L74VHC1G00 LRC | Alldatasheet
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LESHAN RADIO COMPANY, LTD. 2–Input NAND Gate d L74VHC1G00 d SOT–23/TSOP–5/SC–59 DT SUFFIX The L74VHC1G00 is an advanced high speed CMOS 2–input NAND gate fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation. The internal circuit is composed of multiple stages, including a buffer output which provides high noise immunity and stable output. The L74VHC1G00 input structure provides protection when voltages up to 7 V are applied, regardless of the supply voltage. This allows the L74VHC1G0 0 to be used to interface 5 V circuits to 3 V circuits. High Speed: t PD = 3.0 ns (Typ) at V CC = 5 V Low Power Dissipation: I CC = 2 mA (Max) at T A = 25°C Power Down Protection Provided on Inputs Balanced Propagation Delays Pin and Function Compatible with Other Standard Logic Families SC–70/SC–88A/SOT–353 DF SUFFIX MARKING DIAGRAMS Pin 1 d = Date Code Pin 1 d = Date Code Figure 1. Pinout (Top View) Figure 2. Logic Symbol
1 IN B
2 IN A
3 GND
4 OUT Y
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet.
implied. Functional operation should be restricted to the Recommended Operating Conditions.
- Measured with minimum pad spacing on an FR4 board, using 10 mm–by–1 inch, 2–ounce copper trace with no air flow.
- Tested to EIA/JESD22–A114–A.
- Tested to EIA/JESD22–A115–A.
Figure 3. Failure Rate vs. Time Junction Temperature
0.3 V C
0.5 V C
Figure 4. Switching Waveforms Figure 5. Test Circuit *Includes all probe and jig capacitance. for propagation delay tests.
LESHAN RADIO COMPANY, LTD. DEVICE ORDERING INFORMATION L74VHC1G00 Device Nomenclature Device Order Number Logic Circuit Indicator Temp Range Identifier Technology Device Function Package Suffix Tape and Reel Suffix Package Type (Name/SOT#/ Common Name) Tape and Reel Size L74VHC1G00DFT 1 L
74 VHC1G 00 DF T1 S
C–70/SC–88A/ 1 78 mm (7 in) SOT–353
3000 Unit
SC–70/SC–88A/ 178 mm (7 in) SOT–353 SOT–23/TSOP–5/ 178 mm (7 in) SC– 59
LESHAN RADIO COMPANY, LTD. L74VHC1G0 0 PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM A MIN MAX MIN MAX MILLIMETERS 1.80 2.200.071 0.087 INCHES B 1.15 1.350.045 0.053 C 0.80 1.100.031 0.043 D 0.10 0.300.004 0.012 G 0.65 BSC0.026 BSC J 0.10 0.250.004 0.010 K 0.10 0.300.004 0.012 N 0.20 REF0.008 REF S 2.00 2.200.079 0.087 B 0.2 (0.008) MM 12 3 A G S D 5 PL H C N J K −B− SC70−5/SC−88A/SOT−353 DF SUFFIX SOLDERING FOOTPRINT* mm inches SCALE 20:1 0.65 0.025 0.65 0.025 0.50 0.0197 0.40 0.0157 1.9 0.0748
LESHAN RADIO COMPANY, LTD. L74VHC1G0 0 PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERAG PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. A AND B DIMENSIONS DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM MIN MAX MIN MAX INCHESMILLIMETERS A 2.90 3.10 0.1142 0.1220 B 1.30 1.70 0.0512 0.0669 C 0.90 1.10 0.0354 0.0433 D 0.25 0.50 0.0098 0.0197 G 0.85 1.05 0.0335 0.0413 H 0.013 0.100 0.0005 0.0040 J 0.10 0.26 0.0040 0.0102 K 0.20 0.60 0.0079 0.0236 L 1.25 1.55 0.0493 0.0610 M 0 10 0 10 S 2.50 3.00 0.0985 0.1181 0.05 (0.002) 12 3 S A G L B D H C K M J __ _ _ SOT23−5/TSOP−5/SC59−5 DT SUFFIX 0.7 0.028 1.0 0.039 mm inches SCALE 10:1 0.95 0.037 2.4 0.094 1.9 0.074 SOLDERING FOOTPRINT*