LC75816E SANYO | Alldatasheet

Document overview

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Technical content

Features

  • Key input function for up to 30 keys (A key scan is performed only when a key is pressed.)
  • Controls and drives a 5 · 7, 5 · 8, or 5 · 9 dot matrix LCD.
  • Supports accessory display segment drive (up to 65 segments)
  • Display technique: 1/8 duty 1/4 bias drive (5 · 7 dots) 1/9 duty 1/4 bias drive (5 · 8 dots) 1/10 duty 1/4 bias drive (5 · 9 dots)
  • Display digits: 13 digits · 1 line (5 · 7 dots) 12 digits · 1 line (5 · 8 dots, 5 · 9 dots)
  • Display control memory CGROM: 240 characters (5 · 7, 5 · 8, or 5 · 9 dots) CGRAM: 16 characters (5 · 7, 5 · 8, or 5 · 9 dots) ADRAM: 13 · 5 bits DCRAM: 52 · 8 bits
  • Instruction function Display on/off control Display shift function
  • Sleep mode can be used to reduce current drain.
  • Built-in display contrast adjustment circuit
  • Switching between the key scan output port and general- purpose output port functions can be controlled by instructions.
  • The frame frequency of the common and segment output waveforms can be controlled by instructions.
  • Serial data I/O supports CCB format communication with the system controller.
  • Independent LCD driver block power supply VLCD
  • A voltage detection type reset circuit is provided to initialize the IC and prevent incorrect display.
  • The INH pin is provided. This pin turns off the display, disables key scanning, and forces the general-purpose output ports to the low level.
  • RC oscillator circuit

unit: mm 3151-QFP100E unit: mm 3181B-SQFP100 No. 7142-2/43 LC75816E, 75816W 21.6 0.8 3.0max 1.6 17.2 0.825 1 30 5180 1.6 0.5750.575 0.15 2.7 15.6 0.3 20.0 23.2 14.0 0.65 0.825 100 0.8 0.65 0.1 SANYO: QFP100E [LC75816E] 0.2 1.01.0 16.0 14.0 0.5 16.0 14.0 0.5 1.01.0 0.145 1.4 1.6max 0.5 0.5 100 1 25 5175 0.1 SANYO: SQFP100 [LC75816W]

No. 7142-3/43 LC75816E, 75816W Pin Assignments (Top View) KS6 KI4 KI5 VLCD2 VSS S10 S16 S21 S15 S34 S39 S44 S59 S58 S49 S50 S51 S52 S53 S54 S55 S56 S57 S60 S61 S62 S63 S64/COM10 S65/COM9 COM8 COM7 COM6 COM5 COM4 COM3 COM2 COM1 KS1/P1 KS2/P2 KS3 KS4 KS5 DI CL KI1 LC75816E (QFP100E) KI2 KI3 VDD VLCD VLCD1 VLCD0 VLCD3 VLCD4 TEST OSCO INH OSCI DO S33 S32 S31 S30 S29CE 5180 5081 31100 301 S14 S20 S13 S12 S11 S19 S18 S17 S25 S24 S23 S22 S28 S27 S26 S38 S37 S36 S35 S43 S42 S41 S40 S48 S47 S46 S45 S55 S51 S52 S53 S54 S56 S57 S58 S59 S60 S61 S62 S63 S64/COM10 S65/COM9 COM8 COM7 COM6 COM5 COM4 COM3 COM2 COM1 KS1/P1 KS2/P2 S11 KS4 KS6 KS5 KI1 KS3 LC75816W (SQFP100) KI2 KI3 KI4 VDD KI5 VLCD0 VLCD VLCD1 VLCD3 VLCD2 VSS VLCD4 TEST OSCI OSCO INH CE DO CL S35 S34 S33 S32 S31 S29 S30 S27 S28 S26DI 5175 5076 26100 251 S10 S16 S22 S15 S14 S13 S12 S21 S20 S19 S18 S17 S25 S24 S23 S40 S39 S38 S37 S36 S45 S44 S43 S42 S41 S50 S49 S48 S47 S46

No. 7142-4/43 LC75816E, 75816W Parameter Symbol Conditions Ratings Unit Maximum supply voltage VDD max VDD –0.3 to +7.0 V VLCD max VLCD –0.3 to +11.0 VIN1 CE, CL, DI, INH –0.3 to +7.0 Input voltage VIN2 OSCI, KI1 to KI5, TEST –0.3 to VDD + 0.3 V VIN3 VLCD 1, VLCD 2, VLCD 3, VLCD 4 –0.3 to VLCD + 0.3 VOUT 1 DO –0.3 to +7.0 Output voltage VOUT 2 OSCO, KS1 to KS6, P1, P2 –0.3 to VDD + 0.3 V VOUT 3 VLCD 0, S1 to S65, COM1 to COM10 –0.3 to VLCD + 0.3 IOUT 1 S1 to S65 300 µA Output current IOUT 2 COM1 to COM10 3 IOUT 3 KS1 to KS6 1 mA IOUT 4 P1, P2 5 Allowable power dissipation Pd max Ta = 85°C 200 mW Operating temperature Topr –40 to +85 °C Storage temperature Tstg –55 to +125 °C Specifications Absolute Maximum Ratingsat Ta = 25°C, VSS = 0 V Parameter Symbol Conditions Ratings Unit min typ max VDD VDD 4.5 6.0 Supply voltage VLCD VLCD : When the display contrast adjustment circuit is used.7.0 10.0 V VLCD : When the display contrast adjustment circuit is not used.4.5 10.0 Output voltage VLCD 0 VLCD 0 VLCD 4+4.5 VLCD V VLCD 1 VLCD 1 3/4 (VLCD 0–VLCD 4) VLCD 0 Input voltage VLCD 2 VLCD 2 2/4 (VLCD 0–VLCD 4) VLCD 0 V VLCD 3 VLCD 3 1/4 (VLCD 0–VLCD 4) VLCD 0 VLCD 4 VLCD 4 0 1.5 VIH1 CE, CL, DI, INH 0.8 VDD 6.0 Input high level voltage VIH2 OSCI 0.7 VDD VDD V VIH3 KI1 to KI5 0.6 VDD VDD Input low level voltage VIL1 CE, CL, DI, INH, KI1 to KI5 0 0.2 VDD V VIL2 OSCI 0 0.3 VDD Recommended external resistance R OSC OSCI, OSCO 33 kΩ Recommended external capacitance C OSC OSCI, OSCO 220 pF Guaranteed oscillation range fOSC OSC 150 300 600 kHz Data setup time tds CL, DI: Figure 2 160 ns Data hold time tdh CL, DI: Figure 2 160 ns CE wait time tcp CE, CL: Figure 2 160 ns CE setup time tcs CE, CL: Figure 2 160 ns CE hold time tch CE, CL: Figure 2 160 ns High level clock pulse width tøH CL: Figure 2 160 ns Low level clock pulse width tøL CL: Figure 2 160 ns DO output delay time tdc DO, RPU = 4.7kΩ , CL = 10pF*1: Figure 2 1.5 µs DO rise time tdr DO, RPU = 4.7kΩ , CL = 10pF*1: Figure 2 1.5 µs Allowable Operating Ranges at Ta = –40 to +85°C, VSS = 0 V Note: *1. Since the DO pin is an open-drain output, these times depend on the values of the pull-up resistor RPU and the load capacitance CL.

No. 7142-5/43 LC75816E, 75816W Parameter Symbol Conditions Ratings Unit min typ max Hysteresis VH CE, CL, DI, INH, KI1 to KI5 0.1 VDD V Power-down detection voltage VDET 2.5 3.0 3.5 V Input high level current IIH CE, CL, DI, INH, OSCI: VI= 6.0 V 5.0 µA Input low level current IIL CE, CL, DI, INH, OSCI: VI= 0 V –5.0 µA Input floating voltage VIF KI1 to KI5 0.05 VDD V Pull-down resistance R PD KI1 to KI5: VDD = 5.0 V 50 100 250 kΩ Output off leakage current IOFFH DO: VO = 6.0 V 6.0 µA VOH 1 S1 to S65: IO = –20 µA VLCD 0 – 0.6 VOH 2 COM1 to COM10: IO = –100 µA VLCD 0 – 0.6 Output high level voltage VOH 3 KS1 to KS6: IO = –500 µA VDD – 1.0 VDD – 0.5 VDD – 0.2 V VOH 4 P1, P2: IO = –1 mA VDD – 1.0 VOH 5 OSCO: IO = –500 µA VDD – 1.0 VOL 1 S1 to S65: IO = 20 µA VLCD 4 + 0.6 VOL 2 COM1 to COM10: IO = 100 µA VLCD 4 + 0.6 Output low level voltage VOL 3 KS1 to KS6: IO = 25 µA 0.2 0.5 1.5 V VOL 4 P1, P2: IO = 1 mA 1.0 VOL 5 OSCO: IO = 500 µA 1.0 VOL 6 DO: IO = 1 mA 0.1 0.5 VMID 1 S1 to S65: IO = ±20 µA 2/4 (VLCD 0 – VLCD 4) – 0.6 2/4 (VLCD 0 – VLCD 4) + 0.6 Output middle level voltage*2 VMID 2 COM1 to COM10: IO = ±100 µA 3/4 (VLCD 0 – VLCD 4) – 0.6 3/4 (VLCD 0 – VLCD 4) + 0.6 V VMID 3 COM1 to COM10: IO = ±100 µA 1/4 (VLCD 0 – VLCD 4) – 0.6 1/4 (VLCD 0 – VLCD 4) + 0.6 Oscillator frequency fOSC OSCI, OSCO: ROSC = 33 kΩ , COSC = 220 pF 210 300 390 kHz IDD 1 VDD : sleep mode 100 IDD 2 VDD : VDD = 6.0 V, output open, fOSC = 300 kHz 500 1000 Current drain ILCD 1 VLCD : sleep mode 5 µA ILCD 2 VLCD : VLCD = 10.0 V, output open, fOSC = 300 kHz 450 900 When the display contrast adjustment circuit is used. ILCD 3 VLCD : VLCD = 10.0 V, output open, fOSC = 300 kHz 200 400When the display contrast adjustment circuit is not used. Electrical Characteristics for the Allowable Operating Ranges Note: *2. Excluding the bias voltage generation divider resistor built into the VLCD 0, VLCD 1, VLCD 2, VLCD 3, and VLCD 4. (See Figure 1.) VLCD VLCD3 VLCD4 VLCD2 VLCD0 VLCD1 CONTRAST ADJUSTER Excluding these resistors To the common and segment drivers Figure 1

