LBAW56DW1T1G LRC | Alldatasheet
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Characteristic Symbol Ma x Unit Total Device Dissipation FR– 4 Board, (1) P D 200 mW T A = 25°C Derate above 25°C 1.6 mW/°C Thermal Resistance, Junction to Ambient R θJA 600 °C/W Total Device Dissipation P D 300 mW FR-4 Board(2), T A = 25°C Derate above 25°C 2.4 mW/°C Thermal Resistance, Junction to Ambient R θJA 400 °C/W Junction and Storage Temperature T J stg –55 to +150 °C SOT 363/SC-88 Rev.A 1/3 S-LBAW56DW1T1G LBAW56DW1T1G S- Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable. z S-LBAW56DW1T1G S-LBAW56DW1T3G
LESHAN RADIO COMPANY, LTD. PACKAGE DIMENSIONS ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ SC–88 (SOT–363) ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ 0.5 mm (min) 0.4 mm (min) 0.65 mm 0.65 mm 1.9 mm NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A MIN MAX MIN MAX MILLIMETERS 1.80 2.200.071 0.087 INCHES B 1.15 1.350.045 0.053 C 0.80 1.100.031 0.043 D 0.10 0.300.004 0.012 G 0.65 BSC0.026 BSC J 0.10 0.250.004 0.010 K 0.10 0.300.004 0.012 N 0.20 REF0.008 REF S 2.00 2.200.079 0.087 V 0.30 0.400.012 0.016 B 0.2 (0.008) MM 123 A G V S H C N J K 654 –B– D 6 PL Rev.A 3/3 LBAW56DW1T1G, S-LBAW56DW1T1G