LBC817-25WT1G LRC | Alldatasheet

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Technical content

General Purpose Transistors MAXIMUM RATINGS Rating Symbol V alue Unit Collector–Emitter Voltage V CEO 45 V Collector–Base Voltage V CBO 50 V Emitter–Base Voltage V EBO 5.0 V Collector Current — Continuous I C 500 mAdc THERMAL CHARACTERISTICS DEVICE MARKING W

ELECTRICAL CHARACTERISTICS

A = 25°C unless otherwise noted.) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Collector–Emitter Breakdown Voltage C = 10 mA) V (BR)CEO 45 — — V Collector–Emitter Breakdown Voltage EB = 0, I C = 10 µA) V (BR)CES 50 — — V Emitter–Base Breakdown Voltage E = 1.0 µA) V (BR)EBO 5.0 — — V Collector Cutoff Current I CBO CB = 20 V) — — 100 nA CB = 20 V, T A LBC817-25 W T1G SC-70 EMITTER COLLECTOR BASE LESHAN RADIO COMPANY, LTD. We declare that the material of product compliance with RoHS requirements. LBC817–25 T1G = 6B Characteristic Symbol Max Unit Total Device Dissipation FR- 5 Board (1) P D 150 mW T A =25 °C Derate above 25°C 1.2 mW/°C Thermal Resistance, Junction to Ambient R θJA 833 °C/W Total Device Dissipation P D 200 mW Alumina Substrate, (2) T A = 25°C Derate above 25°C 1.6 mW/°C Thermal Resistance, Junction to Ambient R θJA 625 °C/W Junction and Storage Temperature T J , T stg –55 to +150 Rev.O 1/3

A = 25°C unless otherwise noted) (Continued) Characteristic Symbol Min Typ Max Unit ON CHARACTERISTICS FE C = 100 mA, V CE = 1.0 V) 160 — 400 Collector–Emitter Saturation Voltage V CE(sat) — — 0.7 V C = 500 mA, I B = 50 mA) Base–Emitter On Voltage V BE(on) — — 1.2 V ( I C = 500 mA, V CE = 1.0 V) SMALL–SIGNAL CHARACTERISTICS Current–Gain — Bandwidth Product f T 100 — — MHz( I C = 10 mA, V CE = 5.0 V dc , f = 100 MHz) Output Capacitance C obo —1 0 — p F CB = 10 V, f = 1.0 MHz)

ORDERING INFORMATION

LBC817-25WT1G 6B 3000/Tape&Reel LBC817-25WT3G 6B 10000/Tape&Reel LESHAN RADIO COMPANY, LTD. DC Current Gain h LBC817-25 W T1G Rev.O 2/3

LESHAN RADIO COMPANY, LTD. LBC817-25 W T1G SC−70 (SOT−323) A A2 D b e E c L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 0.05 (0.002) 1.9 0.075 0.65 0.025 0.65 0.025 0.9 0.035 0.7 0.028 mm inches SCALE 10:1 XX M XX = Specific Device Code M = Date Code = Pb−Free Package GENERIC MARKING DIAGRAM *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ ”, may or may not be present. SOLDERING FOOTPRINT* H E DIM A MIN NOM MAX MIN MILLIMETERS 0.80 0.90 1.00 0.032 INCHES A1 0.00 0.05 0.10 0.000 A2 0.7 REF b 0.30 0.35 0.40 0.012 c 0.10 0.18 0.25 0.004 D 1.80 2.10 2.20 0.071 E 1.15 1.24 1.35 0.045 e 1.20 1.30 1.40 0.047 0.035 0.040 0.002 0.004 0.014 0.016 0.007 0.010 0.083 0.087 0.049 0.053 0.051 0.055 NOM MAX L 2.00 2.10 2.40 0.079 0.083 0.095 H E e1 0.65 BSC

0.425 REF

0.028 REF

0.026 BSC

0.017 REF

Rev.O 3/3