No. 7142-6/43 LC75816E, 75816W

  • When CL is stopped at the low level tdh 50% VIH1 VIH1 VIL1 VIL1 VIH1 VIL1 tdrtdc tchtcstcp tds CL tøLtøH DO DI D1D0 CE
  • When CL is stopped at the high level tøHtøL 50% VIH1 VIL1 tdh VIH1 VIL1 VIH1 VIL1 tdrtdc tchtcstcp tds CL DO DI D1D0 CE Block Diagram S65/COM9 ADRAM bits CGRAM 5 × × × × 9 16 bits VDET CLOCK GENERATOR CONTRAST ADJUSTER TIMING GENERATOR ADDRESS REGISTER INSTRUCTION REGISTER COMMON DRIVER INSTRUCTION DECODER ADDRESS COUNTER DCRAM 52 8 bits CGROM 5 9 240 bits S H I F T R E G I S T E R L A T C H S E G M E N T D R I V E R OSCI OSCO INH DO DI P1/KS1 P2/KS2 KS3 KS4 KS5 KS6 CE KI1 KI2 KI3 KI4 KI5 CL S63 COM8 COM1 S64/COM10 KEY BUFFERCCB INTERFACE KEY SCAN VDD VLCD4 VLCD3 VLCD2 VLCD1 VLCD VLCD0 VSS TEST Figure 2

No. 7142-7/43 LC75816E, 75816W Pin Functions Pin Pin No. Function Active I/O Handling when unusedLC75816E LC75816W Segment driver outputs. The S64/COM10, S65/COM9 pins can be used as common driver output under the “set display technique” instruction. OPEN— O S1 to S63 S64/COM10 S65/COM9 3 to 65 1 to 63 Common driver outputs. OPEN— OCOM1 to COM8 75 to 68 73 to 66 Oscillator connections. An oscillator circuit is formed by connecting an external resistor and capacitor at these pins. GND— IOSCI 97 95 Serial data interface connections to the controller. Note that DO, being an open-drain output, requires a pull-up resistor. CE : Chip enable CL : Synchronization clock DI : Transfer data DO : Output data GND H ICE 100 98 ICL 1 99 — IDI 2 100 OPEN— OOSCO 96 94 Input that turns the display off, disables key scanning, and forces the general-purpose output ports low.

  • When INH is low (V SS ):
  • Display off S1 to S63 = “L” (VLCD 4). S64/COM10, S65/COM9 = “L” (VLCD 4). COM1 to COM8 = “L” (VLCD 4).
  • General-purpose output ports P1, P2 = low (VSS )
  • Key scanning disabled: KS1 to KS6 = low (VSS )
  • All the key data is reset to low.
  • When INH is high (VDD ):
  • Display on
  • The state of the pins as key scan output pins or general-purpose output ports can be set with the "set key scan output port/general-purpose output port state" instruction.
  • Key scanning is enabled. However, serial data can be transferred when the INH pin is low. VDDL IINH 98 96 LCD drive 3/4 bias voltage (middle level) supply pin. This pin can be used to supply the 3/4 (VLCD 0 – VLCD 4) voltage level externally. OPEN— IVLCD 1 90 88 LCD drive 2/4 bias voltage (middle level) supply pin. This pin can be used to supply the 2/4 (VLCD 0 - VLCD 4) voltage level externally. OPEN— IVLCD 2 91 89 LCD drive 1/4 bias voltage (middle level) supply pin. This pin can be used to supply the 1/4 (VLCD 0 – VLCD 4) voltage level externally. OPEN— IVLCD 3 92 90 Logic block power supply connection. Provide a voltage of between 4.5 and 6.0 V. —— —VDD 87 85 LCD driver block power supply connection. Provide a voltage of between 7.0 and 10.0 V when the display contrast adjustment circuit is used and provide a voltage of between 4.5 and 10.0 V when the circuit is not used. —— —V LCD 88 86 Power supply connection. Connect to ground. —— —VSS 94 92 Key scan outputs. Although normal key scan timing lines require diodes to be inserted in the timing lines to prevent shorts, since these outputs are unbalanced CMOS transistor outputs, these outputs will not be damaged by shorting when these outputs are used to form a key matrix. The KS1/P1 and KS2/P2 pins can be used as general-purpose output ports under the "set key scan output port/general-purpose output port state" instruction. OPEN— O KS1/P1 KS2/P2 KS3 to KS6 78 to 81 76 to 79 Key scan inputs. These pins have built-in pull-down resistors. GNDH IKI1 to KI5 82 to 86 80 to 84 DO 99 97 — O OPEN This pin must be connected to ground. —— ITEST 95 93 LCD drive 4/4 bias voltage (high level) supply pin. The level on this pin can be changed by the display contrast adjustment circuit. However, (V LCD 0 – VLCD 4) must be greater than or equal to 4.5 V. Also, external power must not be applied to this pin since the pin circuit includes the display contrast adjustment circuit. OPEN— OVLCD 0 89 87 LCD drive 0/4 bias voltage (low level) supply pin. Fine adjustment of the display contrast can be implemented by connecting an external variable resistor to this pin. However, (V LCD 0 – VLCD 4) must be greater than or equal to 4.5 V, and VLCD4 must be in the range 0 V to 1.5 V, inclusive. GND— IVLCD 4 93 91

No. 7142-8/43 LC75816E, 75816W Block Functions

  • AC (address counter) AC is a counter that provides the addresses used for DCRAM and ADRAM. The address is automatically modified internally, and the LCD display state is retained.
  • DCRAM (data control RAM) DCRAM is RAM that is used to store display data expressed as 8-bit character codes. (These character codes are converted to 5 · 7, 5 · 8, or 5 · 9 dot matrix character patterns using CGROM or CGRAM.) DCRAM has a capacity of 52 · 8 bits, and can hold 52 characters. The table below lists the correspondence between the 6-bit DCRAM address loaded into AC and the display position on the LCD panel.
  • When the DCRAM address loaded into AC is 00H . Display digit 1 2 3 4 5 6 7 8 9 10 11 12 13 DCRAM address (hexadecimal) 00 01 02 03 04 05 06 07 08 09 0A 0B 0C However, when the display shift is performed by specifying MDATA, the DCRAM address shifts as shown below. Note: *3. The DCRAM address is expressed in hexadecimal. Example: When the DCRAM address is 2EH . Note: *4. 5 · 7 dots ... 13-digit display5 · 7 dots 5 · 8 dots ... 13-digit display4 · 8 dots 5 · 9 dots ... 13-digit display3 · 9 dots Display digit 1 2 3 4 5 6 7 8 9 10 11 12 13 DCRAM address (hexadecimal) 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D (Shift left) Display digit 1 2 3 4 5 6 7 8 9 10 11 12 13 DCRAM address (hexadecimal) 33 00 01 02 03 04 05 06 07 08 09 0A 0B DCRAM address DA0 DA1 DA2 DA3 DA4 DA5 (Shift right) Least significant bit fl LSB DA0 DA1 DA2 DA3 DA4 DA5 0 1 1 1 0 1 Most significant bit fl MSB HexadecimalHexadecimal

