KTU1000 KINETIC | Alldatasheet

Document overview

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  • PDF pages: 13

Technical content

Features

  • Operating Range: 2.7V to 5.5V
  • USB Hi-Speed Dual SPDT Switch
  • >1GHz -3db Bandwidth
  • Low 3.8Ω Switch On-Resistance
  • Typical 2.0pF Switch On-Capacitance
  • Overvoltage Protection Up to +20V
  • Surge Protection Up to +25V
  • FLAG̅̅̅̅̅̅̅̅ open drain output overvoltage indicator
  • EN̅̅̅̅ to disable switch output
  • WLCSP34-12 package (1.17mm x 1.57mm)
  • -40°C to +85°C Temperature Range

Applications

  • Smartphones
  • USB Type-C
  • Mobile Internet Devices
  • Tablet Computers
  • Peripherals Brief Description The KTU1000 is a Hi -Speed USB dual SPDT (single - pole/double-throw) switch with overvoltage protection. This device operates over a 2.7V to 5.5V input supply range with over voltage fault protection up to 20V. USB Type-C features high voltage charging where the KTU1000 protects USB data lines from short circuit and surge events that can permanently damage the mobile system. The device features independent control bits for each switch pair and an on/off enable ( EN̅̅̅̅) for shutdown mode. Additional features include low switch on resistance and capacitance along with a fault fl ag ( FLAG̅̅̅̅̅̅̅̅) to alert the system processor to overvoltage fault events. The KTU1000 has low power consumption and is available in an ultra -small 12 -Bump 1. 17mm x 1. 57mm WLCSP package making it an ideal solution for USB interface switching and protection in mobile applications. Typical Application KTU1000 D+/D− Switches Interface Logic COM1 COM2USB PORT VBUS NC2 NO1 NO2 EN CB1 CB2 FLAG

USB Hi-Speed Switch with Fault Protection

August 2020 - Revision 04d Page 2 Company Confidential Pin Descriptions Pin # Name Function A1 CB1 Digital Control Input 1 A2 COM2 Common Terminal for I/O Switch 1 (Connect to D+ or D-) A3 COM1 Common Terminal for I/O Switch 2 (Connect to D- or D+) A4 FLAG̅̅̅̅̅̅̅̅ Active low fault flag output signal to alert fault event B1 VCC Input Supply Voltage input pin B2 CB2 Digital Control Input 2 B3 GND Ground. Connect this pin to system ground. B4 EN̅̅̅̅ Active low enable input. Drive EN to a logic high level to disable the device and place switches to a high impedance state. C1 NO2 Normally Open Terminal for USB I/O Switch 2 C2 NO1 Normally Open Terminal for USB I/O Switch 1 C3 NC2 Normally Closed Terminal for USB I/O Switch 2 C4 NC1 Normally Closed Terminal for USB I/O Switch 1 WLCSP34-12 12-Bump 1.17mm x 1.57mm x 0.62mm Top Mark WW = Device ID Code, XX = Date Code, YY = Assembly Code, ZZZZ = Serial Number TOP VIEW TOP VIEW WW XXYY ZZZZC B A 1 2 3 CB1 VCC NO2 COM2 CB2 NO1 COM1 GND NC2 FLAG EN NC1 WLCSP-12 (1.17x1.57x0.62mm)

August 2020 - Revision 04d Page 3 Company Confidential Absolute Maximum Ratings1 (TA = 25C unless otherwise noted) Symbol Description Value Units VCC Input voltage -0.3 to 8 V CB1, CB2, EN, FLAG CB1, CB2, EN, FLAG -0.3 to 6 V COM1, COM2 I/O Voltage (2.7V < Vcc < 5.5V) -2 to 20 V Surge IEC61000-4-5 25 NO1, NO2, NC1, NC2 I/O Voltage -0.3 to 6 V Ts Storage Temperature Range -65 to 150 C TLEAD Maximum Soldering Temperature (at leads, 10 sec) 260 C ISW Switch I/O Current (Continuous) 25 mA Ts Storage Temperature Range -65 to 150 C TLEAD Maximum Soldering Temperature (at leads, 10 sec) 260 C Thermal Capabilities Symbol Description Value Units θJA Thermal Resistance – Junction to Ambient2 74 C/W PD Maximum Power Dissipation at TA ≤ 25°C 1697 mW

