 X’talC3 Rd1 CF1 CF2 C2CFC1

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