No. 7142-9/43 LC75816E, 75816W

  • ADRAM (Additional data RAM) ADRAM is RAM that is used to store the ADATA display data. ADRAM has a capacity of 13 · 5 bits, and the stored display data is displayed directly without the use of CGROM or CGRAM. The table below lists the correspondence between the 4-bit ADRAM address loaded into AC and the display position on the LCD panel.
  • When the ADRAM address loaded into AC is 0H . (Number of digit displayed: 13) Display digit 1 2 3 4 5 6 7 8 9 10 11 12 13 ADRAM address (hexadecimal) 0 1 2 3 4 5 6 7 8 9 A B C However, when the display shift is performed by specifying ADATA, the ADRAM address shifts as shown below. Display digit 1 2 3 4 5 6 7 8 9 10 11 12 13 ADRAM address (hexadecimal) 1 2 3 4 5 6 7 8 9 A B C 0 (Shift left) Display digit 1 2 3 4 5 6 7 8 9 10 11 12 13 ADRAM address (hexadecimal) C 0 1 2 3 4 5 6 7 8 9 A B (Shift right) Note: *5. The ADRAM address is expressed in hexadecimal. Example: When the ADRAM address is AH Note: *6. 5 · 7 dots ... 13-digit display5 dots 5 · 8 dots ... 13-digit display4 dots 5 · 9 dots ... 13-digit display3 dots
  • CGROM (Character generator ROM) CGROM is ROM that is used to generate the 240 kinds of 5 · 7, 5 · 8, or 5 · 9 dot matrix character patterns from the 8-bit character codes. CGROM has a capacity of 240 · 45 bits. When a character code is written to DCRAM, the character pattern stored in CGROM corresponding to the character code is displayed at the position on the LCD corresponding to the DCRAM address loaded into AC.
  • CGRAM (Character generator RAM) CGRAM is RAM to which user programs can freely write arbitrary character patterns. Up to 16 kinds of 5 · 7, 5 · 8, or 5 · 9 dot matrix character patterns can be stored. CGRAM has a capacity of 16 · 45 bits. ADRAM address RA0 RA1 RA2 RA3 RA0 RA1 RA2 RA3 0 1 0 1 Hexadecimal Least significant bit fl LSB Most significant bit fl MSB

No. 7142-10/43 LC75816E, 75816W Serial Data Input

  • When CL is stopped at the low level D63D62D4D3D21 0000010 D0 D1 CE CL DI DO A3A2A1A0B3B2B1B0
  • When CL is stopped at the high level
  • B0 to B3, A0 to A3: CCB address 42H
  • D0 to D63: Instruction data The data is acquired on the rising edge of the CL signal and latched on the falling edge of the CE signal. When transferring instruction data from the microcontroller, applications must assure that the time from the transfer of one set of instruction data until the next instruction data transfer is significantly longer than the instruction execution time. D63D62D4D3D20000 1010 D0 D1 CE DI DO CL A3A2A1A0B3B2B1B0 Instruction data (Up to 64 bits) Instruction data (Up to 64 bits)

No. 7142-11/43 LC75816E, 75816W Instruction Table Notes: *7.The data format differs when the “DCRAM data write” instruction is executed in the increment mode (IM = 1). (See detailed instruction descriptions .) *8.The data format differs when the “ADRAM data write” instruction is executed in the increment mode (IM = 1). (See detailed instruction descriptions.) *9.The execution times listed here apply when fosc = 300 kHz. The execution times differ when the oscillator frequency fosc differs. Example: When fosc = 210 kHz 30027 µs ·—— = 39 µs210 *10.When the sleep mode (SP = 1) is set, the execution time is 27 µs (when fosc = 300 kHz). Instruction D0 D1...D39 D40 D41 D42 D43 D44 D45 D46 D47 D48 D49 D50 D51 D52 D53 D54 D55 Execution time *9 Set display technique Display on/off control DG1 DG2 DG3 DG4 DG5 DG6 DG7 DG8 DG9 DG10 DG11 DG12 DG13 X X X Display shift Set AC address DA0 DA1 DA2 DA3 DA4 DA5 X X DCRAM data write *7 AC0 AC1 AC2 AC3 AC4 AC5 AC6 AC7 DA0 DA1 DA2 DA3 DA4 DA5 X X ADRAM data write *8 AD1 AD2 AD3 AD4 AD5 X X X RA0 RA1 RA2 RA3 X X X X CGRAM data write CD1 CD2...CD40 CD41 CD42 CD43 CD44 CD45 X X X CA0 CA1 CA2 CA3 CA4 CA5 CA6 CA7 Set display contrast CT0 CT1 CT2 CT3 X X X X Set key scan output port/ KC1 KC2 KC3 KC4 KC5 KC6 X Xgeneral-purpose output port state D56 D57 D58 D59 D60 D61 D62 D63 DT1 DT2 FC X 0 0 0 1 0 µs M A SC SP 0 0 1 0 0 µs/27 µs *10 M A R/L X 0 0 1 1 27 µs RA0 RA1 RA2 RA3 0 1 0 0 27 µs IM X X X 0 1 0 1 27 µs IM X X X 0 1 1 0 27 µs X X X X 0 1 1 1 27 µs CTC X X X 1 0 0 0 0 µs PC1 PC2 KP1 KP2 1 0 0 1 0 µs X: don’t care

No. 7142-12/43 LC75816E, 75816W Detailed Instruction Descriptions

  • Set display technique ... <Sets the display technique> Code D56 D57 D58 D59 D60 D61 D62 D63 DT1 DT2 FC X 0 0 0 1 X: don’t care X: don’t care Note: *11 Sn (n = 64, 65): Segment outputs COMn (n = 9, 10): Common outputs DT1, DT2: Sets the display technique DT1 DT2 Display technique Output pins S65/COM9 S64/COM10 0 0 1/8 duty, 1/4 bias drive S65 S64 1 0 1/9 duty, 1/4 bias drive COM9 S64 0 1 1/10 duty, 1/4 bias drive COM9 COM10
  • Display on/off control ... <Turns the display on or off> Code D40 D41 D42 D43 D44 D45 D46 D47 D48 D49 D50 D51 D52 D53 D54 D55 D56 D57 D58 D59 DG1 DG2 DG3 DG4 DG5 DG6 DG7 DG8 DG9 DG10 DG11 DG12 DG13 X X X M A SC SP D60 D61 D62 D63 0 0 1 0 M, A: Specifies the data to be turned on or off Note: *12. MDATA, ADATA 5 · 7 dot matrix display 5 · 8 dot matrix display 5 · 9 dot matrix display M A Display operating state 0 0 Both MDATA and ADATA are turned off (The display is forcibly turned off regardless of the DG1 to DG13 data.) 0 1 Only ADATA is turned on (The ADATA of display digits specified by the DG1 to DG13 data are turned on.) 1 0 Only MDATA is turned on (The MDATA of display digits specified by the DG1 to DG13 data are turned on.) 1 1 Both MDATA and ADATA are turned on (The MDATA and ADATA of display digits specified by the DG1 to DG13 data are turned on.) ADATA MDATA ADATA MDATA ADATA MDATA . . . . . . . . . . . . . . . . . . . . . DG1 to DG13: Specifies the display digit For example, if DG1 to DG7 are 1, and DG8 to DG13 are 0, then display digits 1 to 7 will be turned on, and display digits 8 to 13 will be turned off (blanked). Display digit 1 2 3 4 5 6 7 8 9 10 11 12 13 Display digit data DG1 DG2 DG3 DG4 DG5 DG6 DG7 DG8 DG9 DG10 DG11 DG12 DG13 FC: Sets the frame frequency of the common and segment output waveforms FC Frame frequency 1/8 duty, 1/4 bias drive f8 (Hz) 1/9 duty, 1/4 bias drive f9 (Hz) 1/10 duty, 1/4 bias drive f10 (Hz) 0 fosc fosc fosc 3072 3456 3840 1 fosc fosc fosc 1536 1728 1920 A10719

No. 7142-13/43 LC75816E, 75816W SC: Controls the common and segment output pins Note: *13. When SC is 1, the S1 to S65 and COM1 to COM10 output pins are set to the VLCD 4 level, regardless of the M, A, and DG1 to DG13 data. SC Common and segment output pin states

0 Output of LCD drive waveforms

1 Fixed at the VLCD 4 level (all segments off)

SP: Controls the normal mode and sleep mode SP Mode

0 Normal mode

(The common and segment pins go to the VLCD 4 level and the oscillator on the OSCI, OSCO pins is stopped (although it operates during key scan operations), to reduce current drain. Although the "display on/off control", "set display contrast", and "set key scan output port/general- purpose output port state" instructions can be executed in this mode, applications must return the IC to normal mode to execute any of the other instruction settings.)

  • Display shift ... <Shifts the display> Code D56 D57 D58 D59 D60 D61 D62 D63 M A R/L X 0 0 1 1 X: don’t care M, A: Specifies the data to be shifted M A Shift operating state 0 0 Neither MDATA nor ADATA is shifted 0 1 Only ADATA is shifted 1 0 Only MDATA is shifted 1 1 Both MDATA and ADATA are shifted R/L: Specifies the shift direction R/L Shift direction

0 Shift left

1 Shift right

X: don’t care

  • Set AC address... <Specifies the DCRAM and ADRAM address for AC> Code D48 D49 D50 D51 D52 D53 D54 D55 D56 D57 D58 D59 D60 D61 D62 D63 DA0 DA1 DA2 DA3 DA4 DA5 X X RA0 RA1 RA2 RA3 0 1 0 0 DA0 to DA5: DCRAM address DA0 DA1 DA2 DA3 DA4 DA5 LSB Least significant bit MSB Most significant bit RA0 to RA3: ADRAM address RA0 RA1 RA2 RA3 LSB Least significant bit MSB Most significant bit This instruction loads the 6-bit DCRAM address DA0 to DA5 and the 4-bit ADRAM address RA0 to RA3 into the AC.