Ordering Information

Part Number Marking Operating Temperature Package KTU1000EUX-TR KYXXYYZZZZ3 -40°C to +85°C WLCSP-12 1. Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional operation at conditions other than the operating conditions specified is not implied. Only one Absolute Maximum rating should be applied at any one time. 2. Junction to Ambient thermal resistance is highly dependent on PCB layout. Values are based on thermal properties of the device when soldered to an EV board. 3. XX = Date Code, YY = Assembly Code, ZZZZ = Serial Number.

August 2020 - Revision 04d Page 4 Company Confidential Electrical Characteristics4 Unless otherwise noted, the Min and Max specs are applied over the full operation temperature range of –40°C to +85°C, while Typical values are specified at room temperature (25°C). Vcc = 2.7V to 5.5V. Symbol Description Conditions Min Typ Max Units General Operating Conditions Vcc Input operating range 2.7 5.5 V Vsw Analog VIO Signal Range Vcc = 2.7V to 5.5V -0.5 VFP V VUVLO Under Voltage Lockout Threshold 2.0 2.5 V Icc Supply Current VCC = 3.0V, VEN\\ = VCC 0.1 1 A VCC = 3.0V, VCB = Vcc, VEN\\ = 0V 25 40 A VFP COM Overvoltage Detect Threshold VCC = 3.0V, VIN rising 4.5 4.8 5.1 V VCC = 3.0V, VIN falling 4.3 V tFP Fault Protection Response Time VCOM = 1V to 10V step, Vcc = 3.0V; Figure 1 100 ns tFPR Fault Protection Recovery Time VCOM = 10V to 1V step, Vcc = 3.0V; Figure 1 26 us RON On-Resistance VCOM = 0V to VCC, ICOM_ = 10mA 3.8 8 Ω RON[MATCH] On-Resistance Match between channels VCOM = 0V to VCC, ICOM_ = 10mA 0.2 Ω RON[FLAT] On-Resistance Flatness VCOM = 0V to VCC, ICOM_ = 10mA 0.3 Ω ICOM_(OFF) COM_ Off Leakage Current VCC = VEN = 3.0V, VCOM = 3.0V, VNC = 0V 0 5 10 µA INC_(OFF) NC_ Off Leakage Current VCC = VCOM = 3.0V, VNC = 0V 0.1 1 µA Timing – Figures 2 and 3 tON[WAKEUP] IC Wake-Up Turn On Time VCC = 3.0V, VCOM = 1.5V, RL=50Ω, VEN = 0V, VCB = 0V to VCC, Figure 3 14 s tON[SW] SW Transition Turn On Time VCC = 3.0V, VCOM = 1.5V, RL=50Ω, VEN = 0V, VCB = 0V to VCC, Figure 2a 28 s tOFF[SW] SW Transition Turn Off Time VCC = 3.0V, VCOM = 1.5V, RL = 50Ω, VEN = 0V, VCB = 0V to VCC, Figure 2a 1 s tD Break-Before-Make Time Delay RL = 50Ω 28 s CCOM(OFF) Off Capacitance VCOM = 0.5VP-P, DC bias = 0V, f = 1MHz 1.5 pF CCOM(ON) On Capacitance VCOM = 0.5Vp-p, DC bias = 0V, f = 1MHz 2.0 pF AC Performance BW -3dB Bandwidth RS = RL = 50Ω, VCOM = 0dBm >1 GHz VISO Off Isolation f = 100kHz, VCOM = 0.5Vp-p, RS = RL = 50Ω -70 dB VCT Crosstalk f = 100kHz, VCOM = 0.5Vp-p, RS = RL = 50Ω -80 dB Logic Input, Enable, CB1, CB2 VIH Input Logic High 1.2 V VIL Input Logic Low 0.4 V ILK_IN Input Leakage Current EN̅̅̅̅ = CB_ = 0V or VCC -1 1 A Fault Flag VOL FLAG̅̅̅̅̅̅̅̅ Output Voltage Low VIO = 3.3V, ISINK = 1mA 0.1 0.4 V 4. KTU1000 is guaranteed to meet performance specifications ov er the –40°C to +85°C operating temperature range by design, characterization and correlation with statistical process controls.

