L1SS400GT1G LRC | Alldatasheet
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LESHAN RADIO COMPANY, LTD. SOD - 723 L1SS400GT1G ANODE CATHODE ABSOLUTE MAXIMUM RATINGS (Ta = 25°C) Parameter Symbol Limits Unit Peak reverse voltage V RM 90 V DC reverse voltage V R 80 V Peak forward current I FM 225 mA Mean rectifying current I O 100 mA Surge current (1s) I surge 500 mA Junction temperature Tj 125 °C Storage temperature T stg – 55 ~ +125 °C Switching diode Applications High speed switching Features 1) Extremely small surface mounting type. 2) High Speed. 3) High reliability. Construction Silicon epitaxial planar ELECTRICAL CHARACTERISTICS (Ta = 25°C) Parameter Symbol Min. Typ. Max. Unit Conditions Forward voltage V F – – 1.2 V I F =100mA Reverse current I R – – 0.1 µ AV R =80V Capacitance between terminals C T – 0.72 3.0 pF V R =0.5V , f=1MHz Reverse recovery time t rr – – 4 n s V R =6V , I F =10mA , R L =100 Device Marking L1SS400GT1G=3 Device Marking Shipping 3000/Tape&Reel L1SS400GT3G 3 10000/Tape&Reel L1SS400GT1G 3 ORDRING INFORMATION We declare that the material of product compliance with RoHS requirements.
LESHAN RADIO COMPANY, LTD. L1SS400GT1G 100m 10m 100µ 10µ FORWARD VOLTAGE : V F (V) Fig.1 Forward characteristics 0.5 0.2 0.1 ELECTRICAL CHARACTERISTIC CURVES (Ta = 25°C) FORWARD CURRENT : I F (A) 0.1m 10µ 100n 10n 0 20 40 60 80 100 120 REVERSE VOLTAGE : V R (V) Fig.3 Capacitance between terminals REVERSE VOLTAGE : V R (V) Fig.2 Reverse characteristics REVERSE CURRENT : I R (A) 02 46 81 01 21 4 0.1 1 10 100 1000 10,000 CAPACITANCE BETWEEN TERMINALS : C T (pF) REVERSE RECOVERY TIME : t rr (ns) FORWARD CURRENT : I F (mA) Fig.4 Reverse recovery time characteristics 100 01 02 0 3 0 SURGE CURRENT : I surge (A) PULSE WIDTH : T W (ms) Fig.5 Surge current characteristics PULSE GENERATOR OUTPUT 50 Ω SAMPLING OSCILLOSCOPE 50Ω Fig.6 Reverse recovery time (t rr measurement circuit 5kΩ 0.01µF D.U.T.
LESHAN RADIO COMPANY, LTD. L1SS400GT1G SOD−723 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. DIM MIN NOM MAX MILLIMETERS A 0.49 0.52 0.55 b 0.25 0.28 0.32 c 0.08 0.12 0.15 D 0.95 1.00 1.05 E 0.55 0.60 0.65 1.35 1.40 1.45 L 0.15 0.20 0.25 H E 0.019 0.020 0.022 0.0098 0.011 0.013 0.0032 0.0047 0.0059 0.037 0.039 0.041 0.022 0.024 0.026 0.053 0.055 0.057 0.006 0.0079 0.010 MIN NOM MAX INCHES D E b c A L −Y− −X− 0.08 (0.0032) XY H E 0.45 0.0177 0.50 0.0197 1.1 0.043 /C0466 mm inches /C0467 SCALE 10:1 SOLDERING FOOTPRINT*