No. 7142-14/43 LC75816E, 75816W X: don’t care

  • DCRAM data write ... <Specifies the DCRAM address and stores data at that address> Code D40 D41 D42 D43 D44 D45 D46 D47 D48 D49 D50 D51 D52 D53 D54 D55 D56 D57 D58 D59 AC0 AC1 AC2 AC3 AC4 AC5 AC6 AC7 DA0 DA1 DA2 DA3 DA4 DA5 X X IM X X X D60 D61 D62 D63 0 1 0 1 DA0 to DA5: DCRAM address DA0 DA1 DA2 DA3 DA4 DA5 AC0 to AC7: DCRAM data (character code) This instruction writes the 8 bits of data AC0 to AC7 to DCRAM. This data is a character code, and is converted to a 5 · 7, 5 · 8, or 5 · 9 dot matrix display data using CGROM or CGRAM. AC0 AC1 AC2 AC3 AC4 AC5 AC6 AC7 IM: Sets the method of writing data to DCRAM Notes: *14.
  • DCRAM data write method when IM = 0 IM DCRAM data write method 0 Normal DCRAM data write (Specifies the DCRAM address and writes the DCRAM data.) 1 Increment mode DCRAM data write (Increments the DCRAM address by +1 each time data is written to DCRAM.) (1) (1) (1) (1) CE DI DCRAM DCRAM data write finishes
  • DCRAM data write method when IM = 1 (Instructions other than the “DCRAM data write” instruction cannot be executed.) DCRAM CE CCB address CCB address CCB address CCB address DCRAM data write finishes DCRAM data write finishes DCRAM data write finishes Instruction execution time Instruction execution time Instruction execution time Instruction execution time 24 bits 24 bits 24 bits 24 bits CCB address CCB address CCB address CCB address CCB address CCB address 24 bits 8 bits 8 bits 8 bits 8 bits 16 bits Instruction execution time Instruction execution time Instruction execution time Instruction execution time Instruction execution time Instruction execution time DCRAM data write finishes DCRAM data write finishes DCRAM data write finishes DCRAM data write finishes DCRAM data write finishes DCRAM data write finishes Instructions other than the “DCRAM data write” instruction cannot be executed. LSB Least significant bit LSB Least significant bit MSB Most significant bit MSB Most significant bit

No. 7142-15/43 LC75816E, 75816W X: don’t care Data format at (1) (24 bits) Code D40 D41 D42 D43 D44 D45 D46 D47 D48 D49 D50 D51 D52 D53 D54 D55 D56 D57 D58 D59 AC0 AC1 AC2 AC3 AC4 AC5 AC6 AC7 DA0 DA1 DA2 DA3 DA4 DA5 X X IM X X X D60 D61 D62 D63 0 1 0 1 X: don’t care

  • ADRAM data write ... <Specifies the ADRAM address and stores data at that address> Code D40 D41 D42 D43 D44 D45 D46 D47 D48 D49 D50 D51 D52 D53 D54 D55 D56 D57 D58 D59 AD1 AD2 AD3 AD4 AD5 X X X RA0 RA1 RA2 RA3 X X X X IM X X X D60 D61 D62 D63 0 1 1 0 X: don’t care Data format at (3) (16 bits) Code D48 D49 D50 D51 D52 D53 D54 D55 D56 D57 D58 D59 D60 D61 D62 D63 AC0 AC1 AC2 AC3 AC4 AC5 AC6 AC7 0 X X X 0 1 0 1 Data format at (2) (8 bits) Code D56 D57 D58 D59 D60 D61 D62 D63 AC0 AC1 AC2 AC3 AC4 AC5 AC6 AC7 RA0 to RA3: ADRAM address AD1 to AD5: ADATA display data In addition to the 5 · 7, 5 · 8, or 5 · 9 dot matrix display data (MDATA), this IC supports direct display of the five accessory display segments provided in each digit as ADATA. This display function does not use CGROM or CGRAM. The figure below shows the correspondence between the data and the display. When ADn = 1 (where n is an integer between 1 and 5) the segment corresponding to that data will be turned on. RA0 RA1 RA2 RA3 LSB Least significant bit Most significant bit MSB ADATA Corresponding output pin AD1 S5m + 1 (m is an integer between 0 and 12) AD2 S5m + 2 AD3 S5m + 3 AD4 S5m + 4 AD5 S5m + 5 S5m+1 S5m+5 (m is an integer between 0 and 12)

No. 7142-16/43 LC75816E, 75816W IM: Sets the method of writing data to ADRAM IM ADRAM data write method 0 Normal ADRAM data write (Specifies the ADRAM address and writes the ADRAM data.) 1 Increment mode ADRAM data write (Increments the ADRAM address by +1 each time data is written to ADRAM.) Notes: *15.

  • ADRAM data write method when IM = 0
  • ADRAM data write method when IM = 1 (Instructions other than the “ADRAM data write” instruction cannot be excuted.) X: don’t care X: don’t care Data format at (4) (24 bits) Code D40 D41 D42 D43 D44 D45 D46 D47 D48 D49 D50 D51 D52 D53 D54 D55 D56 D57 D58 D59 AD1 AD2 AD3 AD4 AD5 X X X RA0 RA1 RA2 RA3 X X X X IM X X X D60 D61 D62 D63 0 1 1 0 X: don’t care Data format at (6) (16 bits) Code D48 D49 D50 D51 D52 D53 D54 D55 D56 D57 D58 D59 D60 D61 D62 D63 AD1 AD2 AD3 AD4 AD5 X X X 0 X X X 0 1 1 0 Data format at (5) (8 bits) Code D56 D57 D58 D59 D60 D61 D62 D63 AD1 AD2 AD3 AD4 AD5 X X X (4) (4) (4) (4) CE DI ADRAM ADRAM data write finishes ADRAM CE CCB address CCB address CCB address CCB address ADRAM data write finishes ADRAM data write finishes ADRAM data write finishes Instruction execution time Instruction execution time Instruction execution time Instruction execution time 24 bits 24 bits 24 bits 24 bits CCB address CCB address CCB address CCB address CCB address CCB address 24 bits 8 bits 8 bits 8 bits 8 bits 16 bits Instruction execution time Instruction execution time Instruction execution time Instruction execution time Instruction execution time Instruction execution time ADRAM data write finishes ADRAM data write finishes ADRAM data write finishes ADRAM data write finishes ADRAM data write finishes ADRAM data write finishes Instructions other than the “ADRAM data write” instruction cannot be excuted.

No. 7142-17/43 LC75816E, 75816W X: don’t care

  • CGRAM data write ... <Specifies the CGRAM address and stores data at that address> Code D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 CD1 CD2 CD3 CD4 CD5 CD6 CD7 CD8 CD9 CD10 CD11 CD12 CD13 CD14 CD15 CD16 Code D16 D17 D18 D19 D20 D21 D22 D23 D24 D25 D26 D27 D28 D29 D30 D31 CD17 CD18 CD19 CD20 CD21 CD22 CD23 CD24 CD25 CD26 CD27 CD28 CD29 CD30 CD31 CD32 Code D32 D33 D34 D35 D36 D37 D38 D39 D40 D41 D42 D43 D44 D45 D46 D47 CD33 CD34 CD35 CD36 CD37 CD38 CD39 CD40 CD41 CD42 CD43 CD44 CD45 X X X Code D48 D49 D50 D51 D52 D53 D54 D55 D56 D57 D58 D59 D60 D61 D62 D63 CA0 CA1 CA2 CA3 CA4 CA5 CA6 CA7 X X X X 0 1 1 1 CA0 to CA7: CGRAM address CD1 to CD45: CGRAM data (5 · 7, 5 · 8, or 5 · 9 dot matrix display data) The bit CDn (where n is an integer between 1 and 45) corresponds to the 5 · 7, 5 · 8, or 5 · 9 dot matrix display data. The figure below shows that correspondence. When CDn is 1 the dots which correspond to that data will be turned on. Note: *16. CD1 to CD35: 5 · 7 dot matrix display data CD1 to CD40: 5 · 8 dot matrix display data CD1 to CD45: 5 · 9 dot matrix display data CA0 CA1 CA2 CA3 CA4 CA5 CA6 CA7 CD1 CD2 CD3 CD4 CD5 CD6 CD7 CD8 CD9 CD10 CD11 CD12 CD13 CD14 CD15 CD16 CD17 CD18 CD19 CD20 CD21 CD22 CD23 CD24 CD25 CD26 CD27 CD28 CD29 CD30 CD31 CD32 CD33 CD34 CD35 CD36 CD37 CD38 CD39 CD40 CD41 CD42 CD43 CD44 CD45 LSB Least significant bit MSB Most significant bit