Figure 3. IC Wake-Up Timing Diagram

1 X X OPEN OPEN

August 2020 - Revision 04d Page 7 Company Confidential Typical Characteristics VCC = 3V, CVCC = 1µF, TAMB = 25°C unless otherwise specified. Input Current vs VCC Voltage COM Leakage current vs. COM Voltage On Resistance vs. COM Voltage On Resistance vs. Temperature COM Overvoltage Thershold vs. VCC Voltage COM Overvoltage Threshold vs. Temperature Input Current (µA) VCC Voltage (V) 0 1 2 3 4 5 COM Leakage Current (µA) COM Voltage (V) 0 1 2 3 4 5 On Resistance (Ω) VCOM Voltage (V) -40 -15 10 35 60 85 On Resistance (Ω) Temperature (°C) 4.5 4.6 4.7 4.8 4.9 5.0 COM Overvoltage Threshold (V) VCC Voltage (V) 4.5 4.6 4.7 4.8 4.9 5.0 -40 -15 10 35 60 85 COM Overvoltage Threshold (V) Temperature (°C)

August 2020 - Revision 04d Page 8 Company Confidential Typical Characteristics (continued) VCC = 3V, CVCC = 1µF, TAMB = 25°C unless otherwise specified. EN Threshold vs. VCC Voltage CB Threshold vs. VCC Voltage Frequency Response - On Loss Frequency Response - Off Isolation Frequency Response - Crosstalk Eye Diagram USB 2.0 High-Speed 0.50 0.55 0.60 0.65 0.70 0.75 0.80 EN Threshold (V) VCC (V) VIH VIL 0.50 0.55 0.60 0.65 0.70 0.75 0.80 CB Threshold (V) VCC (V) VIH VIL -80 -70 -60 -50 -40 -30 -20 -10 0.1 1 10 100 1000 Magnitude (dB) Frequency (MHz) -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0.1 1 10 100 1000 Magnitude (dB) Frequency (MHz) -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0.1 1 10 100 1000 Magnitude (dB) Frequency (MHz)

August 2020 - Revision 04d Page 9 Company Confidential Typical Characteristics (continued) VCC = 3V, CVCC = 1µF, TAMB = 25°C unless otherwise specified. NC1 to NO1 Switch Break-Before-Make Timing NO1 to NC1 Switch Break-Before-Make Timing COM Input OVP to NC Output Shutdown COM Input OVP to NC Output Recovery Time Fault Flag Reporting Time Switch On-Time for NC1 Switch Off-Time for NC1 Break-Before-Make Time = 26µs NO1 Turn-On 1V/div 5µs/div NC1 Turn-Off 1V/div Control to CB1/CB2 2V/div NO1/NO2 On NC1/NC2 On Break-Before-Make Time = 26µs NO1 Turn-Off 1V/div 5µs/div NC1 Turn-On 1V/div Control to CB1/CB2 2V/div NO1/NO2 On NC1/NC2 On FLT Flag 2V/div 50ns/div VNC_ 4V/div VCOM 4V/div FLT Flag Active = 47ns 10V FLT Flag 2V/div 5µs/div VNC_ 1V/div VCOM 4V/div FLT Flag Reset = 5ns 10V 27µs CB1/2 Hi to Lo 2V/div 5µs/div NC2 Off to On 500mV/div NC1 Off to On 500mV/div 1.5V 1.5V NC1 Switch On-Time = 28µs NC1 Switch Off-Time = 23ns CB1/2 Lo to Hi 2V/div 50ns/div NC2 On to Off 500mV/div NC1 On to Off 500mV/div

August 2020 - Revision 04d Page 10 Company Confidential Typical Characteristics (continued) VCC = 3V, CVCC = 1µF, TAMB = 25°C unless otherwise specified. IC Turn-On Time From Enable FLT Flag 2V/div 10µs/div NC 500mV/div IC Enable 2V/div FLT Flag reset, IC active in 14µs NC_ Output Rise = 43µs IC Enable (Active Low) NC_ Output

Figure 4. Functional Block Diagram CB1/2 control pins, the on-switch will open with a typical 28µs delay before the off-switchs close. output (FLAG̅̅̅̅̅̅̅̅) is provided to alert the system controller to the fault condition.

