LC7958NC SANYO | Alldatasheet

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Technical content

LC7958NC is a 64-bit constant current LED driver IC designed to directly drive LED head array. The output terminals for LED drive are arranged in 2-row staggered position of 80-mm pitch at one side. It enables drive of LED Array of 300-dpi in one side disposition, 600dpi in both sides disposition Features and Functions

  • Logic voltage (VDD): +5 V – 10 %
  • LED drive current (IOH): 5.0 mA (TYP)
  • Clock frequency (fc): 10 MHz
  • Output current control circuit built in
  • Mode switching function by the SEL pin
  • Chip size: 1.43 mm · 5.39 mm
  • Number of pads: 86
  • 64-bit shift register circuit
  • 64-bit latch circuit
  • Output driver on/off switching function
  • Constant current circuit
  • 64-bit p-channel open drain LED driver Any and all SANYO products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your SANYO representative nearest you before using any SANYO products described or contained herein in such applications. SANYO assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all SANYO products described or contained herein. LC7958NC 64-Bit LED Driver for 300 dpi Printers CMOS IC Ordering number: ENN* 6585

The characteristics shown below are those of devices encapsulated in the SANYO standard ceramic package Specifications Absolute Maximum Ratings at Vss=0V Parameter Symbol Conditions Ratings Unit VDD1 -0.3 to 6.5 Power supply voltage VDD2 Ta = 25 °C -0.3 to 6.5 V Input voltage VI Ta = 25 °C -0.3 to VDD1+ 0.3 V Output voltage VO Ta = 25 °C -0.3 to VDD1+ 0.3 V Driver output current IOUT 0 to -10 mA Operating Junction temperature Tj -10 to 125 °C Storage temperature Tstg -35 to 125 °C Allowable Operating Ranges at Vss = 0 V, VDD1 = VDD2 = 5 V – 10%, Ta = 0 to 100°C Ratings Parameter Symbol Conditions min typ max Unit Power supply voltage VDD1,VDD2 VDD1(pad 2), VDD2(pad 6) 4.5 5.5 Potential difference*1 VDF Between VDD1 and VDD2 -0.3 0 0.3 V High-level input voltage VIH 2.0 VDD1 V Low-level input voltage VIL All inputs 0 0.8 V Clock frequency fc CLOCK 1 10 MHz Clock duty D CLK CLOCK 1 35 50 65 % Setup time from SI to CLOCK1 tsc SI, CLOCK 1 30 ns Hold time from CLOCK1 to SI thold SI, CLOCK 1 10 ns Setup time from CLOCK1 to LOAD1 tSL LOAD 1, CLOCK 1 50 ns Hold time from LOAD1 to CLOCK1 tHL LOAD 1, CLOCK 1 50 ns LOAD1 pulse width tWL LOAD 1 40 ns CLOCK1 rise/fall time tCr tCf CLOCK 1 35 ns LOAD1 rise/fall time tLr tLf LOAD 1 35 ns *1:In case potential difference occurred between VDD1 and VDD2, Driver current value changes. Therefore using it with VDD1=VDD2 is recommended.

Parameter Symbol Conditions min typ max Unit High-level output voltage VOH LOAD2, S0, CLOCK2: IO = -200mA VDD - 0.5 V Low-level output voltage VOL LOAD2, S0, CLOCK2: IO = 200mA 0.5 V Clock frequency fc 10 MHz High-level input current IIH All input pads: VDD1 = 5.5 V, VI = 5.5 V 1.0 mA IIL1 -1.0 IIL2 -8 -25 -50Low-level input current IIL3 LOAD1, SI, CLOCK1, STROBE, SEL, ADJ(-), ADJ(+): VDD1 = VDD2 = 5.5 V, VI = 0 V -40 -100 -200 mA High-level output current IOH1 DO1 to DO64: operation mode 1, VDD1 = VDD2 = 5.0 V, VO = 1.6 V, VREF = 1.8 V -3.7 -5.0 -6.7 mA High-level output current minus correction IOH2 DO1 to DO64: operation mode 2 VDD1 = VDD2 = 5.0 V, VO = 1.6 V, VREF = 1.8 V -4.5 -6.0 -7.0 High-level output current plus correction IOH3 DO1 to DO64: operation mode 3 VDD1 = VDD2 = 5.0 V, VO = 1.6 V, VREF = 1.8 V +4.5 +6.0 +7.0 High-level output current relative error between bits D IOH DO1 to DO64: with all bits on -5.0 +5.0 % Output off leakage current IOL DO1 to DO64: operation VDD1 =