Note that although the display contrast can be adjusted by operating the built-in display contrast adjustment circuit, it is also possible to apply fine adjustments to the contrast by connecting an external variable resistor to the VLCD 4 pin and modifying the VLCD 4 pin voltage. However, the following conditions must be met: (VLCD 0 – VLCD 4) ‡ 4.5 V, and 1.5 V ‡ V LCD 4 ‡ 0 V. No. 7142-18/43 LC75816E, 75816W

  • Set display contrast ... <Sets the display contrast> X: don’t care Code D48 D49 D50 D51 D52 D53 D54 D55 D56 D57 D58 D59 D60 D61 D62 D63 CT0 CT1 CT2 CT3 X X X X CTC X X X 1 0 0 0 CT0 to CT3: Sets the display contrast (11 steps) CT0 CT1 CT2 CT3 LCD drive 4/4 bias voltage supply VLCD 0 level 0 0 0 0 0.94 VLCD = VLCD – (0.03 VLCD · 2) 1 0 0 0 0.91 VLCD = VLCD – (0.03 VLCD · 3) 0 1 0 0 0.88 VLCD = VLCD – (0.03 VLCD · 4) 1 1 0 0 0.85 VLCD = VLCD – (0.03 VLCD · 5) 0 0 1 0 0.82 VLCD = VLCD – (0.03 VLCD · 6) 1 0 1 0 0.79 VLCD = VLCD – (0.03 VLCD · 7) 0 1 1 0 0.76 VLCD = VLCD – (0.03 VLCD · 8) 1 1 1 0 0.73 VLCD = VLCD – (0.03 VLCD · 9) 0 0 0 1 0.70 VLCD = VLCD – (0.03 VLCD · 10) 1 0 0 1 0.67 VLCD = VLCD – (0.03 VLCD · 11) 0 1 0 1 0.64 VLCD = VLCD – (0.03 VLCD · 12) CTC: Sets the display contrast adjustment circuit state CTC Display contrast adjustment circuit state 0 The display contrast adjustment circuit is disabled, and the VLCD 0 pin level is forced to the VLCD level. 1 The display contrast adjustment circuit operates, and the display contrast is adjusted.

No. 7142-19/43 LC75816E, 75816W

  • Set key scan output port/general-purpose output port state ... <Sets the key scan output port and general-purpose output port states> X: don’t care Code D48 D49 D50 D51 D52 D53 D54 D55 D56 D57 D58 D59 D60 D61 D62 D63 KC1 KC2 KC3 KC4 KC5 KC6 X X PC1 PC2 KP1 KP2 1 0 0 1 KC1 to KC6: Sets the key scan output pin KS1 to KS6 state Consider the case where the KS1/P1 and KS2/P2 output pins are set to function as key scan output ports. When KC1 to KC3 are set to 1 and KC4 to KC6 are set to 0, in the key scan standby state the KS1 to KS3 output pins will output the high level (V DD ) and KS4 to KS6 will output the low level (VSS). Note that key scan output signals are not output from output pins that are set to the low level. Output pin KS1 KS2 KS3 KS4 KS5 KS6 Key scan output state setting dataKC1 KC2 KC3 KC4 KC5 KC6 PC1, PC2: Sets the general-purpose output port P1, P2 state Consider the case where the KS1/P1 and KS2/P2 output pins are set to function as general-purpose output ports. When PC1 is set to 1 and PC2 is set to 0, the P1 output pin will output the high level (VDD ) and P2 will output the low level (VSS). Output pin P1 P2 General-purpose output port state setting dataPC1 PC2 Note: *17 KSn (n = 1, 2): Key scan output port Pn (n = 1, 2): General-purpose output port KP1, KP2: These bits switch the functions of the KS1/P1 and KS2/P2 output pins between the key scan output port and the general-purpose output port. KP1 KP2 Output pins Maximum number of Number of general- KS1/P1 KS2/P2 key inputs purpose output ports 0 0 KS1 KS2 30 0 1 0 P1 KS2 25 1 0 1 P1 P2 20 2

No. 7142-20/43 LC75816E, 75816W Serial Data Output

  • When CL is stopped at the low level CE A3A2A1A0B3B2B1B0 KD2KD1X SAKD30KD29KD28KD27 01000011 DO DI CL X: don't care Output data
  • When CL is stopped at the high level
  • B0 to B3, A0 to A3 : CCB address 43H
  • KD1 to KD30 : Key data
  • SA : Sleep acknowledge data Note: *18. If a key data read operation is executed when DO is high, the read key data (KD1 to KD30) and sleep acknowledge data(SA) will be invalid. Output data X: don't care CE A3A2A1A0B3B2B1B0 KD3KD2KD1X XSAKD30KD29KD28 01000011 DO DI CL

No. 7142-21/43 LC75816E, 75816W Output Data

  • KD1 to KD30 : Key data When a key matrix of up to 30 keys is formed from the KS1 to KS6 output pins and the KI1 to KI5 input pins and one of those keys is pressed, the key output data corresponding to that key will be set to 1. The table shows the relationship between those pins and the key data bits. When the KS1/P1 and KS2/P2 output pins are set to function as general-purpose output ports with the "set key scan output port/general-purpose output port state" instruction and a key matrix of up to 20 keys is formed from the KS3 to KS6 output pins and the KI1 to KI5 input pins, the KD1 to KD10 key data bits will be set to 0.
  • SA : Sleep acknowledge data This output data bit is set to the state when the key was pressed. Also, while DO will be low in this case, if serial data is input and the mode is set (to normal or sleep mode) during this period, that mode will be set. SA will be 1 in sleep mode and 0 in normal mode. KI1 KI2 KI3 KI4 KI5 KS1/P1 KD1 KD2 KD3 KD4 KD5 KS2/P2 KD6 KD7 KD8 KD9 KD10 KS3 KD11 KD12 KD13 KD14 KD15 KS4 KD16 KD17 KD18 KD19 KD20 KS5 KD21 KD22 KD23 KD24 KD25 KS6 KD26 KD27 KD28 KD29 KD30

No. 7142-22/43 LC75816E, 75816W

  • In normal mode
  • The pins KS1 to KS6 are set to high or low with the "set key scan output port/general-purpose output port state" instruction.
  • If a key on one of the lines corresponding to a KS1 to KS6 pin which is set high is pressed, a key scan is started and the keys are scanned until all keys are released. Multiple key presses are recognized by determining whether multiple key data bits are set.
  • If a key is pressed for longer than 4800T(s) (Where T= ) the LC75816E/W outputs a key data read request (a low level on DO) to the controller. The controller acknowledges this request and reads the key data. However, if CE is high during a serial data transfer, DO will be set high.
  • After the controller reads the key data, the key data read request is cleared (DO is set high) and the LC75816E/W performs another key scan. Also note that DO, being an open-drain output, requires a pull-up resistor (between 1 and 10 kΩ ). Key on 4608T[s] *19 *19 *19 *19 *19 *19 *19 *19 *19 *19 *19 KS4 KS5 KS6 KS3 KS2 *19KS1 T = 1 fosc DO DI Key address (43H) Key address Key address CE Key scan Key data read request Serial data transfer Serial data transfer Serial data transfer Key data read Key data read Key data read Key data read request Key data read request Key input 2 Key input 1 4800T[s] 4800T[s] 4800T[s] T= 1 fosc Note: *19. Not that the high/low states of these pins are determined by the "set key scan output port/general-purpose output port state" instruction,and that key scan output signals are not output from pins that are set to low. 1——fosc Key Scan Operation Functions
  • Key scan timing The key scan period is 2304T(s). To reliably determine the on/off state of the keys, the LC75816E/W scans the keys twice and determines that a key has been pressed when the key data agrees. It outputs a key data read request (a low level on DO) 4800T(s) after starting a key scan. If the key data dose not agree and a key was pressed at that point, it scans the keys again. Thus the LC75816E/W cannot detect a key press shorter than 4800T(s).