August 2020 - Revision 04d Page 12 Company Confidential

Application Information

Analog Switch Applications The KTU1000 is intended for use as a USB 2:1 data mux for USB 2.0 Low, Full and Hi -Speed applications up to 480Mbps and has an analog bandwidth up to 1GHz. KTU1000 switches may be used for other AC coupled analog signal switching applications as long as applied signal levels are with in the minimum to maximum VSW operating limits as defined in the electrical characteristics specification for this device. Due to the high frequency nature of USB and similar data signals, unused switch inputs or output should be terminated with 50Ω to ground to prevent unwanted signal-line reflections. Non-Reverse-Blocking Switches The switches in the KTU1000 are non -reverse-blocking for lowest on resistance and capacitance . Therefore, each switch has a body -diode tha t when forward -biased conducts current from NO1, NO2, NC1, or NC2 to COM1 or COM2. For this reason, USB transceivers or any other I/O devices connected in the system must be in high-Z mode or pulled to ground with logic 0 whenever data is routed through the KTU1000 to another device. For a pin-to-pin compatible device with reverse-blocking, consult the factory. Input Supply Bypass Capacitor The KTU1000 may be operated with no additional external components . To maximize Hi -Speed data performance in systems with voltage supply noise or ripple, adding a Vcc input bypass capacitor in the range of 0.1uF or 1uF from VCC to GND is recommended. Ceramic capacitors with minimum voltage rating of 6.3V and X5R or X7R dielectric should be used. PCB Layout Guidelines To achieve adequate ban dwidth in USB 2.0 Hi-Speed data applications, careful PCB layout is critical for the signal traces to the COM1, COM2, NC1, NC2, NO1, and NO2 pins. The following guidelines are recommended for best system performance: 1. Multi-layer printed circuits boards are recommended for hi-speed data communication applications. Best USB signal quality is realized with 4 layer or greater PCB assemblies. A multilayer board minimizes the board material thickness between the signal trace layer and adjacent ground plane layer, which aids in maintaining consistant trace impedance for high-frequency signals. 2. Input and Output data signals should utilize matched width and length traces and be made as short as possible. As a general guide, USB 2.0 Hi-Speed signals, traces should be equal in lengths, maintain a 6 mil width with 8 mil spacing between traces and have 30 mil or greater isolation to adjacent signal traces. 3. The use of data trace vias should be minimized or ideally avoided altogether as they introd uce impedance discontinuities at high frequencies and compromise signal quality. 4. If signal traces require turns or bends, do not use 90 ° turns. To maintain good high frequency performance, trace turns should use rounded arcs or bend at 45° angles at a maximum. 5. All signal traces should be routed directly over ground planes placed on the next PCB layer. To maintain best PCB trace impedance characteristic and minimize electro-magnetic interfearance (EMI), the ground plane layer should have no breaks under the signal tra ce layer. The ground plane layer should be referenced back to the system power source ground at one single point to avoid stray current paths through the ground plane.

August 2020 - Revision 04d Page 13 Company Confidential Packaging Information WLCSP34-12 (1.570mm x 1.170mm x 0.620mm) WLCSP43 1.57x1.17 3 X 0.400mm A1 Corner Top Side Die Coating Top View Bottom ViewSide View 0.620 ± 0.043mm 0.025 ± 0.003mm 1.570mm ± 0.030mm 1.170mm ± 0.030mm

12 X Ø

0.27 ± 0.027mm 2 X 0.400mm 0.200 ± 0.020mm Recommended Footprint Kinetic Technologies cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Kinetic Technologies product. No intellectual property or circuit patent licenses are implied. Kinetic Technologies reserves the right to change the circuitry and specifications without notice at any time. (NSMD Pad Type) 0.40mm 0.80mm 0.40mm * Dimensions are in millimeters. 0.225mm Copper Pad Diameter 1.20mm 0.325mm Solder Mask Opening