5.5 V, VO = 0 V

(mode 1) IDD VDD1: VDD1 = VDD2 = 5.5 V, VREF = 1.8 V, fc = 10 MHz, with DO1 to DO64 off 9.0 13.0 mA Standby current IDDS VDD1: VDD1 = VDD2 = 5.5 V, VREF = 1.8 V, with fc stopped, with DO1 to DO64 off 2.5 4.0 mA

Switching Characteristics at VSS = 0 V, VDD1 = VDD2 = 5 V – 10%, Ta = 0 to 100°C Ratings Parameter Symbol Conditions min typ max Unit SO output rise time tor SO output fall time tof SO: CL=10.8pF 50 ns tpsrOutput transmission delay time from STROBE to DO tpsf STROBE, DO1 to DO64: CL = 10.8 pF, RF = 10 kW 250 ns tpcrOutput transmission delay time from CLOCK2 to SO tpcf CLOCK2, SO 10 70 ns tPHCLOCK1 fi CLOCK2 transmission delay time tPL CLOC1, CLOCK2, LOAD1, LOAD2: CL=10.8 pF 40 ns Equivalent Circuit Block Diagram CLOCK1 DO64DO1 64-bit constant current driverVREF ADJ(+) ADJ(-) STROBE VDD2 64-bit latch 64-bit shift register SEL LOAD1 SI LOAD2 SO CLOCK2 VDD1 VSS Constant current circuit

Sample Application Circuit Diagram Note 1: The electric potential of the IC substrate is at VDD1. Note 2: The number of cascade connection stages should be within 60. (10MHz) Note 3: All VDD2 terminals should be bonded. Note 4: Leave the SEL Terminal of the odd-numbered IC open, and connect the SEL terminal of even-numbered IC with VSS. Note 5: Apply the stable potential other than the VDD1 and VDD2 lines to the VREF terminal. (To the next input stage) OPEN LED array (Input signal) LED array GND STROBE VREF VSS VDD1 VDD2 DO64 DO1 CLOCK1 SO LOAD2 VSS SEL VDD 2 STROBE LOAD1 SI VREF ADJ(-) ADJ(+) CL OCK DO64 DO 1 CLOCK1 SO LOAD VSS SEL VDD 2 VDD 1 STROB LOAD1 SI VREF ADJ(-) ADJ(+) CL OCK VDD 1

  1. Shift Register and Latch Blocks SEL CLOCK1 LOAD1 Shift register Latch Falling edge DATA load and DATA shift Rising edge - DATA keep - - High - DATA load High - Low - DATA keep Falling edge DATA load and DATA shift Rising edge - DATA keep - - Low - DATA load Low - High - DATA keep 2. Output Block STROBE SI DO output High “ ·” OFF Low Low OFF Low High ON Note 1: "·": don’t care Establishment of Output Current MODE ADJ(+) ADJ(-) Current control resistance IOH(typ)

1 Low Low Built in ( RINT) VREF/RINT · 10

2 Low High Built in ( RINT) VREF/RINT · 10 · 0.94 3 High Low Built in ( RINT) VREF/RINT · 10 · 1.06 Note 2: RINT(TYP) = 3.61 kW *Complement explanation Here shows the general usage of the modes 1 to 3 as follows. MODE 1 is set by connecting the ADJ(+) and ADJ(-) terminals with VSS. In the MODE1 state, by cutting the bonding wire connected with ADJ(+) or ADJ(-), the IC enters the MODE2 or MODE3, respectively. The current in MODE1 can be corrected by about –6 % or +6 % in MODE2 or MODE3, respectively.