No. 7142-23/43 LC75816E, 75816W

  • In sleep mode
  • The pins KS1 to KS6 are set to high or low with the "set key scan output port/general-purpose output port state" instruction.
  • If a key on one of the lines corresponding to a KS1 to KS6 pin which is set high is pressed, the oscillator on the OSCI, OSCO pins is started and a key scan is performed. Keys are scanned until all keys are released. Multiple key presses are recognized by determining whether multiple key data bits are set.
  • If a key is pressed for longer than 4800T(s)(Where T= ) the LC75816E/W outputs a key data read request (a low level on DO) to the controller. The controller acknowledges this request and reads the key data. However, if CE is high during a serial data transfer, DO will be set high.
  • After the controller reads the key data, the key data read request is cleared (DO is set high) and the LC75816E/W performs another key scan. However, this dose not clear sleep mode. Also note that DO, being an open-drain output, requires a pull-up resistor (between 1 and 10 kΩ ).
  • Sleep mode key scan example Example: When a "display on/off control (SP = 1)" instruction and a "set key scan output port/general-purpose output port state (KP1 and KP2 = 0, KC1 to KC5 = 0, KC6 = 1)" instruction are executed. (i.e. sleep mode with only KS6 high.) Multiple Key Presses Although the LC75816E/W is capable of key scanning without inserting diodes for dual key presses, triple key presses on the KI1 to KI5 input pin lines, or multiple key presses on the KS1 to KS6 output pin lines, multiple presses other than these cases may result in keys that were not pressed recognized as having been pressed. Therefore, a diode must be inserted in series with each key. Applications that do not recognize multiple key presses of three or more keys should check the key data for three or more 1 bits and ignore such data. KI1 KI2 KI3 KI4 KI5 *20 "L"KS3 "H"KS6 "L"KS2 When any one of these keys is pressed, the oscillator on the OSCI, OSCO pins is started and the keys are scanned. "L"KS1 "L"KS4 "L"KS5 DO DI CE Key input (KS6 line) Key scan 4800T[s] 4800T[s] T = 1 fosc Key address (43H) Key address Serial data transfer Serial data transfer Serial data transfer Key data read Key data read Key data read request Key data read request 1——fosc Note: *20. These diodes are required to reliably recognize multiple key presses on the KS6 line when sleep mode state with only KS6 high, as in the above example. That is, these diodes prevent incorrect operations due to sneak currents in the KS6 key scan output signal when keys on the KS1 to KS5 lines are pressed at the same time.

No. 7142-24/43 LC75816E, 75816W 1/8 Duty, 1/4 Bias Drive Technique LCD driver output when all LCD segments corresponding to COM1 to COM8 are turned on VLCD3 VLCD4 VLCD4 VLCD2 VLCD1 VLCD0 VLCD4 VLCD3 VLCD3 VLCD2 VLCD2 VLCD1 VLCD1 VLCD0 VLCD0 COM8 COM2 COM1 VLCD4 VLCD3 VLCD2 VLCD1 VLCD0 VLCD4 VLCD3 VLCD2 VLCD1 VLCD0 VLCD4 VLCD3 VLCD2 VLCD1 VLCD0 VLCD4 VLCD3 VLCD2 VLCD1 VLCD0 f8T8 = When a "set display technique" instruction with FC = 0 is executed: f8 = When a "set display technique" instruction with FC = 1 is executed: f8 = fosc 3072 fosc 1536 LCD driver output when all LCD segments corresponding to COM1 to COM8 are turned off LCD driver output when only LCD segments corresponding to COM1 are turned on LCD driver output when only LCD segments corresponding to COM2 are turned on

No. 7142-25/43 LC75816E, 75816W 1/9 Duty, 1/4 Bias Drive Technique VLCD3 VLCD4 VLCD4 VLCD2 VLCD1 VLCD0 VLCD4 VLCD3 VLCD3 VLCD2 VLCD2 VLCD1 VLCD1 VLCD0 VLCD0 COM9 COM2 COM1 VLCD4 VLCD3 VLCD2 VLCD1 VLCD0 VLCD4 VLCD3 VLCD2 VLCD1 VLCD0 VLCD4 VLCD3 VLCD2 VLCD1 VLCD0 VLCD4 VLCD3 VLCD2 VLCD1 VLCD0 f9T9 = When a "set display technique" instruction with FC = 0 is executed: f9 = When a "set display technique" instruction with FC = 1 is executed: f9 = fosc 3456 fosc 1728 LCD driver output when all LCD segments corresponding to COM1 to COM9 are turned on LCD driver output when all LCD segments corresponding to COM1 to COM9 are turned off LCD driver output when only LCD segments corresponding to COM1 are turned on LCD driver output when only LCD segments corresponding to COM2 are turned on

No. 7142-26/43 LC75816E, 75816W 1/10 Duty, 1/4 Bias Drive Technique VLCD3 VLCD4 VLCD4 VLCD2 VLCD1 VLCD0 VLCD4 VLCD3 VLCD3 VLCD2 VLCD2 VLCD1 VLCD1 VLCD0 VLCD0 COM10 COM2 COM1 VLCD4 VLCD3 VLCD2 VLCD1 VLCD0 VLCD4 VLCD3 VLCD2 VLCD1 VLCD0 VLCD4 VLCD3 VLCD2 VLCD1 VLCD0 VLCD4 VLCD3 VLCD2 VLCD1 VLCD0 T10 f10T10 = When a "set display technique" instruction with FC = 0 is executed: f10 = When a "set display technique" instruction with FC = 1 is executed: f10 = T10 fosc 3840 fosc 1920 LCD driver output when all LCD segments corresponding to COM1 to COM10 are turned on LCD driver output when all LCD segments corresponding to COM1 to COM10 are turned off LCD driver output when only LCD segments corresponding to COM1 are turned on LCD driver output when only LCD segments corresponding to COM2 are turned on

No. 7142-27/43 LC75816E, 75816W Voltage Detection Type Reset Circuit (VDET) This circuit generates an output signal and resets the system when logic block power is first applied and when the voltage drops, i.e., when the logic block power supply voltage is less than or equal to the power down detection voltage VDET, which is 3.0V, typical. To assure that this function operates reliably, a capacitor must be added to the logic block power supply line so that the logic block power supply voltage V DD rise time when the logic block power is first applied and the logic block power supply voltage VDD fall time when the voltage drops are both at least 1 ms. (See Figure 3.) Power Supply Sequence The following sequences must be observed when power is turned on and off. (See Figure 3.)

  • Power on :Logic block power supply(V DD ) on fi LCD driver block power supply(VLCD ) on
  • Power off:LCD driver block power supply(VLCD ) off fi Logic block power supply(VDD ) off However, if the logic and LCD driver blocks use a shared power supply, then the power supplies can be turned on and off at the same time. System Reset 1. Reset function The LC75816E/W performs a system reset with the VDET. When a system reset is applied, the display is turned off, key scanning is disabled, the key data is reset, and the general-purpose output ports are set to and held at the low level (V SS). These states that are created as a result of the system reset can be cleared by executing the instruction described below. (See Figure 3.)
  • Clearing the display off state Display operation can be enabled by executing a “display on/off control” instruction. However, since the contents of the DCRAM, ADRAM, and CGRAM are undefined, applications must set the contents of these memories before turning on display with the “display on/off control” instruction. That is, applications must execute the following instructions.
  • Set display technique
  • DCRAM data write
  • ADRAM data write (If the ADRAM is used.)
  • CGRAM data write (If the CGRAM is used.)
  • Set AC address
  • Set display contrast (If the display contrast adjustment circuit is used.) After executing the above instructions, applications must turn on the display with a “display on/off control” instruction. Note that when applications turn off in the normal mode, applications must turn off the display with a “display on/off control” instruction or the INH pin.
  • Clearing the key scan disable and key data reset states Executing a "set key scan output port/general-purpose output port state" instruction not only creates a state in which key scanning can be performed, but also clears the key data reset.
  • Clearing the general-purpose output ports locked at the low level (V SS) state Executing a "set key scan output port/general-purpose output port state" instruction clears the general-purpose output ports locked at the low level (V SS) state and sets the states of the general-purpose output ports.

No. 7142-28/43 LC75816E, 75816W VDETVDET t3 t4t1 t2 VDD VLCD Can be set to either the high (VDD ), or low (VSS ) levelFixed at the low level (VSS )

  • t1 ‡ 1 ms (Logic block power supply voltage VDD rise time)
  • t2 ‡ 0 ms
  • t3 ‡ 0 ms
  • t4 ‡ 1 ms (Logic block power supply voltage VDD fall time)
  • Initial state settings Set display technique DCRAM data write ADRAM data write (If the ADRAM is used.) CGRAM data write (If the CGRAM is used.) Set AC address Set display contrast (If the display contrast adjustment circuit is used.) Instruction execution Key scan General-purpose output ports Display state Initial state settings Disabled Execution enabled Display off Display on Display off “Set key scan output port/general-purpose output port state” instruction execution “Display on/off control” instruction execution (Turning the display on) ”Display on/off control“ instruction execution (Turning the display off) Figure 3

No. 7142-29/43 LC75816E, 75816W 2. Block states during a system reset (1) CLOCK GENERATOR, TIMING GENERATOR When a reset is applied, the oscillator on the OSCI, OSCO pins is started forcibly. This generates the base clock and enables instruction execution. (2) INSTRUCTION REGISTER, INSTRUCTION DECODER When a reset is applied, these circuits are forcibly initialized internally. Then, when instruction execution starts, the IC operates according to those instructions. (3) ADDRESS REGISTER, ADDRESS COUNTER When a reset is applied, these circuits are forcibly initialized internally. Then, the DCRAM and the ADRAM addresses are set when “Set AC address” instruction is executed. (4) DCRAM, ADRAM, CGRAM Since the contents of the DCRAM, ADRAM, and CGRAM become undefined during a reset, applications must execute “DCRAM data write”, “ADRAM data write (If the ADRAM is used.)”, and “CGRAM data write (If the CGRAM is used.)” instructions before executing a “display on/off control” instruction. (5) CGROM Character patterns are stored in this ROM. (6) LATCH Although the value of the data in the latch is undefined during a reset, the ADRAM, CGROM, and CGRAM data is stored by executing a “display on/off control” instruction. (7) COMMON DRIVER, SEGMENT DRIVER These circuits are forced to the display off state when a reset is applied. (8) CONTRAST ADJUSTER Display contrast adjustment circuit operation is disabled when a reset is applied. After that, the display contrast can be set by executing a “set display contrast” instruction. (9) KEY SCAN, KEY BUFFER When a reset is applied, these circuits are forcibly initialized internally, and key scan operation is disabled. Also, the key data is all set to 0. After that, key scanning can be performed by executing a "set key scan output port/general- purpose output port state" instruction. (10) CCB INTERFACE, SHIFT REGISTER These circuits go to the serial data input wait state.

No. 7142-30/43 LC75816E, 75816W S65/COM9 ADRAM bits CGRAM × ×5 9 16 bits VDET CLOCK GENERATOR CONTRAST ADJUSTER TIMING GENERATOR ADDRESS REGISTER INSTRUCTION REGISTER COMMON DRIVER INSTRUCTION DECODER ADDRESS COUNTER DCRAM 52 8 bits CGROM 5 9 240 bits S H I F T R E G I S T E R L A T C H S E G M E N T D R I V E R OSCI OSCO INH DO DI P1/KS1 P2/KS2 KS3 KS4 KS5 KS6 CE KI1 KI2 KI3 KI4 KI5 CL S63 COM8 COM1 S64/COM10 KEY BUFFERCCB INTERFACE KEY SCAN VDD VLCD4 VLCD3 VLCD2 VLCD1 VLCD VLCD0 VSS TEST × × Blocks that are reset 3. Output pin states during the reset period Notes:*21. These output pins are forcibly set to the segment output function and held at the low level (VLCD 4). However, when a “set display technique” instruction is executed, the segment output or the common output function is selected as specified by that instruction. *22. These output pins are forcibly set to the general-purpose output port function and held at the low level (VSS ). However, when a "set key scan output port/general-purpose output port state" instruction has been executed, the key scan output port or general-purpose output port function will be selected as specified by that instruction. *23. Since this output pin is an open-drain output, a pull-up resistor (between 1 kΩ and 10 kΩ ) is required. This pin is held at the high level even if a key data read operation is performed before executing a "set key scan output port/general-purpose output port state" instruction. Output pin State during reset S1 to S63 L (VLCD 4) S64/COM10, S65/COM9 L (VLCD 4)*21 COM1 to COM8 L (VLCD 4) KS1/P1, KS2/P2 L (VSS )*22 KS3 to KS6 L (VSS ) DO H *23

No. 7142-31/43 LC75816E, 75816W Sample Application Circuit 1 1/8 duty, 1/4 bias drive technique (for use with normal panels) COM9/S65 COM10/S64 S63 S62 S61 S10 COM8 COM7 COM6 COM5 COM4 COM3 COM2 COM1 CCC +8V +5V INH CE CL DO DI OSCO OSCI VLCD4 VLCD3 VLCD2 VLCD1 OPEN VLCD VLCD0 VSS TEST VDD K S K P P S K S K S K S K S K I K I K I K I K I Notes:*24. Add a capacitor to the logic block power supply line so that the logic block power supply voltage VDD rise time when power is applied and the logic block power supply voltage VDD fall time when power drops are both at least 1 ms, as the LC75816E/W is reset by the VDET. *25. If a variable resistor is not used for display contrast fine adjustment, the VLCD 4 pin must be connected to ground. *26. If the function of INH pin is not used, the INH pin must be connected to the logic block power supply VDD . *27. The DO pin, being an open-drain output, requires a pull-up resistor. Select a resistance (between 1 to 10 kΩ ) appropriate for the capacitance of the external wiring so that signal waveforms are not degraded. *24 *25 *26 C ‡ 0.047 µF From the controller To the controller To the controller power supply Key matrix (up to 30 keys) (general-purpose output ports) used with the backlight controller or other circuit LCD panel *27

No. 7142-32/43 LC75816E, 75816W Sample Application Circuit 2 1/8 duty, 1/4 bias drive technique (for use with large panels) S63 S62 S61 S10 COM8 COM7 COM6 COM5 COM4 COM3 COM2 COM1 R R R RCCC +8V +5V INH CE CL DO DI OSCO OSCI VLCD4 VLCD3 VLCD2 VLCD1 VLCD VLCD0 VSS TEST VDD K S K S K S K S K S K S K I K I K I K I K I COM9/S65 COM10/S64 *24 *25 *26 C ‡ 0.047 µF 10 kΩ ‡ R ‡ 2.2 kΩ From the controller To the controller To the controller power supply Key matrix (up to 30 keys) (general-purpose output ports) used with the backlight controller or other circuit *27 LCD panel Notes:*24. Add a capacitor to the logic block power supply line so that the logic block power supply voltage VDD rise time when power is applied and the logic block power supply voltage VDD fall time when power drops are both at least 1 ms, as the LC75816E/W is reset by the VDET. *25. If a variable resistor is not used for display contrast fine adjustment, the VLCD 4 pin must be connected to ground. *26. If the function of INH pin is not used, the INH pin must be connected to the logic block power supply VDD . *27. The DO pin, being an open-drain output, requires a pull-up resistor. Select a resistance (between 1 to 10 kΩ ) appropriate for the capacitance of the external wiring so that signal waveforms are not degraded.

No. 7142-33/43 LC75816E, 75816W Sample Application Circuit 3 1/9 duty, 1/4 bias drive technique (for use with normal panels) S63 S62 S61 S10 S65/COM9 COM8 COM7 COM6 COM5 COM4 COM3 COM2 COM1 CCC +8V +5V INH CE CL DO DI OSCO OSCI VLCD4 VLCD3 VLCD2 VLCD1 OPEN VLCD VLCD0 VSS TEST VDD K S K S K S K S K S K S K I K I K I K I K I COM10/S64 P P *24 *25 *26 C ‡ 0.047 µF From the controller To the controller To the controller power supply Key matrix (up to 30 keys) (general-purpose output ports) used with the backlight controller or other circuit *27 LCD panel Notes:*24. Add a capacitor to the logic block power supply line so that the logic block power supply voltage VDD rise time when power is applied and the logic block power supply voltage VDD fall time when power drops are both at least 1 ms, as the LC75816E/W is reset by the VDET. *25. If a variable resistor is not used for display contrast fine adjustment, the VLCD 4 pin must be connected to ground. *26. If the function of INH pin is not used, the INH pin must be connected to the logic block power supply VDD . *27. The DO pin, being an open-drain output, requires a pull-up resistor. Select a resistance (between 1 to 10 kΩ ) appropriate for the capacitance of the external wiring so that signal waveforms are not degraded.

No. 7142-34/43 LC75816E, 75816W Sample Application Circuit 4 1/9 duty, 1/4 bias drive technique (for use with large panels) S63 S62 S61 S10 S65/COM9 COM8 COM7 COM6 COM5 COM4 COM3 COM2 COM1 R R R RCCC +8V +5V INH CE CL DO DI OSCO OSCI VLCD4 VLCD3 VLCD2 VLCD1 VLCD VLCD0 VSS TEST VDD K S K S K S K S K S K S K I K I K I K I K I COM10/S64 *24 *25 *26From the controller To the controller To the controller power supply Key matrix (up to 30 keys) (general-purpose output ports) used with the backlight controller or other circuit *27 LCD panel C ‡ 0.047 µF 10 kΩ ‡ R ‡ 2.2 kΩ Notes:*24. Add a capacitor to the logic block power supply line so that the logic block power supply voltage VDD rise time when power is applied and the logic block power supply voltage VDD fall time when power drops are both at least 1 ms, as the LC75816E/W is reset by the VDET. *25. If a variable resistor is not used for display contrast fine adjustment, the VLCD 4 pin must be connected to ground. *26. If the function of INH pin is not used, the INH pin must be connected to the logic block power supply VDD . *27. The DO pin, being an open-drain output, requires a pull-up resistor. Select a resistance (between 1 to 10 kΩ ) appropriate for the capacitance of the external wiring so that signal waveforms are not degraded.

No. 7142-35/43 LC75816E, 75816W Sample Application Circuit 5 1/10 duty, 1/4 bias drive technique (for use with normal panels) S62 S61 S10 S64/COM10 S65/COM9 COM8 COM7 COM6 COM5 COM4 COM3 COM2 COM1 CCC +8V +5V INH CE CL DO DI OSCO OSCI VLCD4 VLCD3 VLCD2 VLCD1 OPEN VLCD VLCD0 VSS TEST VDD K S K S K S K S K S K S K I K I K I K I K I S63 P P *24 *25 *26From the controller To the controller To the controller power supply Key matrix (up to 30 keys) (general-purpose output ports) used with the backlight controller or other circuit *27 LCD panel C ‡ 0.047 µF Notes:*24. Add a capacitor to the logic block power supply line so that the logic block power supply voltage VDD rise time when power is applied and the logic block power supply voltage VDD fall time when power drops are both at least 1 ms, as the LC75816E/W is reset by the VDET. *25. If a variable resistor is not used for display contrast fine adjustment, the VLCD 4 pin must be connected to ground. *26. If the function of INH pin is not used, the INH pin must be connected to the logic block power supply VDD . *27. The DO pin, being an open-drain output, requires a pull-up resistor. Select a resistance (between 1 to 10 kΩ ) appropriate for the capacitance of the external wiring so that signal waveforms are not degraded.