  1. Test condition: VDD1 = VDD2 = 5.0 V, VREF = 1.8 V, VO = 1.6 V, Ta = 25 °C 2. Ranking determination: The rank is determined by the average ON current (Iave) of the terminals DO1 to DO64 when the all DO outputs are on. 3. Current width: (Imax - Imin)/(Imax + Imin) » 2.0 % Rank ABC Specification [mA] 1 4 - -4.178 to -4.347 2 5 - -4.348 to -4.524 3 6 - -4.525 to -4.708 4 7 1 -4.709 to -4.900 5 8 2 -4.901 to -5.100 6 9 3 -5.101 to -5.308 7 - 4 -5.309 to -5.524 8 - 5 -5.525 to -5.749 9 - 6 -5.750 to -5.983 * * * Rejected article (for the manufacturing process control) Note: The chips of Ranking No. "*" are marked with the ink ON Current Deviation in a Chip Test condition: VDD1 = VDD2 = 5.0 V, VO = 1.6 V, VREF = 1.8 V, Ta = 25 °C 1. Let the average ON current of the terminals DO4, 12, 20, 28, 36, 44, 52, and 60 be Cave, the that of the terminals DO1, 12, 20, and 28 be Lave, and that of the terminals DO36, 44, 52, and 60 be Rave: then the relationship among the Cave, Lave, and Rave should be as follows. | Lave - Cave | / Cave £ 2.5 %, | Rave - Cave | / Cave £ 2.5 % 2. Let the average ON current of DO1 to DO8, DO29 to DO36, and DO57 to DO64 be I1, I2, and I3, respectively: the relationship among the I1, I2, and I3 should be as follows. | In - Iave | / Iave £ 2.5 %, Iave: Average ON current of the DO1 to DO64. I n : I 2 , a n d I 3

Timing Chart (SEL = High) CLOCK1 CLOCK2 SI SO LOAD1 LOAD2 STROB DOn(on) DOn(off) CLOCK1 SO tsc thold tPL tPH 1/fc tpcr tpcf tSL tHL tW tPH tPL tCr tCf tor tof tpsr tpsf 90 % 10 % 90 % 10 % LOAD1

X Y (0,0) Chip size: 5.39 mm · 1.43 mm Pad size: (PV open) 110 mm · 110 mm (Others) F 110 mm (VDD2) 100 mm · 100 mm (DOn) Chip thickness: 330 mm – 30 mm

No. Pin X Y No. Pin X Y

1 SI -2520 -484 44 DO22 -840 398

2 CLOCK1 -2040 -484 45 DO23 -760 539

3 LOAD1 -1800 -484 46 DO24 -680 398

4 VDD -1560 -484 47 DO25 -600 539

5 VREF -1080 -484 48 DO26 -520 398

6 SEL -840 -484 49 DO27 -440 539

7 STROBE -600 -484 50 DO28 -360 398

8 VSS -120 -484 51 DO29 -280 539

9 NC 120 -484 52 DO30 -200 398

10 ADJ(-) 600 -484 53 DO31 -120 539

11 ADJ(+) 840 -484 54 DO32 -40 398

12 VSS 1080 -484 55 DO33 40 539

13 VDD 1560 -484 56 DO34 120 398

14 LOAD2 1800 -484 57 DO35 200 539

15 CLOCK2 2040 -484 58 DO36 280 398

16 S0 2520 -484 59 DO37 360 539

17 VDD2 -2280 18 60 DO38 440 398

18 VDD2 -1320 18 61 DO39 520 539

19 VDD2 -360 18 62 DO40 600 398

20 VDD2 360 18 63 DO41 680 539

21 VDD2 1320 18 64 DO42 760 398

22 VDD2 2280 18 65 DO43 840 539

23 DO1 -2520 539 66 DO44 920 398

24 D02 -2440 398 67 DO45 1000 539

25 DO3 -2360 539 68 DO46 1080 398

26 DO4 -2280 398 69 DO47 1160 539

27 DO5 -2200 539 70 DO48 1240 398

28 DO6 -2120 398 71 DO49 1320 539

29 DO7 -2040 539 72 DO50 1400 398

30 DO8 -1960 398 73 DO51 1480 539

31 DO9 -1880 539 74 DO52 1560 398

32 DO10 -1800 398 75 DO53 1640 539

33 DO11 -1720 539 76 DO54 1720 398

34 DO12 -1640 398 77 DO55 1800 539

35 DO13 -1560 539 78 DO56 1880 398

36 DO14 -1480 398 79 DO57 1960 539

37 DO15 -1400 539 80 DO58 2040 398

38 DO16 -1320 398 81 DO59 2120 539

39 DO17 -1240 539 82 DO60 2200 398

40 DO18 -1160 398 83 DO61 2280 539

41 DO19 -1080 539 84 DO62 2360 398

42 DO20 -1000 398 85 DO63 2440 539

43 DO21 -920 539 86 DO64 2520 398

Unit: mm

Specifications of any and all SANYO products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer's products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer's products or equipment. SANYO Electric Co., Ltd. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with some probability. It is possible that these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. In the event that any or all SANYO products(including technical data,services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from the authorities concerned in accordance with the above law. No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of SANYO Electric Co. , Ltd. Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the SANYO product that you intend to use. Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume production. SANYO believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties. This catalog provides information as of May, 2000. Specifications and information herein are subject to change without notice. PS