No. 7142-36/43 LC75816E, 75816W Sample Application Circuit 6 1/10 duty, 1/4 bias drive technique (for use with large panels) S63 S62 S61 S10 S64/COM10 S65/COM9 COM8 COM7 COM6 COM5 COM4 COM3 COM2 COM1 R R R RCCC +8V +5V INH CE CL DO DI OSCO OSCI VLCD4 VLCD3 VLCD2 VLCD1 VLCD VLCD0 VSS TEST VDD K K K K K K K K K K K *24 *25 *26From the controller To the controller To the controller power supply Key matrix (up to 30 keys) (general-purpose output ports) used with the backlight controller or other circuit *27 LCD panel C ‡ 0.047 µF 10 kΩ ‡ R ‡ 2.2 kΩ Notes:*24. Add a capacitor to the logic block power supply line so that the logic block power supply voltage VDD rise time when power is applied and the logic block power supply voltage VDD fall time when power drops are both at least 1 ms, as the LC75816E/W is reset by the VDET. *25. If a variable resistor is not used for display contrast fine adjustment, the VLCD 4 pin must be connected to ground. *26. If the function of INH pin is not used, the INH pin must be connected to the logic block power supply VDD . *27. The DO pin, being an open-drain output, requires a pull-up resistor. Select a resistance (between 1 to 10 kΩ ) appropriate for the capacitance of the external wiring so that signal waveforms are not degraded.

No. 7142-37/43 LC75816E, 75816W Sample Correspondence between Instructions and the Display (When the LC75816-8722 is used) No. LSB Instruction (hexadecimal) MSB Display Operation D40 to D43 D44 to D47 D48 to D51 D52 to D55 D56 to D59 D60 to D63 Power application Initializes the IC. (Initialization with the VDET.) The display is in the off state. Set display technique Sets to 1/8 duty 1/4 bias display drive technique 0 8 DCRAM data write (increment mode) Writes the display data “ ” to DCRAM address 00H 0 2 0 0 1 A DCRAM data write (increment mode) Writes the display data “S” to DCRAM address 01H 3 5 DCRAM data write (increment mode) Writes the display data “A” to DCRAM address 02H 1 4 DCRAM data write (increment mode) Writes the display data “N” to DCRAM address 03H E 4 DCRAM data write (increment mode) Writes the display data “Y” to DCRAM address 04H 9 5 DCRAM data write (increment mode) Writes the display data “O” to DCRAM address 05H F 4 DCRAM data write (increment mode) Writes the display data “ ” to DCRAM address 06H 0 2 DCRAM data write (increment mode) Writes the display data “L” to DCRAM address 07H C 4 DCRAM data write (increment mode) Writes the display data “S” to DCRAM address 08H 3 5 DCRAM data write (increment mode) Writes the display data “I” to DCRAM address 09H 9 4 DCRAM data write (increment mode) Writes the display data “ ” to DCRAM address 0AH 0 2 DCRAM data write (increment mode) Writes the display data “L” to DCRAM address 0BH C 4 DCRAM data write (increment mode) Writes the display data “C” to DCRAM address 0CH 3 4 DCRAM data write (increment mode) Writes the display data “7” to DCRAM address 0DH 7 3 DCRAM data write (increment mode) Writes the display data “5” to DCRAM address 0EH 5 3 DCRAM data write (increment mode) Writes the display data “8” to DCRAM address 0FH 8 3 DCRAM data write (increment mode) Writes the display data “1” to DCRAM address 10H 1 3 DCRAM data write (increment mode) Writes the display data “6” to DCRAM address 11H 6 3 DCRAM data write (increment mode) Writes the display data “ ” to DCRAM address 12H 0 2 0 A Continued on next page.

No. 7142-38/43 LC75816E, 75816W Continued from preceding page. Note: *28. This sample above assumes the use of 13 digits 5 · 7 dot matrix LCD. CGRAM and ADRAM are not used. X: don’t care No. LSB Instruction (hexadecimal) MSB Display Operation D40 to D43 D44 to D47 D48 to D51 D52 to D55 D56 to D59 D60 to D63 Set AC address Loads the DCRAM address 00H and the ADRAM 0 0 0 2 address 0H into AC Display on/off control Turns on the LCD for all digits (13 digits) in MDATA F F F 1 1 4 Display shift Shifts the display (MDATA only) to the left 1 C Display shift Shifts the display (MDATA only) to the left 1 C Display shift Shifts the display (MDATA only) to the left 1 C Display shift Shifts the display (MDATA only) to the left 1 C Display shift Shifts the display (MDATA only) to the left 1 C Display shift Shifts the display (MDATA only) to the left 1 C Display on/off control Set to sleep mode, turns off the LCD for all digits 0 0 0 0 8 4 Display on/off control Turns on the LCD for all digits (13 digits) in MDATA F F F 1 1 4 Set AC address Loads the DCRAM address 00H and the ADRAM 0 0 0 2 address 0H into AC S A N Y O L S I L C S A N Y O L S I L C 7 A N Y O L S I L C 7 5 N Y O L S I L C 7 5 8 Y O L S I L C 7 5 8 1 O L S I L C 7 5 8 1 6 L S I L C 7 5 8 1 6 L S I L C 7 5 8 1 6 S A N Y O L S I L C

No. 7142-39/43 LC75816E, 75816W Notes on the controller key data read techniques 1. Timer based key data acquisition

  • Flowchart
  • Timing chart t5: Key scan execution time when the key data agreed for two key scans. (4800T(s)) t6: Key scan execution time when the key data did not agree for two key scans and the key scan was executed again. (9600T(s)) t7: Key address (43H) transfer time t8: Key data read time
  • Explanation In this technique, the controller uses a timer to determine key on/off states and read the key data. The controller must check the DO state when CE is low every t9 period without fail. If DO is low, the controller recognizes that a key has been pressed and executes the key data read operation. The period t9 in this technique must satisfy the following condition. t9>t6+t7+t8 If a key data read operation is executed when DO is high, the read key data (KD1 to KD30) and sleep acknowledge data (SA) will be invalid. 1T = ——— fosc YES NODO = L Key data read processing CE = L DO DI CE Key input Key scan Key onKey on t9t9t9t9 t8 t8 t7 t7 Key address Key data read Key data read request Controller determination (Key on) Controller determination (Key on) Controller determination (Key off) Controller determination (Key on) Controller determination (Key off)

No. 7142-40/43 LC75816E, 75816W 2. Interrupt based key data acquisition

  • Flowchart
  • Timing chart t5: Key scan execution time when the key data agreed for two key scans. (4800T(s)) t6: Key scan execution time when the key data did not agree for two key scans and the key scan was executed again. (9600T(s)) t7: Key address (43H) transfer time t8: Key data read time YES YES NODO = L Key data read processing Wait for at least t10 CE = L DO = H CE = L Key off NO DO DI CE Key input Key scan Key onKey on t10t10 t10t10 t5 t6 t8 t8 t7 t7 1T = ——— fosc Key address Key data read Controller determination (Key on) Controller determination (Key off) Controller determination (Key on) Controller determination (Key on) Controller determination (Key on) Controller determination (Key off) Key data read request

No. 7142-41/43 LC75816E, 75816W

  • Explanation In this technique, the controller uses interrupts to determine key on/off states and read the key data. The controller must check the DO state when CE is low. If DO is low, the controller recognizes that a key has been pressed and executes the key data read operation. After that the next key on/off determination is performed after the time t10 has elapsed by checking the DO state when CE is low and reading the key data. The period t10 in this technique must satisfy the following condition. t10 > t6 If a key data read operation is executed when DO is high, the read key data (KD1 to KD30) and sleep acknowledge data (SA) will be invalid.

No. 7142-42/43 LC75816E, 75816W Upper 4bitsLower 4bits LC75816-8722 Character Font (Standard)

PS No. 7142-43/43 LC75816E, 75816W This catalog provides information as of February, 2002. Specifications and information herein are subject to change without notice. Specifications of any and all SANYO products described or contained herein stipulate the performance, characteristics,and functions of the described products in the independent state,and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’s products or equipment. SANYO Electric Co., Ltd. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with some probability. It is possible that these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. In the event that any or all SANYO products (including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from the authorities concerned in accordance with the above law. No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of SANYO Electric Co., Ltd. Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. When designing equipment, refer to the “Delivery Specification” for the SANYO product that you intend to use. Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for volume production. SANYO believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties.